Data Sheet 1 Rev. 1.00
www.infineon.com 2017-07-31
TLE9263BQXV33
System Basis Chip
Mid-Range+ System Basis Chip Family
Quality Requirement Category: Automotive
Features
• Two integrated Low-Drop Voltage Regulators: Main regulator (5 V or 3.3 V
up to 250 mA) and auxiliary regulator (5 V up to 100 mA) with off-board
usage protection
• Voltage regulator (5 V, 3.3 V or 1.8 V) with external PNP transistor configurable for off-board usage or for
load sharing
• 1 high-speed CAN transceiver supporting FD communication up to 5 Mbit/s featuring CAN Partial
Networking & CAN FD tolerant mode according to ISO 11898-2:2016 & SAE J2284
• 2 LIN transceivers LIN2.2A/J2602
•4 high-side outputs 7 Ω typ., 2 HV GPIOs, 3 HV wake inputs
• Integrated fail-safe and supervision functions, e.g. fail-safe, watchdog, interrupt- and reset outputs
• 16-bit SPI for configuration and diagnostics
Applications
• Body Control Modules (BMC), Passive keyless entry and start modules, Gateway applications
• Heating, ventilation and air conditioning (HVAC)
• Seat, roof, tailgate, trailer, door and other closure modules
• Light control modules
• Gear shifters and selectors
Description
Body System IC with Integrated Voltage Regulators, Power Management Functions, HS-CAN Transceiver
supporting CAN FD and Multiple LIN Transceiver.
Featuring Multiple High-Side Switches and High-Voltage Wake Inputs.
Type Package Marking
TLE9263BQXV33 PG-VQFN-48-31 TLE9263BQXV33
Data Sheet 2 Rev. 1.00
2017-07-31
TLE9263BQXV33
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.3 Hints for Unused Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Hints for Alternate Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 System Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1 Block Description of State Machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1.1 Device Configuration and SBC Init Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.1.1 Device Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1.1.2 SBC Init Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.1.2 SBC Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.1.3 SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.1.4 SBC Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.1.5 SBC Restart Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.1.6 SBC Fail-Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.1.7 SBC Development Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.2 Wake Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.2.1 Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.2.1.1 Configuration and Operation of Cyclic Sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.2.1.2 Cyclic Sense in Low Power Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.2.2 Cyclic Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.2.3 Internal Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.3 Supervision Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6 Voltage Regulator 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7 Voltage Regulator 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.2.1 Short to Battery Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
8 External Voltage Regulator 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
8.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
8.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
8.2.1 External Voltage Regulator as Independent Voltage Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
8.2.2 External Voltage Regulator in Load Sharing Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table of Contents
Data Sheet 3 Rev. 1.00
2017-07-31
TLE9263BQXV33
8.3 External Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
8.4 Calculation of RSHUNT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
8.5 Unused Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
8.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
9 High-Side Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
9.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
9.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
9.2.1 Over- and Undervoltage Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
9.2.2 Overcurrent Detection and Switch Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
9.2.3 Open Load Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
9.2.4 HSx Operation in Different SBC Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
9.2.5 PWM and Timer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
9.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
10 High Speed CAN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
10.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
10.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
10.2.1 CAN OFF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10.2.2 CAN Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10.2.3 CAN Receive Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
10.2.4 CAN Wake Capable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
10.2.5 TXD Time-out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
10.2.6 Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
10.2.7 Undervoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
10.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
11 LIN Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
11.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
11.1.1 LIN Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
11.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
11.2.1 LIN OFF Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
11.2.2 LIN Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
11.2.3 LIN Receive Only Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
11.2.4 LIN Wake Capable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
11.2.5 TXD Time-out Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.6 Bus Dominant Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.7 Undervoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.8 Slope Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
11.2.9 Flash Programming via LIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
11.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
12 Wake and Voltage Monitoring Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
12.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
12.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12.2.1 Wake Input Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.2.2 Alternate Measurement Function with WK1 and WK2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.2.2.1 Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.2.2.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.3 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Data Sheet 4 Rev. 1.00
2017-07-31
TLE9263BQXV33
13 Interrupt Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
13.1 Block and Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
13.2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
14 Fail Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
14.1 Block and Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
14.1.1 General Purpose I/O Functionality of FO2 and FO3 as Alternate Function . . . . . . . . . . . . . . . . . . . 102
14.2 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
15 Supervision Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
15.1 Reset Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
15.1.1 Reset Output Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
15.1.2 Soft Reset Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
15.2 Watchdog Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
15.2.1 Time-Out Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
15.2.2 Window Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
15.2.3 Watchdog Setting Check Sum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
15.2.4 Watchdog during SBC Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
15.2.5 Watchdog Start in SBC Stop Mode due to Bus Wake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
15.3 VS Power On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
15.4 Undervoltage VS and VSHS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
15.5 Overvoltage VSHS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
15.6 VCC1 Over-/ Undervoltage and Undervoltage Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
15.6.1 VCC1 Undervoltage and Undervoltage Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
15.6.2 VCC1 Overvoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
15.7 VCC1 Short Circuit and VCC3 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
15.8 VCC2 Undervoltage and VCAN Undervoltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
15.9 Thermal Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
15.9.1 Individual Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
15.9.2 Temperature Prewarning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
15.9.3 SBC Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
15.10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
16 Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
16.1 SPI Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
16.2 Failure Signalization in the SPI Data Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
16.3 SPI Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
16.4 SPI Bit Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
16.5 SPI Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
16.5.1 General Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
16.6 SPI Status Information Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
16.6.1 General Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
16.6.2 Family and Product Information Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163
16.7 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164
17 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
17.1 Application Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166
17.2 ESD Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
17.3 Thermal Behavior of Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172
18 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174
Data Sheet 6 Rev. 1.00
2017-07-31
TLE9263BQXV33
Overview
1 Overview
Scalable System Basis Chip Family
• Product family with various products for complete scalable application coverage.
• Dedicated Data Sheets are available for the different product variants
• Complete compatibility (hardware and software) across the family
• TLE9263 with 2 LIN transceivers, 3 voltage regulators
• TLE9262 with 1 LIN transceiver, 3 voltage regulators
• TLE9261 without LIN transceivers, 3 voltage regulators
• Product variants for 5V (TLE926xQX) and 3.3V (TLE926xQXV33) output voltage for main voltage regulator
• CAN Partial Networking variants for 5V (TLE926x-3QX) and 3.3V (TLE926x-3QXV33) output voltage
Device Description
The TLE9263BQXV33 is a monolithic integrated circuit in an exposed pad VQFN-48 (7mm x 7mm) power
package with Lead Tip Inspection (LTI) feature to support Automatic Optical Inspection (AOI).
The device is designed for various CAN-LIN automotive applications as main supply for the microcontroller
and as interface for a LIN and CAN bus network.
To support these applications, the System Basis Chip (SBC) provides the main functions, such as a 3.3V low-
dropout voltage regulator (LDO) for e.g. a microcontroller supply, another 5V low-dropout voltage regulator
with off-board protection for e.g. sensor supply, another 3.3V/1.8V regulator to drive an external PNP
transistor, which can be used as an independent supply for off-board usage or in load sharing configuration
with the main regulator VCC1, a HS-CAN transceiver supporting CAN FD and LIN transceiver for data
transmission, high-side switches with embedded protective functions and a 16-bit Serial Peripheral Interface
(SPI) to control and monitor the device. Also implemented are a configurable timeout / window watchdog
circuit with a reset feature, three Fail Outputs and an undervoltage reset feature.
The device offers low-power modes in order to minimize current consumption on applications that are
connected permanently to the battery. A wake-up from the low-power mode is possible via a message on the
buses, via the bi-level sensitive monitoring/wake-up inputs as well as via cyclic wake.
The device is designed to withstand the severe conditions of automotive applications.
Data Sheet 7 Rev. 1.00
2017-07-31
TLE9263BQXV33
Overview
Product Features
• Very low quiescent current consumption in Stop- and Sleep Mode
• Periodic Cyclic Wake in SBC Normal- and Stop Mode
• Periodic Cyclic Sense in SBC Normal-, Stop- and Sleep Mode
• Low-Drop Voltage Regulator 3.3V, 250mA
• Low-Drop Voltage Regulator 5V, 100mA, protected features for off-board usage
•Low-Drop Voltage Regulator, driving an external PNP transistor - 3.3V in load sharing configuration or
3.3V/1.8V in stand-alone configuration, protected features for off-board usage. Current limitation by shunt
resistor (up to 350mA with 470m external shunt resistor) in stand-alone configuration
• High-Speed CAN Transceiver:
– fully compliant to HS-CAN standard ISO 11898-2:2016
– supporting CAN FD communication up to 5 Mbps
• Two LIN Transceivers LIN 2.2a, J2602 with configurable TXD timeout feature and LIN Flash Mode
• Fully compliant to “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive
Applications” Revision 1.3, 2012-05-04
•Four High-Side Outputs 7Ω typ.
• Dedicated supply pin for High-Side Outputs
•Two General Purpose High-Voltage In- and Outputs (GPIOs) configurable as add. Fail Outputs, Wake Inputs,
Low-Side switches or High-Side switches
• Three universal High-Voltage Wake Inputs for voltage level monitoring
• Alternate High-Voltage Measurement Function, e.g. for battery voltage sensing
• Configurable wake-up sources
• Reset Output
• Configurable timeout and window watchdog
•Up to three Fail Outputs (depending on configuration)
• Overtemperature and short circuit protection feature
• Wide supply input voltage and temperature range
• Software compatible to all SBC families TLE926x and TLE927x
• Green Product (RoHS compliant) & AEC Qualified
• PG-VQFN-48 leadless exposed-pad power package with Lead Tip Inspection (LTI) feature to support
Automatic Optical Inspection (AOI)
Data Sheet 8 Rev. 1.00
2017-07-31
TLE9263BQXV33
Block Diagram
2 Block Diagram
Figure 1 Block Diagram
V
CC1
SPI
Interrupt
Control
SBC
STATE
MACHINE
SDI
SDO
CLK
CSN
VCC1
CAN cell
LIN cell
Window Watchdog
WK
TXDLIN 1
RXDLIN 1
LIN 1
TXDCAN
RXDCAN
VCAN
CANH
CANL
WK1
RESET
GENERATOR
INT
GND
WAKE
REGISTER
VS
V
S
Fail Safe
RO
FO3/TEST
LIN cell
TXDLIN 2
RXDLIN 2
LIN 2
FO2
FO1
V
CC2
VCC2
High Side
HS2
HS3
HS4
HS1
WK
WK2
WK
WK3
V
CC3
VCC3REF
VCC3SH
VCC3B
VSHS VS
VSHS
Alternative func tion
for FO 2/ 3: GPIO 1/2
Alternative
functi on for W K 1/2:
Voltage measur ement
Data Sheet 9 Rev. 1.00
2017-07-31
TLE9263BQXV33
Pin Configuration
3 Pin Configuration
3.1 Pin Assignment
Figure 2 Pin Configuration
TLE9263
PG-VQFN-48
TLE9263.vsd
1GND
2 n. c.
3 VCC3REF
4 VCC3B
5 VCC3SH
6 n. c.
7 n. c.
8HS1
9 HS2
10 HS3
11 HS4
12 n. c.
FO3/TEST 48
FO2 47
n.c. 46
n.c. 45
LIN2 44
GND 43
LIN1 42
n.c. 41
CANH 40
CANL 39
GND 38
VCAN 37
13 VSHS
14 VS
15 VS
16 n.c.
17 VCC1
18 VCC2
19 n.c.
20 GND
21 FO1
22 WK1
23 WK2
24 WK3
25 TXDLIN2
26 RXDLIN2
27 CLK
28 SDI
29 SDO
30 CSN
31 INT
32 RO
33 TXDLIN1
34 RXDLIN1
35 TXDCAN
36 RXDCAN
Data Sheet 10 Rev. 1.00
2017-07-31
TLE9263BQXV33
Pin Configuration
3.2 Pin Definitions and Functions
Pin Symbol Function
1GND Ground
2n.c. not connected; internally not bonded.
3VCC3REF VCC3REF; Collector connection for external PNP, reference input
4VCC3B VCC3B; Base connection for external PNP
5VCC3SH VCC3SH; Emitter connection for external PNP, shunt connection
6n.c. not connected; internally not bonded.
7n.c. not connected; internally not bonded.
8HS1 High Side Output 1; typ. 7Ω
9HS2 High Side Output 2; typ. 7Ω
10 HS3 High Side Output 3; typ. 7Ω
11 HS4 High Side Output 4; typ. 7Ω
12 n.c not connected; internally not bonded.
13 VSHS Supply Voltage HS, LIN and GPIO1/2 in HS configuration; Supply voltage for
High-Side Switches and LIN modules and respective UV-/OV supervision;
Connected to battery voltage with reverse protection diode and filter against
EMC; connect to VS if separate supply is not needed
14 VS Supply Voltage; Supply voltage for chip internal supply and voltage regulators;
Connected to Battery Voltage with external reverse protection Diode and Filter
against EMC
15 VS Supply Voltage; Supply voltage for chip internal supply and voltage regulators;
Connected to Battery Voltage with external reverse protection Diode and Filter
against EMC
16 n.c. not connected; internally not bonded.
17 VCC1 Voltage Regulator Output 1
18 VCC2 Voltage Regulator Output 2
19 n.c. not connected; internally not bonded.
20 GND GND
21 FO1 Fail Output 1
22 WK1 Wake Input 1; Alternative function: HV-measurement function input pin
(only in combination with WK2, see Chapter 12.2.2)
23 WK2 Wake Input 2; Alternative function: HV-measurement function output pin
(only in combination with WK1, see Chapter 12.2.2)
24 WK3 Wake Input 3
25 TXDLIN2 Transmit LIN2
26 RXDLIN2 Receive LIN2
27 CLK SPI Clock Input
28 SDI SPI Data Input; into SBC (=MOSI)
29 SDO SPI Data Output; out of SBC (=MISO)
Data Sheet 11 Rev. 1.00
2017-07-31
TLE9263BQXV33
Pin Configuration
Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
note that the tie bars at each package corner are connected to the cooling tab (see also Chapter 18)
30 CSN SPI Chip Select Not Input
31 INT Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal
Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config
1/3, no external pull-up sets config 2/4.
32 RO Reset Output
33 TXDLIN1 Transmit LIN1
34 RXDLIN1 Receive LIN1
35 TXDCAN Transmit CAN
36 RXDCAN Receive CAN
37 VCAN Supply Input; for internal HS-CAN cell
38 GND GND
39 CANL CAN Low Bus Pin
40 CANH CAN High Bus Pin
41 n.c. not connected; internally not bonded.
42 LIN1 LIN1 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.2 as well as SAE J2602-2.
43 GND Ground
44 LIN2 LIN2 Bus; Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.2 as well as SAE J2602-2.
45 n.c. not connected; internally not bonded.
46 n.c. not connected; internally not bonded.
47 FO2 Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also Chapter 14.1.1)
48 FO3/TEST Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle
output;
Open drain. Active LOW
TEST; Connect to GND to activate SBC Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also Chapter 14.1.1)
Coolin
g Tab
GND Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB.
The exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
Pin Symbol Function
Data Sheet 12 Rev. 1.00
2017-07-31
TLE9263BQXV33
Pin Configuration
3.3 Hints for Unused Pins
It must be ensured that the correct configurations are also selected, i.e. in case functions are not used that
they are disabled via SPI:
• WK1/2/3: connect to GND and disable WK inputs via SPI
• HSx: leave open
• LINx, RXDLINx, TXDLINx, CANH/L, RXDCAN, TXDCAN: leave all pins open
• RO / FOx: leave open
• INT: leave open
• TEST: connect to GND during power-up to activate SBC Development Mode;
connect to VS or leave open for normal user mode operation
• VCC2: leave open and keep disabled
• VCC3: See Chapter 8.5
• VCAN: connect to VCC1
• n.c.: not connected; internally not bonded; connect to GND
• If unused pins are routed to an external connector which leaves the ECU, then these pins should have
provision for a zero ohm jumper (depopulated if unused) or ESD protection.
3.4 Hints for Alternate Pin Functions
In case of alternate pin functions, selectable via SPI, it must be ensured that the correct configurations are also
selected via SPI, in case it is not done automatically. Please consult the respective chapter. In addition,
following topics shall be considered:
• WK1..2: The pins can be either used as HV wake / voltage monitoring inputs or for a voltage measurement
function (via bit WK_MEAS). In the second case, the WK1..2 pins shall not be used / assigned for any wake
detection nor cyclic sense functionality, i.e. WK1 and WK2 must be disabled in the register WK_CTRL_2 and
the level information is to be ignored in the register WK_LVL_STAT.
• FO2..3: The pins can also be configured as GPIOs in the GPIO_CTRL register. In this case, the pins shall not
be used for any fail output functionality. The default function after Power on Reset (POR) is FOx.
TLE9263BQXV33
General Product Characteristics
Data Sheet 13 Rev. 1.00, 2017-07-31
4 General Product Characteristics
4.1 Absolute Maximum Ratings
Table 1 Absolute Maximum Ratings1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
Voltages
Supply Voltage (VS, VSHS) VSx, max -0.3 – 28 V – P_4.1.1
Supply Voltage (VS, VSHS) VSx, max -0.3 – 40 V Load Dump,
max. 400 ms
P_4.1.2
Voltage Regulator 1 VCC1, max -0.3 – 5.5 V – P_4.1.3
Voltage Regulator 2 VCC2, max -0.3 – 28 V VCC2 = 40V for
Load Dump,
max. 400 ms;
P_4.1.4
Voltage Regulator 3
(VCC3REF)
VCC3REF,max -0.3 – 28 V VCC3REF = 40V for
Load Dump,
max. 400 ms;
P_4.1.5
Voltage Regulator 3 (VCC3B) VCC3B,max -0.3 – VS
+ 10
VVCC3B = 40V for
Load Dump,
max. 400 ms;
P_4.1.25
Voltage Regulator 3
(VCC3SH)
VCC3SH,max VS
- 0.30
–VS
+ 0.30
V – P_4.1.26
Wake Inputs WK1..3 VWK, max -0.3 – 40 V – P_4.1.6
Fail Pin FO1 VFO1, max -0.3 – 40 V – P_4.1.7
Fail Pins FO2, FO3/TEST VFO2_3, max -0.3 – VS
+ 0.3
V – P_4.1.23
LINx, CANH, CANL VBUS, max -27 – 40 V – P_4.1.8
Maximum Differential CAN
Bus Voltage
VCAN_Diff, max -5 – 10 V – P_4.1.27
Logic Input Pins (CSN, CLK,
SDI, TXDLINx, TXDCAN)
VI, max -0.3 – VCC1
+ 0.3
V – P_4.1.9
Logic Output Pins (SDO, RO,
INT, RXDLINx, RXDCAN)
VO, max -0.3 – VCC1
+ 0.3
V – P_4.1.10
VCAN Input Voltage VVCAN, max -0.3 – 5.5 V – P_4.1.11
High Side 1...4 VHS, max -0.3 – VSHS
+ 0.3
V – P_4.1.12
Currents
Wake input WK1 IWK1,max 0–500µA
2) P_4.1.13
Wake input WK2 IWK2,max -500 – 0 µA 2) P_4.1.14
TLE9263BQXV33
General Product Characteristics
Data Sheet 14 Rev. 1.00, 2017-07-31
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not
designed for continuous repetitive operation.
Temperatures
Junction Temperature Tj-40 – 150 °C – P_4.1.15
Storage Temperature Tstg -55 – 150 °C – P_4.1.16
ESD Susceptibility
ESD Resistivity VESD,11 -2 – 2 kV HBM3) P_4.1.17
ESD Resistivity to GND, HSx VESD,12 -2 – 2 kV HBM3) P_4.1.18
ESD Resistivity to GND,
CANH, CANL, LINx
VESD,13 -8 – 8 kV HBM4)3) P_4.1.19
ESD Resistivity to GND VESD,21 -500 – 500 V CDM5) P_4.1.20
ESD Resistivity Pin 1,
12,13,24,25,36,37,48 (corner
pins) to GND
VESD,22 -750 – 750 V CDM5) P_4.1.21
1) Not subject to production test, specified by design.
2) Applies only if WK1 and WK2 are configured as alternative HV-measurement function
3) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 k, 100 pF)
4) For ESD “GUN” Resistivity 6KV (according to IEC61000-4-2 “gun test” (150pF, 330)), will be shown in Application
Information and test report will be provided from IBEE
5) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1
Table 1 Absolute Maximum Ratings1) (cont’d)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
TLE9263BQXV33
General Product Characteristics
Data Sheet 15 Rev. 1.00, 2017-07-31
4.2 Functional Range
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
Device Behavior Outside of Specified Functional Range:
•28V
< VS,func < 40V: Device will still be functional including the state machine; the specified electrical
characteristics might not be ensured anymore. The regulators VCC1/2/3 are working properly, however, a
thermal shutdown might occur due to high power dissipation. HSx switches might be turned OFF depending
on VSHS_OV configurations. The specified SPI communication speed is ensured; the absolute maximum
ratings are not violated, however the device is not intended for continuous operation of VS >28V. The device
operation at high junction temperatures for long periods might reduce the operating life time;
•18V < VS,LIN <28V: The LIN transceiver is still functional. However, the communication might fail due to out-of-
LIN-spec operation;
•V
SHS,UVD < VS,LIN < 6V: The LIN transceiver is still functional. However, the communication might fail due to out-
of-LIN-spec operation;
•VCAN < 4.75V: The undervoltage bit VCAN_UV will be set in the SPI register BUS_STAT_1 and the transmitter
will be disabled as long as the UV condition is present;
•5.25V
< VCAN < 5.50V: CAN transceiver still functional. However, the communication might fail due to out-of-
spec operation;
•V
POR,f < VS < 5.5V: Device will still be functional; the specified electrical characteristics might not be ensured
anymore.
– The voltage regulators will enter the low-drop operation mode
(applies for VCC3 only if bit VCC3_VS_ UV_OFF is set),
– A VCC1_UV reset could be triggered depending on the Vrtx settings,
– The LIN transmitter will be disabled if VSHS,UVD is reached,
– HSx switch behavior will depend on the respective configuration:
- HS_UV_SD_EN = ‘0’ (default): HSx will be turned OFF for VSHS < VSHS_UV and will stay OFF;
- HS_UV_SD_EN = ‘1’: HSx stays on as long as possible. An unwanted overcurrent shut down may occur.
OC shut down bit set and the respective HSx switch will stay OFF;
– FOx outputs will remain ON if they were enabled before VS > 5.5V,
– The specified SPI communication speed is ensured.
Table 2 Functional Range
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
Supply Voltage VS,func VPOR –28V
1) VPOR see
section
Chapter 15.10
1) Including Power-On Reset, Over- and Undervoltage Protection
P_4.2.1
LIN Bus Voltage VS,LIN,func 6–18V
2)
2) Parameter Specification according to LIN 2.2 standard
P_4.2.2
CAN Supply Voltage VCAN,func 4.75 – 5.25 V – P_4.2.3
SPI frequency fSPI ––4MHzsee Chapter 16.7
for fSPI,max
P_4.2.4
Junction Temperature Tj-40 – 150 °C – P_4.2.5
TLE9263BQXV33
General Product Characteristics
Data Sheet 16 Rev. 1.00, 2017-07-31
4.3 Thermal Resistance
Table 3 Thermal Resistance1)
1) Not subject to production test, specified by design.
Parameter Symbol Values Unit Note /
Test Condition
Number
Min. Typ. Max.
Junction to Soldering Point RthJSP – 6 – K/W Exposed Pad P_4.3.1
Junction to Ambient RthJA –33–K/W
2)
2) According to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for 1.5W. Board: 76.2x114.3x1.5mm³ with 2
inner copper layers (35µm thick), with thermal via array under the exposed pad contacting the first inner copper layer and
300mm2 cooling area on the bottom layer (70µm).
P_4.3.2
TLE9263BQXV33
General Product Characteristics
Data Sheet 17 Rev. 1.00, 2017-07-31
4.4 Current Consumption
Table 4 Current Consumption
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
SBC Normal Mode
Normal Mode current
consumption
INormal –3.56.5mAVS = 5.5 V to 28 V;
Tj = -40 °C to +150 °C;
VCC2, CAN, LIN,
VCC3, HSx = OFF
P_4.4.1
SBC Stop Mode
Stop Mode current
consumption
IStop_1,25 –4460µA
1)VCC2/3, HSx = OFF;
CAN, LINx, WKx not
wake capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘0’
P_4.4.2
Stop Mode current
consumption
IStop_1,85 –5070µA
1)2)Tj = 85°C;
VCC2/3, HSx = OFF;
CAN, LINx, WKx not
wake capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘0’
P_4.4.3
Stop Mode current
consumption
(high active peak threshold)
IStop_2,25 –6490µA
1)VCC2/3, HSx = OFF;
CAN, LINx, WKx not
wake capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘1’
P_4.4.35
Stop Mode current
consumption
(high active peak threshold)
IStop_2,85 – 70 100 µA 1)2)Tj = 85°C;
VCC2/3, HSx = OFF;
CAN, LINx, WKx not
wake capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘1’
P_4.4.36
SBC Sleep Mode
Sleep Mode current
consumption
ISleep,25 – 15 25 µA VCC2/3, HSx = OFF;
CAN, LINx, WKx not
wake capable
P_4.4.5
Sleep Mode current
consumption
ISleep,85 –2535µA
2)Tj = 85°C;
VCC2/3, HSx = OFF;
CAN, LINx, WKx not
wake capable
P_4.4.6
TLE9263BQXV33
General Product Characteristics
Data Sheet 18 Rev. 1.00, 2017-07-31
Feature Incremental Current Consumption
Current consumption for CAN
module, recessive state
ICAN,rec – 2 3 mA SBC Normal/Stop
Mode; CAN Normal
Mode; VCC1
connected to VCAN;
VTXDCAN = VCC1;
no RL on CAN
P_4.4.7
Current consumption for CAN
module, dominant state
ICAN,dom –34.5mA
2)SBC Normal/Stop
Mode; CAN Normal
Mode; VCC1
connected to VCAN;
VTXDCAN = GND;
no RL on CAN
P_4.4.8
Current consumption for CAN
module, Receive Only Mode
ICAN,RcvOnly –0.91.2mA
2)SBC Normal/Stop
Mode; CAN Receive
Only Mode; VCC1
connected to VCAN;
VTXDCAN = VCC1;
no RL on CAN
P_4.4.9
Current consumption per LIN
module, recessive state
ILIN,rec – 0.1 1 mA SBC Normal/Stop
Mode; LIN Normal
Mode; VTXDLIN =
VCC1;
no RL on LIN
P_4.4.10
Current consumption per LIN
module, dominant state
ILIN,dom –1.01.5mA
2)SBC Normal/Stop
Mode; LIN Normal
Mode; VTXDLIN =
GND;
no RL on LIN
P_4.4.11
Current consumption per LIN
module, Receive Only Mode
ILIN,RcvOnly –0.20.5mA
2)SBC Normal/Stop
Mode; LIN Receive
Only Mode; VTXDLIN
= VCC1; no RL on LIN
P_4.4.12
Current consumption for
WK1..3 wake capability
(all wake inputs)
IWake,WKx,25 –0.22µA
3)4)5) SBC Sleep Mode;
WK1..3 wake capable
(all WKx enabled);
LIN, CAN = OFF
P_4.4.13
Current consumption for
WK1..3 wake capability
(all wake inputs)
IWake,WKx,85 –0.53µA
2)3)4)5)SBC Sleep
Mode; Tj = 85°C;
WK1..3 wake capable;
(all WKx enabled);
LIN, CAN = OFF
P_4.4.14
Table 4 Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
TLE9263BQXV33
General Product Characteristics
Data Sheet 19 Rev. 1.00, 2017-07-31
Current consumption per LIN
module wake capability
IWake,LIN,25 –0.22µA
3)SBC Sleep Mode;
LIN wake capable;
WK1..3, CAN = OFF
P_4.4.15
Current consumption per LIN
module wake capability
IWake,LIN,85 –0.53µA
2)3)SBC Sleep Mode;
Tj = 85°C;
LIN wake capable;
WK1..3, CAN = OFF
P_4.4.16
Current consumption for CAN
wake capability
IWake,CAN,25 –4.56µA
3)SBC Sleep Mode;
CAN wake capable;
WK1..3, LIN = OFF
P_4.4.17
Current consumption for CAN
wake capability
IWake,CAN,85 –5.57µA
2)3)SBC Sleep Mode;
Tj = 85°C;
CAN wake capable;
WK1..3, LIN = OFF
P_4.4.18
VCC2 Normal Mode current
consumption
INormal,VCC2 –2.53.5mAVS = 5.5 V to 28 V;
Tj = -40 °C to +150 °C;
VCC2 = ON (no load)
P_4.4.32
Current consumption for
VCC2 in SBC Sleep Mode
ISleep,VCC2,25 –2535µA
1)3)SBC Sleep Mode;
VCC2 = ON (no load);
LIN, CAN,
WK1..3 = OFF
P_4.4.19
Current consumption for
VCC2 in SBC Sleep Mode
ISleep,VCC2,85 –3040µA
1)2)3)SBC Sleep Mode;
Tj = 85°C; VCC2 = ON
(no load); LIN, CAN,
WK1..3 = OFF
P_4.4.20
Current consumption for
VCC3 in SBC Sleep Mode in
stand-alone configuration
ISleep,VCC3,25 –4060µA
1)3)SBC Sleep Mode;
VCC3 = ON (no load,
stand-along config.);
LIN, CAN,
WK1..3 = OFF
P_4.4.21
Current consumption for
VCC3 in SBC Sleep Mode in
stand-alone configuration
ISleep,VCC3,85 –5070µA
1)2)3)SBC Sleep Mode;
Tj = 85°C; VCC3 = ON
(no load, stand-along
config.); LIN, CAN,
WK1..3 = OFF
P_4.4.22
Current consumption for HSx
in SBC Stop Mode
IStop,HSx,25 – 550 675 µA 3)6)SBC Stop Mode;
Cyclic Sense & HSx=
ON (no load);
LIN, CAN,
WK1..3 = OFF
P_4.4.33
Table 4 Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
TLE9263BQXV33
General Product Characteristics
Data Sheet 20 Rev. 1.00, 2017-07-31
Note: There is no additional current consumption contribution due to PWM generators.
