LM9076S-3.3/NOPB - NATIONAL SEMICONDUCTOR

VOUT

VIN

CDELAY

SHUTDOWN

GND

1.0 nF

COUT

10 PF

100 k:

CIN

10 PF

0.1 PF

Unregulated

Voltage Input

Regulated

Voltage Output

Delayed Reset

Output

Shutdown Control

Input

LM9076BMA-x.x

ON OFF

RESET

VOUT

VIN

CDELAY

GND

1.0 nF

COUT

10 PF

100 k:

CIN

10 PF

0.1 PF

Unregulated

Voltage Input

Regulated

Voltage Output

Delayed Reset

Output

LM9076S-x.x

RESET

LM9076

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LM9076 150mA Ultra-Low Quiescent Current LDO Regulator with Delayed Reset Output

Check for Samples: LM9076

1FEATURES DESCRIPTION

The LM9076 is a ±3%, 150 mA logic controlled

2• Available with 5.0V or 3.3V Output Voltage voltage regulator. The regulator features an active

• Ultra Low Ground Pin Current, 25 μA Typical low delayed reset output flag which can be used to

for 100 μA Load reset a microprocessor system at turn-ON and in the

• VOUT Initial Accuracy of ±1.5% event that the regulator output voltage falls below a

minimum value. An external capacitor programs a

• VOUT Accurate to ±3% Over Load and delay time interval before the reset output pin can

Temperature Conditions return high.

• Low Dropout Voltage, 200 mV Typical with 150 Designed for automotive and industrial applications,

mA Load the LM9076 contains a variety of protection features

• Low Off State Ground Pin current for such as thermal shutdown, input transient protection

LM9076BMA and a wide operating temperature range. The

• Delayed RESET Output Pin for Low VOUT LM9076 uses an PNP pass transistor which allows

low drop-out voltage operation.

Detection

• +70V/-50V Voltage Transients

• Operational VIN up to +40V

Typical Applications

Figure 1. LM9076S-x.x in 5 lead SFM package

Figure 2. LM9076BMA-x.x in 8 lead SOIC package

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM9076

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Connection Diagram

Figure 3. Top View Figure 4. Top View

Part Numbers LM9076S-3.3 and LM9076S-5.0 Part Numbers LM9076BMA-3.3 and

See SFM Package Number KTT0005B LM9076BMA-5.0

See SOIC Package Number D

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)

VIN(DC) -15V to +55V

VIN(+Transient) t< 10ms, Duty Cycle <1% +70V

VIN(-Transient) t< 1ms, Duty Cycle <1% -50V

SHUTDOWN Pin -15V to +52V

RESET Pin -0.3V to 20V

CDELAY Pin -0.3V to VOUT +0.3V

Storage Temperature -65°C to +150°C

Junction Temperature (TJ) +175C

ESD, HBM, per AEC - Q100 - 002 +/-2 kV

ESD, MM, per AEC - Q100 - 003 +/-250V

(1) Absolute Maximum Ratings indicate the limits beyond which the device may cease to function, and/or damage to the device may occur.

Operating Ratings(1)(2)

VIN Pin 5.35V to 40V

VSHUTDOWN Pin 0V to 40V

Junction Temperature −40°C < TJ< +125°C

Thermal Resistance KTT0005B(3) θJA 75°C/W

θJC 2.9°C/W

Thermal Resistance D(3) θJA 156°C/W

θJC 59°C/W

(1) Absolute Maximum Ratings indicate the limits beyond which the device may cease to function, and/or damage to the device may occur.

(2) Operating Ratings indicate conditions for which the device is intended to be functional, but does not ensure specific performance limits.

For ensured specifications and conditions refer to the Electrical Characteristics

(3) Worst case (FREE AIR) per EIA/JESD51–3.

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Electrical Characteristics for LM9076–3.3

The following specifications apply for VIN = 14V; ILOAD = 10 mA; TJ= +25C; COUT = 10 μF, 0.5Ω< ESR < 4.0Ω; unless

otherwise specified. Bold values indicate −40°C ≤TJ≤+125°C.(1)(2)(3)Minimum and Maximum limits are specified through

test, design or statistical correlation.

