Application Specification
Small Form- Factor Pluggable (SFP) DWDM
(Dense Wavelength Division Multiplexer) 114--13178
LOC B
1of 15
E2009 Tyco Electronics Corporation, Harrisburg, PA
All International Rights Reserved
TE logo and Tyco Electronics are trademarks.
*Trademark. Other products, logos, and company names used are the property of their respective owners.
TOOLING ASSISTANCE CENTER 1--800--722--1111
PRODUCT INFORMATION 1--800--522--6752
This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at www.tycoelectronics.com
Connector and Cage Assembly 06 JUL 09 Rev D
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and
illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of SFP DWDM connector and cage assembly to
interconnect SFP DWDM fiber optic transceivers to host printed circuit (pc) boards used in the communications
industry and peripheral component interconnect (PCI) applications. The connector is available in 20 positions
with contact spacing on 0.8--mm centerlines. The cage assembly serves as a housing for the connector and
transceiver. The cage assembly is designed to be bezel--mounted.
The connector is a housing with right--angle surface mount contacts. The connector features an embossed
triangle for Pin 1 identification, a chamfered corner for orientation, alignment posts that provide stability for
placement on the host pc board, standoffs to allow easy pc board cleaning after soldering, and a card entry slot
that accepts a 1.0+0.1--mm thick integrated circuit card housed in the transceiver.
The cage assembly is a frame with a cavity and a port having compliant pin contacts for mechanical retention
to the host pc board and electromagnetic interference (EMI) suppression pins to provide EMI suppression. The
cavity accepts a heat sink (if used) and the port accepts the transceiver. The cage assembly features a hard
stop which controls the insertion depth of the transceiver and a transceiver locking latch which holds the
transceiver in place. Along the front perimeter of the cage assembly are EMI suppression springs which
impede any EMI emissions coming from the mated transceiver.
The dust cover is used to prevent contaminants from entering the chassis when the transceiver is not installed.
The connectors are supplied in tape--mounted form for manual or high--speed automatic machine placement
(typically vacuum pick and place). The cage assemblies are supplied in thermo--formed tray packaging for
manual placement.
When corresponding with personnel, use the terminology provided in this specification to facilitate your
inquiries for information. Basic terms and features of this product are provided in Figure 1.
Figure 1
Cage AssemblyConnector
Surface Mount
Contacts
Housing
Card Entry
Slot
Standoff
(2 Places)
Alignment Post
(2 Places)
Pin 1 Identifier
(Triangle) Chamfered
Corner
EMI Suppression
Spring (9 Places)
Transceiver
Locking Latch
Compliant Pin
Contacts (9 Places)
Hard Stop
EMI Suppression
Pin(9Places)
Frame
Dust Cover
Cavity
Port
Attachment Latch
(4 Places)
NOTE
i
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D2 of 15 Tyco Electronics Corporation
In applications where heat dissipation is necessary, a heat sink can be used. The heat sink must be chosen to
meet the need of the specific application. A sample of available heats sinks are shown in Figure 2.
These heat sinks are designed to be attached to the cage assembly using a clip. This type allows insertion and
extraction of the transceiver while maintaining the necessary contact between the heat sink and the
transceiver. Sample part numbers and basic terms and features of these products are provided in Figure 2.
ClipHeat Sink Locking Window
(4 Places)
Release Aperture
(2 Places)
Pins
Raised Boss
HEAT SINK
C
L
I
P
4.2--mm Pins 6.5--mm Pins 13.5--mm Pins CLIP
1829903--2 1829904--2 1829905--2 1367646--1
Figure 2
2. REFERENCE MATERIAL
2.1. Revision Summary
Revisions to this application specification include:
SUpdated document to corporate requirements
2.2. Customer Assistance
Reference Product Base Part Numbers 1367073 (connector) and 1367643 (cage assembly) and Product Code
K639 are representative of SFP DWDM connector and cage assembly. Use of these numbers will identify the
product line and expedite your inquiries through a service network established to help you obtain product and
tooling information. Such information can be obtained through a local Representative or, after purchase, by
calling PRODUCT INFORMATION at the number at the bottom of page 1.
2.3. Drawings
Customer Drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the Customer Drawings and this specification or with any other technical
documentation supplied, the information contained in the Customer Drawings takes priority.
