MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.7
September 2010
MOC3031M, MOC3032M, MOC3033M,
MOC3041M, MOC3042M, MOC3043M
6-Pin DIP Zero-Cross Optoisolators Triac Driver Output
(250/400 Volt Peak)
Features
Simplifies logic control of 115 VAC power
Zero voltage crossing
dv/dt of 2000 V/µs typical, 1000 V/µs guaranteed
VDE recognized (File # 94766), ordering option V
(e.g., MOC3043VM)
Applications
Solenoid/valve controls
Lighting controls
Static power switches
AC motor drives
Temperature controls
E.M. contactors
AC motor starters
Solid state relays
Description
The MOC303XM and MOC304XM devices consist of a
GaAs infrared emitting diode optically coupled to a
monolithic silicon detector performing the function of a
zero voltage crossing bilateral triac driver.
They are designed for use with a triac in the interface of
logic systems to equipment powered from 115 VAC
lines, such as teletypewriters, CRTs, solid-state relays,
industrial controls, printers, motors, solenoids and
consumer appliances, etc.
Schematic Package Outlines
MAIN TERM.
NC*
N/C
*DO NOT CONNECT
(TRIAC SUBSTRATE)
1
2
3
ANODE
CATHODE
4
5
6MAIN TERM.
ZERO
CROSSING
CIRCUIT
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.72
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Absolute Maximum Ratings
(T
A
= 25°C unless otherwise noted)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Note
1. Isolation surge voltage, V
ISO
, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are
common, and Pins 4, 5 and 6 are common.
Symbol Parameters Device Value Units
TOTAL DEVICE
T
STG
Storage Temperature All -40 to +150 °C
T
OPR
Operating Temperature All -40 to +85 °C
T
SOL
Lead Solder Temperature All 260 for 10
sec
°C
T
J
Junction Temperature Range All -40 to +100 °C
V
ISO
Isolation Surge Voltage
(1)
(peak AC voltage, 60Hz, 1 sec. duration, I
I-O
2µA)
All 7500 Vac(pk)
P
D
Total Device Power Dissipation @ 25°C
Derate above 25°C
All 250 mW
2.94 mW/°C
EMITTER
I
F
Continuous Forward Current All 60 mA
V
R
Reverse Voltage All 6 V
P
D
Total Power Dissipation 25°C Ambient
Derate above 25°C
All 120 mW
1.41 mW/°C
DETECTOR
V
DRM
Off-State Output Terminal Voltage MOC3031M/2M/3M 250 V
MOC3041M/2M/3M 400
I
TSM
Peak Repetitive Surge Current
(PW = 100µs, 120 pps)
All 1 A
P
D
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
All 150 mW
All 1.76 mW/°C
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.73
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Electrical Characteristics
(T
A
= 25°C Unless otherwise specified)
Individual Component Characteristics
Transfer Characteristics
Zero Crossing Characteristics
Notes:
2. Test voltage must be applied within dv/dt rating.
3. All devices are guaranteed to trigger at an I
F
value less than or equal to max I
FT
. Therefore, recommended
operating I
F
lies between max I
FT
(15mA for MOC3031M & MOC3041M, 10mA for MOC3032M & MOC3042M,
5mA for MOC3033M & MOC3043M) and absolute max I
F
(60mA).
4. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.
