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Notice for TAIYO YUDEN products　
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
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▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
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MULTILAYER CERAMIC CAPACIT�RS
■PARTS NUMBER
J M K 3 1 6 △ B J 1 0 6 M L － T △ △＝Blank space
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫
①Rated voltage
Code Rated voltage［VDC］
P 2.5
A 4
J 6.3
L 10
E 16
T 25
G 35
U 50
H 100
Q 250
S 630
②Series name
Code Series name
M Multilayer ceramic capacitor
V Multilayer ceramic capacitor for high frequency
W LW reverse type multilayer capacitor
③End termination
Code End termination
K Plated
R High Reliability Application
④Dimension（L×W）
Type Dimensions
（L×W）［mm］ EIA（inch）
042 0.4×0.2 01005
063 0.6×0.3 0201
105 1.0×0.5 0402
0.52×1.0 ※ 0204
107 1.6×0.8 0603
0.8×1.6 ※ 0306
212 2.0×1.25 0805
1.25×2.0 ※ 0508
316 3.2×1.6 1206
325 3.2×2.5 1210
432 4.5×3.2 1812
Note : ※LW reverse type（□WK） only
⑤Dimension tolerance
Code Type L［mm］ W［mm］ T［mm］
△ ALL Standard Standard Standard
A
063 0.6±0.05 0.3±0.05 0.3±0.05
105 1.0±0.10 0.5±0.10 0.5±0.10
107 1.6＋0.15/－0.05 0.8＋0.15/－0.05 0.8＋0.15/－0.05
212 2.0＋0.15/－0.05 1.25＋0.15/－0.05
0.45±0.05
0.85±0.10
1.25＋0.15/－0.05
316 3.2±0.20 1.25±0.20 0.85±0.10
1.6±0.20
325 3.2±0.30 2.5±0.30 2.5±0.30
B
105 1.0＋0.15/－0.05 0.5＋0.15/－0.05 0.5＋0.15/－0.05
107 1.6＋0.20/－0 0.8＋0.20/－0 0.45±0.05
0.8＋0.20/－0
212 2.0＋0.20/－0 1.25＋0.20/－0 0.85±0.10
1.25＋0.20/－0
316 3.2±0.30 1.6±0.30 1.6±0.30
C 105 1.0＋0.20/－0 0.5＋0.20/－0 0.5＋0.20/－0
Note: P.6 Standard external dimensions △= Blank space
⑥Temperature characteristics code
■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAPTM））
Code Applicable
standard
Temperature
range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance
tolerance
Tolerance
code
BJ
JIS B －25～＋ 85 20 ±10％ ±10％ K
±20％ M
EIA X5R －55～＋ 85 25 ±15％ ±10％ K
±20％ M
B7 EIA X7R －55～＋125 25 ±15％ ±10％ K
±20％ M
C6 EIA X6S －55～＋105 25 ±22％ ±10％ K
±20％ M
C7 EIA X7S －55～＋125 25 ±22％ ±10％ K
±20％ M
LD(※) EIA X5R －55～＋ 85 25 ±15％ ±10％ K
±20％ M
△F JIS F －25～＋ 85 20 ＋30/－80％ ＋80/－20％ Z
EIA Y5V －30～＋ 85 25 ＋22－82％ ＋80/－20％ Z
Note : ※.LD Low distortion high value multilayer ceramic capacitor △= Blank space
MULTILAYER CERAMIC CAPACITORS
REFLOWWAV E
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▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
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■Temperature compensating type
Code Applicable
standard
Temperature
range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance
tolerance
Tolerance
code
CH
JIS CH
－55～＋125
20
0±60ppm/℃
±0.1pF B
±0.25pF C
±0.5pF D
EIA C0H 25
1pF F
±5％ J
±10％ K
CJ JIS CJ －55～＋125 20 0±120ppm/℃ ±0.25pF C
EIA C0J 25
CK JIS CK －55～＋125 20 0±250ppm/℃ ±0.25pF C
EIA C0J 25
UJ
JIS UJ
－55～＋125
20
－750±120ppm/℃
±0.25pF C
EIA U2J 25 ±0.5pF D
±5％ J
UK JIS UK －55～＋125 20 －750±250ppm/℃ ±0.5pF C
EIA U2K －55～＋125 25
SL JIS S －55～＋125 20 +350～－1000ppm/℃ ±5％ J
⑥Series code
（Super low distortion multilayer ceramic capacitor（CFCAPTM）only）
Code Series code
SD Standard
⑦Nominal capacitance
Code
（example） Nominal capacitance
0R5 0.5pF
010 1pF
100 10pF
101 100p
102 1,000pF
103 10,000pF
104 0.1μF
105 1.0μF
106 10μF
107 100μF
Note : R＝Decimal point
⑧Capacitance tolerance
Code Capacitance tolerance
B ±0.1pF
C ±0.25pF
D ±0.5pF
F ±1pF
J ±5％
K ±10％
M ±20％
Z ＋80/－20％
⑨Thickness
Code Thickness［mm］
C 0.2
D 0.2(Temperature compensating of 042type)
P 0.3
T
K 0.45
V 0.5
W
A 0.8
D 0.85(212type or more)
F 1.15
G 1.25
L 1.6
N 1.9
Y 2.0 max
M 2.5
⑩Special code
Code Special code
－ Standard
⑪Packaging
Code Packaging
F φ178mm Taping （2mm pitch）
T φ178mm Taping （4mm pitch）
P φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
W φ178mm Taping（1mm pitch）042type only
⑫Internal code
Code Internal code
△ Standard
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▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