Symbol Parameter Conditions Min Typ Max Units

LM9076–3.3 REGULATOR CHARACTERISTICS

3.251 3.30 3.349 V

−20°C ≤TJ≤85°C 3.234 3.30 3.366 V

1 mA ≤ILOAD ≤150 mA

Output Voltage 1mA ≤ILOAD ≤150 mA 3.201 3.30 3.399 V

VIN = 60V,

VOUT 2.970 3.30 3.630 V

RLOAD = 1 kΩ, t ≤40ms

Output Voltage Off VSHUTDOWN ≥2V, – 0 250 mV

LM9076 BMA only RLOAD = 1 kΩ

VIN = -15V,

Reverse Battery −300 0 – mV

RLOAD = 1 kΩ

9.0V ≤VIN ≤16V, – 4 25 mV

ILOAD = 10 mA

Line Regulation

ΔVOUT 16V ≤VIN ≤40V, – 17 35 mV

ILOAD = 10 mA

Load Regulation 1 mA ≤ILOAD ≤150 mA – 42 60 mV

ILOAD = 10 mA – 30 50 mV

VDO Dropout Voltage ILOAD = 50 mA – 80 – mV

ILOAD = 150 mA – 150 250 mV

9V ≤VIN ≤16V, – 25 45 μA

ILOAD = 100 uA

9V ≤VIN ≤40V, – 125 160 μA

ILOAD = 10 mA

IGND Ground Pin Current 9V ≤VIN ≤40V, – 0.6 – mA

ILOAD = 50 mA

9V ≤VIN ≤16V, – 3.6 4.5 mA

ILOAD = 150 mA

VOUT Short Circuit VIN = 14V,

ISC 200 400 750 mA

Current RLOAD = 1Ω

VIN = (14VDC) + (1VRMS

PSRR Ripple Rejection @ 120Hz) 50 60 – dB

ILOAD = 50 mA

RESET PIN CHARACTERISTICS

Minimum VIN for valid

VOR (Note 3) – 1.3 2.0 V

RESET Status

VOUT Threshold for X VOUT

VTHR (Note 3) 0.83 0.89 0.94

RESET Low (Nom)

External pull-up resistor

VOH RESET pin high voltage VOUT X 0.90 VOUT X 0.99 VOUT V

to VOUT = 100 kΩ

CDELAY < 4.0V,

VOL RESET pin low voltage – 0.2 0.3 V

ISINK = 250 µA

(1) The regulated output voltage specification is not ensured for the entire range of VIN and output loads. Device operational range is limited

by the maximum junction temperature (T J). The junction temperature is influenced by the ambient temperature (T A), package

selection, input voltage (VIN ), and the output load current. When operating with maximum load currents the input voltage and/or ambient

temperature will be limited. When operating with maximum input voltage the load current and/or the ambient temperature will be limited.

(2) Pulse testing used maintain constant junction temperature (TJ).

(3) Not Production tested, Specified by Design. Minimum, Typical, and/or Maximum values are provided for informational purposes only.

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Electrical Characteristics for LM9076–3.3 (continued)

The following specifications apply for VIN = 14V; ILOAD = 10 mA; TJ= +25C; COUT = 10 μF, 0.5Ω< ESR < 4.0Ω; unless

otherwise specified. Bold values indicate −40°C ≤TJ≤+125°C.(1)(2)(3)Minimum and Maximum limits are specified through

test, design or statistical correlation.

Symbol Parameter Conditions Min Typ Max Units

CDELAY PIN CHARACTERISTICS

CDELAY Charging VIN = 14V,

IDELAY -0.70 -0.42 -0.25 uA

Current VDELAY = 0V

VOUT < 4.0V,

VOL CDELAY pin low voltage – 0.100 – V

ISINK = IDELAY

VIN = 14V, CDELAY =

0.001 uF

tDELAY Reset Delay Time VOUT rising from 0V, Δt 4.7 7.8 13.2 ms

from VOUT > VOR to

RESET pin HIGH

Electrical Characteristics for LM9076–5.0

The following specifications apply for VIN= 14V; VSHUTDOWN = Open; ILOAD = 10 mA; TJ= +25°C; COUT = 10 µF, 0.5Ω< ESR <

4.0Ω; unless otherwise specified. Bold Values indicate −40°C ≤TJ≤125°C.(1)(2)(3) Minimum and Maximum limits are

specified through test, design, or statistical correlation.

