SPHWW1HDND25YHV33H - SAMSUNG - Datasheet.Directory

1#

Product Family Data Sheet Rev. 1.1 2016.04.15

High Voltage LED Series

Chip on Board

LC033B

Gen.2

High efficacy COB LED package,

well-suited for use in spotlight applications

Featur

es & Benefits

• Chip on Board (COB) solution makes it easy to design in

• Simple assembly reduces manufacturing cost

• Low thermal resistance

• InGaN/GaN MQW LED with long time reliability

• Completed 6,000 hours of LM-80 Testing

• ENEC certified: Integral LED Module

Applications

• Spotlight / Downlight

• LED Retrofit Bulbs

• Outdoor Illumination

2

Table of Contents

1. Characteristics ----------------------- 3

2. Product Code Information ----------------------- 6

3. Typical Characteristics Graphs ----------------------- 12

4. Outline Drawing & Dimension ----------------------- 15

5. Reliability Test Items & Conditions ----------------------- 16

6. Label Structure ----------------------- 17

7. Packing Structure ----------------------- 19

8. Precautions in Handling & Use ----------------------- 22

3

1. Characteristics

a) Absolute Maximum Rating

Item Symbol Rating Unit Condition

Ambient / Operating Temperature Ta -40 ~ +105 ºC -

Storage Temperature Tstg -40 ~ +120 ºC -

LED Junction Temperature Tj 150 ºC -

Case Temperature Tc 105 ºC *Note

Forward Current IF 1620 mA -

Power Dissipation PD 59.9 W -

ESD (HBM) - ±2 kV -

ESD (MM) - ±0.5 kV -

b) Electro-optical Characteristics (IF = 900 mA, Tc = 25 ºC)

Item Unit Rank Min. Typ. Max.

Forward Voltage (VF) V YH 32.5 35.5 38.5

Color Rendering Index (Ra) -

3 70 - -

5 80

( R9 > 0 ) - -

7 90 - -

Thermal Resistance (junction to chip point) ºC/W - 0.9 -

Beam Angle º

- 115 -

Nominal Power W 32.0

Eye Protection º

Risk 1 - -

Notes:

1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)

2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1

3) Max Tc=105 ℃ (at max current) is for ENEC condition. Refer to the derating curve, ‘3. Typical Characteristics Graph’

designed within the range.

4

c) Luminous Flux Characteristics (IF = 900 mA)

CRI (Ra)

Min.

Nominal

CCT (K)

Flux

Rank

Flux

Bin

Sorting1) @ Tc = 25 °C (lm)

Calculated Flux2) @ Tc = 85 °C (lm)

Min. Max. Min. Max.

70

3000 4P 41 4021 4570 3619 4113

42 4570 5118 4113 4606

4000 4P 41 4222 4798 3800 4318

42 4798 5374 4318 4836

5000 4P 41 4262 4844 3836 4359

42 4844 5425 4359 4882

80

2700 3G 41 4210 4485 3831 4081

42 4485 4761 4081 4332

3H 42 4485 4761 4081 4332

3000 3G 41 4478 4771 4075 4342

42 4771 5064 4342 4609

3H 42 4771 5064 4342 4609

3500 3G 41 4613 4915 4198 4472

42 4915 5216 4472 4747

3H 42 4915 5216 4472 4747

4000 3G 40 4437 4747 4037 4320

41 4747 5058 4320 4603

3H 41 4747 5058 4320 4603

5000 3G 40 4478 4792 4075 4361

41 4792 5105 4361 4646

3H 41 4792 5105 4361 4646

5700 3G 40 4478 4792 4075 4361

41 4792 5105 4361 4646

3H 41 4792 5105 4361 4646

90

2700 3Q 33 3527 3810 3210 3467

34 3810 4200 3467 3822

3000 3Q 33 3599 3887 3276 3538

34 3887 4277 3538 3892

3500 3Q 33 3707 4004 3374 3644

34 4004 4394 3644 3999

4000 3Q 33 3815 4121 3472 3750

34 4121 4511 3750 4105

95

2700 3J 31 2857 3175 2600 2889

32 3175 3492 2889 3178

3000 3J 31 2946 3273 2681 2978

32 3273 3600 2978 3276

3500 3J 31 3034 3371 2761 3068

32 3371 3708 3068 3375

Notes:

1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)

2) Calculated flux values are for reference only

3) Samsung maintains measurement toleran ce of: luminous flux = ±7 %, CRI = ±1

5

2. Product Code Information

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

S P H C W 1 H D N D 2 5 Y H R T 3 P

Digit PKG Information Code Specification

1 2 3 Samsung Package High Power SPH

4 5 Color WW Warm White (T/U/V/W Ranks)

CW Cool White (Q/R Ranks)

6 Product Version 1

7 8 Form Factor HD COB

9 Lens Type N No lens

10 Internal Code D LC033

11 Chip Type 2

12 CRI & Sorting Temperature

3 Min. 70

25 °C

5 Min. 80

7 Min. 90

8 Min 95

13 14 Forward Voltage (V) YH 32.5~38.5

15 CCT (K)

W 2700 K

Bin

Code:

WA,WB

(MacAdam

Ellipse)

V 3000 K VA, VB

(MacAdam

Ellipse)

VW, VX, VY, VZ

(ANSI bin)

U 3500 K UA, UB

(

MacAdam Ellipse)

T 4000 K TA, TB

(MacAdam

Ellipse)

TW, TX , TY, T Z

(ANSI bin)

R 5000 K RA

(MacAdam

Ellipse)

RW

, RX, RY, RZ (ANSI bi n)

Q 5700 K

Q

W, QX, QY, QZ (ANSI bin )

16 MacAdam / ANSI

2 MacAdam 2-step

3 MacAdam 3-step

T ANSI bin

17 18 Lum i no us Flu x

3J

Bin

Code:

31, 32 (95 CRI)

3G 40, 41, 42 (80 CRI)

3H 41, 42 (80 CRI)

3Q 33, 34 (90 CRI)

4P 41, 42 (70 CRI)

6

a) Binning Structure (IF = 900 mA , Tc = 25 ºC)

CRI (Ra)

Min.

Nominal

CCT (K) Product Code VF

Rank

Color

Rank

Chrom.

Bin

Flux

Rank

Flux

Bin

Flux Range

(Φv, lm)

