Document Number: 52003
Revision 23-Apr-03
www.vishay.com
12
CHP, HCHP
Vishay Sfernice
For technical questions, contact sfer@vishay.com
FEATURES
• ESA SCC 4001
• CECC approvals in progress
• CHP: standard passivated version for industrial,
professional and military applications
• CHPHR: Hi-Rel version for space and medical
applications
• HCHP: for high frequency applications
• CHPCC: short-circuit chips
VISHAY SFERNICE thick lm resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability, homogeneity, reproductibility and
quality.
They conform to specifications NFC 83-240, CECC 40
401 and MIL-R-55342 D. CECC140 401 80 certication
is in progress.
Sputtered Thin Film terminations, with nickel barrier, are very
convenient for high temperature operating conditions. They
can withstand thousands of very severe thermal shocks.
High Stability Resistor Chips
Thick Film Technology
DIMENSIONS in millimeters
DIMENSIONS IN MM
A B – 0.25
+ 0.1
0.51
0.64 0.3 0.2 2
1.5
7
9
4
1
0.51
0.64 0.5 0.3 10
20
30
t
1
± 0.1 t
2
± 0.1
UNIT
WEIGHT
IN
mg
CHP
STYLE
0502
1.27 ± 0.15
1.60 ± 0.15
1.91 ± 0.20
2.03 ± 0.20
2.54 ± 0.20
3.20 ± 0.25 1.60 ± 0.15
1.27 ± 0.15
0.63 ± 0.15
1.27 ± 0.15
0.8 ± 0.15
1.27 ± 0.15
2.54 ± 0.20
1.91 ± 0.20
5.08 ± 0.25
2.54 ± 0.20
3.18 ± 0.25
3.81 ± 0.25
2.54 ± 0.20
5.72 ± 0.25
2.54 ± 0.20
5.08 ± 0.25
6.35 ± 0.25
0505
0603
0705
0805
1005
1206
1505
1010
2208
1020
2010
2512
e
t2
e
e
t1
t2
A
B
WRAP-AROUND TERMINATION
ONE SURFACE TERMINATION
B and BF types are for solder reow assembly.
G and W types are for wire bonding, gluing and ever high
temperature solder reow.
These resistor chips can be used in automatic, semi-automatic
or manual assembly techniques and are suitable for reow
soldering, wave soldering, ball bonding and wedge.
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CHP, HCHP
Vishay Sfernice
Document Number: 52003
Revision 23-Apr-03
For technical questions, contact sfer@vishay.com
SHORT-CIRCUIT CHIPS
Short-circuit chips are available for each series,
maximum resistance being 50mΩ, maximum current
2 A.
Terminations : only AE available (silver + nickel barrier
+ electro plating).
C
HIPS FOR HIGH FREQUENCY
APPLICATIONS
CHP resistors can be delivered in high frequency
versions. (F > 5 GHz).
Their commercial designation becomes HCHP.
TERMINATION PLATING
Various coatings are available :
No plating: precious metal termination for ball bonding
applications.
Plating by immersion Sn Pb Ag (with or without: nickel
barrier) : surface mount.
Electroplating Sn Pb (with : nickel barrier) :
surface mount
– reow or wave soldering (+ 260°C)
– allows less space between components
MECHANICAL SPECIFICATIONS
Substrate alumina
Size from 0502 to 2512
other sizes on request
Resistive Element ruthenium oxyde
Terminations
precious metal with or
without
nickel barrier
• untinned
• solder dipped
• electrolytic Sn Pb
• thin lm terminations B, BF, G, W types
Protection mineral passivation
epoxy coating on B, BF, G, W types
Weight 1 to 30mg
ENVIRONMENTAL SPECIFICATIONS
Temperature Range - 55°C to + 155°C
Climatic Category 55/155/156
Resistance Range 0.5Ω to 100MΩ
Tolerances ± 0.5% to ± 10%
Power Rating 0.05 W to 2 W at + 70°C
Temperature Coefcient
Standard K: ± 100ppm/°C
L: ± 200ppm/°C
M: ± 300ppm/°C
On request ± 50ppm/°C
Limiting Element Voltage 50V to 250V
Insulation Resistance 109Ω
ELECTRICAL SPECIFICATIONS
High Stability Resistor Chips
Thick Film Technology
0.05
RATING
AT + 70°C
W
DESIGNATION
VISHAY SFERNICE
UTE 83-240
QUALIFIED
LIST
GAM LNZ
T-1
OHMIC RANGE
LIMITING
ELEMENT
VOLTAGE
50V
CHP 0502
RR 0502
CHP 0505
RR 0505
CHP 0603
RR 0603
CHP 0705
RR 0705
CHP 0805
RR 0805
CHP 1005
RR 1005
CHP 1206
RR 1206
CHP 1505
RR 1505
CHP 1010
RR 1010
CHP 2208
RR 2208
CHP 1020
RR 1020
CHP 2010
RR 2010
CHP 2512
RR 2512
K
L
K
L
K
L
K
L
K
L
K
L
K
L
K
L
K
L
K
L
K
L
K
L
K
L
0.125
0.125
0.2
0.2
0.25
0.25
0.5
0.5
0.75
1
1
2
50V
50V
75V
75V
100V
150V
150V
100V
200V
100V
200V
250V
1Ω
0.5Ω
1 Ω
0.5Ω
1Ω
0.5 Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
1Ω
0.5Ω
10MΩ
25MΩ
10MΩ
10MΩ
10MΩ
25MΩ
10MΩ
25MΩ
10MΩ
25MΩ
10MΩ
50MΩ
10MΩ
50MΩ
10MΩ
75MΩ
10MΩ
25MΩ
10MΩ
100MΩ
10MΩ
10MΩ
10MΩ
100MΩ
10MΩ
100MΩ
SPECIAL FEATURES
•
•
•
•
•
•
•
•
•
Document Number: 52003
Revision 23-Apr-03
www.vishay.com
14
CHP, HCHP
Vishay Sfernice
For technical questions, contact sfer@vishay.com
POWER RATING CHART
AMBIENT TEMPERATURE IN °C
RATED POWER IN %
100
80
60
40
0
0 25 50 70 100 125 155
0705
1206
2010
2512
200
180
160
140
120
100
80
60
40
20
0
0 0.5 1 1.5 2 2.5 3
SELF HEATING CURVES
RATED POWER IN WATTS
SELF HEATING IN °C
TERMINATIONS
Terminations are dependent on application. Various
materials and nal treatments can be used according to
the tables below.