Current consumption for HSx
in SBC Stop Mode
IStop,HSx,85 – 575 700 µA 2)3)6)SBC Stop Mode;
Tj = 85°C;
Cyclic Sense & HSx =
ON (no load);
LIN, CAN,
WK1..3 = OFF
P_4.4.34
Current consumption for
cyclic sense function
IStop,CS25 –2028µA
3)7)8)SBC Stop Mode;
WD = OFF
P_4.4.23
Current consumption for
cyclic sense function
IStop,CS85 –2435µA
2)3)7)8)SBC Stop Mode;
Tj = 85°C;
WD = OFF
P_4.4.27
Current consumption for
watchdog active in Stop
Mode
IStop,WD25 –2028µA
2)SBC Stop Mode;
Watchdog running
P_4.4.30
Current consumption for
watchdog active in Stop
Mode
IStop,WD85 –2435µA
2)SBC Stop Mode;
Tj = 85°C;
Watchdog running
P_4.4.31
Current consumption for
active fail outputs (FO1..3)
IStop,FOx –1.02.0mA
2)all SBC Modes;
Tj = 25°C; FOx = ON
(no load);
P_4.4.24
1) If the load current on VCC1 will exceed the configured VCC1 active peak threshold IVCC1,Ipeak1,r or IVCC1,Ipeak2,r,
the current consumption will increase by typ. 2.9mA to ensure optimum dynamic load behavior. Same applies to VCC2. For
VCC3 the current consumption will increase by typ. 1.4mA. See also Chapter 6, Chapter 7, Chapter 8.
2) Not subject to production test, specified by design.
3) Current consumption adders of features defined for SBC Sleep Mode also apply for SBC Stop Mode and vice versa (unless
otherwise specified).
4) No pull-up or pull-down configuration selected.
5) The specified WKx current consumption adder for wake capability applies regardless how many WK inputs are activated.
6) A typ. 75µA / max 125µA (Tj = 85°C) adder applies for every additionally activated HSx switch in SBC Stop Mode;
In SBC Normal Mode every HSx switch consumes the typ. 75µA / max 125µA (Tj = 85°C) without the initial adder because
the biasing is already enabled.
7) HS1 used for cyclic sense, Timer 2, 20ms period, 0.1ms on-time, no load on HS1.
In general the current consumption adder for cyclic sense in SBC Stop Mode can be calculated with below equation:
IStop,CS = 18µA + (525µA *tON/TPer)
8) Also applies to Cyclic Wake
Table 4 Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
Parameter Symbol Values Unit Note / Test Condition Number
Min. Typ. Max.
Data Sheet 21 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5 System Features
This chapter describes the system features and behavior of the TLE9263BQXV33:
• State machine
• SBC mode control
• Device configuration
• State of supply and peripherals
• System functions such as cyclic sense or cyclic wake
• Supervision and diagnosis functions
The System Basis Chip (SBC) offers six operating modes:
• SBC Init Mode: Power-up of the device and after a soft reset,
• SBC Normal Mode: The main operating mode of the device,
• SBC Stop Mode: The first-level power saving mode with the main voltage regulator VCC1 enabled,
• SBC Sleep Mode: The second-level power saving mode with VCC1 disabled,
• SBC Restart Mode: An intermediate mode after a wake event from SBC Sleep or Fail-Safe Mode or after a
failure (e.g. WD failure, VCC1 undervoltage reset) to bring the microcontroller into a defined state via a reset.
Once the failure condition is not present anymore the device will automatically change to SBC Normal Mode
after a delay time (tRD1).
• SBC Fail-Safe Mode: A safe-state mode after critical failures (e.g. WD failure, VCC1 undervoltage reset) to
bring the system into a safe state and to ensure a proper restart of the system. VCC1 is disabled. It is a
permanent state until either a wake event (via CAN, LINx or WKx) occurs or the overtemperature condition is
not present anymore.
A special mode, called SBC Development Mode, is available during software development or debugging of the
system. All above mentioned operating modes can be accessed in this mode. However, the watchdog counter
is stopped and does not need to be triggered. This mode can be accessed by setting the TEST pin to GND
during SBC Init Mode.
The device can be configured via hardware (external component) to determine the device behavior after a
watchdog trigger failure. See Chapter 5.1.1 for further information.
The System Basis Chip is controlled via a 16-bit SPI interface. A detailed description can be found in
Chapter 16.The configuration as well as the diagnosis is handled via the SPI. The SPI mapping of the
TLE9263BQXV33 is compatible to other devices of the TLE926x and TLE927x families.
Data Sheet 22 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1 Block Description of State Machine
The different SBC Modes are selected via SPI by setting the respective SBC MODE bits in the register
M_S_CTRL. The SBC MODE bits are cleared when going through SBC Restart Mode and thus always show the
current SBC mode.
Figure 3 State Diagram showing the SBC Operating Modes
SBC Init Mode *
(Long open window)
VCC1
ON
VCC2
OFF
VCC3
OFF
FOx
inact.
CAN
(3)
OFF
LINx
(3)
OFF
Wake up event
SPI cmd SPI cmd SPI cmd
Any SPI
command
WD trigger
First battery connection
VCC1
Undervoltage
Automatic
1st Watchdog Failure Config 2,
2nd Watchdog Failure, Config 4
VCC1 Short to GND
SBC Soft Reset
Reset is released
WD starts with long open window
(1) After Fail-Safe Mode entry, the device will stay for at least typ . 1s
in this mode (with RO low) after a TSD2 event and min. typ. 100ms
after other Fail-Safe Events. Only then the device can leave the
mode via a wake-up event. Wake events are stored during this time.
(2) according to VCC3 configuration
(3) For SBC Development Mode CAN/LINx/VCC2 are ON in SBC Init
Mode and stay ON when going from there to SBC Normal Mode
(4) See chapter CAN & LIN for detailed behavior in SBC Restart Mode
(5) See Chapter 5.1.5 and 14.1 for detailed FOx behavior
WD
Config.
HSx
OFF
SBC Normal Mode
VCC1
ON
VCC2
config.
VCC3
config.
FOx
act/inact
CAN
(3)
config.
LINx
(3)
config.
WD
config.
HSx
config.
SBC Sleep Mode
VCC1
OFF
VCC2
fixed
FOx
fixed
CAN
Wake
capable /off
LINx
Wake
capable /off
WD
OFF.
HSx
fixed
SBC Stop Mode
VCC1
ON
VCC2
fixed
VCC3
fixed
FOx
fixed
CAN
fixed
LINx
fixed
WD
fixed
HSx
fixed
SBC Restart Mode
(RO pin is asserted)
VCC1
ON/
ramping
VCC2
OFF
FOx
(5)
active/
fixed
CAN
(4)
woken /
OFF
WD
OFF
HSx
OFF
SBC Fail-Safe Mode
(1)
VCC1
OFF
VCC2
OFF
VCC3
OFF
FOx
(5)
active
CAN
Wake
capable
WD
OFF
HSx
OFF
Config .: settings can be
changed in this SBC mode ;
Fixed : settings stay as defined
in SBC Normal Mode
TSD2 event,
LINx
Wake
capable
LINx
(4)
woken /
OFF
VCC3
(2)
fixed/
ramping
VCC3
(2)
Fixed /
OFF
* The SBC Development Mode
is a super set of state machine
where the WD timer is stopped
and CAN /LINx behavior differs
in SBC Init Mode . Otherwise,
there are no differences in
behavior.
Cyc. Wake
OFF
Cyc. Sense
OFF
Cyc. Wake
config.
Cyc. Sense
config.
Cyc. Wake
fixed
Cyc. Sense
fixed
Cyc. Wake
OFF
Cyc. Sense
fixed
Cyc. Wake
OFF
Cyc. Sense
OFF
Cyc. Wake
OFF
Cyc. Sense
OFF
CAN, LINx, WKx wake-up event
OR
Release of over temperature
TSD2 after t
TSD2
VCC1 over voltage
Config 2/4 (if VCC_OV_RST set)
VCC1 over voltage
Config 1/3 (if VCC_OV_RST set)
Watchdog Failure:
Config 1/3 & 1st WD failure
in Config4 After 4x consecutive VCC 1
under voltage events
(if VS > VS_UV)
Data Sheet 23 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1.1 Device Configuration and SBC Init Mode
The SBC starts up in SBC Init Mode after crossing the power-on reset VPOR,r threshold (see also Chapter 15.3)
and the watchdog will start with a long open window (tLW).
During this power-on phase following configurations are stored in the device:
• The device behavior regarding a watchdog trigger failure and a VCC1 overvoltage condition is determined by
the external circuitry on the INT pin (see below)
• The selection of the normal device operation or the SBC Development Mode (watchdog disabled for debugging
purposes) will be set depending on the voltage level of the FO3/TEST pin (see also Chapter 5.1.7).
5.1.1.1 Device Configuration
The configuration selection is intended to select the SBC behavior regarding a watchdog trigger failure.
Depending on the requirements of the application, the VCC1 output shall be switched OFF and the device shall
go to SBC Fail-Safe Mode in case of a watchdog failure (1 or 2 fails). To set this configuration (Config 2/4), the
INT pin does not need an external pull-up resistor. In case VCC1 should not be switched OFF (Config 1/3), the
INT pin needs to have an external pull-up resistor connected to VCC1 (see application diagram in
Chapter 17.1).
Figure 5 shows the timing diagram of the hardware configuration selection. The hardware configuration is
defined during SBC Init Mode. The INT pin is internally pulled LOW with a weak pull-down resistor during the
reset delay time tRD1, i.e.after VCC1 crosses the reset threshold VRT1 and before the RO pin goes HIGH. The INT
pin is monitored during this time (with a continuos filter time of tCFG_F) and the configuration (depending on
the voltage level at INT) is stored at the rising edge of RO.
Note: If the POR bit is not cleared then the internal pull-down resistor will be reactivated every time RO is
pulled LOW the configuration will be updated at the rising edge of RO. Therefore it is recommended
to clear the POR bit right after initialization. In case there is no stable signal at INT, then the default
value ‘0’ will taken as the config select value = SBC Fail-Safe Mode.
Data Sheet 24 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
Figure 4 Hardware Configuration Selection Timing Diagram
There are four different device configurations (Table 5) available defining the watchdog failure and the VCC1
overvoltage behavior. The configurations can be selected via the external connection on the INT pin and the
SPI bit CFG in the HW_CTRL register (see also Chapter 16.4):
•CFGP = ‘1’: Config 1 and Config 3:
– A watchdog trigger failure leads to SBC Restart Mode and depending on CFG the Fail Outputs (FOx) are
activated after the 1st (Config 1) or 2nd (Config 3) watchdog trigger failure;
– A VCC1 overvoltage detection will lead to SBC Restart Mode if VCC1_OV_RST is set.
VCC1_ OV will be set and the Fail Outputs are activated;
•CFGP = ‘0’: Config 2 and Config 4:
– A watchdog trigger failure leads to SBC Fail-Safe Mode and depending on CFG the Fail Outputs (FOx)
are activated after the 1st (Config 2) or 2nd (Config 4) watchdog trigger failure. The first watchdog
trigger failure in Config 4 will lead to SBC Restart Mode;
– A VCC1 overvoltage detection will lead to SBC Fail-Safe Mode if VCC1_OV_RST is set.
VCC1_ OV will be set and the Fail Outputs are activated;
The respective device configuration can be identified by reading the SPI bit CFG in the HW_CTRL register and
the CFGP bit in the WK_LVL_STAT register.
Table 5 shows the configurations and the device behavior in case of a watchdog trigger failure:
Table 5 Watchdog Trigger Failure Configuration
Config INT Pin (CFGP)SPI Bit CFG Event FOx Activation SBC Mode Entry
1 External pull-up 1 1 x Watchdog Failure after 1st WD Failure SBC Restart Mode
2 No ext. pull-up 1 1 x Watchdog Failure after 1st WD Failure SBC Fail-Safe Mode
3 External pull-up 0 2 x Watchdog Failure after 2nd WD Failure SBC Restart Mode
4 No ext. pull-up 0 2 x Watchdog Failure after 2nd WD Failure SBC Fail-Safe Mode
t
VCC1
t
RO
t
VS
V
POR,r
t
RD1
V
RT1,r
t
CFG_F
Configuration selection monitoring period
Continuous Filtering with
Data Sheet 25 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
Table 6 shows the configurations and the device behavior in case of a VCC1 overvoltage detection when
VCC1_OV_RST is set:
The respective configuration will be stored for all conditions and can only be changed by powering down the
device (VS < VPOR,f).
Table 6 Device Behavior in Case of VCC1 Overvoltage Detection
Config INT Pin (CFGP)CFG Bit VCC1_O
V_RST
Event VCC1_
OV
FOx Activation SBC Mode Entry
1-4 any value x 0 1 x VCC1 OV 1 no FOx activation unchanged
1 External pull-
up
1 1 1 x VCC1 OV 1 after 1st VCC1 OV SBC Restart Mode
2No ext. pull-up1 1 1 x VCC1 OV 1after 1st VCC1 OV SBC Fail-Safe Mode
3 External pull-
up
0 1 1 x VCC1 OV 1 after 1st VCC1 OV SBC Restart Mode
4No ext. pull-up0 1 1 x VCC1 OV 1after 1st VCC1 OV SBC Fail-Safe Mode
Data Sheet 26 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1.1.2 SBC Init Mode
In SBC Init Mode, the device waits for the microcontroller to finish its startup and initialization sequence. In
the SBC Init Mode any valid SPI command will bring the SBC to SBC Normal Mode. During the long open
window the watchdog has to be triggered. Thereby the watchdog will be automatically configured.
A missing watchdog trigger during the long open window will cause a watchdog failure and the device will
enter SBC Restart Mode.
Wake events are ignored during SBC Init Mode and will therefore be lost.
Note: Any SPI command will bring the SBC to SBC Normal Mode even if it is a illegal SPI command (see
Chapter 16.2).
Note: For a safe start-up, it is recommended to use the first SPI command to trigger and to configure the
watchdog (see Chapter 15.2).
Note: At power up no VCC1_UV will be issued nor will FOx be triggered as long as VCC1 is below the VRT,x
threshold and if VS is below the VCC1 short circuit detection threshold VS,UV. The RO pin will be kept
low as long as VCC1 is below the selected VRT,x threshold.
Data Sheet 27 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1.2 SBC Normal Mode
The SBC Normal Mode is the standard operating mode for the SBC. All configurations have to be done in SBC
Normal Mode before entering a low-power mode (see also Chapter 5.1.6 for the device configuration defining
the Fail-Safe Mode behavior). A wake-up event on CAN, LINx and WKx will create an interrupt on pin INT -
however, no change of the SBC mode will occur. The configuration options are listed below:
• VCC1 is active
• VCC2 can be switched ON or OFF (default = OFF)
• VCC3 is configurable (OFF coming from SBC Init Mode; as previously programmed coming from SBC Restart
Mode)
• CAN is configurable (OFF coming from SBC Init Mode; OFF or wake capable coming from SBC Restart Mode,
see also Chapter 5.1.5)
• LIN is configurable (OFF coming from SBC Init Mode; OFF or wake capable coming from SBC Restart Mode,
see also Chapter 5.1.5)
• HS Outputs can be switched ON or OFF (default = OFF) or can be controlled by PWM; HS Outputs are OFF
coming from SBC Restart Mode
• Wake pins show the input level and can be selected to be wake capable (interrupt)
• Cyclic sense can be configured with HS1...4 and Timer1 or Timer 2
• Cyclic wake can be configured with Timer1 or Timer2
• Watchdog is configurable
• All FOx outputs are OFF by default. Coming from SBC Restart Mode FOx can be active (due to a failure event,
e.g. watchdog trigger failure, VCC1 short circuit, etc.) or inactive (no failure occurred)
In SBC Normal Mode, there is the possibility of testing the FO outputs, i.e. to verify if setting the FO pin to low
will create the intended behavior within the system. The FO output can be enabled and then disabled again
by the microcontroller by setting the FO_ON SPI bit. This feature is only intended for testing purposes.
