DSC1102/22 Low-Jitter Precision LVPECL Oscillator Features General Description * Low RMS Phase Jitter: <1 ps (typ.) * High Stability: 10 ppm, 20 ppm, 25 ppm, 50 ppm * Wide Temperature Range - Ext. Industrial: -40C to +105C - Industrial: -40C to +85C - Ext. Commercial: -20C to +70C * High Supply Noise Rejection: -50 dBc * Wide Frequency Range: 2.3 MHz to 460 MHz * Small Industry Standard Footprints: - 2.5 mm x 2.0 mm, 3.2 mm x 2.5 mm, 5.0 mm x 3.2 mm, and 7.0 mm x 5.0 mm * Excellent Shock and Vibration Immunity - Qualified to MIL-STD-883 * High Reliability - 20x Better MTF than Quartz Oscillators * Low Current Consumption * Supply Range of 2.25V to 3.63V * Standby and Output Enable Function * Lead Free and RoHS Compliant * LVDS and HCSL Versions Available The DSC1102 and DSC1122 series of high performance oscillators utilizes a proven silicon MEMS technology to provide excellent jitter and stability over a wide range of supply voltages and temperatures. By eliminating the need for quartz or SAW technology, MEMS oscillators significantly enhance reliability and accelerate product development, while meeting stringent clock performance criteria for a variety of communications, storage, and networking applications. Applications * Storage Area Networks - SATA, SAS, Fibre Channel * Passive Optical Networks - EPON, 10G-EPON, GPON, 10G-GPON * Ethernet - 1G, 10GBASE-T/KR/LR/SR, and FCoE * HD/SD/SDI Video and Surveillance 2019 Microchip Technology Inc. DSC1102 has a standby feature allowing it to completely power down when EN pin is pulled low; whereas for DSC1122, only the outputs are disabled when EN is low. Both oscillators are available in industry standard packages, including the smallest 2.5 mm x 2.0 mm, and are drop-in replacements for standard 6-pin LVPECL quartz crystal oscillators. Block Diagram Pin 1 ENABLE Pin 2 NC MEMS OSCILLATOR PLL Pin 3 GND TABLE 1: Pin 6 VDD TEMP SENSOR & COMPENSATION CIRCUITRY DIVIDER DRIVER Pin 5 OUTPUT Pin 4 OUTPUT OUTPUT ENABLE MODES EN Pin DSC1102 DSC1122 High Outputs Active Outputs Active NC Outputs Active Outputs Active Low Standby Outputs Disabled DS20006254A-page 1 DSC1102/22 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Supply Voltage .......................................................................................................................................... -0.3V to +4.0V Input Voltage .................................................................................................................................... -0.3V to VDD + 0.3V ESD Protection (HBM) ...............................................................................................................................................4 kV ESD Protection (MM) ............................................................................................................................................... 400V ESD Protection (CDM) ............................................................................................................................................1.5 kV Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Specifications: VDD = 3.3V; TA = +25C unless otherwise specified. Parameters Supply Voltage (Note 1) Supply Current Frequency Stability Sym. Min. Typ. Max. Units VDD 2.25 -- 3.63 V -- -- 0.095 -- 20 22 -- -- 10 -- -- 20 -- -- 25 -- -- 50 IDD f mA Conditions -- DSC1102, EN pin low, Output is disabled DSC1122, EN pin low, Output is disabled ppm Includes frequency variation due to initial tolerance, temp., and power supply