High Stability Resistor Chips
Thick Film Technology
TESTS
Termination Adhesion
Resistance to Solder Heat
Rapid Temperature Change
Climatic Sequence
Humidity (Steady State)
Load Life
Short Time Overload
5 N
for 10 seconds ± (0.25% + 0.05Ω)
± (0.25% + 0.05Ω)
< ± 0.1%
< ± 0.1%
< ± 0.1%
< ± 0.2%
< ± 0.1%
1000 h 2000 h 10 000 h
< ± 0.1% < ± 0.25% < ± 0.5%
< ± 0.2%
immersion 10 seconds
in Sn/Pb 60/40
at + 260°C
5 cycles
– 55°C + 155°C ± (0.25% + 0.05Ω)
Phase A dry heat
Phase B damp heat
Phase C cold –55°C
Phase D damp heat 5 cycles
± (1% + 0.05Ω)
56 days ± (1% + 0.05Ω)
6.25 Pn
for 5 seconds ± (0.25% + 0.05Ω)
1000 h at rated power
90'/30' at + 70°C 1000 h
± (1% + 0.05Ω)
CONDITIONS REQUIREMENTS TYPICAL VALUES
AND DRIFTS*
*Chips with terminations R (Platinum - Gold tinned).
PERFORMANCE
WRAPAROUND
TERMINATION TYPES
RECOMMENDED
THIN FILM TERMINATIONS
ONE FACE
Solder Dipping over Nickel Barrier
(1)
BF B
Gold over Nickel Barrier W G
Gold W G
Platinium Gold G (U)
Platinium Gold Solder Dipped B (R)
Platinium Gold and Electroplated Nickel B (BE)
and Electroplate Sn Pb
Platinium Gold and Electroplated Nickel B (BT)
and Dipped Sn Pb
Palladium Silver G (E)
WRAPAROUND
TERMINATIONS TYPE
PREVIOUS
TERMINATIONS
(2)
ONE FACE
(1) Standard Sn/Pb/Ag alloy (62/36/2) (will be lead free as soon as
requested).
(2) Previous Termination type between brackets.
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CHP, HCHP
Vishay Sfernice
Document Number: 52003
Revision 23-Apr-03
For technical questions, contact sfer@vishay.com
MARKING
On request : print marking of ohmic value (4 digit code).
For sizes ≥ 0705 : First 3 digits are signicant gures, 4th digit indicates the number of zeros to
follow the when ohmic value is smaller than
100, R is used as a seperator. eg: 0R51 = 0.51Ω
97R6 = 97.6Ω
4992 = 49900Ω
High Stability Resistor Chips
Thick Film Technology
Various packaging options are available:
• bag: for manual assembly or prototyping
• waffle pack: for microelectronic applications
• tape and reel: for automatic assembly, minimum quantity 250 pieces per ohmic value.
PACKAGING
HIGH RELIABILITY RESISTORS
CHP resistors can be delivered in high reliability versions.
Their commercial designation becomes CHP HR.
The main characteristics are:
0502 400
0505 100
0603 100
0705 100
0805 100
1005 140
8mm
1206
1505 60
1010 100
2208 12mm
1020 50 60 8mm
2010 12mm
2512 45
MAX. UNITS PER PACKAGE
SIZE WIDTH
REEL
BAG
WAFFLE PACK
REEL
DIA 178mm
–
3000
3000
3000
–
3000
2000
1500
2000
DISSIPATION
AT +70°C
TERMINATION
MATERIALS
SERIES AND
MODEL
CHP HR 0505
CHP HR 0705
CHP HR 0805
CHP HR 1206
CHP HR 1010
0.125W
0.2W
0.2W
0.25W
0.5W
OHMIC
VALUE
1Ω at
< 10Ω
10Ω at
1MΩ
TOL.
± %
± 1%
± 2 %
T.C.R.
ppm/°C
± 200
± 100
BE : Platinum
- Gold + nickel
barrier + electro
plating Sn Pb
R : Platinum -
Gold tinned
TERMINATIONS
R
See termination table
TOLERANCE
± 1%
± 0.5 %
± 1 %
± 2 %
± 5 %
± 10 %
± 20 %
OHMIC VALUE
10kΩ
TEMPERATURE
COEFFICIENT
±100 ppm/°C
± 100 ppm/°C
± 200 ppm/°C
± 300 ppm/°C
SIZE
1206
SERIES
CHP
CHP standard passivated chips
CHPHR HI-REL version
HCHP high frequency applications
CHPCC short-circuit chips
ORDERING INFORMATION
PACKAGING