Symbol Parameter Conditions Min Typ Max Units

LM9076–5.0 REGULATOR CHARACTERISTICS

4.925 5.00 5.075 V

−20°C ≤TJ≤85°C 4.900 5.00 5.100 V

1 mA ≤ILOAD ≤150 mA

Output Voltage 1 mA ≤ILOAD ≤150 mA 4.850 5.00 5.150 V

VIN = 60V,

VOUT 4.500 5.00 5.500 V

RLOAD = 1 kΩ, t ≤40ms

Output Voltage Off VSHUTDOWN ≥2V, – 0 250 mV

LM9076 BMA only RLOAD = 1 kΩ

VIN = -15V,

Reverse Battery −300 0 – mV

RLOAD = 1 kΩ

9.0V ≤VIN ≤16V, – 4 25 mV

ILOAD = 10 mA

Line Regulation

ΔVOUT 16V ≤VIN ≤40V, – 17 35 mV

ILOAD = 10 mA

Load Regulation 1 mA ≤ILOAD ≤150 mA – 42 60 mV

ILOAD = 10 mA – 30 50 mV

VDO Dropout Voltage ILOAD = 50 mA – 80 – mV

ILOAD = 150 mA – 150 250 mV

9V ≤VIN ≤16V, – 25 45 μA

ILOAD = 100 uA

9V ≤VIN ≤40V, – 125 160 μA

ILOAD = 10 mA

Ground Pin Current 9V ≤VIN ≤40V,

IGND – 0.6 – mA

ILOAD = 50 mA

9V ≤VIN ≤16V, – 3.6 4.5 mA

ILOAD = 150 mA

Ground Pin Current in 9V ≤VIN ≤40V, – 15 25 μA

Shutdown Mode VSHUTDOWN = 2V

(1) Pulse testing used maintain constant junction temperature (TJ).

(2) The regulated output voltage specification is not ensured for the entire range of VIN and output loads. Device operational range is limited

by the maximum junction temperature (T J). The junction temperature is influenced by the ambient temperature (T A), package

selection, input voltage (VIN ), and the output load current. When operating with maximum load currents the input voltage and/or ambient

temperature will be limited. When operating with maximum input voltage the load current and/or the ambient temperature will be limited.

(3) Not Production tested, Specified by Design. Minimum, Typical, and/or Maximum values are provided for informational purposes only.

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Electrical Characteristics for LM9076–5.0 (continued)

The following specifications apply for VIN= 14V; VSHUTDOWN = Open; ILOAD = 10 mA; TJ= +25°C; COUT = 10 µF, 0.5Ω< ESR <

4.0Ω; unless otherwise specified. Bold Values indicate −40°C ≤TJ≤125°C.(1)(2)(3) Minimum and Maximum limits are

specified through test, design, or statistical correlation.

Symbol Parameter Conditions Min Typ Max Units

VOUT Short Circuit VIN = 14V,

ISC 200 400 750 mA

Current RLOAD = 1Ω

VIN = (14VDC) + (1VRMS

PSRR Ripple Rejection @ 120Hz) 50 60 – dB

ILOAD = 50 mA

RESET PIN CHARACTERISTICS

Minimum VIN for valid

VOR (Note 3) – 1.3 2.0 V

RESET Status

VOUT Threshold for X VOUT

VTHR (Note 3) 0.83 0.89 0.94

RESET Low (Nom)