Data Sheet 28 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1.3 SBC Stop Mode
The SBC Stop Mode is the first level technique to reduce the overall current consumption by setting the
voltage regulators VCC1, VCC2 and VCC3 into a low-power mode. In this mode VCC1 is still active and supplying
the microcontroller, which can enter a power down mode. The VCC2 supply, CAN & LIN mode as well as the
HSx outputs can be configured to stay enabled. All kind of settings have to be done before entering SBC Stop
Mode. In SBC Stop Mode any kind of SPI WRITE commands are ignored and the SPI_FAIL bit is set, except for
changing to SBC Normal Mode, triggering a SBC Soft Reset, refreshing the watchdog as well as for reading and
clearing the SPI status registers. A wake-up event on CAN, LINx and WKx will create an interrupt on pin INT -
however, no change of the SBC mode will occur. The configuration options are listed below:
•VCC1 is ON
•VCC2 is fixed as configured in SBC Normal Mode
• VCC3 is fixed as configured in SBC Normal Mode
• CAN mode is fixed as configured in SBC Normal Mode
• LIN mode is fixed as configured in SBC Normal Mode
• WK pins are fixed as configured in SBC Normal Mode
• HS Outputs are fixed as configured in SBC Normal Mode
• Cyclic sense is fixed as configured in SBC Normal Mode
• Cyclic wake is fixed as configured in SBC Normal Mode
• Watchdog is fixed as configured in SBC Normal Mode
• SBC Soft Reset can be triggered
• FOx outputs are fixed, i.e. the state from SBC Normal Mode is maintained
An interrupt is triggered on the pin INT when SBC Stop Mode is entered and not all wake source signalization
flags from WK_STAT_1 and WK_STAT_2 were cleared.
Note: If switches are enabled during SBC Stop Mode, e.g. HSx on with or without PWM, then the SBC current
consumption will increase (see Chapter 4.4).
Note: It is not possible to switch directly from SBC Stop Mode to SBC Sleep Mode. Doing so will also set the
SPI_FAIL flag and will bring the SBC into Restart Mode.
Note: When WK1 and WK2 are configured for the alternate measurement function (WK_MEAS = 1) then the
wake inputs cannot be selected as wake input sources.
Data Sheet 29 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1.4 SBC Sleep Mode
The SBC Sleep Mode is the second level technique to reduce the overall current consumption to a minimum
needed to react on wake-up events or for the SBC to perform autonomous actions (e.g. cyclic sense). In this
mode, VCC1 is OFF and not supplying the microcontroller anymore.The VCC2 supply as well as the HSx outputs
can be configured to stay enabled. The settings have to be done before entering SBC Sleep Mode. A wake-up
event on CAN, LINx or WKx will bring the device via SBC Restart Mode into SBC Normal Mode again and signal
the wake source. The configuration options are listed below:
• VCC1 is OFF
• VCC2 is fixed as configured in SBC Normal Mode
• VCC3 is fixed or OFF as configured in SBC Normal Mode
• CAN mode changes automatically from ON or Receive Only Mode to wake capable mode or can be selected
to be OFF
• LIN mode changes automatically from ON or Receive Only Mode to wake capable mode or can be selected to
be OFF
• WK pins are fixed as configured in SBC Normal Mode
• HS Outputs are fixed as configured in SBC Normal Mode
• Cyclic sense is fixed as configured in SBC Normal Mode
• Cyclic wake is not available
• Watchdog is OFF
• FOx outputs are fixed, i.e. the state from SBC Normal Mode is maintained
• As VCC1 is OFF during SBC Sleep Mode, no SPI communication is possible;
• The Sleep Mode entry is signalled in the SPI register DEV_STAT with the bit DEV_STAT
It is not possible to switch all wake sources off in SBC Sleep Mode. Doing so will set the SPI_FAIL flag and will
bring the SBC into SBC Restart Mode.
In order to enter SBC Sleep Mode successfully, all wake source signalization flags from WK_STAT_1 and
WK_STAT_2 need to be cleared. A failure to do so will result in an immediate wake-up from SBC Sleep Mode
by going via SBC Restart to Normal Mode.
All settings must be done before entering SBC Sleep Mode.
Note: If switches are enabled during SBC Sleep mode, e.g. HSx on with or without PWM, then the SBC
current consumption will increase (see Chapter 4.4).
Note: Cyclic Sense function will not work properly anymore in case of an overcurrent, overtemperature,
under- or overvoltage (in case function is selected) event because the respective HS switch will be
disabled.
Note: When WK1 and WK2 are configured for the alternate measurement function (WK_MEAS = 1) then the
wake inputs cannot be selected as wake input sources.
Data Sheet 30 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.1.5 SBC Restart Mode
There are multiple reasons to enter the SBC Restart Mode. The purpose of the SBC Restart Mode is to reset the
microcontroller:
• in case of undervoltage on VCC1 in SBC Normal and in SBC Stop Mode,
• in case of overvoltage on VCC1 if the bit VCC1_OV_RST is set and if CFGP = ‘1’,
• due to 1st incorrect Watchdog triggering (only if Config1, Config3 or Config 4 is selected, otherwise SBC Fail-
Safe Mode is immediately entered),
• In case of a wake event from SBC Sleep or SBC Fail-Safe Mode or a release of overtemperature shutdown
(TSD2) out of SBC Fail-Safe Mode this transition is used to ramp up VCC1 after a wake in a defined way.
From SBC Restart Mode, the SBC goes automatically to SBC Normal Mode, i.e the mode is left automatically
by the SBC without any microcontroller influence. The SBC MODE bits are cleared. As shown in Figure 47 the
Reset Output (RO) is pulled low when entering Restart Mode and is released at the transition to Normal Mode
after the reset delay time (tRD1). The watchdog timer will start with a long open window starting from the
moment of the rising edge of RO and the watchdog period setting in the register WD_CTRL will be changed to
the respective default value ‘100’.
Leaving the SBC Restart Mode will not result in changing / deactivating the Fail outputs.
The behavior of the blocks is listed below:
• All FOx outputs are activated in case of a 1st watchdog trigger failure (if Config1 or Config2 is selected) or
in case of VCC1 overvoltage detection (if VCC1_OV_RST is set)
• VCC1 is ON or ramping up
• VCC2 will be disabled if it was activated before
• VCC3 is fixed or ramping as configured in SBC Normal Mode
• CAN is “woken” due to a wake event or OFF depending on previous SBC and transceiver mode (see also
Chapter 10). It is wake capable when it was in CAN Normal-, Receive Only or wake capable mode before
SBC Restart Mode
• LIN is “woken” or OFF depending on previous SBC and transceiver mode (see also Chapter 11). It is wake
capable when it was in LIN Normal-, Receive Only or wake capable mode before SBC Restart Mode.
• HS Outputs will be disabled if they were activated before
• RO is pulled low during SBC Restart Mode
• SPI communication is ignored by the SBC, i.e. it is not interpreted
• The Restart Mode entry is signalled in the SPI register DEV_STAT with the bits DEV_STAT
Table 7 Reasons for Restart - State of SPI Status Bits after Return to Normal Mode
Prev. SBC Mode Event DEV_STAT WD_FAIL VCC1_UV VCC1_OV VCC1_SC
Normal 1x Watchdog Failure 01 01 x x x
Normal 2x Watchdog Failure 01 10 x x x
Normal VCC1 undervoltage reset 01 xx 1 x x
Normal VCC1 overvoltage reset 01 xx x 1 x
Stop 1x Watchdog Failure 01 01 x x x
Stop 2x Watchdog Failure 01 10 x x x
Stop VCC1 undervoltage reset 01 xx 1 x x
Stop VCC1 overvoltage reset 01 xx x 1 x
Sleep Wake-up event 10 xx x x x
Fail-Safe Wake-up event 01 see “Reasons for Fail Safe, Table 8”
Data Sheet 31 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
Note: An overvoltage event on VCC1 will only lead to SBC Restart Mode if the bit VCC1_OV_RST is set and if
CFGP = ‘1’ (Config 1/3).
Note: The content of the WD_FAIL bits will depend on the device configuration, e.g. 1 or 2 watchdog
failures.
5.1.6 SBC Fail-Safe Mode
The purpose of this mode is to bring the system in a safe status after a failure condition by turning off the VCC1
supply and powering off the microcontroller. After a wake event the system is then able to restart again.
The Fail-Safe Mode is automatically reached for following events:
• after an SBC thermal shutdown (TSD2) (see also Chapter 15.9.3),
• in case of overvoltage on VCC1 if the bit VCC1_OV_RST is set and if CFGP = ‘0’,
• after a 1st incorrect watchdog trigger in Config2 (CFG = 1) and after a 2nd incorrect watchdog trigger in Config4
(CFG = 0) (see also Chapter 5.1.1),
• if VCC1 is shorted to GND (see also Chapter 15.7),
• After 4 consecutive VCC1 undervoltage events (only if VS > VS,UV, see Chapter 15.6).
In this case, the default wake sources (CAN, LINx, WK1...3, see also registers WK_CTRL_2, BUS_CTRL_1 and
BUS_CTRL_2) are activated, the wake events are cleared in the register WK_STAT_1, and all output drivers
and all voltage regulators are switched off. When WK1 and WK2 are configured for the alternate measurement
function (WK_MEAS = 1) then WK1 and WK2 will stay configured for the measurement function when SBC Fail-
Safe Mode is entered, i.e. they will not be activated as wake sources.
The SBC Fail-Safe Mode will be maintained until a wake event on the default wake sources occurs. To avoid
any fast toggling behavior a filter time of typ. 100ms (tFS,min) is implemented. Wake events during this time will
be stored and will automatically lead to entering SBC Restart Mode after the filter time.
In case of an VCC1 overtemperature shutdown (TSD2) the SBC Restart Mode will be reached automatically
after a filter time of typ. 1s (tTSD2) without the need of a wake event.
Leaving the SBC Fail-Safe Mode will not result in deactivation of the Fail Output pins.
The following functions are influenced during SBC Fail-Safe Mode:
• All FOx outputs are activated (see also Chapter 14)
• VCC1 is OFF
• VCC2 is OFF
• VCC3 is OFF
•CAN is wake capable
•LINx is wake capable
• HS Outputs are OFF
• WK pins are wake capable through static sense (with default 16µs filter time)
• Cyclic sense and Cyclic wake is disabled
• SPI communication is disabled because VCC1 is OFF
• The Fail-Safe Mode activation is signalled in the SPI register DEV_STAT with the bits FAILURE and
DEV_STAT
Data Sheet 32 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
Note: An overvoltage event on VCC1 will only lead to SBC Fail-Safe Mode if the bit VCC1_OV_RST is set and
if CFGP = ‘0’ (Config 2/4).
Note: The content of the WD_FAIL bits will depend on the device configuration, e.g. 1 or 2 watchdog
failures.
Note: See Chapter 15.6.1 for detailed description of the 4x VCC1 undervoltage behavior.
5.1.7 SBC Development Mode
The SBC Development Mode is used during the development phase of the module. It is especially useful for
software development.
Compared to the default SBC user mode operation, this mode is a super set of the state machine. The device
will start also in SBC Init Mode and it is possible to use all the SBC Modes and functions with following
differences:
• Watchdog is stopped and does not need to be triggered. Therefore no reset is triggered due to watchdog
failure
• SBC Fail-Safe and SBC Restart Mode are not reached due to watchdog failure but the other reasons to enter
these modes are still valid
• LINx, CAN and VCC2 default value in SBC INIT MODE and entering SBC Normal Mode from SBC Init Mode
is ON instead of OFF
The SBC Development Mode is reached automatically if the FO3/TEST pin is set and kept LOW during SBC Init
Mode. The voltage level monitoring is started as soon as VS > VPOR,f. The Development Mode is configured and
maintained if SBC Init Mode is left by sending any SPI command while FO3/TEST is LOW. In case the FO3/TEST
level will be HIGH for longer than tTEST during the monitoring period then the SBC Development Mode is not
reached .
The SBC will remain in this mode for all conditions and can only be left by powering down the device
(VS < VPOR,f).
Table 8 Reasons for Fail-Safe - State of SPI Status Bits after Return to Normal Mode
Prev. SBC
Mode
Failure Event DEV_
STAT
TSD2 WD_
FAIL
VCC1_
UV
VCC1_
UV_FS
VCC1_
OV
VCC1_
SC
Normal 1 x Watchdog Failure 01 x 01 x x x x
Normal 2 x Watchdog Failure 01 x 10 x x x x
Normal TSD2 01 1 xx x x x x
Normal VCC1 short to GND 01 x xx 1 x x 1
Normal 4x VCC1 UV 01 x xx 1 1 x x
Normal VCC1 overvoltage 01 x xx x x 1 x
Stop 1 x Watchdog Failure 01 x 01 x x x x
Stop 2 x Watchdog Failure 01 x 10 x x x x
Stop TSD2 01 1 xx x x x x
Stop VCC1 short to GND 01 x xx 1 x x 1
Stop 4x VCC1 UV 01 x xx 1 1 x x
Stop VCC1 overvoltage 01 x xx x x 1 x
Data Sheet 34 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.2 Wake Features
Following wake sources are implemented in the device:
• Static Sense: WK inputs are permanently active (see Chapter 12)
• Cyclic Sense: WK inputs only active during on-time of cyclic sense period (see below)
• Cyclic Wake: internal wake source controlled via internal timer (see below)
• CAN wake: Wake-up via CAN message (see Chapter 10)
• LIN wake: Wake-up via LIN message (see Chapter 11)
5.2.1 Cyclic Sense
The cyclic sense feature is intended to reduce the quiescent current of the device and the application.
In the cyclic sense configuration, one or more high-side drivers are switched on periodically controlled by
TIMER1_CTRL and TIMER2_CTRL. The respective high-side drivers supply external circuitries e.g. switches
and/or resistor arrays, which are connected to one or more wake inputs (see Figure 5). Any edge change of the
WKx input signal during the on-time of the cyclic sense period causes a wake. Depending on the SBC mode,
either the INT is pulled low (SBC Normal Mode and Stop Mode) or the SBC is woken enabling the VCC1 (after
SBC Sleep and SBC Fail-Safe Mode).
Figure 5 Cyclic Sense Working Principle
Switching
Circuitry
1-4
High Side
HS x
WK x
SBC
STATE
MACHINE
GND
WK
1-3
WK_FLT_CTRL
HS_CTRL
TIMER_CTRL
Period / On-Time
Signals
to uC
INT
Data Sheet 35 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.2.1.1 Configuration and Operation of Cyclic Sense
The correct sequence to configure the cyclic sense is shown in Figure 6. All the configurations have to be
performed before the on-time is set in the TIMERx_CTRL registers. The settings “OFF / LOW” and “OFF / HIGH”
define the voltage level of the respective HS driver before the start of the cyclic sense. The intention of this
selection is to avoid an unintentional wake due to a voltage level change at the start of the cyclic sense.