2.4. Manuals
Manual 402--40 can be used as a guide to soldering. This manual provides information on various flux types
and characteristics with the commercial designation and flux removal procedures. A checklist is included in the
manual as a guide for information on soldering problems.
2.5. Standards and Publications
Standards and publications developed by the Electronic Industries Alliance (EIA) provide industry test and
performance requirements. The document available which pertains to this product is:
EIA--364--52, “Solderability of Contact Terminations Test Procedure for Electrical Connectors and Sockets.”
2.6. Specifications
Product Specifications 108--1949 (connector) and 108--1950 (cage assembly) provides product performance
and test information.
Workmanship Specification 101--21 provides solder fillet requirements for the connector.
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D 3 of 15Tyco Electronics Corporation
2.7. Instructional Material
Instruction Sheets (408--series) provide product assembly instructions or tooling setup and operation
procedures. Documents available which pertain to this product are:
408--9816 Handling of Reeled Products
408--10084 SFP DWDM Connectors and Cage Assembly
3. REQUIREMENTS
3.1. Safety
Do not stack component packages so high that the shipping containers buckle or deform.
3.2. Limitations
The connectors are designed to operate in a temperature range of --55_to 85_C[--67_to 185_F].
The top surface of the transceiver must maintain a flatness of 0.08.
3.3. Material
The connector housing is made of liquid crystal polymer (LCP) thermoplastic, UL 94--V--0. The surface mount
and compliant pin contacts are made of phosphor bronze plated with gold over gold flash and underplated with
nickel. The cage assembly is made of copper alloy plated with tin. The dust cover is made of thermoplastic.
The heat sink is made of cast aluminum plated with electroless nickel, and the clip is made of stainless steel.
3.4. Storage
A. Ultraviolet Light
Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector
material.
B. Shelf Life
The connector and cage assembly should remain in the shipping containers until ready for use to prevent
deformation to any protruding parts. The connectors and cage assemblies should be used on a first in, first
out basis to avoid storage contamination that could adversely affect performance.
C. Reeled Components
The connectors are supplied in reels on carrier tapes approved under EIA--481, “8--mm Through 200--mm
Embossed Carrier Taping and 8--mm and 12--mm Punched Carrier Taping of Surface Mount Components
for Automatic Handling.” These reels have a diameter of 330 with 480 connectors per reel. Store coil
wound reels horizontally and traverse wound reels vertically.
Refer to Section 5 for carrier tape dimensions.
3.5. Chemical Exposure
Do not store connectors or cage assemblies near any chemical listed below as they may cause stress
corrosion cracking in the contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.6. Host PC Board
A. Material and Thickness
The host pc board material shall be glass epoxy (FR--4 or G--10). The minimum board thickness must be
1.57 for mounting the connector and cage assembly to one side of the board. For mounting to both sides
of the board, the board thickness range must be 3.0 through 3.6.
Contact PRODUCT INFORMATION at the number listed at the bottom of page 1 for suitability of other board
materials.
NOTE
i
NOTE
i
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D4 of 15 Tyco Electronics Corporation
B. Tolerance
Maximum allowable bow of the host pc board shall be 0.08 over the length of the cage assembly.
The coplanarity of the host pc board circuit pads must be 0.03.
C. Circuit Pads
The circuit pads must be solderable in accordance with EIA--364--52.
D. Hole Dimension
The holes for the connector alignment posts and cage assembly compliant pin contacts must be drilled
and plated through to prevent stubbing during placement. Holes for the EMI suppression pins must be
drilled and can be used with or without plating. Recommended drilled hole diameter, plating type and
thickness, and finished hole size are provided in Figure 3.
Recommended Hole Dimensions
For Cage Assembly Compliant Pin Contacts and Connector Alignment Posts
A
Drilled Hole Diameter
B
Finished Hole Diameter
After Plating
0.025--0.050
Copper Plating (Max Hardness 150 Knoop)
0.010--0.025
Tin--Lead Plating
Pad Width (Equals Finished
Hole Diameter Plus 0.51)
Trace Width (As Required)
DIMENSION
HOLE A
Drilled Hole Diameter
B
Finished Hole Diameter
(After Plating, If Applicable)
Contact Alignment Post —1.55+0.05
C
o
m
p
l
i
a
n
t
P
i
n
C
o
n
t
a
c
t
0.95+0.02 0.85+0.05
Compliant Pin ContactG
1.15+0.02 1.05+0.10
EMI Suppression Pin 0.95+0.05 0.95+0.05
Figure 3
GRefer to the customer drawing of the cage assembly for the dimension that corresponds to each compliant pin contact.