External pull-up resistor

VOH RESET pin high voltage VOUT X 0.90 VOUT X 0.99 VOUT V

to VOUT = 100 kΩ

CDELAY < 4.0V,

VOL RESET pin low voltage – 0.2 0.3 V

ISINK = 250 µA

CDELAY PIN CHARACTERISTICS

CDELAY Charging VIN = 14V,

IDELAY -0.70 -0.42 -0.25 uA

Current VDELAY = 0V

VOUT < 4.0V,

VOL CDELAY pin low voltage – 0.100 – V

ISINK = IDELAY

VIN = 14V, CDELAY =

0.001 uF

tDELAY Reset Delay Time VOUT rising from 0V, Δt 7.1 11.9 20.0 ms

from VOUT > VOR to

RESET pin HIGH

SHUTDOWN CONTROL LOGIC — LM9076BMA-5.0 Only

VSHUTDOWN pin falling

SHUTDOWN Pin Low

VIL(SD) from 5.0V until VOUT 1 1.5 – V

Threshold Voltage >4.5V (VOUT = On)

VSHUTDOWN pin rising

SHUTDOWN Pin High

VIH(SD) from 0V until VOUT < – 1.5 2 V

Threshold Voltage 0.5V (VOUT = Off)

VSHUTDOWN = 40V – 35 – μA

SHUTDOWN Pin High

IIH(SD) VSHUTDOWN = 5V – 15 35 μA

Bias Current VSHUTDOWN = 2V – 6 10 μA

SHUTDOWN Pin Low

IIL(SD) VSHUTDOWN = 0V – 0 – μA

Bias Current

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Typical Performance Characteristics

Output Capacitor ESR Output Capacitor ESR

Figure 5. Figure 6.

Output Voltage vs Low Input Voltage Output Voltage vs Low Input Voltage

Figure 7. Figure 8.

Ground Pin Current vs Low Input Voltage Ground Pin Current vs Low Input Voltage

Figure 9. Figure 10.

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Typical Performance Characteristics (continued)

Ground Pin Current vs Load Current Ground Pin Current vs Load Current

Figure 11. Figure 12.

Output Voltage vs Input Voltage Output Voltage vs Input Voltage

Figure 13. Figure 14.

Output Voltage vs Junction Temperature Output Voltage vs Junction Temperature

Figure 15. Figure 16.

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Typical Performance Characteristics (continued)

Dropout Voltage vs Load Current Load Transient Response

Figure 17. Figure 18.

Load Transient Response Line Transient Response

Figure 19. Figure 20.

Delayed Reset Time vs Vin

Line Transient Response Normalized to VIN = 14V

Figure 21. Figure 22.

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Typical Performance Characteristics (continued)

Ripple Rejection

Figure 23.

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APPLICATION INFORMATION

REGULATOR BASICS

The LM9076 regulator is suitable for Automotive and Industrial applications where continuous connection to a

battery supply is required (refer to Typical Applications).

The pass element of the regulator is a PNP device which requires an output bypass capacitor for stability. The

minimum bypass capacitance for the output is 10 μF (refer to ESR limitations). A 22 μF, or larger, output bypass

capacitor is recommended for typical applications

INPUT CAPACITOR

The LM9076 requires a low source impedance to maintain regulator stability because critical portions of the

internal bias circuitry are connected to directly to VIN. In general, a 10 μF electrolytic capacitor, located within two

inches of the LM9076, is adequate for a majority of applications. Additionally, and at a minimum, a 0.1 μF

ceramic capacitor should be located between the LM9076 VIN and Ground pin, and as close as is physically

possible to the LM9076 itself .

OUTPUT CAPACITOR

An output bypass capacitor is required for stability. This capacitance must be placed between the LM9076 VOUT

pin and Ground pin, as close as is physically possible, using traces that are not part of the load current path.

The output capacitor must meet the requirements for minimum capacitance and also maintain the appropriate

ESR value across the entire operating ambient temperature range. There is no limit to the maximum output

capacitance as long as ESR is maintained.

The minimum bypass capacitance for the output is 10 μF (refer to ESR limitations). A 22 μF, or larger, output

bypass capacitor is recommended for typical applications.

Solid tantalums capacitors are recommended as they generally maintain capacitance and ESR ratings over a

wide temperature range. Ceramic capacitor types XR7 and XR5 may be used if a series resistor is added to

simulate the minimum ESR requirement. See Figure 24.