Cyclic Sense (=TimerX) will start as soon as the respective on-time has been selected independently from the
assignment of the HS and filter configuration. The selection of the respective timer (Config C/D see
Chapter 12.2.1) must therefore be done before starting the timer. The correct configuration sequence is as
follows:
• Configure the initial level
• Mapping of a Timer to the respective HSx outputs
• Configuring the respective filter timing and WK pins
• Configuring the timer period and on-time
Figure 6 Cyclic Sense: Configuration and Sequence
Note: All configurations of period and on-time can be selected. However, recommended on-times for cyclic
sense are 0.1ms, 0.3ms and 1ms. The SPI_FAIL will be set if the on-time is longer than the period.
Cyclic Sense Configuration
Assign Timer to selected HS switch
in HS_CTRL_X
Enable WKx as wake source with
configured Timer in WK_FLT_CTRL
Cyclic Sense starts / ends by
setting / clearing On-time
Timer1, Timer2
Select Timer Period and desired
On-Time in TIMERx_CTRL
WK1, WK2, WK3 with
above selected timer
Period : 10, 20, 50, 100, 200ms, 1s, 2s
On-Time: 0.1, 0.3, 1.0, 10, 20ms
Assign TIMERx_ON to OFF/Low or
OFF/High in TIMERx_CTRL
Timer1, Timer2
Select WKx pull-up / pull-down
configuration in WK_PUPD_CTRL
No pull -up/-down, pull -down or pull-up
selected, automatic switching
Changing the settings can be done on the
fly, changes become effective at the next
on-time or period
Data Sheet 36 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
The first sample of the WK input value (HIGH or LOW) is taken as the reference for the next cycle. A change of
the WK input value between the first and second cycle recognized during the on-time of the second cycle will
cause a wake from SBC Sleep Mode or an interrupt during SBC Normal or SBC Stop Mode.
A filter time of 16µs is implemented to avoid a parasitic wake-up due to transients or EMC disturbances. The
filter time tFWK1 is triggered right at the end of the selected on-time and a wake signal is recognized if:
• the input level will not cross the switching threshold level of typ. 3V during the selected filter time (i.e. if the
signal will keep the HIGH or LOW level) and
• there was an input level change between the current and previous cycle
Data Sheet 37 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
A wake event due to cyclic sense will set the respective bit WK1_WU, WK2_WU, or WK3_WU.
During Cyclic Sense, WK_LVL_STAT is updated only with the sampled voltage levels of the WKx pins in SBC
Normal or SBC Stop Mode.
The functionality of the sampling and different scenarios are depicted in Figure 7 to Figure 9. The behavior in
SBC Stop and SBC Sleep Mode is identical except that in Stop Mode INT will be triggered to signal a change of
WK input levels and in SBC Sleep Mode, VCC1 will power-up instead.
Figure 7 Wake Input Timing
Figure 8 Cyclic Sense Example in SBC Stop Mode, HSx starts “OFF”/LOW, GND based WKx input
Filter time
tFWK1
On Time
Periode
HS switch
t
Filter time
tFWK1
HS on Cyclic Sense
1st sample taken
as reference Wake detection possible
on 2nd sam ple
High
n-1
Low
open
closed
Filter time
INT &
WK Bit Set
Learning
Cycle
WK
n-1
= High
WK
n
= Low
WK
n
≠WK
n-1
wake event
WK
n+1
= Low
WK
n
= WK
n+1
no wake
WK
n+2
= High
WK
n+2
≠WK
n+ 1
wake event
nn+1n+2
HS
WK
High
Low
Switch
INT
High
Low
Data Sheet 38 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
Figure 9 Cyclic Sense Example in SBC Sleep Mode, HSx starts “OFF”/HIGH,
GND based WKx input
The cyclic sense function will not work properly anymore in case of following conditions:
• in case SBC Fail-Safe Mode is entered: The respective HS Switch will be disabled and the respective wake
pin will be changed to static sensing
• In SBC Normal, Stop, or Sleep Mode in case of an overcurrent, overtemperature, under- or overvoltage (in
case function is selected) event: the respective HS switch will be disabled
Note: The internal timers for cyclic sense are not disabled automatically in case the HS switch is turned off
due to above mentioned failures.This must be considered to avoid loss of wake events.
5.2.1.2 Cyclic Sense in Low Power Mode
If cyclic sense is intended for SBC Stop or SBC Sleep Mode mode, it is necessary to activate the cyclic sense in
SBC Normal Mode before going to the low power mode. A wake event due to cyclic sense will set the respective
bit WK1_WU, WK2_WU or WK3_WU. In Stop Mode the wake event will trigger an interrupt, in Sleep Mode the
wake event will send the device via Restart Mode to Normal Mode. Before returning to SBC Sleep Mode, the
wake status register WK_STAT_1 and WK_STAT_2 needs to be cleared. Trying to go to SBC Sleep mode with
uncleared wake flags, such as WKx_WU the SBC will directly wake-up from Sleep Mode by going via Restart
Mode to Normal Mode, a reset is issued. The WKx_WU bit is seen as source for the wake. This is implemented
in order not to loose an wake event during the transition.
Start of
Cyclic Sense
High
n-1
Low
open
closed
Filter time
INT &
WK Bit Set
Learning
Cycle
WK
n-1
= Low
WK
n
= Low
WK
n
= WK
n-1
no wake event
WK
n
= WK
n+1
= Low
(but ignored because
change during filter time )
WK
n
= WK
n+1
no w ake event
WK
n+2
= High
WK
n+2
≠WK
n+ 1
wake event
nn+1 n+2
HS
WK
High
Low
Switch
High
Low
VCC1
SBC Sleep Mode
Spike
Transition to:
SBC Normal Mode
Data Sheet 39 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.2.2 Cyclic Wake
The cyclic wake feature is intended to reduce the quiescent current of the device and application.
For the cyclic wake feature one or both timers are configured as internal wake-up source and will periodically
trigger an interrupt in SBC Normal and SBC Stop Mode.
The correct sequence to configure the cyclic wake is shown in Figure 10. The sequence is as follows:
• First, disable the timers to ensure that there is not unintentional interrupt when activating cyclic wake,
• Enable Timer1 and/or Timer2 as a wake-up source in the register WK_CTRL_1,
• Configure the respective period Timer1 and/or Timer2. Also an on-time (any value) must be selected to start
the cyclic wake even if the value is ignored.
Figure 10 Cyclic Wake: Configuration and Sequence
As in cyclic sense, the cyclic wake function will start as soon as the on-time is configured. An interrupt is
generated for every start of the on time except for the very first time when the timer is started
Cyclic Wake Configuration
Cyclic Wake starts / ends by
setting / clearing On-time
INT is pulled low at every rising edge
of On-time except first one
Select Timer Period and any
On-Time in TIMERX_CTRL
Periods : 10, 20, 50, 100, 200 ms, 1s, 2s
On-times: any
(OFF /LOW & OFF/HIGH are not allowed )
Disable Timer1 and/or Timer2 as a
wake source in WK_CTRL_1
To avoid unintentional interrupts
Select Timer1 and/or Timer2 as a
wake source in WK_CTRL_1
No interrupt will be generated ,
if the timer is not enabled as a wake source
Data Sheet 40 Rev. 1.00
2017-07-31
TLE9263BQXV33
System Features
5.2.3 Internal Timer
The integrated Timer1 and Timer2 are typically used to wake up the microcontroller periodically (cyclic wake)
or to perform cyclic sense on the wake inputs. Therefore, the timers can be mapped to the dedicated HS
switches by SPI (via HS_CTRL1...2).
Following periods and on-times can be selected via the register TIMER1_CTRL and TIMER2_CTRL
respectively:
• Period: 10ms / 20ms / 50ms / 100ms / 200ms / 1s / 2s
• On time: 0.1ms / 0.3ms / 1.0ms / 10ms / 20ms / OFF at HIGH or LOW
5.3 Supervision Features
The device offers various supervision features to support functional safety requirements. Please see
Chapter 15 for more information.
Data Sheet 41 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 1
6 Voltage Regulator 1
6.1 Block Description
Figure 11 Module Block Diagram
Functional Features
•3.3V low-drop voltage regulator
•Undervoltage monitoring with adjustable reset level, VCC1 prewarning and VCC1 short circuit detection
(VRT1/2/3/4, VPW,f ). Please refer to Chapter 15.6 and Chapter 15.7 for more information.
• Short circuit detection and switch off with undervoltage fail threshold, device enters SBC Fail-Safe Mode
•≥470nF ceramic capacitor at voltage output for stability, with ESR < 1Ω @ f = 10 kHz, to achieve the voltage
regulator control loop stability based on the safe phase margin (bode diagram).
• Output current capability up to IVCC1,lim.
GND
Overt emperature
Shutdown
1
Bandgap
Reference
VS
State
Machine
VCC1
INH
Vref
Data Sheet 42 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 1
6.2 Functional Description
The Voltage Regulator 1 (=VCC1) is “ON” in SBC Normal and SBC Stop Mode and is disabled in SBC Sleep and
in SBC Fail-Safe Mode. The regulator can provide an output current up to IVCC1,lim.
For low-quiescent current reasons, the output voltage tolerance is decreased in SBC Stop Mode because only
a low-power mode regulator with a lower accuracy (VCC1,out41) will be active for small loads. If the load current
on VCC1 exceeds the selected threshold (IVCC1,Ipeak1,r or IVCC1,Ipeak2,r) then the high-power mode regulator will be
also activated to support an optimum dynamic load behavior. The current consumption will then increase by
typ. 2.9mA.
If the load current on VCC1 falls below the selected threshold (IVCC1,Ipeak1,f or IVCC1,Ipeak2,f), then the low-quiescent
current mode is resumed again by disabling the high-power mode regulator.
Both regulators (low-power mode and high-power mode) are active in SBC Normal Mode.
Two different active peak thresholds can be selected via SPI:
•I_PEAK_TH = ‘0’(default): the lower VCC1 active peak threshold 1 is selected with lowest quiescent current
consumption in SBC Stop Mode (IStop_1,25, IStop_1,85);
•I_PEAK_TH = ‘1’: the higher VCC1 active peak threshold 2 is selected with an increased quiescent current
consumption in SBC Stop Mode (IStop_2,25, IStop_2,85);
Data Sheet 43 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 1
6.3 Electrical Characteristics
Table 9 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Output Voltage including line
and Load regulation
(VCC1 = 3.3V)
VCC1,out5 3.23 3.3 3.37 V 1)SBC Normal Mode;
10µA < IVCC1 < 250mA
6V < VS < 28V
P_6.3.14
Output Voltage including line
and Load regulation
VCC1,out8 3.23 3.3 3.37 V 1)SBC Normal Mode;
10µA < IVCC1 < 150mA
P_6.3.22
Output Voltage including line
and Load regulation
(VCC1 = 3.3V)
VCC1,out6 3.29 – 3.35 V 1)2)SBC Normal Mode;
20mA < IVCC1 < 80mA
8V < VS < 18V
25°C < Tj < 125°C
P_6.3.15
Output Voltage including line
and Load regulation
(VCC1 = 3.3V)
VCC1,out71 3.29 3.3 3.43 V SBC Stop Mode;
1mA < IVCC1 < IVCC1,Ipeak
P_6.3.16
Output Voltage including line
and Load regulation
(VCC1 = 3.3V)
VCC1,out72 3.29 3.3 3.47 V SBC Stop Mode;
10µA < IVCC1 < 1mA
P_6.3.21
Output Drop VCC1,d1 – – 500 mV IVCC1 = 50mA
VS=3V
P_6.3.3
Output Drop VCC1,d2 – – 500 mV IVCC1 = 150mA
VS=5V
P_6.3.4
VCC1 Active Peak Threshold 1
(Transition threshold
between low-power and high-
power mode regulator)
IVCC1,Ipeak1,r –1.93.5mA
2) ICC1 rising;
VS = 13.5V
-40°C < Tj < 150°C;
I_PEAK_TH = ‘0’
P_6.3.13
VCC1 Active Peak Threshold 1
(Transition threshold
between high-power and low-
power mode regulator)
IVCC1,Ipeak1,f 0.5 1.3 – mA 2) ICC1 falling;
VS = 13.5V
-40°C < Tj < 150°C;
I_PEAK_TH = ‘0’
P_6.3.17
VCC1 Active Peak Threshold 2
(Transition threshold
between low-power and high-
power mode regulator)
IVCC1,Ipeak2,r –4.37.0mA
2) ICC1 rising;
VS = 13.5V
-40°C < Tj < 150°C;
I_PEAK_TH = ‘1’
P_6.3.18
VCC1 Active Peak Threshold 2
(Transition threshold
between high-power and low-
power mode regulator)
IVCC1,Ipeak2,f 1.7 3.4 – mA 2) ICC1 falling;
VS = 13.5V
-40°C < Tj < 150°C;
I_PEAK_TH = ‘1’
P_6.3.19
Overcurrent Limitation IVCC1,lim 250 – 12002) mA current flowing out of
pin, VCC1 = 0V
P_6.3.6
Data Sheet 44 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 1
Figure 12 Typical on-resistance characterization results of VCC1 pass device during low drop
operation for ICC1 = 100mA
1) In SBC Stop Mode, the specified output voltage tolerance applies when IVCC1 has exceeded the selected active peak
threshold (IVCC1,Ipeak1,r or IVCC1,Ipeak2,r) but with increased current consumption.
2) Not subject to production test, specified by design.
Data Sheet 45 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 1
Figure 13 Characterization results of on-resistance range of VCC1 pass device during low drop
operation for ICC1 = 150mA
Data Sheet 46 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 2
7 Voltage Regulator 2
7.1 Block Description
Figure 14 Module Block Diagram
Functional Features
• 5 V low-drop voltage regulator
• Protected against short to battery voltage, e.g. for off-board sensor supply
• Can also be used for CAN supply
• VCC2 undervoltage monitoring. Please refer to Chapter 15.8 for more information
• Can be active in SBC Normal, SBC Stop, and SBC Sleep Mode (not SBC Fail-Safe Mode)
• VCC2 switch off after entering SBC Restart Mode. Switch off is latched, LDO must be enabled via SPI after
shutdown.
• Overtemperature protection
• 470nF ceramic capacitor at output voltage for stability, with ESR < 1 @ f = 10 kHz, to achieve the voltage
regulator control loop stability based on the safe phase margin (bode diagram).
• Output current capability up to IVCC2,lim.
GND
Overt emperat ure
Shutdown
1
Bandgap
Reference
VS
State
Machine
VCC2
INH
Vref
Data Sheet 47 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 2
7.2 Functional Description
In SBC Normal Mode VCC2 can be switched on or off via SPI.
For SBC Stop- or Sleep Mode, the VCC2 has to be switched on or off before entering the respective SBC mode.
The regulator can provide an output current up to IVCC2,lim.
For low-quiescent current reasons, the output voltage tolerance is decreased in SBC Stop Mode because only
a low-power mode regulator with a lower accuracy (VCC2,out5) will be active for small loads. If the load current
on VCC2 exceeds IVCC2 > IVCC2,Ipeak,r then the high-power mode regulator will also be enabled to support an
optimum dynamic load behavior. The current consumption will then increase by typ. 2.9mA.