Symbol Parameters Test Conditions Device Min. Typ. Max. Units
EMITTER
V
F
Input Forward Voltage I
F
= 30mA All 1.25 1.5 V
I
R
Reverse Leakage Current V
R
= 6V All 0.01 100 µA
DETECTOR
I
DRM1
Peak Blocking Current,
Either Direction
Rated V
DRM
, I
F
= 0
(2)
All 100 nA
V
TM
Peak On-State Voltage,
Either Direction
I
TM
= 100mA peak, I
F
= 0 All 1.8 3 V
dv/dt Critical Rate of Rise of
Off-State Voltage
I
F
= 0 (Figure 9)
(4)
All 1000 V/µs
Symbol DC Characteristics Test Conditions Device Min. Typ. Max. Units
I
FT
LED Trigger Current Main Terminal
Voltage = 3V
(3)
MOC3031M/
MOC3041M
15 mA
MOC3032M/
MOC3042M
10
MOC3033M/
MOC3043M
5
I
H
Holding Current,
Either Direction
All 400 µA
Symbol Characteristics Test Conditions Device Min. Typ. Max. Units
V
IH
Inhibit Voltage I
F
= rated I
FT
, MT1-MT2
voltage above which device
will not trigger
off-state
All 20 V
I
DRM2
Leakage in Inhibited
State
I
F
= rated I
FT
, rated V
DRM
off-state
All 2 mA
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.74
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol Parameter Min. Typ. Max. Unit
Installation Classifications per DIN VDE 0110/1.89
Ta b le 1
For Rated Main Voltage < 150Vrms I-IV
For Rated Main voltage < 300Vrms I-IV
Climatic Classification 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
CTI Comparative Tracking Index 175
V
PR
Input to Output Test Voltage, Method b,
V
IORM
x 1.875 = V
PR
, 100% Production Test
with tm = 1 sec, Partial Discharge < 5pC
1594 V
peak
Input to Output Test Voltage, Method a,
V
IORM
x 1.5 = V
PR
, Type and Sample Test
with tm = 60 sec, Partial Discharge < 5pC
1275 V
peak
V
IORM
Max. Working Insulation Voltage 850 V
peak
V
IOTM
Highest Allowable Over Voltage 6000 V
peak
External Creepage 7 mm
External Clearance 7 mm
Insulation Thickness 0.5 mm
RIO Insulation Resistance at Ts, V
IO
= 500V 10
9
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.75
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Typical Performance Curves
TA, AMBIENT TEMPERATURE ( oC)
0.1
1
10
100
1000
10000
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
0.8
0.9
1.0
1.1
1.2
1.3
-4-3-2-10 1234
-800
-600
-400
-200
0
200
400
600
800
IF - LED FORWARD CURRENT (mA)
TA, AMBIENT TEMPERATURE (°C)
VTM, ON-STATE VOLTAGE (VOLTS)
0.1 1 10 100
VF - FORWARD VOLTAGE (V)
IFT, NORMALIZED
IDRM, LEAKAGE CURRENT (nA) ITM, ON-STATE CURRENT (mA)
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Figure 3. Trigger Current vs. Temperature Figure 4. Leakage Current, IDRM vs. Temperature
Figure 1. LED Forward Voltage vs. Forward Current Figure 2. On-State Characteristics
TA = -40°C
TA = 25°C
TA = 85°C
IF = 30mA
TA = 25°C
NORMALIZED TO
TA = 25oC
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.76
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Typical Performance Curves
(Continued)
-40 -20 0 20
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
TA, AMBIENT TEMPERATURE (°C)
PWIN, LED TRIGGER PULSE WIDTH (µS)
40 60 80 100
IDRM2, NORMALIZED
IH, HOLDING CURRENT (NORMALIZED)
VINH - NORMALIZED IFT, LED TRIGGER CURRENT (NORMAILZED)
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
110100
0
2
4
6
8
10
12
14
16
-40 -20 0 20 40 60 80 100
-40 -20 0 20 40 60 80 100
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
0.7
0.8
0.9
1.0
1.1
1.2
1.3
Figure 7. Holding Current, IH vs. Temperature Figure 8. Inhibit Voltage vs. Temperature
Figure 5. IDRM2 - Leakage in Inhibit State vs. Temperature Figure 6. LED Current Required to Trigger vs. LED Pulse Width
IF = RATED IFT
NORMALIZED TO
PWIN >> 100 µs
NORMALIZED TO
TA = 25°C
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.77
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Typical circuit (Fig 12, 13) for use when hot line switching is required. In this circuit the “hot” side of the line is switched
and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line.
R
in
is calculated so that I
F
is equal to the rated I
FT
of the part, 5mA for the MOC3033M and MOC3043M, 10mA for
the MOC3032M and MOC3042M, or 15mA for the MOC3031M and MOC3041M. The 39 ohm resistor and 0.01µF
capacitor are for snubbing of the triac and may or may not be necessary depending upon the particular triac and
load used.
Figure 9. Static dv/dt Test Circuit
Figure 10. Static dv/dt Test Waveform
(MOC3031M, MOC3032M, MOC3033M)
Vdc
+400 for MOC304XM
+250 for MOC303XM
R = 10 k
CTEST
X100
SCOPE
PROBE
PULSE
INPUT MERCURY
WETTED
RELAY
158 V
0 VOLTS
APPLIED VOLTAGE
WAVEFORM
Vmax = 250 V
dv/dt = 0.63 Vmax = 158
RTEST
D.U.T.D.U.T.
