VLMTG3100-GS08 - VISHAY SEMICONDUCTOR

Vishay Semiconductors

VLMB/BG/TG31..

Document Number 81242

Rev. 1.1, 31-Aug-07

www.vishay.com

Standard SMD LED PLCC-2

FEATURES

• SMD LED with exceptional brightness

• Luminous intensity categorized

• Compatible with automatic placement

equipment

• EIA and ICE standard package

• Compatible with IR reflow, vapor phase and wave

solder processes according to CECC 00802 and

J-STD-020B

• Available in 8 mm tape

• Low profile package

• Non-diffused lens: excellent for coupling to light

pipes and backlighting

• Low power consumption

• Luminous intensity ratio in one packaging unit

IVmax/IVmin ≤ 1.6

• Lead (Pb)-free device

• Preconditioning: acc. to JEDEC level 2a

•

ESD-withstand voltage: > 1 kV acc. to MIL STD 883 D,

Method 3015.7

19225

DESCRIPTION

This device has been designed to meet the increasing

demand for InGaN technology.

The package of the VLMB/BG/TG31.. is the PLCC-2.

It consists of a lead frame which is embedded in a

white thermoplast. The reflector inside this package is

filled up with clear epoxy.

PRODUCT GROUP AND PACKAGE DATA

• Product group: LED

• Package: SMD PLCC-2

• Product series: standard

• Angle of half intensity: ± 60°

APPLICATIONS

• Automotive: backlighting in dashboards and

switches

• Telecommunication: indicator and backlighting in

telephone and fax

• Indicator and backlight for audio and video

equipment

• Indicator and backlight in office equipment

• Flat backlight for LCDs, switches and symbols

• General use

PARTS TABLE

PART COLOR, LUMINOUS INTENSITY TECHNOLOGY

VLMB3140-GS08 Blue, IV > 45 mcd InGaN on SiC

VLMB3140-GS18 Blue, IV > 45 mcd InGaN on SiC

VLMBG3100-GS08 Blue green, IV > 140 mcd InGaN on SiC

VLMBG3100-GS18 Blue green, IV > 140 mcd InGaN on SiC

VLMTG3100-GS08 True green, IV > 180 mcd InGaN on SiC

VLMTG3100-GS18 True green, IV > 180 mcd InGaN on SiC

www.vishay.com

Document Number 81242

Rev. 1.1, 31-Aug-07

Vishay Semiconductors

VLMB/BG/TG31..

Note:

1) Tamb = 25 °C, unless otherwise specified

2) Driving LED in reverse direction is suitable for short term application

Note:

1) Tamb = 25 °C, unless otherwise specified

2) in one Packing Unit IVmax/IVmin ≤ 1.6

Note:

1) Tamb = 25 °C, unless otherwise specified

2) in one Packing Unit IVmax/IVmin ≤ 1.6

ABSOLUTE MAXIMUM RATINGS1) VLMB3140, VLMBG3100, VLMTG3100

PARAMETER TEST CONDITION SYMBOL VALUE UNIT

Reverse voltage2) VR5V

DC Forward current Tamb ≤ 80 °C IF20 mA

Surge forward current tp ≤ 10 µs IFSM 0.2 A

Power dissipation PV84 mW

Junction temperature Tj110 °C

Operating temperature range Tamb - 40 to + 100 °C

Storage temperature range Tstg - 40 to + 100 °C

Thermal resistance junction/

ambient

mounted on PC board

(pad size > 16 mm2)RthJA 350 K/W

OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMB3140, BLUE

PARAMETER TEST CONDITION SYMBOL MIN TYP MAX UNIT

Luminous intensity2) IF = 20 mA IV45 100 mcd

Dominant wavelength IF = 20 mA λd462 470 476 nm

Peak wavelength IF = 20 mA λp464 nm

Angle of half intensity IF = 20 mA ϕ± 60 deg

Forward voltage IF = 20 mA VF34.2V

Reverse voltage IR = 10 µA VR5V

Temperature coefficient of VFIF = 20 mA TCV- 4 mV/K

Temperature coefficient of IVIF = 20 mA TCI- 0.4 %/K

OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMBG3100, BLUE GREEN

PARAMETER TEST CONDITION SYMBOL MIN TYP MAX UNIT

Luminous intensity2) IF = 20 mA IV140 220 mcd

Dominant wavelength IF = 20 mA λd496 505 514 nm

Peak wavelength IF = 20 mA λp502 nm

Angle of half intensity IF = 20 mA ϕ± 60 deg

Forward voltage IF = 20 mA VF34.2V

Reverse voltage IR = 10 µA VR5V

Temperature coefficient of VFIF = 20 mA TCV- 4 mV/K

Temperature coefficient of IVIF = 20 mA TCI- 0.2 %/K

Document Number 81242

Rev. 1.1, 31-Aug-07

www.vishay.com

Vishay Semiconductors

VLMB/BG/TG31..