If the load current on VCC2 falls below the threshold (IVCC2 < IVCC2,Ipeak,f), then the low-quiescent current mode
is resumed again by disabling the high-power mode regulator.
Both regulators are active in SBC Normal Mode.
Note: If the VCC2 output voltage is supplying external off-board loads, the application must consider the
series resonance circuit built by cable inductance and decoupling capacitor at the load. Sufficient
damping must be provided.
7.2.1 Short to Battery Protection
The output stage is protected for short to VBAT.
Data Sheet 48 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 2
7.3 Electrical Characteristics
Table 10 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Output Voltage including line
and Load regulation
(SBC Normal Mode)
VCC2,out1 4.9 5.0 5.1 V 1)SBC Normal Mode;
10µA < IVCC2 < 100mA
6.5V < VS < 28V
1) In SBC Stop Mode, the specified output voltage tolerance applies when IVCC2 has exceeded the selected active peak
threshold (IVCC2,Ipeak,r) but with increased current consumption.
P_7.3.1
Output Voltage including line
and Load regulation
(SBC Normal Mode)
VCC2,out2 4.9 5.0 5.1 V 1)SBC Normal Mode;
10µA < IVCC2 < 80mA
6V < VS < 28V
P_7.3.16
Output Voltage including line
and Load regulation
(SBC Normal Mode)
VCC2,out3 4.9 5.0 5.1 V 1)SBC Normal Mode;
10µA < IVCC2 < 40mA
P_7.3.2
Output Voltage including line
and Load regulation
(SBC Normal Mode)
VCC2,out4 4.97 – 5.07 V 2)SBC Normal Mode;
10µA < IVCC2 < 5mA
8V < VS < 18V
25°C < Tj < 125°C
2) Not subject to production test, specified by design.
P_7.3.14
Output Voltage including line
and Load regulation
(SBC Stop/Sleep Mode)
VCC2,out5 4.9 5.05 5.2 V Stop, Sleep Mode;
1mA < IVCC2 < IVCC2,Ipeak
P_7.3.3
Output Voltage including line
and Load regulation
(SBC Stop/Sleep Mode)
VCC2,out6 4.9 5.05 5.25 V Stop, Sleep Mode;
10µA < IVCC2 < 1mA
P_7.3.18
Output Drop VCC2,d1 – – 500 mV IVCC2 = 30mA
VS = 5V
P_7.3.4
VCC2 Active Peak Threshold
(Transition threshold
between low-power and high-
power mode regulator)
IVCC2,Ipeak,r –1.93.5mA
2)ICC2 rising;
VS = 13.5V
-40°C < Tj < 150°C
P_7.3.15
VCC2 Active Peak Threshold
(Transition threshold
between high-power and low-
power mode regulator)
IVCC2,Ipeak,f 0.5 1.3 – mA 2)ICC2 falling;
VS = 13.5V
-40°C < Tj < 150°C
P_7.3.17
Overcurrent limitation IVCC2,lim 100 – 7502) mA current flowing out of
pin, VCC2 = 0V
P_7.3.5
Data Sheet 49 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 2
Figure 15 Typical on-resistance of VCC2 pass device during low drop operation for ICC2 = 30mA
Data Sheet 50 Rev. 1.00
2017-07-31
TLE9263BQXV33
Voltage Regulator 2
Figure 16 On-resistance range of VCC2 pass device during low drop operation for ICC2 = 50mA
Data Sheet 51 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
8 External Voltage Regulator 3
8.1 Block Description
Figure 17 Functional Block Diagram
Functional Features
• Low-drop voltage regulator with external PNP transistor (up to 350mA with 470m shunt resistor)
• Four high-voltage pins are used: VS, VCC3B, VCC3SH, VCC3REF
• Configurable as stand-alone regulator (3.3V or 1.8V output voltage selectable via SPI) or in load-sharing
mode with VCC1 (3.3V output voltage)
•≥ 4.7µF ceramic capacitor at output voltage for stability, with ESR < 150mΩ @ f = 10 kHz to achieve the
voltage regulator control loop stability based on the safe phase margin (bode diagram).
• Overcurrent limitation with external shunt in stand-alone configuration
• Adjustable load current sharing ratio between VCC1 and VCC3 for load-sharing configuration
• Undervoltage shutdown in stand-alone configuration only
Table 11
1)External Voltage Regulator Configurations depending on VCC1 output voltage
1) This settings are valid only for the VCC3 stand-alone configuration. The bit VCC3_ V_CFG is ignored for VCC3 load
sharing configuration
VCC1 configuration VCC3 voltage for VCC3_ V_CFG = 0 VCC3 voltage for VCC3_ V_CFG = 1
VCC1 = 3.3V VCC3 = 3.3V VCC3 = 1.8V
R
BE
V
S
-V
CC3shunt
> V
shunt_threshold
V
REF
State Machine
+
-
I
CC3base
VCC3REFVCC3BVCC3SHVS
Data Sheet 52 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
8.2 Functional Description
The external voltage regulator can be used as an independent voltage regulator or in load-sharing mode with
VCC1. Setting VCC3_ON in the M_S_CTRL register in SBC Normal Mode sets the stand-alone configuration of
VCC3 as an independent voltage regulator. The load sharing configuration is set via the SPI bit VCC3_LS in the
HW_CTRL register.
Figure 18 Selecting the Configuration of the VCC3 Regulator
Depending on the configuration the regulator will act in the respective SBC Mode as described in Table 12.
After the VCC3 configuration has been selected, it cannot be changed anymore.
In stand-alone configuration the maximum current ICC3max is defined by the current limitation determined by
the used shunt. In load sharing configuration, the shunt is used to determine the current ratio between VCC1
and VCC3. Since the junction temperature of the external PNP transistor cannot be sensed by the SBC, it
cannot be protected against overtemperature by the SBC. Therefore the thermal behavior has to be analyzed
by the application.
For low-quiescent current reasons, the output voltage tolerance is decreased in SBC Stop Mode because a
low-power mode regulator with a lower accuracy will be active for small loads. If the base current on VCC3
exceeds IVCC3base > IVCC3base,Ipeak,r then the high-power mode regulator is enabled additionally to support an
optimum dynamic load behavior. If the base current on VCC3 falls below the threshold (IVCC3base <
IVCC3base,Ipeak,f), then the low-quiescent current consumption is resumed again by disabling the high-power
mode regulator.
Only the high-power mode regulator is active in SBC Normal Mode.
The status of VCC3 is reported in the SUP_STAT_2 SPI register. The regulator will switch OFF in case of VS
dropping below VS_UV regardless of the VCC3 configuration and will be automatically enabled again when
exceeding this threshold voltage unless the control bit VCC3_VS_ UV_OFF is set, i.e. in order to keep VCC3
enabled below VS_UV the bit VCC3_VS_ UV_OFF must be set. VCC3 will also stay active in SBC Stop Mode
Set bit
VCC3_V_CFG = 0
Set bit
VCC3_ON = 0 or 1
Set bit
VCC3_LS = 1
VCC3_V_CFG is
automatically set to 0
VCC3_LS, VCC3_ON and
VCC3_V_CFG cannot be
changed anymore VCC3_LS and VCC3_V_CFG
cannot be changed anymore
(once VCC3_ON is set for the first time )
VCC3
load sharing?
Default value of
VCC3_LS = ‘0'
VCC3
output voltage
in stand-alone
configuration
Set bit
VCC3_V_CFG = 1
Set bit
VCC3_ON = 0 or 1
stand-alone
configuration
VCC3 = 3.3V
stand-alone
configuration
VCC3 = 1.8V
VCC3 load sharing
VCC3 = VCC1
No
Yes 3.3V
1.8V
Data Sheet 53 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
when the bit VCC3_LS_ STP_ON is set and when load sharing is configured (for detailed protection features
see Chapter 15.7 and Chapter 16.3).
Note: The configuration of the VCC3 voltage regulator behavior must be done immediately after power-up
of the device and cannot be changed afterwards as long as the device is supplied.
Note: As soon as the bit VCC3_ON or VCC3_LS is set for the first time, the configuration for VCC3 cannot be
changed anymore. This configuration is valid - also after a SBC Soft Reset - as long as the SBC is
powered.
Note: If the VCC3 output voltage is supplying external off-board loads, the application must consider the
series resonance circuit built by cable inductance and decoupling capacitor at the load. Sufficient
damping must be provided (e.g. a 100Ohm resistor between the PNP collector and VCC3REF with
10uF capacitor on collector - see also Figure 19).
8.2.1 External Voltage Regulator as Independent Voltage Regulator
Configured as an independent voltage regulator the SBC offers with VCC3 a third supply which could be used
as off-board supply e.g. for sensors due to the integrated HV pins VCC3B, VCC3SH, VCC3REF.
This configuration is set and locked by enabling VCC3_ON while keeping VCC3_LS = 0. VCC3 can be switched
ON or OFF but the configuration cannot be changed anymore. However, the SPI_FAIL is not set while trying to
change the configuration.
An overcurrent limitation function is realized with the external shunt (see Chapter 8.4 for calculating the
desired shunt value) and the output current shunt voltage threshold (Vshunt_threshold). If this threshold is
reached, then ICC3 is limited and only the current limitation bit VCC3_OC is set (no other reaction) and can be
cleared via SPI once the overcurrent condition is not present anymore. If the overcurrent limitation feature is
not needed, then connect the pins VCC3SH and VS together.
In this configuration VCC3 has the undervoltage signalization enabled and an undervoltage event is signaled
with the bit VCC3_UV in the SUP_STAT_2 SPI register.
Note: To avoid undesired current consumption increase of the device it must be ensured that VCC3 is not
connected to VCC1 in this configuration.
Table 12 External Voltage Regulator State by SBC Mode
SBC Mode Load Sharing Mode1)
1) Behaves as VCC1 and has to be configured in SBC Normal Mode
Independent Voltage Regulator
INIT Mode OFF OFF
Normal Mode Configurable Configurable
Stop Mode OFF/Fixed2)
2) Load Sharing operation in SBC Stop Mode is by default disabled for power saving reasons but VCC3_LS bit will stay
set. However, it can be also configured via the SPI bit VCC3_LS_ STP_ON to stay enabled in SBC Stop Mode.
Fixed
Sleep Mode OFF Fixed
Restart Mode ON or ramping Fixed
Fail-Safe Mode OFF OFF
Data Sheet 54 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
Figure 19 Protecting the VCC3 against inductive short circuits when configured as an independent
voltage regulator for off-board supply
8.2.2 External Voltage Regulator in Load Sharing Mode
The purpose of the load sharing mode is to increase the total current capability of VCC1 without increase of
the power dissipation within the SBC. The load current is shared between the VCC1 internal regulator and the
external PNP transistor of VCC3. Figure 20 shows the setup for Load Sharing. Load Sharing is active in SBC
Normal Mode. It can also be configured via SPI to stay active in SBC Stop Mode.
An input voltage up to VSx,MAX is regulated to VCC3,nom = 3.3 V with a precision of ±2% when used in the load
sharing configuration in SBC Normal Mode.
This configuration is set and locked by enabling VCC3_LS for the first time while VCC3_ON has no function, i.e.
keep VCC3_ON = 0. Trying to change the VCC3 configuration after VCC3_LS has been set will result in the
SPI_FAIL bit being set and keeping the VCC3 configurations unchanged. Load sharing will be automatically
disabled (only if VCC3_LS_ STP_ON = 0) during SBC Stop Mode due to power saving reasons but the bit will
remain set to automatically switch back on after returning to SBC Normal Mode. It must be ensured that the
same VCC3 output voltage level is selected as for VCC1.
In this configuration VCC3 has no undervoltage signalization. VCC3 shuts down if Fail-Safe Mode is reached,
e.g. due to undervoltage shutdown (VS,UV monitoring).
VCC3 has no overcurrent limitation in this configuration and the shunt resistor is defining the load sharing
ratio between the VCC1 and VCC3 load currents (see Equation (8.2) in Chapter 8.4). Thus, no overcurrent
condition VCC3_OC will be signaled in this configuration.
R
BE
V
S
-V
CC3shunt
> V
shunt_threshold
V
REF
State Machine
+
-
I
CC3base
VCC3REFVCC3BVCC3SHVS
R
SHUNT
T1
C
2
C
1
V
S
V
CC3
I
CC3
R
Lim
100 Ω
Data Sheet 55 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
Figure 20 VCC3 in Load Sharing Configuration
8.3 External Components
Characterization is performed with the BCP52-16 from Infineon (ICC3 < 200 mA) and with MJD253.
Other PNP transistors can be used. However, the functionality must be checked in the application.
Figure 20 shows one hardware set up used.
Note: The SBC is not able to ensure a thermal protection of the external PNP transistor. The power
handling capabilities for the application must therefore be chosen according to the selected PNP
device, the PCB layout and properties of the application to prevent thermal damage, e.g. via the
shunt current limitation in stand alone configuration or by selecting the proper ICC1/ICC3 ratio in
load-sharing configuration.
Note: To ensure an optimum EMC behavior of the VCC3 regulator when the VCC3 output is leaving the PCB,
it is necessary to optimize the PCB layout to have the PNP very close to the SBC. If this is not sufficient
or possible, an external capacitance should be placed to the off-board connector (see also
Chapter 17.1).
Table 13 Bill of Materials for the VCC3 Function with and without load sharing configuration
Device Vendor Reference / Value
C2 Murata 10 µF/10 V GCM31CR71A106K64L
RSHUNT - 1 Ω (with / without LS)
T1 Infineon BCP52-16
VCC3REFVCC3BVCC3SHVS
RSHUNT T1
C2
C1
VSVCC13
Vcc3
Vcc1
ICC3
ICC1
Data Sheet 56 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
8.4 Calculation of RSHUNT
As a independent regulator, the maximum current ICC3max where the limit starts and the bit ICC3 > ICC3max is set is
determined by the shunt resistor RSHUNT and the Output Current Shunt Voltage Threshold Vshunt_threshold.
The resistor can be calculated as following:
(8.1)
If VCC3 is configured for load sharing, then the shunt resistor determines the load sharing ratio between VCC1
and VCC3. The ratio can be calculated as following:
(8.2)
Example: A shunt resistor with 470mΩ and a load current of 100mA out of VCC1 would result in ICC3 = 191mA.
8.5 Unused Pins
In case the VCC3 is not used in the application, it is recommended to connect the unused pins of VCC3 as
followed:
• Connect VCC3SH to VS or leave open;
• Leave VCC3B open;
• Leave VCC3REF open
• Do not enable the VCC3 via SPI as this leads to increased current consumption
max3
_
CC
thresholdshunt
SHUNT
I
U
R=
)(
15105110 1
1
3a
R
ImV
I
I
SHUNT
CC
CC
CC
−
Ω
=
)(
15105110
1
3b
R
mVI
I
SHUNT
CC
CC
−Ω⋅
=
Data Sheet 57 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
8.6 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all outputs open; all voltages with respect to ground;
positive current defined flowing into pin; unless otherwise specified.
Table 14 Electrical Characteristics
Parameter Symbol Values Uni
t
Note or Test Condition Number
Min. Typ. Max.
