XC6501 ETR0337-006 Output Capacitor-Less, Low Power Consumption, High Speed LDO Regulator GENERAL DESCRIPTION The XC6501 series is a 6.0V high speed, low noise CMOS LDO regulator that can provide stable output voltages within a range of 1.2V to 5.0V (0.05V increments) even without a load capacitor CL. This is possible because phase compensation is carried out internally unlike other LDOs where it is done externally. The series consists of a reference voltage source, driver transistor, error amplifier, current limit circuit, and phase compensation circuit. The CE function enables the circuit to be put into stand-by mode by inputting a low level signal to the CE pin thereby reducing current consumption from an already low 13A (in operation) to less than 0.1A. In the stand-by mode, if a CL cap is used, the electric charge stored at CL can be discharged via the internal auto-discharge switch and as a result, the VOUT pin quickly returns to the VSS level. The current limit fold-back circuit operates as a short circuit protection and a current limiter function for the output pin. APPLICATIONS Mobile phones RF, Digital cash, I/O etc. Portable games Camera modules Wireless LAN modules LCD modules Bluetooth Digital-TV tuners FEATURES 1.46.0V Operating Voltage Range : Output Voltage Range : Dropout Voltage : Low Power Supply : 13AVOUT=2.8V Stand-by Current : Less than 0.1A Ripple Rejection : 50dBf=1kHz,VOUT=2.8V Protection Circuits : Current limit 300mA, TYP. : Short circuit protection : Internal phase compensation Packages : SOT-25, SSOT-24, USP-4, USPN-4,USP-3 Environmentally Friendly : EU RoHS Compliant, Pb Free Output capacitor is not required 2.05.0VAccuracy:1% 1.21.95VAccuracy:0.02V 150mVIOUT=100mA, VOUT=2.8V CL High Speed Auto Discharge TYPICAL PERFORMANCE CHARACTERISTICS XC6501 Series Ta=25,tr=tf=5s C IN=0.1F (ceramic) 3.0 300 Without CLCL CL =1.0F 250 2.8 200 2.6 150 2.4 2.2 100 Output Current 2.0 50 Output Current: I OUT (mA) OUT (V) 3.2 Output Voltage: V TYPICAL APPLICATION CIRCUIT 0 Time (40s/div) 1/23 XC6501 Series PIN CONFIGURATION *The heat dissipation pad of the USP-4 package is reference to solder as the reference mount pattern and metal mask pattern for mounting strength. The mount pattern should be electrically opened or connected to the VSS (No.2) pin. PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTION 4 VIN Power Supply 5 1 VOUT Output 2 2 VSS Ground 1 3 3 CE ON/OFFControl - 4 - NC No Connection USP-3 USP-4 SSOT-24 SOT-25 USPN-4 1 4 4 1 2 1 3 3 2 2 - 3 - - PRODUCT CLASSIFICATION Ordering Information XC6501- DESIGNATOR (*1) DESCRIPTION Regulator Type Output Voltage Output Voltage Accuracy SYMBOL A B C D P 1250 1 A - (*1) (*2) Packages Taping Type (*2) HR HR-G GR GR-G NR NR-G MR MR-G 7R-G DESCRIPTION CE High Active, Without CE Pull-down, Without CL discharge CE High Active, Without CE Pull-down, With CL discharge CE High Active, With CE Pull-down, Without CL discharge CE High Active, With CE Pull-down, With CL discharge 3 pin, without CE pin (USP-3) ex.)28V =2, =8 0.1V increments ex.)1.80V =1, =8, =1 Accuracy= 0.02V @ 1.2V1.9V Accuracy= 1% @ 2.05.0V 0.05V increments ex.)1.85V =1, =8, =A Accuracy =0.02V @ 1.25V1.95V Accuracy= 1% @ 2.054.95V USP-3 (Only XC6501P) USP-3 (Halogen & Antimony free) USP-4 