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■STANDARD EXTERNAL DIMENSIONS
※ LW reverse type
Type( EIA ) Dimension [mm]
Ｌ Ｗ T *1 e
□MK042（01005） 0.4±0.02 0.2±0.02 0.2±0.02 C 0.1±0.03
D
□MK063（0201） 0.6±0.03 0.3±0.03 0.3±0.03 P 0.15±0.05
T
□MK105（0402） 1.0±0.05 0.5±0.05
0.2±0.02 C
0.25±0.10 0.3±0.03 P
0.5±0.05 V
□VK105（0402） 1.0±0.05 0.5±0.05 0.5±0.05 W 0.25±0.10
□WK105（0204）※ 0.52±0.05 1.0±0.05 0.3±0.05 P 0.18±0.08
□MK107（0603） 1.6±0.10 0.8±0.10 0.45±0.05 K 0.35±0.25
0.8±0.10 A
□MR107（0603） 1.6±0.10 0.8±0.10 0.8±0.10 Ａ 0.1～0.6
□WK107（0306）※ 0.8±0.10 1.6±0.10 0.5±0.05 Ｖ 0.25±0.15
□MK212（0805） 2.0±0.10 1.25±0.10
0.45±0.05 K
0.5±0.25 0.85±0.10 D
1.25±0.10 G
□MR212（0805） 2.0±0.10 1.25±0.10 1.25±0.10 Ｇ 0.25～0.75
□WK212（0508）※ 1.25±0.15 2.0±0.15 0.85±0.1 Ｄ 0.3±0.2
□MK316（1206） 3.2±0.15 1.6±0.15
0.85±0.10 D
0.5+0.35/-0.25
1.15±0.10 Ｆ
1.25±0.10 G
1.6±0.20 L
□MR316（1206） 3.2±0.15 1.6±0.15 1.6±0.20 Ｌ 0.25～0.85
□MK325（1210） 3.2±0.30 2.5±0.20
0.85±0.10 D
0.6±0.3
1.15±0.10 F
1.9±0.20 N
1.9+0.1/-0.2 Y
2.5±0.20 M
□MR325（1210） 3.2±0.30 2.5±0.20 1.9±0.20 N 0.3～0.9
2.5±0.20 M
□MK432（1812） 4.5±0.40 3.2±0.30 2.5±0.20 M 0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Type EIA（inch） Dimension Standard quantity［pcs］
［ｍｍ］ Code Paper tape Embossed tape
042 01005 0.2 C － 40000
D
063 0201 0.3 P 15000 －
T
105 0402
0.2 C 20000 －
0.3 P 15000 －
0.5 V
10000 －
W
0204 ※ 0.30 P
107 0603 0.45 K 4000 －
0.8 A
0306 ※ 0.50 V － 4000
212 0805
0.45 K 4000 －
0.85 D
1.25 G － 3000
0508 ※ 0.85 D 4000 －
316 1206
0.85 D 4000 －
1.15 F － 3000
1.25 G
1.6 L － 2000
325 1210
0.85 D
－ 2000
1.15 F
1.9 N
2.0 max Y
2.5 M － 500（T），1000（P）
432 1812 2.5 M － 500
Note : ※.LW Reverse type（□WK）
e
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▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
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󳓵󲺝󲺎󲺟󲺡󲺠󲹭󲺛󲺢󲺚󲺏󲺒󲺟
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺠󲺑󲹭󲺇󲹭󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󳙨󳙘󲹽󲹻󲺅󲺂󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺑󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺀󲺆󲹿󲺘󲺑󲹺󲺡 󲺀󲺆󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺁󲺄󲹿󲺘󲺑󲹺󲺡 󲺁󲺄󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺂󲺃󲹿󲺘󲺑󲹺󲺡 󲺂󲺃󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺃󲺅󲹿󲺘󲺑󲹺󲺡 󲺃󲺅󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺅󲹿󲹿󲺘󲺑󲹺󲺡 󲺅󲹿󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲹾󲹽󲺀󲺘󲺑󲹺󲺡 󲹾󲹽󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺔󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲹾󲹿󲺀󲺘󲺑󲹺󲺡 󲹾󲹿󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺔󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲹾󲺂󲺀󲺘󲺑󲹺󲺡 󲹾󲺂󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺒󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺀󲺀󲺀󲺘󲺑󲹺󲺡 󲹾󲺃 󲺀󲺀󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺙󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺁󲺄󲺀󲺘󲺑󲹺󲺡 󲹾󲹽 󲺁󲺄󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󳔤󲺀󲹾󲺃󲺡󲺦󲺝󲺒
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺠󲺑󲹭󲺇󲹭󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󳙨󳙘󲹾󲹻󲺃󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺙󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺅󲹿󲺀󲺘󲺙󲹺󲺡 󲺅󲹿󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲹿󲹽 󲺟
󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲹾󲹽󲺁󲺘󲺙󲹺󲺡 󲹽󲹻󲹾 󳁼 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲹿󲹽 󲺟
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺠󲺑󲹭󲺇󲹭󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󳙨󳙘󲹾󲹻󲹾󲺂󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺓󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺔󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺀󲺀󲺀󲺘󲺓󲹺󲺡 󲺀󲺀󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺔󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺀󲺆󲺀󲺘󲺓󲹺󲺡 󲺀󲺆󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺁󲺄󲺀󲺘󲺓󲹺󲺡 󲺁󲺄󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺂󲺃󲺀󲺘󲺓󲹺󲺡 󲺂󲺃󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺃󲺅󲺀󲺘󲺓󲹺󲺡 󲺃󲺅󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺙󲺼󲻄󲹭󲺑󲺶󲻀󲻁󲺼󲺿󲻁󲺶󲺼󲺻󲹭󲺕󲺶󲺴󲺵󲹭󲺣󲺮󲺹󲻂󲺲󲹭󲺚󲻂󲺹󲻁󲺶󲺹󲺮󲻆󲺲󲺿󲹭󲺐󲺲󲺿󲺮󲺺󲺶󲺰󲹭󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺼󲺿󲻀󲹵󲺐󲺓󲺬󲺙󲺑󲹶