Parameters independent from Test Set-up
External Regulator Control
Drive Current Capability
IVCC3base 40 60 80 mA VVCC3base = 13.5 V P_8.6.1
Input Current VCC3ref IVCC3ref 0310µAVVCC3ref = 3.3 V P_8.6.2
Input Current VCC3
Shunt Pin
IVCC3shunt 0310µAVVCC3shunt = VSP_8.6.3
Output Current Shunt
Voltage Threshold
Vshunt_threshold 180 245 310 mV 1) P_8.6.6
Current increase regulation
reaction time
trIinc ––5µs
4)VCC3 = 3.3 V to 0 V;
ICC3base = 20 mA Figure 21
P_8.6.7
Current decrease regulation
reaction time
trIdec ––5µs
4)VCC3 = 0 V to 3.3V;
ICC3base = 20 mA Figure 21
P_8.6.8
Leakage current of
VCC3base when VCC3
disabled
IVCC3base_lk ––5µAVCC3base = VS;
Tj = 25°C
P_8.6.9
Leakage current of VCC3shunt
when VCC3 disabled
IVCC3shunt_lk ––5µAVCC3shunt = VS;
Tj = 25°C
P_8.6.11
Base to emitter resistor RBE 120 150 185 kΩVCC3 = OFF; P_8.6.12
Active Peak Threshold VCC3
(Transition threshold
between low-power and
high-power mode regulator)
IVCC3base,Ipeak,r – 5065µA
4)Drive current IVCC3base;
IVCC3base rising
VS =13.5V;
-40°C < Tj < 150°C
P_8.6.33
Active Peak Threshold VCC3
(Transition threshold
between high-power and
low-power mode regulator)
IVCC3base,Ipeak,f 15 30 – µA 4)Drive current IVCC3base;
IVCC3base falling
VS =13.5V;
-40°C < Tj < 150°C
P_8.6.34
Parameters dependent on the Test Set-up (with external PNP device MJD-253)
External Regulator Output
Voltage (VCC3 = 3.3V)
VCC3.out1 3.23 3.3 3.37 V 2)SBC Normal Mode;
load sharing
configuration with 470
mΩ shunt resistor;
10 µA < IVCC1 + IVCC3
< 300 mA;
P_8.6.26
Data Sheet 58 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
External Regulator Output
Voltage
(VCC3 = 3.3V)
VCC3,out4 3.23 3.3V 3.37 V SBC Normal Mode;
stand-alone
configuration
10 mA < IVCC3 < 300 mA;
P_8.6.22
External Regulator Output
Voltage
(VCC3 = 3.3V)
VCC3,out5 3.15 3.3V 3.453) V SBC Stop-, Sleep Mode;
Stand-alone
configuration
10µA < IVCC3 < IVCC3_peak,r
5)
P_8.6.23
External Regulator Output
Voltage
(VCC3 = 1.8V)
VCC3,out6 1.75 1.8 1.85 V 2)SBC Normal Mode;
stand-alone
configuration
10 mA < ICC3 < 300 mA;
P_8.6.24
External Regulator Output
Voltage
(VCC3 = 1.8V)
VCC3,out7 1.70 1.8 1.903) V2)SBC Stop-, Sleep Mode;
Stand-alone
configuration
10µA < ICC3 < IVCC3_peak,r
5);
P_8.6.25
Load Sharing Ratio
ICC1 : ICC3
RatioLS_1,VCC3 1 :
1.35
1 :
1.9
1 :
2.45
–4)5)6.0V < VS < 28V;
SBC Normal Mode;
LS ratio for a 470 mΩ
shunt resistor and total
load current of 300mA
P_8.6.16
Load Sharing Ratio
ICC1 : ICC3
RatioLS_2,VCC3 1 :
0.67
1 :
0.95
1 :
1.23
–4)5)6.0V < VS < 28V;
SBC Normal Mode;
LS ratio for a 1 Ω shunt
resistor and total load
current of 300mA
P_8.6.20
Load Sharing Ratio
ICC1 : ICC3
RatioLS_3,VCC3 1 :
1.50
1 :
1.95
1 :
2.40
–4)5) Tj = 150°C;
8.0V < VS < 18V;
SBC Normal Mode;
LS ratio for a 470 mΩ
shunt resistor and total
load current of 300mA
P_8.6.27
Load Sharing Ratio
ICC1 : ICC3
RatioLS_4,VCC3 1 :
0.75
1 :
0.98
1 :
1.21
–4)5) Tj = 150°C;
8.0V < VS < 18V;
SBC Normal Mode;
LS ratio for a 1 Ω shunt
resistor and total load
current of 300mA
P_8.6.28
1) Threshold at which the current limitation starts to operate. This threshold is only active when VCC3 is configured for
stand-alone configuration.
2) Tolerance includes load regulation and line regulation.
Table 14 Electrical Characteristics (cont’d)
Parameter Symbol Values Uni
t
Note or Test Condition Number
Min. Typ. Max.
Data Sheet 59 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
Note: There is no thermal protection available for the external PNP transistor. Therefore, the application
must be designed to avoid overheating of the PNP via the shunt current limitation in stand alone
configuration and by selecting the proper ICC1/ICC3 ratio in load-sharing configuration.
Note: In SBC Stop Mode, the same output voltage tolerance applies as in SBC Normal Mode when IVCC3 has
exceeded the selected active peak threshold (IVCC3base,Ipeak) but with increased current consumption.
3) At Tj > 125°C, the power transistor leakage could be increased, which has to be added to the quiescent current of the
application independently if the regulator is turned on/off. To prevent an overvoltage condition at no load due to this
increased leakage, an internal clamping structure will automatically turn on at typ. 200mV above the upper limit of
the programmed output voltage.
4) Not subject to production test, specified by design.
5) a) Ratio will change depending on the chosen shunt resistor which value is correlating to the maximum power
dissipation of the PNP pass device. See Chapter 8.4 for the ratio calculation. The ratio will also change at low-drop
operation.
For supply voltages of 5.5V < VS < 6V the accuracy applies only for a total load current of 250mA.
The load sharing ratio in SBC Stop Mode has +/-10% wider limits than specified.
b) The output voltage precision in load sharing in SBC Stop Mode is according to VCC1 +/-4% or better for loads up to
20mA and +/-2% with loads greater than 20mA.
In SBC Normal the +/-2% precision for 5V/3.3V tolerance is valid regardless of the applied load.
Data Sheet 60 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
Timing diagram for regulator reaction time “current increase regulation reaction time” and “current decrease
regulation reaction time”
Figure 21 Regulator Reaction Time
t
t
V
CC3
I
CCbase
I
CC3base, 50%
t
rlinc
t
rldec
Data Sheet 61 Rev. 1.00
2017-07-31
TLE9263BQXV33
External Voltage Regulator 3
Typical Load Sharing Characteristics using the BCP52-16 PNP transistor and a 1 Ω shunt resistor
Figure 22 Load Sharing Ratio ICC1 : ICC3 vs. the total load current
Figure 23 Load Sharing Behavior of ICC1 vs. the total load current
00,2 0,4 0,6 0,8 1,0 1,2 1,4
0
0,05
0,10
0,15
0,20
0,25
0,30
0,35
Load Sharing Ratio - Icc1 vs. Icc3
Total Current - Icc1 + Icc3 (mA)
Tj = 27°C
Tj = 150°C
Tj = -40°C
(A)
- Icc3 vs. Icc1
00,02 0,04 0,06 0,08 0,10 0,12 0,14 0,16
0
0,05
0,10
0,15
0,20
0,25
0,30
0,35
Load Current - Icc1
Total Current - Icc1 + Icc3 (mA)
Tj = 27°C
Tj = 150°C
Tj = -40°C
(A)
Data Sheet 62 Rev. 1.00
2017-07-31
TLE9263BQXV33
High-Side Switch
9 High-Side Switch
9.1 Block Description
Figure 24 High-Side Module Block Diagram
Features
• Dedicated supply pin VSHS for high-side outputs
• Overvoltage and undervoltage switch off - configurable via SPI
• Overcurrent detection and switch off
• Open load detection in ON-state
• PWM capability with internal timer configurable via SPI
• Switch recovery after removal of OV or UV condition configurable via SPI
9.2 Functional Description
The High-Side switches can be used for control of LEDs, as supply for the wake inputs and for other loads. The
High-Side outputs can be controlled either directly via SPI by (HS_CTRL1, HS_CTRL2), by the integrated
timers or by the integrated PWM generators.
The high-side outputs are supplied by a dedicated supply pin VSHS (different to VS). The topology supports
improved cranking condition behavior.
The configuration of the High-Side (Permanent On, PWM, cyclic sense, etc.) drivers must be done in SBC
Normal Mode. The configuration is taken over in SBC Stop- or SBC Sleep Mode and cannot be modified. When
entering SBC Restart Mode or SBC Fail-Safe Mode the HSx outputs are disabled.
HS Gate Control
Overcurrent Detection
Open Load (On)
VSHS
HSx
Data Sheet 63 Rev. 1.00
2017-07-31
TLE9263BQXV33
High-Side Switch
9.2.1 Over- and Undervoltage Switch Off
All HS drivers in on-state are switched off in case of overvoltage on VSHS (VSHS,OVD). If the voltage drops below
the overvoltage threshold the HS drivers are activated again. The feature can be disabled by setting the SPI bit
HS_OV_SD_EN.
The HS drivers are switched off in case of undervoltage on VSHS (VSHS,UVD). If the voltage rises above the
undervoltage threshold the HS drivers are activated again. The feature can be disabled by setting the SPI bit
HS_UV_SD_EN.
So after release of undervoltage or overvoltage condition the HS switch goes back to programmed state in
which it was configured via SPI. This behavior is only valid if the bit HS_OV_UV_REC is set to ‘1’. Otherwise the
switches will stay off and the respective SPI control bits are cleared.
The overvoltage and undervoltage is signaled in the bits VSHS_OV and VSHS_UV, no other error bits are set.
9.2.2 Overcurrent Detection and Switch Off
If the load current exceeds the overcurrent shutdown threshold for a time longer then the overcurrent
shutdown filter time the output is switched off.
The overcurrent condition and the switch off is signaled with the respective HSx_OC_OT bit in the register
HS_OC_OT_STAT. The HSx configuration is then reset to 000 by the SBC. To activate the High-Side again the
HSx configuration has to be set to ON (001) or be programmed to a timer function. It is recommended to clear
the overcurrent bit before activation the High-Side switch, as the bits are not cleared automatically by the
SBC.
9.2.3 Open Load Detection
Open load detection on the High-Side outputs is done during on state of the output. If the current in the
activated output falls below then Open Load Detection current, the open load is detected and signaled via the
respective bit HS1_OL, HS2_OL, HS3_OL, or HS4_OL in the register HS_OL_STAT. The High-Side output stays
activated. If the open load condition disappears the Open Load bit in the SPI can be cleared. The bits are not
cleared automatically by the SBC.
9.2.4 HSx Operation in Different SBC Modes
• During SBC Stop and SBC Sleep Mode the HSx outputs can be used for the cyclic sense feature. The open-
load detection, overcurrent shut down as well as overvoltage and undervoltage shutdown are available. The
overcurrent shutdown protection feature may influence the wake-up behavior1).
• the HSx output can also be enabled for SBC Stop and SBC Sleep Mode as well as controlled by the PWMx
generator. The HSx outputs must be configured in SBC Normal Mode before entering a low-power mode.
• The HSx outputs are switched off during SBC Restart or SBC Fail-Safe Mode. They can be enabled via SPI if
the failure condition is removed.
1) For the wake feature, the forced overcurrent shut down case must be considered in the user software for all SBC Modes, i.e. due to
disabled HSx switches a level change might not be detected anymore at WKx pins.
Data Sheet 64 Rev. 1.00
2017-07-31
TLE9263BQXV33
High-Side Switch
9.2.5 PWM and Timer Function
Two 8-bit PWM generators are dedicated to generate a PWM signal on the HS outputs, e.g. for brightness
adjustment or compensation of supply voltage fluctuation. The PWM generators are mapped to the dedicated
HS outputs, and the duty cycle can be independently configured with a 8bit resolution via SPI (PWM1_CTRL,
PWM2_CTRL). Two different frequencies (200Hz, 400Hz) can be selected independently for every PWM
generator in the register PWM_FREQ_CTRL.
PWM Assignment and Configuration:
• Configure duty cycle and frequency for respective PWM generator in PWM1_CTRL/PWM2_CTRL and
PWM_FREQ_CTRL
• Assign PWM generator to respective HS switch(es) in HSx_CTRL
• The PWM generation will start right after the HSx is assigned to the PWM generator (HS_CTRL1, HS_CTRL2)
Assignment options of HS1... HS4
•Timer 1
•Timer 2
•PWM 1
•PWM 2
Minimum On-time during PWM Operation
The min. on-time during PWM is limited by the actual on- and off-time of the respective HS switch, e.g. the
PWM setting ‘0000 0001’ could not be realized.
Reliable Open-Load Detection during PWM Operation
The minimum PWM setting for a reliable open-load detection is 3digits for a period of 400Hz and >2 digits for
the frequency setting of 200Hz, i.e. the high-side on-time must be longer than tOL,HS.
Reliable Overcurrent Detection during PWM Operation
The minimum PWM setting for a reliable overcurrent detection is >1 digit for a period of 400Hz and 1 digit for
the frequency setting of 200Hz, i.e. the high-side on-time must be longer than tSD,HS.
Data Sheet 65 Rev. 1.00
2017-07-31
TLE9263BQXV33
High-Side Switch
9.3 Electrical Characteristics
Table 15 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Output HS1, HS2, HS3, HS4
Static Drain-Source ON
Resistance HS1...HS4
RON,HS25 –710ΩIds = 60mA,
Tj < 25°C
P_9.3.1
Static Drain-Source ON
Resistance HS1...HS4
RON,HS150 – 11.5 16 ΩIds = 60mA,
Tj < 150°C
P_9.3.2
Leakage Current HSx / per
channel
Ileak,HS ––2µA
1)0 V < VHSx
< VSHS;
Tj < 85°C
P_9.3.11
Output Slew Rate (rising) SRraise,HS 0.8 – 2.5 V/µs 1)20 to 80%
VSHS = 6 to 18V
RL = 220Ω
1) Not subject to production test, specified by design.
P_9.3.3
Output Slew Rate (falling) SRfall,HS -2.5 – -0.8 V/µs 1)80 to 20%
VSHS = 6 to 18V
RL = 220Ω
P_9.3.4
Switch-on time HSx tON,HS 3 – 30 µs CSN = HIGH to
0.8*VSHS;
RL = 220Ω;
VSHS = 6 to 18V
P_9.3.5
Switch-off time HSx tOFF,HS 3 – 30 µs CSN = HIGH to
0.2*VSHS;
RL = 220Ω;
VSHS = 6 to 18V
P_9.3.6
Short Circuit Shutdown
Current
ISD,HS 150 245 300 mA VSHS = 6 to 20V,
hysteresis
included
P_9.3.7
Short Circuit Shutdown
Filter Time
tSD,HS 12 16 20 µs 2), 3)
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
3) Configure proper minimum PWM settings for reliable detection of overcurrent and open load measurement (see also
Chapter 9.2.5).