E. Layout
The host pc board holes and circuit pads must be precisely located to ensure proper placement and
optimum performance of the connector and cage assembly. The layout must be designed using the
dimensions provided on the customer drawing for the specific connector and cage assembly. A sample
layout is provided in Figure 4.
When mounting cage assemblies to both sides of the board, the same EMI suppression pin holes must be
shared by the cage assemblies on the opposite side of the board.
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D 5 of 15Tyco Electronics Corporation
Figure 4 (Cont’d)
Sample Recommended PC Board Layout
(Connector and Cage Assembly)
Datum and Basic Dimension Established by Customer
Pads and Vias and Chassis Ground
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D6 of 15 Tyco Electronics Corporation
Figure 4 (End)
Detail X
1.70
1.70
Pin 11
Pin 20
3.68
8.48 10.53
Pin 10
0.9
Pin 1
9.6
10.93
11.93
9¢0.8
2¢1.55+0.05
0.1 A B
20¢0.50+0.03
0.06 A B
3.2
5
7.1
2.00+0.05
0.06 A B
3.7. Solder Paste Characteristics
1. Alloy type shall be:
Tin--lead solder—63 Sn/37 Pb, 60 Sn/40 Pb, or 62 Sn/36 Pb/2 Ag
Lead--free solder—compatible with pure tin or gold, for example, SAC305 (96.5 Sn/3 Ag/0.5 Cu or
SAC405 (95.5 Sn/4 Ag/0.5 Cu)
2. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.
3. Paste will be at least 80% solids by volume.
4. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).
5. Minimum viscosity of screen print shall be 5¢10% cp (centipoise).
6. Minimum viscosity of stencil print shall be 7.5¢10% cp (centipoise).
3.8. Solder Volume
Minimum solder volume (V) (before curing) for each circuit pad is calculated by multiplying the pad length (L)
by the pad width (W) by the stencil thickness (T):
2.0(L)¢0.5(W)¢0.15(T) = 0.15 mm3(V)
Solder volume for each connector must be 0.15 mm3per contact solder tine.
Solder volume may vary depending on solder paste composition.
3.9. Solder Paste Thickness
Solder paste thickness for the connector contact solder tines must be at least 0.15.
3.10. Stencil
The stencil aperture is determined by the circuit pad size and stencil thickness. It may be any shape as long as
it prevents solder bridging from one pad to another. Generally, a thinner stencil will need a larger aperture to
maintain the given volume of solder paste. The stencil should be 0.15 thick. The stencil layout must be
designed using the dimensions provided on the customer drawing for the specific connector.
NOTE
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SFP DWDM Connector and Cage Assembly 114- 13178
Rev D 7 of 15Tyco Electronics Corporation
3.11. Solder Mask
When soldering, a solder mask is recommended between all circuit pads to minimize solder bridging between
pads. The mask must not exceed the height of the pad. If a trace is run between adjacent pads on the pc
board, a solder mask must be applied over the trace to prevent bridging and wicking of solder away from the
connector contact solder tines. Mask most suitable is Liquid Photo Imageable.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
3.12. Connector Placement
Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact
solder tines.
The connector must be soldered to the host pc board BEFORE seating the cage assembly; otherwise, the soldering
process will cause damage to the cage assembly.
A. Registration
The connector contact solder tines must be aligned with matching circuit pads and alignment posts aligned
with matching holes before placing the connector onto the host pc board.
B. Position
Optimally, the connector contact solder tines should be centered on the host pc board circuit pads.
However, slight misalignment is permissible as shown in Figure 5.
Host PC Board
Contact Solder Tine Centered on
PC Board Circuit Pad Preferred
Contact Solder Tine Overhang
Up to 50% is Permissible
Figure 5
C. Seating
Because the connector alignment posts are for clearance and fit only, the force required to seat the
connector is minimal. Apply only that force necessary to seat the contact solder tines into the top surface
of the solder paste. The alignment posts must be inserted into the host pc board holes and the standoffs
must be seated on the board. See Figure 6.
Figure 6
Host PC Board
Connector
Alignment Post (2 Places)
Inserted into Hole in PC Board
Contact Solder Tine
Seated on Circuit Pad
Standoff (2 Places)
Seated on Board
CAUTION
!