USP-4 (Halogen & Antimony free) SSOT-24 SSOT-24 (Halogen & Antimony free) SOT-25 SOT-25 (Halogen & Antimony free) USPN-4 (Halogen & Antimony free) The "-G" suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant. The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or representative. (Standard orientation: R-, Reverse orientation: L- 2/23 XC6501 Series BLOCK DIAGRAMS VIN VOUT VIN VOUT CFB Current Limit + Error Amp - CE ON/OFF Control CFB each circuit R1 Current Limit R1 Rdischg + Error Amp - R2 Voltage Reference CE each circuit ON/OFF Control R2 Voltage Reference /CE VSS VSS XC6501A Series XC6501B Series VIN VIN VOUT VOUT CFB Current Limit R1 + Error Amp - CE ON/OFF Control CFB + Error Amp - R2 CE Voltage Reference VSS each circuit R1 Current Limit ON/OFF Control Voltage Reference Rdischg R2 /CE VSS each circuit XC6501C Series XC6501D Series VIN VOUT CFB Current Limit R1 + Error Amp - R2 Voltage Reference VSS *Diodes inside the circuit are an ESD protection diode and a parasitic diode. XC6501P Series ABSOLUTE MAXIMUM RATINGS PARAMETER Input Voltage Output Current Output Voltage CE Input Voltage USPN-4 USP-3 SYMBOL VIN IOUT VOUT VCE USP-4 Pd Power Dissipation SSOT-24 SOT-25 RATINGS VSS-0.3+6.5 400 (*1) VSS-0.3VIN+0.3 VSS-0.3+6.5 100 120 120 1000 (PCB mounted)*2 150 500 (PCB mounted)*2 250 600 PCB mounted*2 -40+85 -55+125 UNITS V mA V V mW Operating Temperature Range Topr Storage Temperature Range Tstg *1 PdVIN-VOUTxIOUT *2 The power dissipation figure shown is PCB mounted and is for reference only. Please refer to page 20 for details. 3/23 XC6501 Series ELECTRICAL CHARACTERISTICS XC6501 Series Ta=25 PARAMETER SYMBOL Output Voltage VOUT(E) Maximum Output Current Load Regulation Dropout Voltage (*5) Supply Current Stand-by Current (*2) IOUTMAX VOUT Vdif IDD Istby 2.0VVOUTT(*3) VCE=VIN, IOUT=10mA -0.02 2.0VVOUTT VCE=VIN, IOUT=10mA x0.99 (*4) 0.20 %/V 1.4 - 6.0 V - 100 - ppm/ - 50 - dB 210 300 - mA - 25 - mA VCEH 1.0 - 6.0 V VCEL VSS - 0.25 V -0.1 3.5 6.0 0.1 10 A -0.1 - 0.1 A - 250 400 300 480 PSRR Current Limit ILIM Short Circuit Current ISHORT VCE=VIN, IOUT=30mA -40Ta85 VOUT(T)4.75V VIN=VOUT(T)+1.0VDC+0.5Vp-pAC VCE=VIN, IOUT=30mA, f=1kHz VOUT(T)4.80V VIN=5.75VDC+0.5Vp-pAC VCE=VIN, IOUT=30mA, f=1kHz VCE=VIN VCE=VIN, VOUT is short-circuited at the VSS level ICEH VIN=VCE=6.0V ICEL VCE=VSS RDCHG XC6501A/B XC6501C/D VIN=6.0V, VOUT=1.2V, VCE=VSS VIN=6.0V, VOUT=5.0V, VCE=VSS Notes: (*3) *1: Unless otherwise stated regarding input voltage conditions, VIN=VOUT(T) +1.0V. *2: VOUT(E): An actual output voltage when an amply stabilized IOUT (VOUT(T)+1.0V) is input.. *3: VOUT(T): Nominal output voltage value *4: VOUT(E): Effective output voltage value *5: Vdif={VIN1 - VOUT1 } *6: VOUT1: A voltage equal to 98% of the output voltage when an amply stabilized IOUT (VOUT(T)+1.0V) is input. *7: VIN1: The input voltage when VOUT1 appears as input voltage is gradually decreased. *8: This function is built in the XC6501B/D series only. The XC6501A/C series discharges by resistors R1+ R2 only as shown in the block diagrams. 