70

3000 SPHWW1HDND23YHVT4P YH VT VW, VX

VY, VZ 4P

41

4021 ~ 4570

42

4570 ~ 5118

4000 SPHWW1HDND23YHTT4P YH TT TW, TX

TY, TZ 4P

41

4222 ~ 4798

42

4798 ~ 5374

5000 SPHCW1HDND23YHRT4P YH RT RW, RX

RY, RZ 4P

41

4262 ~ 4844

42

4844 ~ 5425

80

2700

SPHWW1HDND25YHW23G YH W2 WB 3G

41

4210 ~ 4485

42

4485 ~ 4761

SPHWW1HDND25YHW33G YH W3 WA, WB 3G

41

4210 ~ 4485

42

4485 ~ 4761

SPHWW1HDND25YHW23H

YH

W2

WB

3H

42

4485 ~ 4761

SPHWW1HDND25YHW33H

YH

W3

WA, WB

3H

42

4485 ~ 4761

3000

SPHWW1HDND25YHV23G YH V2 VB 3G

41

4478 ~ 4771

42

4771 ~ 5064

SPHWW1HDND25YHV33G YH V3 VA, VB 3G

41

4478 ~ 4771

42

4771 ~ 5064

SPHWW1HDND25YHV23H

YH

V2

VB

3H

42

4771 ~ 5064

SPHWW1HDND25YHV33H

YH

V3

VA, VB

3H

42

4771 ~ 5064

3500

SPHWW1HDND25YHU23G YH U2 UB 3G

41

4613 ~ 4915

42

4915 ~ 5216

SPHWW1HDND25YHU33G YH U3 UA, UB 3G

41

4613 ~ 4915

42

4915 ~ 5216

SPHWW1HDND25YHU23H

YH

U2

UB

3H

42

4915 ~ 5216

SPHWW1HDND25YHU33H

YH

U3

UA, UB

3H

42

4915 ~ 5216

4000

SPHWW1HDND25YHT23G YH T2 TB 3G

40

4437 ~ 4747

41

4747 ~ 5058

SPHWW1HDND25YHT33G YH T3 TA, TB 3G

40

4437 ~ 4747

41

4747 ~ 5058

SPHWW1HDND25YHT23H

YH

T2

TB

3H

41

4747 ~ 5058

SPHWW1HDND25YHT33H

YH

T3

TA, TB

3H

41

4747 ~ 5058

5000

SPHCW1HDND25YHR33G YH R3 RA 3G

40

4478 ~ 4792

41

4792 ~ 5105

SPHCW1HDND25YHRT3G YH RT RW, RX,

RY, RZ 3G

40

4478 ~ 4792

41

4792 ~ 5105

SPHCW1HDND25YHR33H

YH

R3

RA

3H

41

4792 ~ 5105

SPHCW1HDND25YHRT3H YH RT RW, RX,

RY, RZ 3H 41 4792 ~ 5105

5700

SPHCW1HDND25YHQT3G YH QT QW, QX

QY, QZ 3G

40

4478 ~ 4792

41

4792 ~ 5105

SPHCW1HDND25YHQT3H YH QT QW, QX

QY, QZ 3H 41 4792 ~ 5105

7

a) Binning Structure (IF = 900 mA, Tc = 25 ºC)

CRI (Ra)

Min.

Nominal

CCT (K) Product Code VF

Rank

Color

Rank

Chrom.

Bin

Flux

Rank

Flux

Bin

Flux Range

(Φv, lm)

90

2700

SPHWW1HDND27YHW23Q YH W2 WB 3Q

33

3527 ~ 3810

34

3810 ~ 4200

SPHWW1HDND27YHW33Q YH W3 WA, WB 3Q

33

3527 ~ 3810

34

3810 ~ 4200

3000

SPHWW1HDND27YHV23Q YH V2 VB 3Q

33

3599 ~ 3887

34

3887 ~ 4277

SPHWW1HDND27YHV33Q YH V3 VA, VB 3Q

33

3599 ~ 3887

34

3887 ~ 4277

3500

SPHWW1HDND27YHU23Q YH U2 UB 3Q

33

3707 ~ 4004

34

4004 ~ 4394

SPHWW1HDND27YHU33Q YH U3 UA, UB 3Q

33

3707 ~ 4004

34

4004 ~ 4394

4000

SPHWW1HDND27YHT23Q YH T2 TB 3Q

33

3815 ~ 4121

34

4121 ~ 4511

SPHWW1HDND27YHT33Q YH T3 TA, TB 3Q

33

3815 ~ 4121

34

4121 ~ 4511

95

2700

SPHWW1HDND28YHW23J YH W2 WB 3J

31

2857 ~ 3175

32

3175 ~ 3492

SPHWW1HDND28YHW33J YH W3 WA,WB 3J

31

2857 ~ 3175

32

3175 ~ 3492

3000

SPHWW1HDND28YHV23J YH V2 VB 3J

31

2946 ~ 3273

32

3273 ~ 3600

SPHWW1HDND28YHV33J YH V3 VA,VB 3J

31

2946 ~ 3273

32

3273 ~ 3600

3500

SPHWW1HDND28YHU23J YH U2 UB 3J

31

3034 ~ 3371

32

3371 ~ 3708

SPHWW1HDND28YHU33J YH U3 UA,UB 3J

31

3034 ~ 3371

32

3371 ~ 3708

8

b) Chromaticity Region & Coordinates (IF = 900 mA, Ta = 25 ºC)

Region CIE x CIE y Region CIE x CIE y

V rank (3000 K)

T rank (4000 K)