CAUTION
!
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D8 of 15 Tyco Electronics Corporation
3.13. Soldering
A. Process
The connector must be soldered using non--focused infrared (IR) reflow or equivalent soldering technique.
When mounting to both sides of the host pc board, the surface tension of the solder when it is in the
liquidus state will hold the connector on the board.
Reflow temperature and time may vary depending on the size of the host pc board and placement of other
components. The reflow temperature and approximate time to which the connector can be subjected is
specified in Figure 7.
Excessive temperatures may cause connector housing degradation or plating deterioration. It is recommended that
component temperatures not exceed 230_C [446_F] when using tin--lead solder and 260_C [500_F] when using
lead--free solder.
More Than 3 Minutes
3_C [37.4_F]
Per Second
100 Seconds
0.5_C[33_F]
Per Second
Equalization
Figure 7
20_C[68_F]
110_C [230_F]
160_C [320_F]
230_C [446_F]
Ramp--Up Reflow Cool--Down
Reflow Soldering Process Cycle
Pre--Heat Soldering Solidification
30 Seconds
3_C [37.4_F]
Per Second
Peak Dwell
20 Seconds
45 Seconds
3_C [37.4_F]
Per Second
Ambient Rate
Ambient Rate
Tin--Lead Solder
(Maximum 230_C [446_F] for 20 Seconds)
Lead--Free Solder
(Maximum 260_C [500_F] for 20 Seconds)
Time (Seconds)
250_C [482_F]
00.0 120.0 240.0 360.0
200_C [392_F]
150_C [302_F]
100_C [212_F]
50_C [122_F]
0
CAUTION
!
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D 9 of 15Tyco Electronics Corporation
B. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Cleaners must be free of dissolved flux and other
contaminants. It is recommended cleaning the pc board on its edge. If using aqueous cleaner, standard
equipment such as a soak--tank or an automatic in--line machine should be used. Common cleaning
solvents that will not the affect the connector for the time and temperature specified are listed in Figure 8.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Refer to the manufacturer’s Material Safety Data Sheet (MSDS) for characteristics and handling of cleaners.
Trichloroethylene and Methylene Chloride is not recommended because of harmful occupational and environmental
effects. Both are carcinogenic (cancer--causing).
If you have a particular cleaning solvent that is not listed, contact PRODUCT INFORMATION at the number at the
bottom of page 1 for recommendations.
CLEANER TIME TEMPERATURE
NAME TYPE
T
I
M
E
(Minutes)
T
E
M
P
E
R
A
T
U
R
E
(Maximum)
ALPHA 2110 Aqueous 1132_C [270_F]
Isopropyl Alcohol Solvent 5100_C [212_F]
KESTER 5778 Aqueous 5100_C [212_F]
KESTER 5779 Aqueous 5100_C [212_F]
LONCOTERGE 520 Aqueous 5100_C [212_F]
LONCOTERGE 530 Aqueous 5100_C [212_F]
Figure 8
C. Drying
When drying cleaned assemblies and host pc boards, make certain that temperatures do not exceed 85_C
[185_F]. Excessive temperatures may cause connector housing degradation.
3.14. Checking Installed Connector
All solder joints must conform to those specified in Workmanship Specification 101--21 and all other
requirements specified in this document. The installed connector must have solder fillets evenly formed around
each contact solder tine. Solder must have 95% minimum coverage over the circuit pad. See Figure 9.
Figure 9
Solder Fillet Even Formed Around
Each Contact Solder Tine
95% Minimum Solder
Coverage Over Circuit Pad
Host PC Board
Connector
ALPHA is a trademark of Cookson Group, Inc. KESTER is a trademark of Kester, Inc. LONCOTERGE is a trademark of Union Carbide Corp.
DANGER
NOTE
i
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D10 of 15 Tyco Electronics Corporation
3.15. Cage Assembly Placement
The connector must be soldered to the host pc board BEFORE seating the cage assembly.
A. Registration
The compliant pin contacts and EMI suppression pins must be aligned with matching holes in the host pc
board, then inserted into the pc board simultaneously to prevent twisting or bending of these parts.
B. Seating
The force used to seat the cage assembly must be applied evenly to prevent deformation or other damage
to the compliant pin contacts. Apply only that force necessary to seat the shoulders of the compliant pins
onto the host pc board to the dimension shown in Figure 10.