Note:

1) Tamb = 25 °C, unless otherwise specified

2) In one Packing Unit IVmax/IVmin ≤ 1.6

Note:

Luminous intensity is tested at a current pulse duration of 25 ms and

an accuracy of ± 11 %.

The above type numbers represent the order groups which include

only a few brightness groups. Only one group will be shipped on

each reel (there will be no mixing of two groups on each reel).

In order to ensure availability, single brightness groups will not be

orderable.

In a similar manner for colors where wavelength groups are

measured and binned, single wavelength groups will be shipped on

any one reel.

In order to ensure availability, single wavelength groups will not be

orderable.

OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMTG3100, TRUE GREEN

PARAMETER TEST CONDITION SYMBOL MIN TYP MAX UNIT

Luminous intensity2) IF = 20 mA IV180 300 mcd

Dominant wavelength IF = 20 mA λd515 528 541 nm

Peak wavelength IF = 20 mA λp522 nm

Angle of half intensity IF = 20 mA ϕ± 60 deg

Forward voltage IF = 20 mA VF34.2V

Reverse voltage IR = 10 µA VR5V

Temperature coefficient of VFIF = 20 mA TCV- 3.5 mV/K

Temperature coefficient of IVIF = 20 mA TCI- 0.3 %/K

LUMINOUS INTENSITY CLASSIFICATION

GROUP LIGHT INTENSITY (MCD)

STANDARD OPTIONAL MIN MAX

P145 56

256 71

Q171 90

290 112

R1112 140

2140 180

S1180 224

2224 280

T1280 355

2355 450

U1450 560

2560 710

CROSSING TABLE

VISHAY OSRAM

VLMB3140 LBT673

VLMBG3100 LVT673

VLMTG3100 LTT673

COLOR CLASSIFICATION

GROUP

BLUE BLUE GREEN TRUE GREEN

DOM. WAVELENGTH (NM)

MIN. MAX. MIN. MAX. MIN. MAX.

2458 464

3462 468 496 502 515 523

4466 472 500 506 521 529

5470 476 504 510 527 535

6474 480 508 514 533 541

www.vishay.com

Document Number 81242

Rev. 1.1, 31-Aug-07

Vishay Semiconductors

VLMB/BG/TG31..

TYPICAL CHARACTERISTICS

Tamb = 25 °C, unless otherwise specified

Figure 1. Forward Current vs. Ambient Temperature for InGaN

Figure 2. Forward Current vs. Forward Voltage

Figure 3. Specific Luminous Flux vs. Forward Current

Tamb - Ambient Temperature (°C)

16806

IF - Forward Current (mA)

10 20 30 40 50 60 70 80 11010090

100

2.0 2.5 3.0 3.5 4.0 4.5 5.0

VF - Forward Voltage (V)

19918

IF - Forward Current (mA)

0.01

0.1

110 100

IF- Forward Current (mA)16194

I - Relative Luminous Intensity

Vrel

Figure 4. Relative Intensity vs. Wavelength

Figure 5. Relative Intensity vs. Wavelength

Figure 6. Relative Intensity vs. Wavelength

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

400 420 440 460 480 500 520 540 560

λ- Wavelength (nm)

16069

IV rel - Relative Luminous Intensity

blue

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

420 440 460 480 500 520 540 560 580 600

16070

blue green

I- Relative Luminous Intensity

Vrel

λ - Wavelength (nm)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

460 480 500 520 540 560 580 600 620

λ-Wavelength (nm)

16068

IV rel - Relative Luminous Intensity

true green

Document Number 81242

Rev. 1.1, 31-Aug-07

www.vishay.com

Vishay Semiconductors

VLMB/BG/TG31..