4/23 0.10 TaVOUT (*6) V - Ripple Rejection Rate (*7) x1.01 0.1 VOUT CE High Level Voltage CE Low Level Voltage CE High Level Current CE Low Level Current CL Auto-Discharge Resistance (*8) CIRCUIT - VOUT(T)+0.5VVIN6.0V, VCE=VIN, IOUT=30mA 200 - UNITS (*4) VOUTT (*4) VCE=VIN VCE=VIN, 0.1mAIOUT100mA VCE=VIN , IOUT=100mA VIN=VCE=6.0V, IOUT=0A VIN=6.0V, VCE=VSS MAX. +0.02 (*4) VIN Output Voltage Temperature Characteristics TYP. mA mV mV A A VINVOUT Input Voltage MIN. 15 E-1 E-2 0.01 VOUT Line Regulation CONDITIONS 45 XC6501 Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Chart NOMINAL VOLTAGE (V) VOUT(T) 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 1.60 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 2.25 2.30 2.35 2.40 2.45 2.50 2.55 2.60 2.65 2.70 2.75 2.80 2.85 2.90 2.95 E-0 OUTPUT VOLTAGE (V) E-1 DROPOUT VOLTAGE (mV) E-2 SUPPLY CURRENT (A) VOUT(E) Vdif ISS MIN. MAX. 1.1800 1.2300 1.2800 1.3300 1.3800 1.4300 1.4800 1.5300 1.5800 1.6300 1.6800 1.7300 1.7800 1.8300 1.8800 1.9300 1.9800 2.0295 2.0790 2.1285 2.1780 2.2275 2.2770 2.3265 2.3760 2.4255 2.4750 2.5245 2.5740 2.6235 2.6730 2.7225 2.7720 2.8215 2.8710 2.9205 1.2200 1.2700 1.3200 1.3700 1.4200 1.4700 1.5200 1.5700 1.6200 1.6700 1.7200 1.7700 1.8200 1.8700 1.9200 1.9700 2.0200 2.0705 2.1210 2.1715 2.2220 2.2725 2.3230 2.3735 2.4240 2.4745 2.5250 2.5755 2.6260 2.6765 2.7270 2.7775 2.8280 2.8785 2.9290 2.9795 TYP. MAX. 440 690 300 610 260 530 230 470 TYP. MAX. 11 17 18 200 430 190 410 12 19 210 380 13 20 150 360 5/23 XC6501 Series ELECTRICAL CHARACTERISTICS (Continued) Voltage Table (continued) NOMINAL VOLTAGE (V) VOUT(T) 3.00 3.05 3.10 3.15 3.20 3.25 3.30 3.35 3.40 3.45 3.50 3.55 3.60 3.65 3.70 3.75 3.80 3.85 3.90 3.95 4.00 4.05 4.10 4.15 4.20 4.25 4.30 4.35 4.40 4.45 4.50 4.55 4.60 4.65 4.70 4.75 4.80 4.85 4.90 4.95 5.00 6/23 E-0 OUTPUT VOLTAGE (V) E-1 DROPOUT VOLTAGE (mV) VOUT(E) MIN. MAX. 2.9700 3.0195 3.0690 3.1185 3.1680 3.2175 3.2670 3.3165 3.3660 3.4155 3.4650 3.5145 3.5640 3.6135 3.6630 3.7125 3.7620 3.8115 3.8610 3.9105 3.9600 4.0095 4.0590 4.1085 4.1580 4.2075 4.2570 4.3065 4.3560 4.4055 4.4550 4.5045 4.5540 4.6035 4.6530 4.7025 4.7520 4.8015 4.8510 4.9005 4.9500 3.0300 3.0805 3.1310 3.1815 3.2320 3.2825 3.3330 3.3835 3.4340 3.4845 3.5350 3.5855 3.6360 3.6865 3.7370 3.7875 3.8380 3.8885 3.9390 3.9895 4.0400 4.0905 4.1410 4.1915 4.2420 4.2925 4.3430 4.3935 4.4440 4.4945 4.5450 4.5955 4.6460 4.6965 4.7470 4.7975 4.8480 4.8985 4.9490 4.9995 5.0500 E-2 SUPPLY CURRENT (A) Vdif ISS TYP. MAX. 150 360 TYP. MAX. 20 14 140 350 21 130 340 15 22 120 330 16 23 XC6501 Series OPERATIONAL EXPLANATION The voltage divided by resistors R1 & R2 is compared with the internal reference voltage by the error amplifier. The P-channel MOSFET which is connected to the VOUT pin is then driven by the subsequent output signal. The output voltage at the VOUT pin is controlled & stabilized by a system of negative feedback. The current limit circuit and short protect circuit operate in relation to the level of output current. Further, the IC's internal circuitry can be shutdown via the CE pin's signal. <CL High Speed Auto-Discharge Function> The XC6501B/D series can discharge the electric charge in the output capacitor CL, when a low signal to the CE pin, which enables a whole IC circuit turn off, is inputted via the N-channel transistor located between the VOUT pin and the VSS pin as shown in the BLOCK DIAGRAM. The CL auto-discharge resistance value is set at 400(VOUT=5.0V @ VIN=6.0V