VW

0.4223 0.3990

VY

0.4345 0.4033

TW

0.3736 0.3874

TY

0.3871 0.3959

0.4345 0.4033 0.4468 0.4077

0.3871 0.3959 0.4006 0.4044

0.4431 0.4213 0.4562 0.4260

0.3828 0.3803 0.3952 0.3880

0.4299 0.4165 0.4431 0.4213

0.3703 0.3726 0.3828 0.3803

VX

0.4223 0.3990

VZ

0.4260 0.3854

TX

0.3703 0.3726

TZ

0.3828 0.3803

0.4147 0.3814 0.4373 0.3893

0.3828 0.3803 0.3952 0.3880

0.4260 0.3854 0.4468 0.4077

0.3784 0.3647 0.3898 0.3716

0.4345 0.4033 0.4345 0.4033

0.3670 0.3578 0.3784 0.3647

R rank (5000 K) Q rank (5700 K)

RW

0.3376 0.3616

RY

0.3463 0.3687

QW

0.3207 0.3462

QY

0.3290 0.3538

0.3463 0.3687 0.3551 0.3760

0.3290 0.3538 0.3376 0.3616

0.3451 0.3554 0.3533 0.3620

0.3290 0.3417 0.3371 0.3490

0.3371 0.3490 0.3451 0.3554

0.3215 0.3350 0.3290 0.3417

RX

0.3371 0.3490

RZ

0.3451 0.3554

QX

0.3215 0.3350

QZ

0.3290 0.3417

0.3451 0.3554 0.3533 0.3620

0.3290 0.3417 0.3371 0.3490

0.3440 0.3428 0.3515 0.3487

0.3290 0.3300 0.3366 0.3369

0.3366 0.3369 0.3440 0.3428

0.3222 0.3243 0.3290 0.3300

9

b) Chromaticity Region & Coordinates (IF = 900 mA, Ta = 25 ºC)

MacAdam Ellipse (WA, WB) MacAdam Ellipse (VA, VB)

Step C IE x C IE y θ a b Step CIE x C IE y θ a b

2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.4030 53.22 0.0056 0.0027

3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041

MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB)

Step C IE x C IE y θ a b Step CIE x C IE y θ a b

2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027

3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040

MacAdam Ellipse (RA)

Step C IE x C IE y θ a b

3-step 0.3447 0.3553 59.62 0.0082 0.0035

Note:

Samsung maintai ns me asur e ment t ole ran ce of: Cx, Cy = ±0.005

θ

CIE x,y

10

3. Typical Characteristics Graphs

a) Spectrum Distribution (IF = 900 mA, Tc = 25 ºC)

CCT: 2700 K CCT: 3000 K

CCT: 3500 K CCT: 4000 K

CCT: 5000 K CCT: 5700 K

11

b) Forward Current Characteristics (Tc = 25 ºC)

c) Temperature Characteristics (IF = 900 mA)

d) Color Shift Characteristics Tc = 25 ºC IF = 900 mA

12

e) Derating Curve

f) Beam Angle Characteristics (IF = 900 mA, Tc = 25 ºC)

13

4. Outline Drawing & Dimension

Item Dimension Tolerance Unit

Length 21.50 ±0.15 mm

Width 21.50 ±0.15 mm

Height 1.50 ±0.20 mm

Light Emitting Surface (LES) Diameter 17 ±0.15 mm

Note: Denoted produ ct information above is only an example

( 33W8027 : 33W, CRI80+, 2700K )

1. Unit: mm

2. Tolerance: ± 0.15 mm

1. Unit: mm

2. Tol erance: ± 0.2 mm

Tc point

Note

14

5. Reliability Test Items & Conditions

a) Test Items

Test Item Test Condition Test Hour / Cycle

Room Temperature

Life Test 25 ºC, IF = max 1000 h

High Temperature

Humidity Life Test 85 ºC, 85 % RH, DC Derating, IF = max 1000 h

High Temperature

Life Test

105 ºC, DC Derating, IF = max 1000 h

Low Temperature

Life Test -40 ºC, DC 1620 mA 1000 h

High Temperature

Storage 120 ºC 1000 h

Low Temperature

Storage -40 ºC 1000 h

Thermal Shock -45 ºC / 15 min ↔ 125 ºC / 15 min

temperature change in 5 min 200 cycles

Temperature Cycle

On/Off Test -40 ºC / 85 ºC each 20 min, 100 min transfer

power on/ off each 5 min, DC 900 mA 100 cycles

Temperature Humidity

Storage Test -10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH

(24 h / cycle) 100 cycles

ESD (HBM)