󳔤󲹾󲹽󲺄󲺡󲺦󲺝󲺒
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹽󲹻󲺅󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺎󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺡󲺚󲺘󲹾󲹽󲺄󲺏󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺎󲹺󲺡 󲹿󲺂 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹽󲹻󲺅󲹸󲹽󲹻󲹿󲹽󲹼󲹺󲹽 󲺟
󳔤󲹿󲹾󲹿󲺡󲺦󲺝󲺒
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹾󲹻󲹿󲺂󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺔󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺔󲺚󲺘󲹿󲹾󲹿󲹭󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺔󲹺󲺡 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲹿󲺂󲻝󲹽󲹻󲹾󲹽 󲺟
󲺔󲺚󲺘󲹿󲹾󲹿󲺏󲺙󲺑󲹿󲹿󲺂󲺨󲺪󲺔󲹺󲺡 󲺥󲺂󲺟 󲹿󲹻󲹿 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲹿󲺂󲹸󲹽󲹻󲹿󲹽󲹼󲹺󲹽 󲺟
󳔤󲺀󲹾󲺃󲺡󲺦󲺝󲺒
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹾󲹻󲺃󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺙󳞦
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪 󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺢󲺚󲺘󲺀󲹾󲺃󲹭󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺙󲹺󲺡 󲺂󲹽 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲹿󲹽 󲺟
󲺔󲺚󲺘󲺀󲹾󲺃󲺏󲺙󲺑󲺁󲺄󲺂󲺨󲺪󲺙󲹺󲺡 󲺀󲺂 󲺥󲺂󲺟 󲺁󲹻󲺄 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲺀󲹽 󲺟
󲺡󲺚󲺘󲺀󲹾󲺃󲺏󲺙󲺑󲹾󲹽󲺃󲺨󲺪󲺙󲹺󲺡 󲹿󲺂 󲺥󲺂󲺟 󲹾󲹽 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲺀󲹽 󲺟
󳔤󲺀󲹿󲺂󲺡󲺦󲺝󲺒
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹾󲹻󲺆󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺛󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺢󲺚󲺘󲺀󲹿󲺂󲹭󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺛󲹺󲺡 󲺂󲹽 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹿󲹽󲹽 󲹾󲹻󲺆󲻝󲹽󲹻󲹿󲹽 󲺟
󲺚󲺲󲺱󲺶󲻂󲺺󲹺󲺕󲺶󲺴󲺵󲹭󲺣󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺚󲻂󲺹󲻁󲺶󲺹󲺮󲻆󲺲󲺿󲹭󲺐󲺲󲺿󲺮󲺺󲺶󲺰󲹭󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺼󲺿
󳔤󲹾󲹽󲺄󲺡󲺦󲺝󲺒
󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺏󲺗󲹭󲺇󲹭󲺏󲹼󲺥󲺂󲺟󳙨󳙘󲹽󲹻󲺅󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺎󳞦
󲺕󲺎󲺙󲺡
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲹽󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹾󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲺂󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹾󲺂󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹿󲹿󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹿󲹿󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺀󲺀󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲺀󲺀󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺁󲺄󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲺁󲺄󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺃󲺅󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲺃󲺅󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲹽󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹾󲹽󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲺂󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹾󲺂󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹿󲹿󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹿󲹿󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺀󲺀󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲺀󲺀󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲹽󲺁󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟
󲹷󲹾
󲹽󲹻󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟
󲺂󲹽
󲺀󲺂
󲺀󲺂
󲹿󲺂
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
󲺀󲺂
󲹾󲹽󲹽
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󲹭󲺡󲻆󲺽󲺲
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲹿󲺂
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󲹭󲺡󲻆󲺽󲺲
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󲹭󲺡󲻆󲺽󲺲
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾 󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿 󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀
󲹷󲺀
󲺨󲺺󲺺󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪
󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲
󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴
󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄
󲺤󲺇󲺤󲺮󲻃󲺲
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
󲻁󲺮󲺻󳁴
󲹭󲺨󳞣󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲹭󲺨󲺓󲺪
󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲
󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪
󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
22
■PARTS NUMBER
【Temperature Characteristic B7 : X7R , C7 : X7S】　0.8mm thickness（A）
HALT
Rated voltage x ％
HMK107 B7102[]A-T X7R 1000 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7152[]A-T X7R 1500 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7222[]A-T X7R 2200 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7332[]A-T X7R 3300 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7472[]A-T X7R 4700 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7682[]A-T X7R 6800 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7103[]A-T X7R 10000 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7153[]A-T X7R 15000 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7223[]A-T X7R 22000 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 B7333[]A-T X7R 33000 p ±10，±20 3.5 200 0.8±0.10 R
HMK107 C7104[]A-T X7S 0.1 μ ±10，±20 3.5 200 0.8±0.10 R
●212TYPE
【Temperature Characteristic BJ : B/X5R】　1.25mm thickness（G）
HALT
Rated voltage x ％
HMK212 BJ103[]G-T B X5R
*1
10000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ153[]G-T BX5R
*1
15000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ223[]G-T BX5R
*1
22000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ333[]G-T BX5R
*1
33000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ473[]G-T BX5R
*1
47000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ683[]G-T BX5R
*1
68000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ104[]G-T BX5R
*1
0.1 μ ±10，±20 3.5 200 1.25±0.10 R
HMK212 BJ224[]G-T BX5R
*1
0.22 μ ±10，±20 3.5 200 1.25±0.10 R
QMK212 BJ472[]G-T BX5R
*1
4700 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 BJ682[]G-T BX5R
*1
6800 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 BJ103[]G-T BX5R
*1
10000 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 BJ153[]G-T BX5R
*1
15000 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 BJ223[]G-T BX5R
*1
22000 p ±10，±20 2.5 150 1.25±0.10 R
【Temperature Characteristic BJ : B/X5R】　0.85mm thickness（D）
HALT
Rated voltage x ％
QMK212 BJ102[]D-T BX5R
*1
1000 p ±10，±20 2.5 150 0.85±0.10 R
QMK212 BJ152[]D-T BX5R
*1
1500 p ±10，±20 2.5 150 0.85±0.10 R
QMK212 BJ222[]D-T BX5R
*1
2200 p ±10，±20 2.5 150 0.85±0.10 R
QMK212 BJ332[]D-T BX5R
*1
3300 p ±10，±20 2.5 150 0.85±0.10 R
【Temperature Characteristic B7 : X7R】　1.25mm thickness（G）
HALT
Rated voltage x ％
HMK212 B7103[]G-T X7R 10000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7153[]G-T X7R 15000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7223[]G-T X7R 22000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7333[]G-T X7R 33000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7473[]G-T X7R 47000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7683[]G-T X7R 68000 p ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7104[]G-T X7R 0.1 μ ±10，±20 3.5 200 1.25±0.10 R
HMK212 B7224[]G-T X7R 0.22 μ ±10，±20 3.5 200 1.25±0.10 R
QMK212 B7472[]G-T X7R 4700 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 B7682[]G-T X7R 6800 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 B7103[]G-T X7R 10000 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 B7153[]G-T X7R 15000 p ±10，±20 2.5 150 1.25±0.10 R
QMK212 B7223[]G-T X7R 22000 p ±10，±20 2.5 150 1.25±0.10 R
【Temperature Characteristic B7 : X7R】　0.85mm thickness（D）
HALT
Rated voltage x ％
QMK212 B7102[]D-T X7R 1000 p ±10，±20 2.5 150 0.85±0.10 R
QMK212 B7152[]D-T X7R 1500 p ±10，±20 2.5 150 0.85±0.10 R
QMK212 B7222[]D-T X7R 2200 p ±10，±20 2.5 150 0.85±0.10 R