at typical). The discharge time of the output capacitor CL is set by the CL auto-discharge resistance R and the output capacitor CL. By setting time constant of a CL auto-discharge resistance value Rdischg and an output capacitor value CL as (=C x Rdischg), the output voltage after discharge via the N-channel transistor is calculated by the following formulas. V = VOUT(E) x e -t/, or t=x In (VOUT(E) / V ) where V : Output voltage after discharge, VOUT(E) : Output voltage, t : Discharge time, : CL auto-discharge resistance Rdischg x Output capacitor CL <Current Limiter, Short-Circuit Protection> The XC6501 series' fold-back circuit operates as an output current limiter and a short protection of the output pin. When the load current reaches the current limit level, the fixed current limiter circuit operates and output voltage drops. When the output voltage is shorted to the VSS, its current flow reached and minimized to about 25mA. <CE Pin> The IC's internal circuitry can be shutdown via the signal from the CE pin with the XC6501 series. In shutdown mode output at the VOUT pin will be pulled down to the VSS level via R1 & R2. However, as for the XC6501B/D series, the CL auto-discharge resistor is connected in parallel to R1 and R2 while the power supply is applied to the VIN pin. Therefore, time until the VOUT pin reaches the VSS level becomes short. The output voltage becomes unstable, when the CE pin is open. If this IC is used with the correct output voltage for the CE pin, the logic is fixed and the IC will operate normally. However, supply current may increase as a result of through current in the IC's internal circuitry when medium voltage is input. NOTES ON USE 1. Please use this IC within the stated absolute maximum ratings. The IC is liable to malfunction should the ratings be exceeded. 2. This IC achieves stable operation without an output capacitor CL by internal phase compensation. However, wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please wire the input capacitor CIN and the output capacitor CL as close to the IC as possible. 7/23 XC6501 Series TEST CIRCUITS Circuit CIN=0.1F (ceramic) VIN V A CE V IOUT VOUT VSS A V Circuit A VIN V CE VOUT VSS Circuit VIN V CE VOUT VSS 8/23 IOUT A V XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS *CE Voltage condition: Unless otherwise stated, VCE =VIN (1) Output Voltage vs. Output Current XC6501x121 1.2 0.9 0.6 Ta = -40 0.3 Ta = 25 Ta = 25 CIN = 0.1F (ceramic) 1.5 Output Voltage: VOUT [V] 1.5 Output Voltage: VOUT [V] XC6501x121 VIN = 2.2V CIN = 0.1F (ceramic) 1.2 0.9 0.6 VIN = 1.5V 0.3 VIN = 1.7V Ta = 85 0.0 VIN = 2.2V 0.0 0 50 100 150 200 250 300 350 400 Output Current: IOUT [mA] 0 50 XC6501x281 2.5 2.0 1.5 1.0 Ta = -40 Ta = 25 0.5 Ta = 25 CIN = 0.1F (ceramic) 3.0 Output Voltage: VOUT [V] Output Voltage: VOUT [V] XC6501x281 VIN = 3.8V CIN = 0.1F (ceramic) 3.0 100 150 200 250 300 350 400 Output Current: IOUT [mA] 2.5 2.0 1.5 1.0 VIN = 3.1V 0.5 VIN = 3.3V Ta = 85 0.0 VIN = 3.8V 0.0 0 50 100 150 200 250 300 350 400 Output Current: IOUT [mA] 0 50 XC6501x501 5.0 4.0 3.0 2.0 Ta = -40 Ta = 25 1.0 Ta = 85 0.0 Ta = 25 CIN = 0.1F (ceramic) 6.0 Output Voltage: VOUT [V] Output Voltage: VOUT [V] XC6501x501 VIN = 6.0V CIN = 0.1F (ceramic) 6.0 100 150 200 250 300 350 