PACKAGE DIMENSIONS in millimeters

Figure 7. Dominant Wavelength vs. Forward Current

Figure 8. Dominant Wavelength vs. Forward Current

IF - Forward Current (mA)

16814

Dominant Wavelength λ(nm)

468

470

472

474

476

0 1020304050

blue

IF- Forward Current (mA)

16813

Dominant Wavelength λ(nm)

501

503

505

507

509

511

513

515

0 1020304050

blue green

Figure 9. Dominant Wavelength vs. Forward Current

Figure 10. Relative Luminous Intensity

IF- Forward Current (mA)

16812

Dominant Wavelength λ(nm)

524

526

528

530

532

534

536

538

0 1020304050

true green

0.4 0.2 0 0.2 0.4 0.6

95 10319 0.6

0.9

0.8

0°

30°

10° 20°

40°

50°

60°

70°

80°

0.7

1.0

IV rel - Relative Luminous Intensity

95 11314-1

Mounting Pad Layout

3.5 ± 0.2

0.9

1.75 ± 0.10

Pin identification

2.8+ 0.15

2.2

2.4

3+ 0.15

1.2

2.6 (2.8)

1.6 (1.9)

area covered with

solder resist

technical drawings

according to DIN

specifications

Drawing-No.: 6.541-5025.01-4

Issue: 8; 22.11.05

www.vishay.com

Document Number 81242

Rev. 1.1, 31-Aug-07

Vishay Semiconductors

VLMB/BG/TG31..

METHOD OF TAPING/POLARITY AND TAPE AND REEL

SMD LED (VLM3 - SERIES)

Vishay’s LEDs in SMD packages are available in an

antistatic 8 mm blister tape (in accordance with

DIN IEC 40 (CO) 564) for automatic component

insertion. The blister tape is a plastic strip with

impressed component cavities, covered by a top tape.

TAPING OF VLM.3..

REEL PACKAGE DIMENSION IN MM FOR

SMD LEDS, TAPE OPTION GS08

(= 1500 PCS.)

REEL PACKAGE DIMENSION IN MM FOR

SMD LEDS, TAPE OPTION GS18

(= 8000 PCS.) PREFERRED

Figure 11. Tape Dimensions in mm for PLCC-2

Adhesive T ape

Component Cavity

Blister T ape

94 8670

1.85

1.65

4.0

3.6

3.4

2.05

1.95

1.6

1.4

4.1

3.9

4.1

3.9

5.75

5.25

8.3

7.7

3.5

3.1

2.2

2.0

0.25

94 8668

Figure 12. Reel Dimensions - GS08

Figure 13. Reel Dimensions - GS18

180

178

Identification

4.5

3.5

2.5

1.5

13.00

12.75

63.5

60.5

14.4 max.

10.0

9.0

120°

94 8665

Label:

Vishay

Type

Group

Tape Code

Production

Code

Quantity

321

329

Identification

4.5

3.5

2.5

1.5

13.00

12.75

62.5

60.0

14.4 max.

10.4

8.4

120°

18857

Label:

Vishay

Type

Group

Tape Code

Production

Code

Quantity

Document Number 81242

Rev. 1.1, 31-Aug-07

www.vishay.com

Vishay Semiconductors

VLMB/BG/TG31..

SOLDERING PROFILE BARCODE PRODUCT LABEL

EXAMPLE:

A) Type of component

B) Manufacturing plant

C) SEL - selection code (bin):

e.g.: R2 = code for luminous intensity group

3 = code for color group

D) Date code year/week

E) Day code (e. g. 3: Wednesday)

F) Batch no.

G) Total quantity

H) Company code

DRY PACKING

The reel is packed in an anti-humidity bag to protect

the devices from absorbing moisture during

transportation and storage.

FINAL PACKING

The sealed reel is packed into a cardboard box. A

secondary cardboard box is used for shipping

purposes.