Aluminum electrolytic capacitors are not recommended as they are subject to wide changes in capacitance and

ESR across temperature.

Figure 24. Using Low ESR Capacitors

DELAY CAPACITOR

The capacitor on the Delay pin must be a low leakage type since the charge current is minimal (420 nA typical)

and the pin must fully charge to VOUT. Ceramic, Mylar, and polystyrene capacitor types are generally

recommended, although changes in capacitance values across temperature changes will have some effect on

the delay timing.

Any leakage of the IDELAY current, be it through the delay capacitor or any other path, will extend the delay time,

possibly to the point that the Reset pin output does not go high.

SHUTDOWN PIN - LM9076BMA ONLY

The basic On/Off control of the regulator is accomplished with the SHUTDOWN pin. By pulling the SHUTDOWN

pin high the regulator output is switched Off. When the regulator is switched Off the load on the battery will be

primarily due to the SHUTDOWN pin current.

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When the SHUTDOWN pin is low, or left open, the regulator is switched On. When an unregulated supply, such

as V BATTERY , is used to pull the SHUTDOWN pin high a series resistor in the range of 10KΩto 50KΩis

recommended to provide reverse voltage transient protection of the SHUTDOWN pin. Adding a small capacitor

(0.001uF typical) from the SHUTDOWN pin to Ground will add noise immunity to prevent accidental turn on due

to noise on the supply line.

RESET FLAG

The RESET pin is an open collector output which requires an external pull-up resistor to develop the reset signal.

The external pull-up resistor should be in the range of 10 kΩto 200 kΩ.

At VIN values of less than typically 2V the RESET pin voltage will be high. For VIN values between typically 2V

and approximately VOUT + VBE the RESET pin voltage will be low. For VIN values greater than approximately

VOUT + VBE the RESET pin voltage will be dependent on the status of the VOUT pin voltage and the Delayed

Reset circuitry. The value of VBE is typically 600 mV at 25°C and will decrease approximately 2 mV for every 1°C

increase in the junction temperature. During normal operation the RESET pin voltage will be high .

Any load condition that causes the VOUT pin voltage to drop below typically 89% of normal will activate the

Delayed Reset circuit and the RESET pin will go low for the duration of the delay time.

Any line condition that causes VIN pin voltage to drop below typically VOUT + VBE will cause the RESET pin to go

low without activating the Delayed Reset circuitry.

Excessive thermal dissipation will raise the junction temperature and could activate the Thermal Shutdown

circuitry which, in turn, will cause the RESET pin to go low.

For the LM9076BMA devices, pulling the SHUTDOWN pin high will turn off the output which, in turn, will cause

the RESET pin to go low once the VOUT voltage has decayed to a value that is less than typically 89% of normal.

See Figure 25.

RESET DELAY TIME

When the regulator output is switched On, or after recovery from brief VOUT fault condition, the RESET flag can

be can be programmed to remain low for an additional delay time. This will give time for any system reference

voltages, clock signals, etc., to stabilize before the micro-controller resumes normal operation.

This delay time is controlled by the capacitor value on the CDELAY pin. During normal operation the CDELAY

capacitor is charged to near VOUT . When a VOUT fault causes the RESET pin to go low, the CDELAY capacitor is

quickly discharged to ground. When the VOUT fault is removed, and VOUT returns to the normal operating value,

the CDELAY capacitor begins charging at a typical constant 0.420 uA rate. When the voltage on the CDELAY

capacitor reaches the same potential as the VOUT pin the RESET pin will be allowed to return high.

The typical RESET delay time can be calculated with the following formula:

tDELAY = VOUT X (CDELAY / IDELAY ) (1)

For the LM9076–3.3 with a CDELAY value of 0.001 uF and a IDELAY value of 0.420 uA the typical RESET delay

time is:

tDELAY =3.3V × (0.001 uF / 0.420 uA) = 7.8 ms (2)

For the LM9076–5.0 with a CDELAY value of 0.001 uF and a IDELAY value of 0.420 uA the typical RESET delay

time is:

tDELAY = 5.0V X (0.001uF / 0.420uA) = 11.9 ms (3)

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THERMAL PROTECTION

Device operational range is limited by the maximum junction temperature (TJ). The junction temperature is

influenced by the ambient temperature (TA), package selection, input voltage (VIN), and the output load current.