voltage. One year at +25C Aging - First Year fY1 -- -- 5 ppm Aging - After First Year fY2+ -- -- <1 ppm/yr Start-up Time (Note 2) tSU -- -- 5 ms VIH 0.75 x VDD -- -- VIL -- -- 0.25 x VDD Output Disable Time (Note 3) tDA -- -- 5 ns -- Output Enable Time tEN -- -- 5 ms DSC1102 -- -- 20 ns DSC1122 Enable Pull-Up Resistor (Note 4) RPU -- 40 -- k Pull-up resistor exists IDD -- 56.5 58 mA Output Enabled, RL = 50 VOH VDD - 1.08 -- -- VOL -- -- VDD - 1.55 -- -- 800 -- Input Logic Levels V Year two and beyond at +25C T = +25C Input logic high Input logic low LVPECL Outputs Supply Current Output Logic Levels Peak-to-Peak Output Swing Note 1: 2: 3: 4: V mV Output logic high, RL = 50 Output logic low Single-Ended Pin 6 VDD should be filtered with a 0.1 F capacitor. tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. Output Waveform and Test Circuit figures below define the parameters. Output is enabled if pad is floated or not connected. DS20006254A-page 2 2019 Microchip Technology Inc. DSC1102/22 ELECTRICAL CHARACTERISTICS (CONTINUED) Specifications: VDD = 3.3V; TA = +25C unless otherwise specified. Parameters Min. Typ. Max. Units -- 250 -- ps f0 2.3 -- 460 MHz Output Duty Cycle SYM 48 -- 52 % Period Jitter JPER -- 2.5 -- psRMS -- 0.25 -- -- 0.38 -- -- 1.7 2 Output Transition Time (Note 3) Frequency Integrated Phase Noise Note 1: 2: 3: 4: Sym. tr tf JPH Conditions Rise time, 20% to 80% Fall time, RL = 50, CL = 0 pF -- Differential -- 200 kHz to 20 MHz @ 156.25 MHz psRMS 100 kHz to 20 MHz @ 156.25 MHz 12 kHz to 20 MHz @ 156.25 MHz Pin 6 VDD should be filtered with a 0.1 F capacitor. tSU is time to 100 ppm stable output frequency after VDD is applied and outputs are enabled. Output Waveform and Test Circuit figures below define the parameters. Output is enabled if pad is floated or not connected. 2019 Microchip Technology Inc. DS20006254A-page 3 DSC1102/22 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions -20 -- +70 C -40 -- +85 C Ordering Option I -40 -- +105 C Ordering Option L Temperature Ranges Operating Temperature Range TA Ordering Option E Junction Temperature TJ -- -- +150 C -- Storage Temperature Range TS -55 -- +150 C -- Soldering Temperature -- -- -- +260 C 40 sec. max. Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150C rating. Sustained junction temperatures above +150C can impact the device reliability. DS20006254A-page 4 2019 Microchip Technology Inc. DSC1102/22 2.0 PIN DESCRIPTIONS FIGURE 2-1: EN 1 6 VDD NC 2 5 OUT GND 3 4 OUT Pin Configuration, 6-Lead QFN The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name Description 1 EN Enable or Standby. 2 NC Leave unconnected or connect to ground. 3 GND Ground. 4 OUT Output. 5 OUT Complementary Output. 6 VDD Supply Voltage. 2019 Microchip Technology Inc. DS20006254A-page 5 DSC1102/22 3.0 NOMINAL PERFORMANCE PARAMETERS Unless specified otherwise, T = +25C, VDD = 3.3V. FIGURE 3-1: Ratio. 3.1 Power Supply Rejection FIGURE 3-2: Phase Noise). Phase Jitter (Integrated Output Waveform tR Output tF 80% 350mv mV 830 50% Output 20% tEN 1/f o tDA VIH Enable FIGURE 3-3: DS20006254A-page 6 VIL Output Waveform. 2019 Microchip Technology Inc. DSC1102/22 3.2 Typical Termination Scheme VDD VDD R1 R3 R2 R4 6 FIGURE 3-4: 2 5 3 4 Typical Termination Scheme. The values for R1, R2, R3, and R4 in the termination scheme depend on what VDD is used. Table 3-1 lists the recommended values for each resistor depending on VDD. TABLE 3-1: 3.3 RECOMMENDED RESISTOR VALUES VDD R1, R3 R2, R4 3.3V 130 82 2.5V 249 62 Test Circuit FIGURE 3-5: Test Circuit. 