Figure 14. Vishay Lead (Pb)-free Reflow Soldering Profile

(acc. to J-STD-020B)

Figure 15. Double Wave Soldering of Opto Devices (all Packages)

100

150

200

250

300

0 50 100 150 200 250 300

Time (s)

Temperature (°C)

240 °C 245 °C

max. 260 °C

max. 120 s max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

19885

IR Reflow Soldering Profile for lead (Pb)-free soldering

Preconditioning acc. to JEDEC Level 2a

max. 2 cycles allowed

255 °C

235 °C...260 °C

2 K/s

ca. 200 K/s

ca. 2 K/s

second

wave

first wave

ca. 5 K/s

5 s

full line: typical

dotted line: process limits

Time (s)

Temperature (°C)

Lead Temperature

300

250

200

150

100

0100 150 200 250

948626-1

TTW Soldering

(acc. to CECC00802)

100 °C...130 °C

forced cooling

106

VISHAY

B C D E F G

19919

Aluminum bag

Label

Reel

15973

www.vishay.com

Document Number 81242

Rev. 1.1, 31-Aug-07

Vishay Semiconductors

VLMB/BG/TG31..

RECOMMENDED METHOD OF STORAGE

Dry box storage is recommended as soon as the

aluminum bag has been opened to prevent moisture

absorption. The following conditions should be

observed, if dry boxes are not available:

• Storage temperature 10 °C to 30 °C

• Storage humidity ≤ 60 % RH max.

After more than 672 h under these conditions moisture

content will be too high for reflow soldering.

In case of moisture absorption, the devices will recover

to the former condition by drying under the following

condition:

192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/

nitrogen) or

96 h at 60 °C + 5 °C and < 5 % RH for all device

containers or

24 h at 100 °C + 5 °C not suitable for reel

or tubes.

An EIA JEDEC Standard JESD22-A112 level 2a label

is included on all dry bags.

Example of JESD22-A112 level 2a label

ESD PRECAUTION

Proper storage and handling procedures should be

followed to prevent ESD damage to the devices

especially when they are removed from the antistatic

shielding bag. Electro-static sensitive devices warning

labels are on the packaging.

VISHAY SEMICONDUCTORS STANDARD

BAR CODE LABELS

The Vishay Semiconductors standard bar code labels

are printed at final packing areas. The labels are on

each packing unit and contain Vishay Semiconductors

specific data.

L E V E L

CAUTION

This bag contains

MOISTURE –SENSITIVE DEVICES

1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)

2. After this bag is opened devices that will be subjected to infrared reflow,

vapor-phase reflow, or equivalent processing (peak package body temp.

260°C) must be:

a) Mounted within

672 hours at factory condition of < 30°C/60%RH or

b) Stored at <10% RH.

3. Devices require baking before mounting if:

a) Humidity Indicator Card is >10% when read at 23°C + 5°C or

b) 2a or 2b is not met.

4. If baking is required, devices may be baked for:

192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen) or

96 hours at 60±5

Cand <5%RH For all device containers or

24 hours at 100±5°C Not suitable for reels or tubes

Bag Seal Date: ______________________________

(If blank, see bar code label)

Note: LEVEL defined by EIA JEDEC Standard JESD22-A113

19786

Document Number 81242

Rev. 1.1, 31-Aug-07

www.vishay.com

Vishay Semiconductors

VLMB/BG/TG31..

Ozone Depleting Substances Policy Statement

It is the policy of Vishay Semiconductor GmbH to

1. Meet all present and future national and international statutory requirements.

2. Regularly and continuously improve the performance of our products, processes, distribution and operating

systems with respect to their impact on the health and safety of our employees and the public, as well as their

impact on the environment.

It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as

ozone depleting substances (ODSs).

The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and

forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban

on these substances.

Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of

ODSs listed in the following documents.

1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively

2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental

Protection Agency (EPA) in the USA

3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.

Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting

substances and do not contain such substances.

We reserve the right to make changes to improve technical design

and may do so without further notice.

Parameters can vary in different applications. All operating parameters must be validated for each customer

application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or

unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and

expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such

unintended or unauthorized use.

Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany

Document Number: 91000 www.vishay.com

Revision: 18-Jul-08 1

Disclaimer

Legal Disclaimer Notice

Vishay

All product specifications and data are subject to change without notice.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf

(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein

or in any other disclosure relating to any product.

Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any

information provided herein to the maximum extent permitted by law. The product specifications do not expand or

otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed

therein, which apply to these products.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this

document or by any conduct of Vishay.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless

otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such

applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting

from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding

products designed for such applications.

Product names and markings noted herein may be trademarks of their respective owners.