τττ
τ
RC
RC RC
Figure 11. Static dv/dt Test Waveform
(MOC3041M, MOC3042M, MOC3043M)
252 V
0 VOLTS
APPLIED VOLTAGE
WAVEFORM
Vmax = 400 V
dv/dt = 0.63 Vmax = 252
RC
τ
RC RC
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable RTEST allows the dv/dt
to be gradually increased until the D.U.T. continues to
trigger in response to the applied voltage pulse, even after
the LED current has been removed. The dv/dt is then
decreased until the D.U.T. stops triggering. τRC is
measured at this point and recorded.
Figure 12. Hot-Line Switching Application Circuit
(MOC3031M, MOC3032M, MOC3033M)
0.01
VCC
Rin 1
2
3
6
5
4115 VAC
HOT
NEUTRAL
180
*For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
1 k
MOC3031M
MOC3032M
MOC3033M 39 *
LOAD
Figure 13. Hot-Line Switching Application Circuit
(MOC3041M, MOC3042M, MOC3043M)
0.01
VCC
Rin 1
2
3
6
5
4240 VAC
HOT
NEUTRAL
360
*For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
330
MOC3041M
MOC3042M
MOC3043M 39 *
LOAD
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.78
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1
and R2, are optional 1k
.
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors,
R1 and R2, are optional 330
.
Note:
This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
Figure 14. Inverse-Parallel SCR Driver Circuit
(MOC3031M, MOC3032M, MOC3033M)
VCC
Rin
1
2
3
6
5
4
115 VAC
SCR
180
R1 D1
SCR
MOC3031M
MOC3032M
MOC3033M
R2 D2
LOAD
Figure 15. Inverse-Parallel SCR Driver Circuit
(MOC3041M, MOC3042M, MOC3043M)
VCC
Rin
1
2
3
6
5
4
240 VAC
SCR
360
R1 D1
SCR
MOC3041M
MOC3042M
MOC3043M
R2 D2
LOAD
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.79
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Package Dimensions
8.13–8.89
6.10–6.60
Pin 1
64
13
0.25–0.36
5.08 (Max.)
3.28–3.53
0.38 (Min.) 2.54–3.81
2.54 (Bsc)
(0.86)
0.41–0.51
1.02–1.78
0.76–1.14
8.13–8.89
6.10–6.60
Pin 1
64
13
0.25–0.36
5.08 (Max.)
3.28–3.53
0.38 (Min.) 2.54–3.81
2.54 (Bsc)
(0.86)
0.41–0.51
1.02–1.78
0.76–1.14
7.62 (Typ.)
15° (Typ.)
0.20–0.30
0.20–0.30
10.16–10.80
Through Hole 0.4" Lead Spacing
Surface Mount
Rcommended Pad Layout
(1.78)
(2.54)
(1.52)
(7.49)
(10.54)
(0.76)
8.13–8.89
Note:
All dimensions in mm.
6.10–6.60
8.43–9.90
Pin 1
64
13
0.25–0.36
2.54 (Bsc)
(0.86)
0.41–0.51
1.02–1.78
0.76–1.14
0.38 (Min.)
3.28–3.53
5.08
(Max.) 0.20–0.30
0.16–0.88
(8.13)
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.710
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Ordering Information
Marking Information
Option
Order Entry Identifier
(Example) Description
No option MOC3031M Standard Through Hole Device
S MOC3031SM Surface Mount Lead Bend
SR2 MOC3031SR2M Surface Mount; Tape and Reel
T MOC3031TM 0.4" Lead Spacing
V MOC3031VM VDE 0884
TV MOC3031TVM VDE 0884, 0.4" Lead Spacing
SV MOC3031SVM VDE 0884, Surface Mount
SR2V MOC3031SR2VM VDE 0884, Surface Mount, Tape and Reel
MOC3031V
1
2
6
43 5
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are
marked with date code ‘325’ or earlier are marked in portrait format.
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4 One digit year code, e.g., ‘3’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
X YY
Q
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.711
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)
Carrier Tape Specification
Reflow Profile
4.0 ± 0.1
Ø1.5 MIN
User Direction of Feed
2.0 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
24.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
21.0 ± 0.1
4.5 ± 0.20
0.1 MAX 10.1 ± 0.20
9.1 ± 0.20
Ø1.5 ± 0.1/-0
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
°C
Time (s)
0 60 180120 270
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
360
1.822°C/Sec Ramp up rate
33 Sec
©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com
MOC303XM, MOC304XM Rev. 1.0.711
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Product Status Definition
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The datasheet is for reference information only.
Rev. I49
n
MOC303XM, MOC304XM — 6-Pin DIP Zero-Cross Optoisolators Triac Driver Output (250/400 Volt Peak)