QMK212 B7332[]D-T X7R 3300 p ±10，±20 2.5 150 0.85±0.10 R
●316TYPE
【Temperature Characteristic BJ : B/X5R】　1.6mm thickness（L）
HALT
Rated voltage x ％
HMK316 BJ473[]L-T BX5R
*1
47000 p ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ683[]L-T BX5R
*1
68000 p ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ104[]L-T BX5R
*1
0.1 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ154[]L-T BX5R
*1
0.15 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ224[]L-T BX5R
*1
0.22 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ334[]L-T BX5R
*1
0.33 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ474[]L-T BX5R
*1
0.47 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 BJ105[]L-T BX5R
*1
1 μ ±10，±20 3.5 200 1.6±0.20 R
QMK316 BJ333[]L-T BX5R
*1
33000 p ±10，±20 2.5 150 1.6±0.20 R
QMK316 BJ473[]L-T BX5R
*1
47000 p ±10，±20 2.5 150 1.6±0.20 R
QMK316 BJ683[]L-T BX5R
*1
68000 p ±10，±20 2.5 150 1.6±0.20 R
QMK316 BJ104[]L-T BX5R
*1
0.1 μ ±10，±20 2.5 150 1.6±0.20 R
SMK316 BJ153[]L-T BX5R
*1
15000 p ±10，±20 2.5 120 1.6±0.20 R
SMK316 BJ223[]L-T BX5R
*1
22000 p ±10，±20 2.5 120 1.6±0.20 R
250
630
100
Rated voltage [V]
250
250
Thickness
*3
[mm]
Thickness
*3
[mm]
Soldering
R:Reflow
W:Wave
Capacitance
tolerance [％]
Capacitance
tolerance [％]
Thickness
*3
[mm]
Part number 1
Part number 2
100
100
Part number 2
Part number 2
tanδ
[％]
Temperature
characteristics
Temperature
characteristics
Part number 1
Part number 1 Part number 2
Part number 2
Capacitance
[F]
Capacitance
tolerance [％]
100
Rated voltage [V]
Rated voltage [V]
250
Rated voltage [V]
250
Part number 1
Part number 1
Part number 1
Rated voltage [V] Temperature
characteristics
Capacitance
[F]
Temperature
characteristics
Rated voltage [V]
Thickness
*3
[mm]
Thickness
*3
[mm]
Thickness
*3
[mm]
Soldering
R:Reflow
W:Wave
Soldering
R:Reflow
W:Wave
Soldering
R:Reflow
W:Wave
tanδ
[％]
Capacitance
tolerance [％]
tanδ
[％]
tanδ
[％]
tanδ
[％]
Part number 2
Capacitance
tolerance [％]
Temperature
characteristics
Capacitance
tolerance [％]
Temperature
characteristics
Soldering
R:Reflow
W:Wave
Soldering
R:Reflow
W:Wave
Capacitance
[F]
Capacitance
[F]
Capacitance
[F]
Capacitance
[F]
tanδ
[％]
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
23
■PARTS NUMBER
【Temperature Characteristic BJ : B/X5R】　1.15mm thickness（F）
HALT
Rated voltage x ％
SMK316 BJ102[]F-T B X5R
*1
1000 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 BJ152[]F-T BX5R
*1
1500 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 BJ222[]F-T BX5R
*1
2200 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 BJ332[]F-T BX5R
*1
3300 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 BJ472[]F-T BX5R
*1
4700 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 BJ682[]F-T BX5R
*1
6800 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 BJ103[]F-T BX5R
*1
10000 p ±10，±20 2.5 120 1.15±0.10 R
【Temperature Characteristic B7 : X7R】　1.6mm thickness（L）
HALT
Rated voltage x ％
HMK316 B7473[]L-T X7R 47000 p ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7683[]L-T X7R 68000 p ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7104[]L-T X7R 0.1 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7154[]L-T X7R 0.15 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7224[]L-T X7R 0.22 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7334[]L-T X7R 0.33 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7474[]L-T X7R 0.47 μ ±10，±20 3.5 200 1.6±0.20 R
HMK316 B7105[]L-T X7R 1 μ ±10，±20 3.5 200 1.6±0.20 R
QMK316 B7333[]L-T X7R 33000 p ±10，±20 2.5 150 1.6±0.20 R
QMK316 B7473[]L-T X7R 47000 p ±10，±20 2.5 150 1.6±0.20 R
QMK316 B7683[]L-T X7R 68000 p ±10，±20 2.5 150 1.6±0.20 R
QMK316 B7104[]L-T X7R 0.1 μ ±10，±20 2.5 150 1.6±0.20 R
SMK316 B7153[]L-T X7R 15000 p ±10，±20 2.5 120 1.6±0.20 R
SMK316 B7223[]L-T X7R 22000 p ±10，±20 2.5 120 1.6±0.20 R
【Temperature Characteristic B7 : X7R】　1.15mm thickness（F）
HALT
Rated voltage x ％