A pc board support fixture must be used to provide proper support for the host pc board and to prevent damage to the
host pc board and its adjacent components. Refer to Section 5 for design requirements.
Cage Assembly
Host PC Board EMI Suppression
Pins
Figure 10
0.05 Max
Shoulder of Compliant Pin
to Host PC Board
3.16. Heat Sink and Clip
The heat sink and clip must be installed onto the cage assembly AFTER placement of the cage assembly onto the
host pc board and BEFORE installation of the cage assembly into the bezel.
The heat sink must be placed on the cage assembly and secured to the cage assembly using the clip. After the
heat sink and clip are installed, the following requirements must apply (refer to Figure 11):
— the perimeter of the heat sink must be flush with the top of the frame of the cage assembly
— the raised boss must be centered in the cavity of the cage assembly
— the clip locking windows must be fully latched onto the attachment latches of the cage assembly
Any heat sink used must be flush with and securely attached to the cage assembly.
NOTE
i
CAUTION
!
NOTE
i
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D11 of 15Tyco Electronics Corporation
Figure 11
Perimeter of
Heat Sink
Attachment Latch
(4 Places)
Locking Window (4 Places)
Clip
Top of Frame of
Cage Assembly
Raised Boss
Cavity
3.17. Bezel
A. Thickness
The bezel thickness range shall be 0.8 through 2.6.
B. Cutout
The bezel must provide a cutout that allows proper mounting of the cage assembly. The cage assembly
EMI suppression springs must be compressed by the bezel in order to provide an electrical ground
between the cage assembly and bezel for EMI suppression. Care must be used to avoid interference
between adjacent cage assemblies and other components. The minimum allowable distance between
cage assemblies must be considered to ensure proper assembly. Dimensions for bezel cutout and
minimum allowable distance between cutouts are shown in Figure 12.
3.18. Installing Cage Assembly onto Bezel
The cage assembly (with host pc board) must be installed onto the bezel so that the port of the cage assembly
is centered over the cutout of the bezel. The bezel and host pc board must be positioned in relation to each
other to avoid interference with the function of the cage assembly transceiver locking latch and to ensure
proper function of the EMI suppression springs. This relationship must conform to the dimensions given in
Figure 12.
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D12 of 15 Tyco Electronics Corporation
Reco
m
m
e
n
ded
B
e
z
e
l
Cutout (
M
i
n
i
m
u
m
P
i
tc
h
)
a
n
d
Host PC Board and Bezel Position
A
B
C
Cutout Centerline to Cutout Centerline
Bezel Thickness: 0.8--2.6
Cutout in Bezel
Y
Y
Note: Not to Scale
Section Y--Y
2.9+0.90 (Distance
Between Back of
Bezel and Front of
Host PC Board)
D
(Bottom of Cutout
in Bezel to Top of
Host PC Board)
Host PC Board
Host PC Board
10 (Ref)
0.30 Maximum Radius
(4 Places Each Cutout)
Bezel
DIMENSION +0.10
ABCD
15.25 16.25 10.40 0.40
Figure 12
3.19. Checking Installed Cage Assembly
After installation, the cage assembly EMI suppression springs must be compressed by the bezel. A slight bow
in the cage assembly is permitted. The bezel must not interfere with the function of the transceiver locking
latch. The bezel and host pc board must be positioned according to the dimensions shown in Figure 13.
0.40+0.10
(Bottom of Cutout in Bezel
to Top of Host PC Board)
2.9+0.90
(Distance Between Back of Bezel
and Front of Host PC Board)
Host
PC Board
Bezel Cutout
Cage
Assembly
Cage Assembly EMI Suppression
Springs Compressed By Bezel
Cage Assembly
Transceiver
Locking Latch
Slightly Raised
Front View Side View
10 (Ref)
Bezel
Connector
Host
PC Board
Figure 13
Heat Sink
(Ref)
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D13 of 15Tyco Electronics Corporation
3.20. Dust Cover
The dust cover must be installed into the port of the cage assembly when the transceiver is not mated with the
cage assembly.
3.21. Removal
A. Heat Sink
The cage assembly (and host pc board) must be removed from the bezel before the heat sink and clip can
be removed from the cage assembly. The heat sink must be removed according to the following:
1. Insert the tip of the tool (such as a small screwdriver) behind either release aperture of the clip, and
rotate the tool until the corresponding locking windows are released from the attachment latches of the
cage assembly. Repeat this step for the remaining release aperture. Refer to Figure 14.