400 Output Current: IOUT [mA] 5.0 4.0 3.0 2.0 VIN = 5.3V VIN = 5.5V 1.0 VIN = 6.0V 0.0 0 50 100 150 200 250 300 350 400 Output Current: IOUT [mA] 0 50 100 150 200 250 300 350 400 Output Current: IOUT [mA] 9/23 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output Voltage vs. Input Voltage XC6501x121 1.2 1.0 0.8 IOUT = 10mA IOUT = 30mA 0.6 IOUT = 100mA Ta = 25 CIN = 0.1F (ceramic) 1.26 Output Voltage: VOUT [V] 1.4 Output Voltage: VOUT [V] XC6501x121 Ta = 25 CIN = 0.1F (ceramic) 0.4 1.24 1.22 1.20 1.18 IOUT = 10mA IOUT = 30mA 1.16 IOUT = 100mA 1.14 0.5 1.0 1.5 2.0 Input Voltage: VIN [V] 2.5 2.0 XC6501x281 2.6 2.4 IOUT = 10mA IOUT = 30mA IOUT = 100mA Ta = 25 CIN = 0.1F (ceramic) 2.86 Output Voltage: VOUT [V] Output Voltage: VOUT [V] 2.8 2.2 2.0 2.84 2.82 2.80 2.78 IOUT = 10mA IOUT = 30mA 2.76 IOUT = 100mA 2.74 2.0 2.5 3.0 3.5 Input Voltage: VIN [V] 4.0 3.2 XC6501x501 6.0 4.8 4.6 IOUT = 10mA IOUT = 30mA IOUT = 100mA 4.2 Ta = 25 CIN = 0.1F (ceramic) 5.06 Output Voltage: VOUT [V] Output Voltage: VOUT [V] 5.0 4.4 3.9 4.6 5.3 Input Voltage: VIN [V] XC6501x501 Ta = 25 CIN = 0.1F (ceramic) 5.2 5.04 5.02 5.00 4.98 IOUT = 10mA IOUT = 30mA 4.96 IOUT = 100mA 4.94 4.0 10/23 6.0 XC6501x281 Ta = 25 CIN = 0.1F (ceramic) 3.0 3.0 4.0 5.0 Input Voltage: VIN [V] 4.5 5.0 5.5 Input Voltage: VIN [V] 6.0 5.2 5.4 5.6 5.8 Input Voltage: VIN [V] 6.0 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Dropout Voltage vs. Output Current XC6501x121 CIN = 0.1F (ceramic) Ta = -40 0.8 Ta = 25 Ta = 85 0.6 0.4 0.2 Below the minimum operating voltage CIN = 0.1F (ceramic) 0.5 Dropout Voltage: Vdif [V] 1.0 Dropout Voltage: Vdif [V] XC6501x281 0.0 Ta = -40 0.4 Ta = 25 Ta = 85 0.3 0.2 0.1 0.0 0 50 100 150 Output Current: IOUT [mA] 200 0 50 100 150 Output Current: IOUT [mA] 200 (4) Supply Current vs. Input Voltage XC6501x501 CIN = 0.1F (ceramic) 0.5 Ta = -40 0.4 Ta = 25 Ta = 85 0.3 16.0 Supply Current: ISS [A] Dropout Voltage: Vdif [V] XC6501x121 0.2 0.1 0.0 12.0 8.0 Ta = -40 4.0 Ta = 25 Ta = 85 0.0 0 50 100 150 Output Current: IOUT [mA] 0 200 1 XC6501x281 5 6 XC6501x501 20.0 Supply Current: ISS [A] 16.0 Supply Current: ISS [A] 2 3 4 Input Voltage: VIN [V] 12.0 8.0 Ta = -40 4.0 Ta = 25 Ta = 85 0.0 15.0 10.0 Ta = -40 5.0 Ta = 25 Ta = 85 0.0 0 1 2 3 4 Input Voltage: VIN [V] 5 6 0 1 2 3 4 Input Voltage: VIN [V] 5 6 11/23 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Output Voltage vs. Ambient Temperature XC6501x121 XC6501x281 VIN = 2.2V CIN = 0.1F (ceramic) 1.24 VIN = 3.8V CIN = 0.1F (ceramic) 2.90 IOUT = 10mA Output Voltage: VOUT [V] Output Voltage: VOUT [V] IOUT = 10mA IOUT = 30mA 1.22 IOUT = 100mA 1.20 1.18 1.16 IOUT = 30mA 2.85 IOUT = 100mA 2.80 2.75 2.70 -50 -25 0 25 50 75 Ambient Temperature: Ta [] 100 -50 -25 0 25 50 75 Ambient Temperature: Ta [] 100 (6) Supply Current vs. Ambient Temperature XC6501x501 XC6501 VIN = 6.0V CIN = 0.1F (ceramic) 5.10 VIN = VOUT + 1.0V 20.0 Supply Current: ISS [A] Output Voltage: VOUT [V] IOUT = 10mA IOUT = 30mA 5.05 IOUT = 100mA 5.00 4.95 15.0 10.0 IOUT = 10mA 5.0 IOUT = 30mA IOUT = 100mA 4.90 0.0 -50 -25 0 25 50 75 Ambient Temperature: Ta [] 100 (7) CE Threshold Voltage vs. Ambient Temperature CE Threshold Voltage: VCE [V] XC6501 VIN = VOUT + 1.0V IOUT = 1mA, CIN = 0.1F (ceramic) 0.8 0.7 0.6 0.5 CE "H" LEVEL CE "L" LEVEL 0.4 -50 12/23 -25 0 25 50 75 Ambient Temperature: Ta [] 100 -50 -25 0 25 50 75 Ambient Temperature: Ta [] 100 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Rising Response Time 0.0 Output Voltage -3.0 1.0 IOUT = 10mA -6.0 IOUT = 30mA IOUT = 100mA 0.5 0.0 Output Voltage -3.0 1.0 -6.0 Output Voltage -3.0 3.0 2.0 IOUT = 10mA -6.0 IOUT = 30mA IOUT = 100mA -9.0 1.0 9.0 Input Voltage: VIN[V] 4.0 0.0 IOUT = 30mA IOUT = 100mA tr = 5s, Ta = 25 VIN = 06.0V, CIN = 0.1F (ceramic), Without CL 6.0 3.0 Output Voltage 0.0 -3.0 2.0 -6.0 IOUT = 30mA IOUT = 100mA XC6501x501 3.0 8.0 Output Voltage -3.0 6.0 4.0 IOUT = 10mA IOUT = 30mA IOUT = 100mA Time [50s/div] 2.0 0.0 9.0 Input Voltage: VIN [V] 10.0 3.0 IOUT = 10mA XC6501x501 Input Voltage 6.0 4.0 Time [50s/div] 6.0 0.0 5.0 -9.0 12.0 0.5 Input Voltage Time [50s/div] tr = 5s, Ta = 25 VIN = 06.0V, CIN = CL = 0.1F (ceramic) 1.5 IOUT = 10mA -9.0 6.0 5.0 0.0 -9.0 0.0 XC6501x281 tr = 5s, Ta = 25 VIN = 06.0V, CIN = CL = 0.1F (ceramic) 3.0 -6.0 2.0 XC6501x281 Input Voltage 0.0 3.0 Time [50s/div] 6.0 9.0 2.5 Input Voltage Time [50s/div] Output Voltage: VOUT [V] 9.0 Input Voltage: VIN [V] 1.5 6.0 3.0 tr = 5s, Ta = 25 VIN = 06.0V, CIN = 0.1F (ceramic), Without CL 6.0 1.0 0.0 12.0 10.0 Input Voltage 3.0 0.0 8.0 Output Voltage -3.0 6.0 4.0 IOUT = 10mA -6.0 -9.0 IOUT = 30mA IOUT = 100mA Output Voltage: VOUT [V] 2.0 tr = 5s, Ta = 25 VIN = 06.0V, CIN = 0.1F (ceramic), Without CL Output Voltage: VOUT [V] 3.0 9.0 Input Voltage: VIN [V] 2.5 Input Voltage -9.0 Input Voltage: VIN [V] 3.0 Output Voltage: VOUT [V] 6.0 XC6501x121 Output Voltage: VOUT [V] Input Voltage: VIN [V] 9.0 tr = 5s, Ta = 25 VIN = 06.0V, CIN = CL = 0.1F (ceramic) 2.0 Output Voltage: VOUT [V] XC6501x121 0.0 Time [50s/div] 13/23 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (9) Input Transient Response IOUT = 30mA 1.3 IOUT = 100mA 0.0 1.2 Output Voltage -1.0 Input Voltage: VIN [V] 1.2 Output Voltage -1.0 3.3 3.1 IOUT = 10mA 3.0 3.0 IOUT = 30mA Output Voltage IOUT = 100mA 1.0 2.9 2.8 6.0 Input Voltage: VIN [V] 3.2 0.0 1.1 2.7 tr = tf = 5s, Ta = 25 VIN = 3.8V4.8V, CIN = 0.1F (ceramic), Without CL 5.0 3.2 4.0 3.1 IOUT = 10mA 3.0 2.0 Output Voltage IOUT = 100mA 1.0 2.7 XC6501x501 XC6501x501 6.0 5.4 Input Voltage 5.0 IOUT = 10mA IOUT = 30mA 4.0 5.3 5.2 IOUT = 100mA Output Voltage 2.0 5.1 5.0 4.9 Time [200s/div] 7.0 2.9 2.8 0.0 5.5 3.0 IOUT = 30mA Time [200s/div] tr = tf = 5s, Ta = 25 VIN = 5.5V6.0V, CIN = CL = 0.1F (ceramic) 3.3 Input Voltage Time [200s/div] 1.0 14/23 0.0 XC6501x281 tr = tf = 5s, Ta = 25 VIN = 3.8V4.8V, CIN = CL = 0.1F (ceramic) 1.3 IOUT = 100mA XC6501x281 4.0 3.0 IOUT = 30mA 1.0 Time [200s/div] Input Voltage 7.0 1.4 IOUT = 10mA Time [200s/div] 5.0 2.0 1.5 Input Voltage 2.0 Input Voltage: VIN [V] Input Voltage: VIN [V] 6.0 1.1 1.6 tr = tf = 5s, Ta = 25 VIN = 5.5V6.0V, CIN = 0.1F (ceramic), Without CL 6.0 5.5 5.4 Input Voltage 5.3 5.0 IOUT = 10mA 4.0 IOUT = 30mA 5.2 IOUT = 100mA 3.0 Output Voltage: VOUT [V] 1.0 tr = tf = 5s, Ta = 25 VIN = 2.2V3.2V, CIN = 0.1F (ceramic), Without CL Output Voltage: VOUT [V] 1.4 IOUT = 10mA 3.0 Input Voltage: VIN [V] 2.0 Output Voltage: VOUT [V] 1.5 Input Voltage 4.0 Output Voltage: VOUT [V] Input Voltage: VIN [V] 3.0 1.6 Output Voltage: VOUT [V] 4.0 XC6501x121 tr = tf = 