2019 Microchip Technology Inc. DS20006254A-page 7 DSC1102/22 3.4 Recommended Board Layout Via to GND layer 1 6 Supply bypass capacitor 2 3 5 4 Via to GND layer FIGURE 3-6: 3.5 Recommended Board Layout. Solder Reflow Profile MSL 1 @ 260C refer to JSTD-020C Ramp-Up Rate (200C to Peak Temp) Preheat Time 150C to 200C Time Maintained above 217C Peak Temperature Time within 5C of Actual Peak 3C/sec. max. 60-180 sec. 60-150 sec. 255C to 260C 20-40 sec. Ramp-Down Rate 6C/sec. max. Time 25C to Peak Temperature 8 minutes max. DS20006254A-page 8 2019 Microchip Technology Inc. DSC1102/22 4.0 PACKAGE MARKING INFORMATION 4.1 Package Marking Information 6-Lead CDFN/VDFN* Example XXXXXXX DCPYYWW 0SSS 0400000 DCP1941 0603 Legend: XX...X Y YY WW SSS e3 * Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. 2019 Microchip Technology Inc. DS20006254A-page 9 DSC1102/22 DS20006254A-page 10 2019 Microchip Technology Inc. DSC1102/22 2019 Microchip Technology Inc. DS20006254A-page 11 DSC1102/22 DS20006254A-page 12 2019 Microchip Technology Inc. DSC1102/22 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.10 C C A1 A SEATING PLANE 6X 0.08 C SIDE VIEW 2X b2 1 2 NOTE 1 L N 4X b1 L1 e BOTTOM VIEW 0.07 0.05 C A B C Microchip Technology Drawing C04-1007A Sheet 1 of 2 2019 Microchip Technology Inc. DS20006254A-page 13 DSC1102/22 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 Overall Length D Overall Width E b1 Terminal Width b2 Terminal Width Terminal Length L Terminal Pullback L1 MIN 0.80 0.00 0.85 0.45 0.65 MILLIMETERS NOM 6 1.05 BSC 0.85 0.02 3.20 BSC 2.50 BSC 0.90 0.50 0.70 0.10 REF MAX 0.90 0.05 0.95 0.55 0.75 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1007A Sheet 2 of 2 DS20006254A-page 14 2019 Microchip Technology Inc. DSC1102/22 6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 G 6 C Y 1 2 X1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width (X4) X1 Contact Pad Width (X2) X2 Contact Pad Length (X6) Y Space Between Contacts (X4) G1 MIN MILLIMETERS NOM 1.05 BSC 1.60 MAX 1.00 0.60 0.85 0.25 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3007A 2019 Microchip Technology Inc. DS20006254A-page 15 DSC1102/22 DS20006254A-page 16 2019 Microchip Technology Inc. DSC1102/22 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.20 C 1 2 2X 0.20 C TOP VIEW 0.10 C C SEATING PLANE A1 A 6X 0.08 C SIDE VIEW 0.10 C A B D2 1 2 0.10 NOTE 1 C A B E2 6X L (K) N 6X b 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-1010A Sheet 1 of 2 2019 Microchip Technology Inc. DS20006254A-page 17 DSC1102/22 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 Overall Length D Exposed Pad Length D2 Overall Width E E2 Exposed Pad Width b Terminal Width L Terminal Length K Terminal-to-Exposed-Pad MIN 0.80 0.00 2.70 1.70 1.35 1.00 MILLIMETERS NOM 6 2.54 0.85 0.02 7.00 BSC 2.80 5.00 BSC 1.80 1.40 1.10 0.20 REF MAX 0.90 0.05 2.90 1.90 1.45 1.20 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1010A Sheet 2 of 2 DS20006254A-page 18 2019 Microchip Technology Inc. DSC1102/22 6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN] With 2.8x1.8 mm Exposed Pad Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 6 C Y2 OV EV G Y1 1 2 X1 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X6) X1 Contact Pad Length (X6) Y1 Contact Pad to Center Pad (X2) G Thermal Via Diameter (X6) V Thermal Via Pitch EV MIN MILLIMETERS NOM 2.54 BSC MAX 2.90 1.90 3.70 1.50 1.35 0.20 0.33 1.