2. Lift the clip and heat sink from the cage assembly.
Figure 14
Release Aperture
of Clip
Locking Window
(4 Places)
Attachment Latch
(4 Places)
B. Cage Assembly
The heat sink must be removed from the cage assembly before removing the cage assembly from the
host pc board. A flat metal bar (or similar object) can be inserted into the port of the cage assembly, but
the object MUST NOT touch the connector; otherwise, damage to the contacts could occur, then the cage
assembly can be removed by lifting it off of the board. The cage assembly MUST NOT be re--used after
removal.
C. Connector
The cage assembly must be removed from the host pc board before removing the connector. Standard
de--soldering methods must be used to remove the connector from the host pc board. The connector
MUST NOT be re--used after removal.
3.22. Repair
The connector and cage assembly are not repairable. Any defective or damaged products MUST NOT be
used.
4. QUALIFICATION
SFP DWDM connectors are Recognized by Underwriters Laboratories Inc. (UL) in File E28476.
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D14 of 15 Tyco Electronics Corporation
5. TOOLING
No tooling is required for placement of the cage assembly onto the host pc board.
No tooling is required for manual placement of the connector onto the host pc board. For automatic machine
placement, the robotic equipment must have a true position accuracy tolerance sufficient to properly locate the
connector. This includes gripper and fixture tolerances as well as equipment repeatability. It must use the
connector datum surfaces to ensure reliable placement. See Figure 15.
A pc board support fixture must be used to provide proper support for the host pc board, and to prevent
damage to the host pc board and its adjacent components during seating of the cage assembly. It must have a
flat surface with holes or a channel wide and deep enough to receive any protruding components during
seating of the cage assembly on the host pc board. See Figure 15.
Feed Strip Carrier Dimensions for Connector
Robotic Equipment
Figure 15
PC Board Support Fixture
(Application Specific,
Customer Supplied)
SFP DWDM Connector and Cage Assembly 114- 13178
Rev D15 of 15Tyco Electronics Corporation
6. VISUAL AID
Figure 16 shows a typical application of SFP DWDM connector and cage assembly. This illustration should be
used by production personnel to ensure a correctly applied product. Applications which DO NOT appear
correct should be inspected using the information in the preceding pages of this specification and in the
instructional material shipped with the product or tooling.
FIGURE 16. VISUAL AID
CONTACT SOLDER TINES MUST
BE SEATED ON CIRCUIT PADS
SOLDER FILLET MUST BE
FORMED EVENLY AROUND
EACH CONTACT SOLDER TINE
STANDOFFS
MUST BE SEATED
ON PC BOARD
CONTACT SOLDER TINE
MUST BE CENTERED ON
CIRCUIT PADS (SLIGHT
MISALIGNMENT IS ALLOWED)
CAGE ASSEMBLY EMI
SUPPRESSION SPRINGS
MUST BE COMPRESSED
BY BEZEL
BEZEL MUST NOT INTERFERE WITH
FUNCTION OF CAGE ASSEMBLY
TRANSCEIVER LOCKING LATCH
ALL COMPLIANT PIN CONTACTS
BE INSERTED INTO MATCHING
PC BOARD HOLES WITH
SHOULDERS SEATED ON BOARD
CAGE ASSEMBLY MUST NOT
BE DAMAGED IN ANY WAY —
SLIGHT BOW IN CAGE
ASSEMBLY IS PERMITTED
DUST COVER (Not Shown) MUST
BE INSTALLED IN PORT WHEN
TRANSCEIVER IS NOT MATED
WITH CAGE ASSEMBLY
CONNECTOR MUST NOT BE
DAMAGED IN ANY WAY
ALIGNMENT POSTS MUST BE
FULLY INSERTED INTO MATCHING
PC BOARD HOLES
ALL EMI SUPPRESSION PINS MUST
BE FULLY INSERTED INTO
MATCHING PC BOARD HOLES
PERIMETER OF HEAT SINK MUST
BE FLUSH WITH TOP OF FRAME
OF CAGE ASSEMBLY
CLIP LOCKING WINDOWS MUST BE
FULLY LATCHED ONTO ATTACHMENT
LATCHES OF CAGE ASSEMBLY