When operating with maximum load currents the input voltage and/or ambient temperature will be limited. When

operating with maximum input voltage the load current and/or the ambient temperature will be limited.

Even though the LM9076 is equipped with circuitry to protect itself from excessive thermal dissipation, it is not

recommended that the LM9076 be operated at, or near, the maximum recommended die junction temperature

(TJ) as this may impair long term device reliability.

The thermal protection circuity monitors the temperature at the die level. When the die temperature exceeds

typically 160°C the voltage regulator output will be switched off.

Figure 25. Typical Reset Pin Operational Waveforms

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REVISION HISTORY

Changes from Revision K (March 2013) to Revision L Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 12

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM9076BMA-3.3/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 9076B

MA3.3

LM9076BMA-5.0 NRND SOIC D 8 95 Non-RoHS

& Green Call TI Call TI -40 to 125 9076B

MA5.0

LM9076BMA-5.0/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 9076B

MA5.0

LM9076BMAX-3.3/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 9076B

MA3.3

LM9076BMAX-5.0/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 9076B

MA5.0

LM9076S-3.3/NOPB ACTIVE DDPAK/

TO-263 KTT 5 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM9076S

-3.3

LM9076S-5.0 NRND DDPAK/

TO-263 KTT 5 45 Non-RoHS

& Green Call TI Call TI -40 to 125 LM9076S

-5.0

LM9076S-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 5 45 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM9076S

-5.0

LM9076SX-3.3/NOPB ACTIVE DDPAK/

TO-263 KTT 5 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM9076S

-3.3

LM9076SX-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 5 500 RoHS-Exempt

& Green SN Level-3-245C-168 HR -40 to 125 LM9076S

-5.0

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM9076BMAX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM9076BMAX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

LM9076SX-3.3/NOPB DDPAK/

TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM9076SX-5.0/NOPB DDPAK/

TO-263 KTT 5 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

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Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM9076BMAX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM9076BMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0

LM9076SX-3.3/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0

LM9076SX-5.0/NOPB DDPAK/TO-263 KTT 5 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

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PACKAGE OUTLINE

.228-.244 TYP

[5.80-6.19]

.069 MAX

[1.75]

6X .050

[1.27]

8X .012-.020

[0.31-0.51]

.150

[3.81]

.005-.010 TYP

[0.13-0.25]

0 - 8 .004-.010

[0.11-0.25]

.010

[0.25]

.016-.050

[0.41-1.27]

4X (0 -15 )

.189-.197

[4.81-5.00]

NOTE 3

B .150-.157

[3.81-3.98]

NOTE 4

4X (0 -15 )

(.041)

[1.04]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.

Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed .006 [0.15] per side.

4. This dimension does not include interlead flash.

5. Reference JEDEC registration MS-012, variation AA.

.010 [0.25] C A B

PIN 1 ID AREA

SEATING PLANE

.004 [0.1] C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.800

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EXAMPLE BOARD LAYOUT

.0028 MAX

[0.07]

ALL AROUND

.0028 MIN

[0.07]

ALL AROUND

(.213)

[5.4]

6X (.050 )

[1.27]

8X (.061 )

[1.55]

8X (.024)

[0.6]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

EXPOSED

METAL

OPENING

SOLDER MASK METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

SYMM

SEE

DETAILS

SYMM

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EXAMPLE STENCIL DESIGN

8X (.061 )

[1.55]

8X (.024)

[0.6]

6X (.050 )

[1.27] (.213)

[5.4]

(R.002 ) TYP

[0.05]

SOIC - 1.75 mm max heightD0008A

SMALL OUTLINE INTEGRATED CIRCUIT

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL

SCALE:8X

SYMM

MECHANICAL DATA

KTT0005B

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BOTTOM SIDE OF PACKAGE

TS5B (Rev D)

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