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-3010A 2019 Microchip Technology Inc. DS20006254A-page 19 DSC1102/22 /HDG9HU\7KLQ'XDO)ODWSDFN1R/HDG3DFNDJH+3$ [PP%RG\>9')1@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ ' $ % 1 '$780$ '$780% ( 127( ; & ; & 7239,(: 6($7,1* 3/$1( $ & & $ ; & 6,'(9,(: 127( / / 1 ;E H %277209,(: & $ % & 0LFURFKLS7HFKQRORJ\'UDZLQJ&5HY$6KHHWRI DS20006254A-page 20 2019 Microchip Technology Inc. DSC1102/22 /HDG9HU\7KLQ'XDO)ODWSDFN1R/HDG3DFNDJH+3$ [PP%RG\>9')1@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ 1XPEHURI7HUPLQDOV 3LWFK 2YHUDOO+HLJKW 6WDQGRII 2YHUDOO/HQJWK 2YHUDOO:LGWK 7HUPLQDO:LGWK 7HUPLQDO/HQJWK 3XOOEDFN 8QLWV 'LPHQVLRQ/LPLWV 1 H $ $ ' ( E / / 0,1 0,//,0(7(56 120 %6& %6& %6& 5() 0$; Notes: 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6&%DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5()5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS7HFKQRORJ\'UDZLQJ&5HY$6KHHWRI 2019 Microchip Technology Inc. DS20006254A-page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page 22 2019 Microchip Technology Inc. DSC1102/22 APPENDIX A: REVISION HISTORY Revision A (October 2019) * Initial creation of document DSC1102/22 to Microchip data sheet template DS20006254A. * *Minor text changes throughout. 2019 Microchip Technology Inc. DS20006254A-page 23 DSC1102/22 NOTES: DS20006254A-page 24 2019 Microchip Technology Inc. DSC1102/22 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. X X X -XXX.XXXX X Package Temperature Stability Frequency Packaging Range Option Device Device: DSC1102: DSC1122: Package: Low-Jitter Precision LVPECL Oscillator with Standby Pin Low-Jitter Precision LVPECL Oscillator with Output Enable A B C D N = = = = = 6-Lead 7.0 mm x 5.0 mm VDFN 6-Lead 5.0 mm x 3.2 mm CDFN 6-Lead 3.2 mm x 2.5 mm VDFN 6-Lead 2.5 mm x 2.0 mm VDFN 6-Lead 7.0 mm x 5.0 mm VDFN w/o center pad E I L = = = -20C to +70C (Extended Commercial) -40C to +85C (Industrial) -40C to +105C (Extended Industrial) Stability: 1 2 3 5 = = = = 50 ppm 25 ppm 20 ppm 10 ppm Frequency: xxx.xxxx Packing Option: <blank>= T = Temperature Range: Note: = 2.3 MHz to 460 MHz (User Defined) Tube 1000/Reel Please visit the Microchip ClockWorks(R) Configurator to configure the part number for customized frequency. http://clockworks.microchip.com/timing 2019 Microchip Technology Inc. Examples: a) DSC1102AE1-053.5000: DSC1102, 6-Lead 7x5 VDFN, Ext. Commercial Temp. Range, 50 ppm Stability, 53.5 MHz Frequency, Tube b) DSC1122BI2-246.8100T: DSC1122, 6-Lead 5x3.2 CDFN, Industrial Temp. Range, 25 ppm Stability, 246.81 MHz Frequency, 1000/Reel c) DSC1102CL5-156.2500: DSC1102, 6-Lead 3.2x2.5 VDFN, Ext. Industrial Temp. Range, 10 ppm Stability, 156.25 MHz Frequency, Tube d) DSC1122DE3-094.5500T: DSC1122, 6-Lead 2.5x2.0 VDFN, Industrial Temp. Range, 20 ppm Stability, 94.55 MHz Frequency, 1000/Reel Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006254A-page 25 DSC1102/22 NOTES: DS20006254A-page 26 2019 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2019, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip's Quality Management Systems, please visit www.microchip.com/quality. 2019 Microchip Technology Inc. ISBN: 978-1-5224-5100-6 DS20006254A-page 27 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 Germany - Rosenheim Tel: 49-8031-354-560 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 Israel - Ra'anana Tel: 972-9-744-7705 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20006254A-page 28 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 2019 Microchip Technology Inc. 05/14/19