SMK316 B7102[]F-T X7R 1000 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 B7152[]F-T X7R 1500 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 B7222[]F-T X7R 2200 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 B7332[]F-T X7R 3300 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 B7472[]F-T X7R 4700 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 B7682[]F-T X7R 6800 p ±10，±20 2.5 120 1.15±0.10 R
SMK316 B7103[]F-T X7R 10000 p ±10，±20 2.5 120 1.15±0.10 R
●325TYPE
【Temperature Characteristic BJ : B/X5R】　2.5mm thickness（M）
HALT
Rated voltage x ％
HMK325 BJ225[]M-T 100 B X5R
*1
2.2 μ ±10，±20 3.5 200 2.5±0.20 R
【Temperature Characteristic BJ : B/X5R】　1.9mm thickness（N）
HALT
Rated voltage x ％
HMK325 BJ154[]N-T BX5R
*1
0.15 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 BJ224[]N-T BX5R
*1
0.22 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 BJ334[]N-T BX5R
*1
0.33 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 BJ474[]N-T BX5R
*1
0.47 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 BJ684[]N-T BX5R
*1
0.68 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 BJ105[]N-T BX5R
*1
1 μ ±10，±20 3.5 200 1.9±0.20 R
QMK325 BJ473[]N-T BX5R
*1
47000 p ±10，±20 2.5 150 1.9±0.20 R
QMK325 BJ104[]N-T BX5R
*1
0.1 μ ±10，±20 2.5 150 1.9±0.20 R
QMK325 BJ154[]N-T BX5R
*1
0.15 μ ±10，±20 2.5 150 1.9±0.20 R
QMK325 BJ224[]N-T BX5R
*1
0.22 μ ±10，±20 2.5 150 1.9±0.20 R
SMK325 BJ223[]N-T BX5R
*1
22000 p ±10，±20 2.5 120 1.9±0.20 R
SMK325 BJ333[]N-T BX5R
*1
33000 p ±10，±20 2.5 120 1.9±0.20 R
SMK325 BJ473[]N-T BX5R
*1
47000 p ±10，±20 2.5 120 1.9±0.20 R
【Temperature Characteristic BJ : B/X5R】　1.15mm thickness（F）
HALT
Rated voltage x ％
HMK325 BJ104[]F-T 100 B X5R
*1
0.1 μ ±10，±20 3.5 200 1.15±0.10 R
【Temperature Characteristic B7 : X7R】　2.5mm thickness（M）
Rated voltage [V] HALT
Rated voltage x ％
HMK325 B7225[]M-T 100 X7R 2.2 μ ±10，±20 3.5 200 2.5±0.20 R
【Temperature Characteristic B7 : X7R】　1.9mm thickness（N）
HALT
Rated voltage x ％
HMK325 B7154[]N-T X7R 0.15 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 B7224[]N-T X7R 0.22 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 B7334[]N-T X7R 0.33 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 B7474[]N-T X7R 0.47 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 B7684[]N-T X7R 0.68 μ ±10，±20 3.5 200 1.9±0.20 R
HMK325 B7105[]N-T X7R 1 μ ±10，±20 3.5 200 1.9±0.20 R
QMK325 B7473[]N-T X7R 47000 p ±10，±20 2.5 150 1.9±0.20 R
QMK325 B7104[]N-T X7R 0.1 μ ±10，±20 2.5 150 1.9±0.20 R
QMK325 B7154[]N-T X7R 0.15 μ ±10，±20 2.5 150 1.9±0.20 R
QMK325 B7224[]N-T X7R 0.22 μ ±10，±20 2.5 150 1.9±0.20 R
Rated voltage [V]
Temperature
characteristics
Rated voltage [V]
100
250
630
100
630
Thickness
*3
[mm]
Part number 1 Part number 2
Soldering
R:Reflow
W:Wave
100
Part number 1 Part number 2 Thickness
*3
[mm]
Temperature
characteristics
Temperature
characteristics
Capacitance
[F]
Capacitance
[F]
tanδ
[％]
Thickness
*3
[mm]
Soldering
R:Reflow
W:Wave
tanδ
[％]
Part number 1 Part number 2 Rated voltage [V]
Part number 1 Part number 2 Rated voltage [V]
250
630
tanδ
[％]
tanδ
[％]
Soldering
R:Reflow
W:Wave
Temperature
characteristics
Thickness
*3
[mm]
Soldering
R:Reflow
W:Wave
Thickness
*3
[mm]
Thickness
*3
[mm]
Thickness
*3
[mm]
tanδ
[％]
Capacitance
tolerance [％]
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Temperature
characteristics
tanδ
[％]
Capacitance
[F]
Capacitance
tolerance [％]
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
tanδ
[％]
Capacitance
[F]
Capacitance
tolerance [％]
Capacitance
tolerance [％]
Part number 1
Rated voltage [V] Temperature
characteristics
Part number 1
250
630
Part number 2
Part number 2 Rated voltage [V]
Rated voltage [V]
Part number 1 Part number 2
Temperature
characteristics
Part number 1 Part number 2
Thickness
*3
[mm]
Soldering
R:Reflow
W:Wave
Capacitance
tolerance [％]
Capacitance
[F]
Capacitance
tolerance [％]
Capacitance
[F]
Soldering
R:Reflow
W:Wave
Soldering
R:Reflow
W:Wave
Soldering
R:Reflow
W:Wave
1
3
▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.
Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).
CERAMIC CAPACITORS
24
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Type(EIA) Thickness Standard quantity [pcs]
mm code Paper tape Embossed tape
□MK042(01005) 0.2 C, D － 40000
□MK063(0201) 0.3 P, T 15000
－
□WK105(0204) ※ 0.3 P 10000
□MK105(0402)
0.2 C 20000
0.3 P 15000
0.5 V 10000
□VK105(0402) ※ 0.5 W
□MK107(0603)
□WK107(0306) ※
□MR107(0603)
0.45 K 4000
0.5 V － 4000
0.8 A
4000 －
□MK212(0805)
□WK212(0508) ※
□MR212(0805)
0.45 K
0.85 D
1.25 G － 3000
□MK316(1206)
□MR316(1206)
0.85 D 4000 －
1.15 F
－ 3000
1.25 G
1.6 L
2000
□MK325(1210)
□MR325(1210)
0.85 D
－
1.15 F
1.9 N
2.0max. Y
2.5 M 500（T）, 1000（P）
□MK432(1812) 2.5 M － 500
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Chip filled
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Type(EIA) Chip Cavity Insertion Pitch Tape Thicknes
Ａ Ｂ Ｆ Ｔ T1
□MK063(0201) 0.37 0.67
2.0±0.05
0.45max. 0.42max.
□WK105(0204) ※
0.65 1.15
□MK105(0402) （*1 C） 0.4max. 0.3max.
□MK105(0402) （*1 P） 0.45max. 0.42max.
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. Unit：mm
●Punched carrier tape （2mm pitch）
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ Ｔ
□MK105 (0402)
□VK105 (0402) 0.65 1.15 2.0±0.05 0.8max.
Unit：ｍｍ
●Punched carrier tape （4mm pitch）
Type(EIA) Chip Cavity Insertion Pich Tape Thickness
Ａ Ｂ Ｆ Ｔ
□MK107(0603)
□WK107(0306) ※
□MR107(0603)
1.0 1.8
4.0±0.1
1.1max.
□MK212(0805)
□WK212(0508) ※ 1.65 2.4 1.1max.
□MK316(1206) 2.0 3.6
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
●Embossed tape（4mm wide）
Type(EIA) Chp Cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
□MK042(01005) 0.23 0.43 1.0±0.02 0.5max. 0.25max.
Unit：mm
●Embossed tape（8mm wide）
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
□WK107(0306) ※ 1.0 1.8
4.0±0.1
1.3max. 0.25±0.1
□MK212(0805)
□MR212(0805) 1.65 2.4
3.4max. 0.6max.
□MK316(1206)
□MR316(1206)
2.0 3.6
□MK325(1210)
□MR325(1210)
2.8 3.6
Note： ※ LW Reverse type. Unit：mm
●Embossed tape（12mm wide）
Type(EIA) Chip Cavity Insertion Pitch Tape Thickness
Ａ Ｂ Ｆ K T
□MK432(1812) 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unit：mm
④Trailer and Leader
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-01
⑤Reel size
A B C D E R
φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0
T W
4mm wide tape 1.5max. 5±1.0
8mm wide tape 2.5max. 10±1.5
12mm wide tape 2.5max. 14±1.5 Unit：mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-01
Multilayer Ceramic Capacitors , Super Low Distortion Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Medium-High Voltage Multilayer Ceramic Capacitor
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
X7R, X7S : －55 to ＋125℃
X5 : －55 to ＋85℃
B : －25 to ＋85℃
2. Storage Temperature Range
Specified Value
X7R, X7S : －55 to ＋125℃
X5R : －55 to ＋85℃
B : －25 to ＋85℃
3. Rated Voltage
Specified Value 100VDC(HMK), 250VDC(QMK), 630VDC(SMK)
4. Withstanding Voltage（Between terminals）
Specified Value No breakdown or damage
Test Methods and
Remarks
Applied voltage : Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）
Duration : 1 to 5sec.
Carge/discharge current : 50mA max.
５．Insulation Resistance
Specified Value 100MΩμF or 10GΩ, whichever is smaller.
Test Methods and
Remarks
Applied voltage : Rated voltage（HMK, QMK）, 500V（SMK）
Duration : 60±5sec.
Charge/discharge current : 50mA max.
6．Capacitance （Tolerance）
Specified Value ±10%, ±20%
Test Methods and
Remarks
Masuring frequency : 1kz±10%
Measuring voltage : 1±0.2Vrms
Bias application : None
７．Dissipation Factor
Specified Value 3.5%max（HMK）
2.5%max（QMK, SMK）
Test Methods and
Remarks
Measuring frequency : 1kHz±10%
Measuring voltage : 1±0.2Vrms
Bas application : None
8．Temperature Characteristic of Capacitance
Specified Value
B : ±10%（－25 to ＋85℃）
X5R : ±15%（－55 to ＋85℃）
X7R : ±15%（－55 to ＋125℃）
X7S : ±22%（－55 to ＋125℃）
Test Methods and
Remarks
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Step B X5R、X7R、X7S
1 Minimum operating tempeature
2 20℃ 25℃
3 Maximum operating temperature
（C－C2） ×100（%）
C2
C : Capacitance value in Step 1 or Step 3
C2 : Capacitance value in Step 2
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-01
9．Deflection
Specified Value Appearance : No abnormality
Capacitance change : Within±10%
Test Methods and
Remarks
Warp : 1mm
Duration : 10sec.