R

1

: 10 MΩ

R2: 1.5 kΩ

C: 100 pF

V: ±2 kV

5 times

ESD (MM)

R

1

: 10 MΩ

R2: 0 kΩ

C: 200 pF

V: ±0.5 kV

5 times

Vibration Test 20 ~ 80 H z (displacement: 0.06 inch, max. 20 g)

80 ~ 2 kHz (max. 20 g)

min. frequency ↔ max. frequency 4 min transfer 4 times

Mechanical Shock Test 1500 g, 0.5 ms

each of the 6 surfaces (3 axis x 2 sides) 5 times

Salt Spray Test 35 ºC, 5 % salt water

8 h spray, 16 h dwell 2 cycles

b) Criteria for Judging the Damage

Item Symbol Test Condition

(Tc = 25 ºC)

Limit

Min. Max.

Forward Voltage VF IF = 900 mA L.S.L. * 0.9 U.S.L. * 1.1

Lumino us Flu x Φv IF = 900 mA L.S.L * 0.7 U.S.L * 1.3

15

6. Label Structure

a) Label Structure

Note: Denoted rank code and product code above is only an example (see description on page 5)

Rank Code:

ⓐⓑ: Forward Voltage rank (refer to page 7-10)

ⓔⓕ: Luminous Flux bin (refer to page 7-10)

Aluminum Bag & Inner Box Outer Box

16

b) Lot Number

The lot number is composed of the following characters:

●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS

● : Production site (S: Giheung, Korea, G: Tianjin, China)

◎ : L (LED)

◇

: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)

◆ : Year (Y: 2014, Z: 2015, A: 2016, …)

□ : Month (1~9, A, B, C)

■ : Day (1~9, A, B~V)

△△△ : Product serial number (001 ~ 009)

▲▲▲

: Tray number (001 ~ 999)

17

7. Packing Structure

Packing material Max. quantity

in pcs of COB

Dimension (mm)

Length

Width

Height

Tolerance

Tray 40 322.6 135.9 10.8 1.0

Aluminum Bag 320 (8 trays) 450 230 - 10

PE Foam Pad - 280 130 10 2

Inner Box 320 (1 aluminum bag) 338 148 55 2

Outer Box 1,280 (4 i nn er bo xes) 351 308 120 5

Pallet 71,680 (56 outer boxes) 1000 1000 130 10

a) Packing Structure

BODY

TRAY

PE-FOAM

8ea

0ea

6ea

1ea

4ea

2ea

3ea

Cover Tray(1pcs)

HUMIDITY IND ICATOR

(Do not use Cobalt Dichloride.)

Body Tray(8pcs)

Taping (Taping Strength : feebly)

Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq

SILICA GEL(5g)

(Do not use Cobalt Dichloride.)

MBB bag

Heat Sealing

8body + 1cover tray / MBB bag

(MBB-BAG : Heat Sealing)

4 inner-box / Out-box

18

b) Tray

①

COVER

②

BODY

19

c) Aluminum Vinyl Packing Bag

d) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag

20

8. Precautions in Handling & Use

1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA

is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the

device.

2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped

from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at

temperature 0~40 ºC, 0~90 % RH).

3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:

a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or

b. Stored at <10 % RH

4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.

5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.

6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.

7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or

anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it

may cause da mag e or ev en d estr u cti on t o LE D d ev ice s. D a mage d LEDs may show some unus ual charac teri sti cs su ch a s

increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.

8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in

luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a

discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light

emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical

properties of materials used in luminaires and they must be carefully selected.

9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,

please pick at the handling area as indicated below.

Legal and additional information.

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