5s, Ta = 25 VIN = 2.2V3.2V, CIN = CL = 0.1F (ceramic) Output Voltage 2.0 5.1 5.0 1.0 4.9 Time [200s/div] Output Voltage: VOUT [V] XC6501x121 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Load Transient Response 0.8 50mA 0.1mA 50 0 0.6 100 Output Current 100 Output Current 2.0 50 0 3.0 10mA tr = tf = 5s, Ta = 25 IOUT = 1050mA, VIN = 3.8V, CIN = 0.1F (ceramic) CL = 0.1F 2.8 2.6 150 2.4 2.2 100 Output Current XC6501x501 5.0 200 Output Voltage 4.8 150 4.6 100 Output Current 4.2 Time [40s/div] 50 0 5.2 tr = tf = 5s, Ta = 25 IOUT = 1050mA, VIN = 6.0V, CIN = 0.1F (ceramic) CL = 0.1F 50 0 300 250 Without CL 5.0 200 Output Voltage 4.8 150 4.6 4.4 100 Output Current 50mA 50mA 0.1mA Output Voltage: VOUT [V] 250 5.4 50mA 10mA XC6501x501 Without CL 300 200 Time [40s/div] CL = 0.1F 0 Output Voltage 2.0 300 50 250 Without CL Time [40s/div] tr = tf = 5s, Ta = 25 IOUT = 0.150mA, VIN = 6.0V, CIN = 0.1F (ceramic) 50mA 50mA 0.1mA Output Voltage: VOUT [V] 150 3.2 Output Current: IOUT [mA] 200 2.4 4.4 0.8 0.4 300 250 Without CL 2.6 5.2 150 XC6501x281 Output Voltage 5.4 1.0 XC6501x281 2.8 2.2 200 Output Voltage Time [40s/div] CL = 0.1F 3.0 1.2 Time [40s/div] tr = tf = 5s, Ta = 25 IOUT = 0.150mA, VIN = 3.8V, CIN = 0.1F (ceramic) 250 Without CL 0.6 100 Output Current CL = 0.1F 300 10mA 4.2 Output Current: IOUT [mA] 150 1.4 tr = tf = 5s, Ta = 25 IOUT = 1050mA, VIN = 2.2V, CIN = 0.1F (ceramic) Output Current: IOUT [mA] 1.0 Output Voltage: VOUT [V] 200 Output Voltage 1.6 Output Current: IOUT [mA] 1.2 3.2 Output Voltage: VOUT [V] 250 Without CL 0.4 Output Voltage: VOUT [V] 300 Output Current: IOUT [mA] 1.4 CL = 0.1F Output Voltage: VOUT [V] 1.6 XC6501x121 tr = tf = 5s, Ta = 25 IOUT = 0.150mA, VIN = 2.2V, CIN = 0.1F (ceramic) 50 Output Current: IOUT [mA] XC6501x121 0 Time [40s/div] 15/23 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (11) CE Rising Respose Time 0.0 Output Voltage -1.0 1.5 1.0 IOUT = 10mA -2.0 IOUT = 30mA IOUT = 100mA 0.0 2.5 CE Input Voltage 1.0 2.0 0.0 Output Voltage -1.0 1.0 -2.0 IOUT = 30mA IOUT = 100mA -3.0 Time [40s/div] XC6501x281 XC6501x281 VIN = 2.2V, tr = 5s, Ta = 25 VCE = 0VIN, CIN = CL = 0.1F (ceramic) 4.0 6.0 5.0 CE Input Voltage 2.0 4.0 Output Voltage 0.0 -2.0 3.0 2.0 IOUT = 10mA -4.0 IOUT = 30mA 1.0 6.0 VIN = 3.8V, tr = 5s, Ta = 25 VCE = 0VIN, CIN = 0.1F (ceramic), Without CL 4.0 2.0 Output Voltage 0.0 -2.0 2.0 -4.0 IOUT = 30mA XC6501x501 3.0 8.0 Output Voltage -3.0 4.0 IOUT = 10mA -6.0 -9.0 IOUT = 30mA IOUT = 100mA Time [40s/div] 16/23 6.0 2.0 0.0 9.0 Input Voltage: VCE [V] 10.0 CE Input Voltage 0.0 IOUT = 100mA XC6501x501 6.0 3.0 IOUT = 10mA -6.0 12.0 6.0 4.0 Time [40s/div] VIN = 2.2V, tr = 5s, Ta = 25 VCE = 0VIN, CIN = CL = 0.1F (ceramic) 0.0 5.0 Time [40s/div] Output Voltage: VOUT [V] Input Voltage: VCE [V] 9.0 0.0 0.5 CE Input Voltage IOUT = 100mA -6.0 1.5 IOUT = 10mA Time [40s/div] Input Voltage: VCE [V] 6.0 0.5 2.0 3.0 VIN = 6.0V, tr = 5s, Ta = 25 VCE = 0VIN, CIN = 0.1F (ceramic), Without CL 6.0 1.0 0.0 12.0 10.0 CE Input Voltage 3.0 0.0 8.0 Output Voltage -3.0 6.0 4.0 IOUT = 10mA -6.0 -9.0 IOUT = 30mA IOUT = 100mA Time [40s/div] Output Voltage: VOUT [V] 2.0 VIN = 2.2V, tr = 5s, Ta = 25 VCE = 0VIN, CIN = 0.1F (ceramic), Without CL Output Voltage: VOUT [V] 1.0 3.0 Input Voltage: VCE [V] 2.5 CE Input