Test board : Glass epoxy-resin substrate
Thicknss : 1.6mm
Capacitance measurement shall be conducted with the board bent.
10．Adhesive Strength of Terminal Electrodes
Specified Value No terminal separation or its indication.
Test Methods and
Remarks
Applied force : 5N
Duration : 30±5sec.
11．Solderability
Specified Value At least 95% of terminal electrode is covered by new solder
Test Methods and
Remarks
Eutectic solder Lead-free solder
Solder type H60A or H63A Sn-3.0Ag-0.5Cu
Solder temperature 230±5℃ 245±3℃
Duration 4±1 sec.
12．Resistance to Soldering
Specified Value
Appearance : No abnormality
Capacitance change : Within±15%（HMK）, ±10%（QMK, SMK）
Dissipation factor : Inital value
Insulation resistance : Initial value
Withstanding voltage （between terminals） : No abnormality
Test Methods and
Remarks
Preconditioning : Thermal treatment（at 150℃ for 1hr） Note1
Solder temperature : 270±5℃
Duration : 3±0.5sec.
Prehating conditions : 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
Recovery : 24±2hrs under the stadard condition Note3
13．Temperature Cycle （Thermal Shock）
Specified Value
Appearance : No abnormality
Capacitance change : Within±15%（HMK）, ±7.5%（QMK, SMK）
Dissipation factor : Initial value
Insulation resistance : Initial value
Test Methods and
Remarks
Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1
Conditions for 1 cycle
Step temperature（℃） Time（min.）
1 Minimum operating temperature 30±3min.
2 Normal temperature 2 to 3min.
3 Maximum operating temperature 30±3min.
4 Normal temperature 2 to 3min.
Number of cycles : 5 times
Recovery : 24±2hrs under the standard condition Note3
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-01
14．Humidity （Steady state）
Specified Value
Appearance : No abnormality
Capacitance change : Within±15%
Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK）.
Insulation resistance : 25MΩμF or 1000MΩ, whichever is smaller.
Test Methods and
Remarks
Preconditioning : Thermal treatment（at 150℃ for 1hr） Note1
Temperature : 40±2℃
Humidity : 90 to 95%RH
Duration : 500 ＋24/－0 hrs
Recovery : 24±2hrs under the standard condition Note3
15．Humidity Loading
Specified Value
Appearance : No abnormality
Capacitance change : Within±15%
Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK）.
Insulation resistance : 10MΩμF or 500MΩ, whichever is smaller.
Test Methods and
Remarks
According to JIS 5102 clause 9.9.
Preconditioning : Voltage treatment Note2
Temperature : 40±2℃
Humidity : 90 to 95%RH
Applied voltage : Rated voltage
Charge/discharge current : 50mA max.
Duration : 500 ＋24/－0 hrs
Recovery : 24±2hrs under the standard condition Note3
16．High Temperature Loading
Specified Value
Appearance : No abnormality
Capacitance change : Within±15%
Dissipation factor : 7%max（HMK）, 5%max（QMK, SMK）.
Insulation resistance : 50MΩμF or 1000MΩ, whichever is smaller.
Test Methods and
Remarks
According to JIS 5102 clause 9.10.
Preconditioning : Voltage treatment Note2
Temperature : Maximum operating temperature
Applied voltage : Rated voltage×2（HMK）
Rated voltage×1.5（QMK）
Rated voltage×1.2（SMK）
Charge/discharge current : 50mA max.
Duration : 1000 ＋24/－0 hrs
Recovery : 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the
test conditions, and kept at room temperature for 24±2hours.
Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted
under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
Precautions
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
Precautions
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
Technical
considerations
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
（unit: mm）
Wave-soldering
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 1.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Land patterns for PCBs
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 1.25 1.6 2.5 3.2
A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
Note：Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type 105 107 212
Size L 0.52 0.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
（2）Examples of good and bad solder application
Items Not eommended Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
Components near mounted
components
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical
stresses from board warp or deflection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
Technical
considerations
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
Items Not recommended Recommended
Single-sided mounting
Double-sided mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120μm
c Adhesives shall not contact land
Amount adhesive
After capacitors are bonded
4. Soldering
Precautions
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
considerations
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
［Reflow soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
⊿T
316type or less ⊿T≦150℃
⊿T
325type or more ⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
Technical
considerations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output : 20 W/ℓ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity : Below 70% RH
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
Technical
considerations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.