Voltage -3.0 Input Voltage: VCE [V] 3.0 Output Voltage: VOUT [V] 2.0 XC6501x121 Output Voltage: VOUT [V] Input Voltage: VCE [V] 3.0 VIN = 2.2V, tr = 5s, Ta = 25 VCE = 0VIN, CIN = CL = 0.1F (ceramic) 2.0 0.0 Output Voltage: VOUT [V] XC6501x121 XC6501 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (12) Ripple Rejection Rate XC6501x121 Ta = 25 V IN = 2.2VDC+0.5Vp-p AC, CL = 0.1F (ceramic) 100 80 60 40 IOUT = 0.1mA 20 IOUT = 30mA IOUT = 10mA IOUT = 100mA 0 0.01 0.1 1 10 Ripple Frequency: f [kHz] 100 Ripple Rejection Rate: PSRR [dB] Ripple Rejection Rate: PSRR [dB] XC6501x121 Ta = 25 VIN = 2.2V DC+0.5Vp-pAC, Without CL 100 80 60 40 IOUT = 0.1mA 20 IOUT = 30mA IOUT = 10mA IOUT = 100mA 0 0.01 0.1 1 10 Ripple Frequency: f [kHz] 100 80 60 40 IO UT = 0.1mA IO UT = 10mA 20 IO UT = 30mA IO UT = 100mA 0 0.01 0.1 1 10 100 80 60 100 80 60 40 I OUT = 0.1mA I OUT = 10mA 20 I OUT = 30mA I OUT = 100mA 0 0.01 0.1 1 10 Ripple Frequency: f [kHz] XC6501x501 XC6501x501 IOUT = 0.1mA IOUT = 10mA IOUT = 30mA IOUT = 100mA 40 20 0 0.01 Ta = 25 VIN = 3.8V DC+0.5Vp-pAC, Without CL Ripple Frequency: f [kHz] Ta = 25 VIN = 5.75VDC+0.5Vp-p AC, CL = 0.1F (ceramic) 100 Ripple Rejection Rate: PSRR [dB] XC6501x281 Ta = 25 V IN = 3.8VDC+0.5Vp-p AC, CL = 0.1F (ceramic) 0.1 1 10 Ripple Frequency: f [kHz] 100 Ripple Rejection Rate: PSRR [dB] Ripple Rejection Rate: PSRR [dB] Ripple Rejection Rate: PSRR [dB] XC6501x281 100 100 Ta = 25 VIN = 5.75V DC+0.5Vp-pAC, Without CL 100 80 60 IOUT = 0.1mA IOUT = 10mA IOUT = 30mA IOUT = 100mA 40 20 0 0.01 0.1 1 10 Ripple Frequency: f [kHz] 100 17/23 0.250.05 0.4250.05 0.38+0.02 -0.03 1.20.05 18/23 +0 0.3 -0.2 2.80.2 1.3MAX 0.2MIN 1.6 1.10.1 +0.2 -0.1 2.10.3 1.1MAX +0.2 1.25 -0.1 0.90.1 0.20.1 0.20.1 0.70.1 0.70.1 0.20.05 (0.05) MAX0.6 0.6MAX 1.60.08 1.20.08 XC6501 Series PACKAGING INFORMATION XC6501 Series PACKAGING INFORMATION (Continued) USP-3 Reference Metal Mask Design 0.3 USP-4 Reference Pattern Layout 0.5 0.25 1.2 0.7 0.25 1.35 0.4 USP-3 Reference Pattern Layout USP-4 Reference Metal Mask Design 1.0 0.8 0.35 0.35 0.35 0.35 4 3 4 3 0.3 1 1 2 2 0.6 0.6 0.6 0.45 0.4 USPN-4 Reference Metal Mask Design 0.25 USPN-4 Reference Pattern Layout 19/23 XC6501 Series PACKAGING INFORMATION (Continued) USP-4 Power Dissipation Power dissipation data for the USP-4 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 40.0 28.9 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2.54 1.4 Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 1000 85 400 20/23 Thermal Resistance (/W) 100.00 XC6501 Series PACKAGING INFORMATION (Continued) SSOT-24 Power Dissipation Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 2. 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 500 85 200 Thermal Resistance (/W) 200.00 21/23 XC6501 Series PACKAGING INFORMATION (Continued) SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 3. 2. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter mm Evaluation Board (Unit: mm) Power Dissipation vs. Ambient temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 600 85 240 Thermal Resistance (/W) 166.67 Power Dissipation Pd (mW) PdmW Pd-Ta Pd vs. Ta 700 600 500 400 300 200 100 0 25 22/23 45 65 85 Ambient Temperature Ta () Ta 105 125 XC6501 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 23/23