P_9.3.8
Open Load Detection
Current
IOL,HS 0.4 – 3 mA hysteresis
included
P_9.3.9
Open Load Detection
hysteresis
IOL,HS,hys 0.05 0.45 1.0 mA 1) P_9.3.14
Open Load Detection Filter
Time
tOL,HS 50 64 80 µs 2), 3) P_9.3.10
Data Sheet 66 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
10 High Speed CAN Transceiver
10.1 Block Description
Figure 25 Functional Block Diagram
10.2 Functional Description
The Controller Area Network (CAN) transceiver part of the SBC provides high-speed (HS) differential mode
data transmission (up to 2 Mbaud) and reception in automotive and industrial applications. It works as an
interface between the CAN protocol controller and the physical bus lines compatible to ISO 11898-2:2016 and
SAE J2284.
The CAN transceiver offers low power modes to reduce current consumption. This supports networks with
partially powered down nodes. To support software diagnostic functions, a CAN Receive-only Mode is
implemented.
It is designed to provide excellent passive behavior when the transceiver is switched off (mixed networks,
clamp15/30 applications).
A wake-up from the CAN wake capable mode is possible via a message on the bus. Thus, the microcontroller
can be powered down or idled and will be woken up by the CAN bus activities.
The CAN transceiver is designed to withstand the severe conditions of automotive applications and to support
12 V applications.
TXDCAN
Output
Stage
Driver
Temp.-
Protection
CANH
CANL +
timeout
RXDCAN
Receiver
MUX
VCC 1
SPI Mode
Control
To SPI diagnostic
VCAN
VCC1
RTXD
Wake
Receiver
Vs
VCAN
VBIAS = 2.5V
Data Sheet 67 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
The different transceiver modes can be controlled via the SPI CAN bits.
Figure 26 shows the possible transceiver mode transitions when changing the SBC mode.
Figure 26 CAN Mode Control Diagram
CAN FD Support
CAN FD stands for ‘CAN with Flexible Data Rate’. It is based on the well established CAN protocol as specified
in ISO 11898-1. CAN FD still uses the CAN bus arbitration method. The benefit is that the bit rate can be
increased by switching to a shorter bit time at the end of the arbitration process and then to return to the
longer bit time at the CRC delimiter, before the receivers transmit their acknowledge bits. See also Figure 27.
In addition, the effective data rate is increased by allowing longer data fields. CAN FD allows the transmission
of up to 64 data bytes compared to the 8 data bytes from the standard CAN.
Figure 27 Bite Rate Increase with CAN FD vs. Standard CAN
Not only the physical layer must support CAN FD but also the CAN controller. In case the CAN controller is not
able to support CAN FD then the respective CAN node must at least tolerate CAN FD communication. This CAN
SBC Normal Mode
SBC Mode CAN Transceiver Mode
SBC Stop Mode
SBC Sleep Mode
SBC Restart Mode
Receive Only Normal Mode OFFWake Capable
Receive Only OFFWake Capable
OFFWoken
1
OFFWake Capable
1
after a wake event on CAN Bus
Normal Mode
Behavior after SBC Restart Mode - not coming from SBC Sleep Mode due to a wake up of the respective transceiver:
If the transceivers had been configured to Normal Mode, or Receive Only Mode, then the mode will be changed to Wake
Capable. If it was Wake Capable, then it will remain Wake Capable. If it had been OFF before SBC Restart Mode, then it
will remain OFF.
Behavior in SBC Development Mode:
CAN default value in SBC INIT MODE and entering SBC Normal Mode from SBC Init Mode is ON instead of OFF.
SBC Fail-Safe Mode Wake Capable
Example:
- 11bit identifier + 8Byte data
- Arbitration Phase 500kbps
- Data Phase 2Mbps
average bit rate 1.14Mbps
CAN Header Data phase
(Byte 0 – Byte 7) CAN Footer
Standard CAN
message
CAN Header Data phase
(Byte 0 – Byte 7) CAN Footer
CAN FD with
reduced bit time
Data Sheet 68 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
FD tolerant mode is realized in the physical layer in combination with CAN Partial Networking. The TLE926x-
3QX variants of this family also support the CAN FD tolerant mode.
10.2.1 CAN OFF Mode
The CAN OFF Mode is the default mode after power-up of the SBC. It is available in all SBC Modes and is
intended to completely stop CAN activities or when CAN communication is not needed. The CANH/L bus
interface acts as a high impedance input with a very small leakage current. In CAN OFF Mode, a wake-up event
on the bus will be ignored.
10.2.2 CAN Normal Mode
The CAN Transceiver is enabled via SPI in SBC Normal Mode. CAN Normal Mode is designed for normal data
transmission/reception within the HS-CAN network. The Mode is available in SBC Normal Mode and in SBC
Stop Mode. The bus biasing is set to VCAN/2.
Transmission
The signal from the microcontroller is applied to the TXDCAN input of the SBC. The bus driver switches the
CANH/L output stages to transfer this input signal to the CAN bus lines.
Enabling sequence
The CAN transceiver requires an enabling time tCAN,EN before a message can be sent on the bus. This means
that the TXDCAN signal can only be pulled LOW after the enabling time. If this is not ensured, then the TXDCAN
needs to be set back to HIGH (=recessive) until the enabling time is completed.
Only the next dominant bit will be transmitted on the bus.
Figure 28 shows different scenarios and explanations for CAN enabling.
Figure 28 CAN Transceiver Enabling Sequence
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls CANH/L slopes symmetrically.
Reception
Analog CAN bus signals are converted into digital signals at RXD via the differential input receiver.
t
V
CANDI F F
t
CAN ,EN
t
V
TXDCAN
t
CAN
Mode
CAN
NO RMA L
CAN
OFF
CAN, EN
t
recessive TXD level
requi red before start of
tr ansm issi on
t
CAN, EN
not ensur ed , no
tr ansm issi on on bus
CAN, EN
t
Cor rect sequence ,
Bus is enabl ed after t
CAN, EN
t
CAN, EN
not ensured ,
no tr ansm ission on bus
recessive TXD
level required
Dominant
Recessive
Data Sheet 69 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
10.2.3 CAN Receive Only Mode
In CAN Receive Only Mode (RXD only), the driver stage is de-activated but reception is still operational. This
mode is accessible by an SPI command in Normal Mode and in Stop Mode. The bus biasing is set to VCAN/2.
10.2.4 CAN Wake Capable Mode
This mode can be used in SBC Stop, Sleep, Restart and Normal Mode and it is used to monitor bus activities.
It is automatically accessed in SBC Fail-Safe Mode. Both bus pins CANH/L are connected to GND via the input
resistors.
A wake-up signal on the bus results in a change of behavior of the SBC, as described in Table 16. The pins
CANH/L are terminated to typ. 2.5V through the input resistors. As a wake-up signalization to the
microcontroller, the RXD_CAN pin is set LOW and will stay LOW until the CAN transceiver is changed to any
other mode. After a wake-up event, the transceiver can be switched to CAN Normal Mode for communication
via SPI.
As shown in Figure 29, a wake-up pattern (WUP) is signaled on the bus by two consecutive dominant bus
levels for at least tWake1 (filter time t > tWake1) and shorter than tWake2, each separated by a recessive bus level
of greater than tWake1 and shorter than tWake2.
Data Sheet 70 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
Figure 29 WUP detection following the definition in ISO 11898-2:2016
Rearming the Transceiver for Wake Capability
After a BUS wake-up event, the transceiver is woken. However, the CAN transceiver mode bits will still show
wake capable (=‘01’) so that the RXD signal will be pulled low. There are two possibilities how the CAN
transceiver’s wake capable mode is enabled again after a wake event:
• The CAN transceiver mode must be toggled, i.e. switched from Wake Capable Mode to CAN Normal Mode,
CAN Receive Only Mode or CAN Off, before switching to CAN Wake Capable Mode again.
• Rearming is done automatically when the SBC is changed to SBC Stop, SBC Sleep, or SBC Fail-Safe Mode
to ensure wake-up capability.
Note: It is not necessary to clear the CAN wake-up bit CAN_WU to become wake capable again. It is sufficient to
toggle the CAN mode.
Note: The CAN module is supplied by an internal voltage when in CAN Wake Capable Mode, i.e. the module
must not be supplied through the VCAN pin during this time. Before changing the CAN Mode to
Normal Mode, the supply of VCAN has to be activated first.
Ini
Bias off
1
Bias off
2
Bias off
3
Bias on
4
Bias on
Wait
Bias off
Bus recessive > tWAKE1
Bus dominant > tWAKE1
optional:
tWAKE 2 expired
Bus recessive > tWAKE1
Bus dominant > tWAKE1
Bus recessive > tWAKE1Bus dominant > tWAKE1
optional:
tWAKE2 expired
tSilence expired AND
Device in low-power mode
tSilence expired AND
device in low-power mode
Entering CAN Normal
or CAN Recive Only
Entering low-power mode ,
when selective wake-up
function is disabled
or not supported
Data Sheet 71 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
Wake-Up in SBC Stop and Normal Mode
In SBC Stop Mode, if a wake-up is detected, it is always signaled by the INT output and in the WK_STAT_1 SPI
register. It is also signaled by RXDCAN pulled to low. The same applies for the SBC Normal Mode. The
microcontroller should set the device from SBC Stop Mode to SBC Normal Mode, there is no automatic
transition to Normal Mode.
For functional safety reasons, the watchdog will be automatically enabled in SBC Stop Mode after a Bus wake
event in case it was disabled before (if bit WD_EN_ WK_BUS was configured to HIGH before).
Wake-Up in SBC Sleep Mode
Wake-up is possible via a CAN message (filter time t > tWake1). The wake-up automatically transfers the SBC into
the SBC Restart Mode and from there to Normal Mode the corresponding RXD pin in set to LOW. The
microcontroller is able to detect the low signal on RXD and to read the wake source out of the WK_STAT_1
register via SPI. No interrupt is generated when coming out of Sleep Mode. The microcontroller can now for
example switch the CAN transceiver into CAN Normal Mode via SPI to start communication.
Table 16 Action due to CAN Bus Wake-Up
SBC Mode SBC Mode after Wake VCC1 INT RXD
Normal Mode Normal Mode ON LOW LOW
Stop Mode Stop Mode ON LOW LOW
Sleep Mode Restart Mode Ramping Up HIGH LOW
Restart Mode Restart Mode ON HIGH LOW
Fail-Safe Mode Restart Mode Ramping up HIGH LOW
Data Sheet 72 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
10.2.5 TXD Time-out Feature
If the TXD signal is dominant for a time t > tTXD_CAN_TO, in CAN Normal Mode, the TXD time-out function
deactivates the transmission of the signal at the bus. This is implemented to prevent the bus from being
blocked permanently due to an error. The transmitter is disabled and the transceiver is switched to Receive
Only Mode. The failure is stored in the SPI flag CAN_FAIL. The CAN transmitter stage is activated again after
the dominant time-out condition is removed and the transceiver is automatically switched back to CAN
Normal Mode. The transceiver configuration stays unchanged.
10.2.6 Bus Dominant Clamping
If the HS CAN bus signal is dominant for a time t > tBUS_CAN_TO in CAN Normal and Receive Only Mode a bus
dominant clamping is detected and the SPI bit CAN_FAIL is set. The transceiver configuration stays
unchanged.
10.2.7 Undervoltage Detection
The voltage at the CAN supply pin is monitored only in CAN Normal and Receive Only Mode for SBC Normal
and Stop Mode . In case of VCAN undervoltage a signalization via SPI bit VCAN_UV is triggered and the SBC
disables the transmitter stage. If the CAN supply reaches a higher level than the undervoltage detection
threshold (VCAN > VCAN_UV), the transceiver is automatically switched back to CAN Normal Mode. The
transceiver configuration stays unchanged.
Data Sheet 73 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
10.3 Electrical Characteristics
Table 17 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; 4.75 V < VCAN < 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Uni
t
Note or
Test Condition
Number
Min. Typ. Max.
CAN Bus Receiver
Differential Receiver
Threshold Voltage,
recessive to dominant edge
Vdiff,rd_N –0.800.90VVdiff = VCANH - VCANL ;
-12V ≤ VCM(CAN) ≤ +12 V;
0.9 V ≤ Vdiff,D_Range ≤ 8 V;
CAN Normal Mode
P_10.3.2
Differential Receiver
Threshold Voltage,
dominant to recessive edge
Vdiff,dr_N 0.50 0.60 – V Vdiff = VCANH -VCANL;
-12V ≤ VCM(CAN) ≤ +12 V;
-3 V ≤ Vdiff,R_Range ≤ 0.5 V;
CAN Normal Mode
P_10.3.3
Common Mode Range CMR -12 – 12 V 1) P_10.3.4
CANH, CANL Input
Resistance
Rin 20 40 50 kΩCAN Normal / Wake
capable Mode;
Recessive state;
-2 V ≤ VCANL/H ≤ +7 V
P_10.3.6
Differential Input Resistance Rdiff 40 80 100 kΩCAN Normal / Wake
capable Mode;
Recessive state;
-2 V ≤ VCANL/H ≤ +7 V
P_10.3.7
Input Resistance Deviation
between CANH and CANL
ΔRi-3 – 3 % 1)Recessive state;
VCANH = VCANL = 5V
P_10.3.38
Input Capacitance CANH,
CANL versus GND
Cin –2040pF
1)VTXD = 5V P_10.3.39
Differential Input
Capacitance
Cdiff –1020pF
1)VTXD = 5V P_10.3.40
Wake-up Receiver
Threshold Voltage,
recessive to dominant edge
Vdiff, rd_W – 0.8 1.15 V -12V ≤ VCM(CAN) ≤ +12 V;
1.15 V ≤ Vdiff,D_Range ≤ 8 V;
CAN Wake Capable
Mode
P_10.3.8
Wake-up Receiver
Threshold Voltage,
dominant to recessive edge
Vdiff, dr_W 0.4 0.7 – V -12V ≤ VCM(CAN) ≤ +12 V;
-3 V ≤ Vdiff,R_Range ≤ 0.4 V;
CAN Wake Capable
Mode
P_10.3.9
CAN Bus Transmitter
CANH/CANL Recessive
Output Voltage
(CAN Normal Mode)
VCANL/H_NM 2.0 – 3.0 V CAN Normal Mode;
VTXD = VCC1;
no load
P_10.3.11
Data Sheet 74 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
CANH/CANL Recessive
Output Voltage
(CAN Wake Capable Mode)
VCANL/H_LP -0.1 – 0.1 V CAN Wake Capable
Mode; VTXD = VCC1;
no load
P_10.3.43
CANH, CANL Recessive
Output Voltage Difference
Vdiff = VCANH - VCANL
(CAN Normal Mode)
Vdiff_r_N -500 – 50 mV CAN Normal Mode
VTXD = VCC1;
no load
P_10.3.12
CANH, CANL Recessive
Output Voltage Difference
Vdiff = VCANH - VCANL
(CAN Wake Capable Mode)
Vdiff_r_W -200 – 200 mV CAN Wake Capable
Mode;
VTXD = VCC1;
no load
P_10.3.41
CANL Dominant Output
Voltage
VCANL 0.5 – 2.25 V CAN Normal Mode;
VTXD = 0 V;
VCAN = 5 V;
50Ω ≤ RL ≤ 65Ω
P_10.3.13
CANH Dominant Output
Voltage
VCANH 2.75 – 4.5 V CAN Normal Mode;
VTXD = 0 V;
VCAN = 5 V;
50Ω ≤ RL ≤ 65Ω
P_10.3.14
CANH, CANL Dominant
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_d_N 1.5 – 3.0 V CAN Normal Mode;
VTXD = 0 V;
VCAN = 5 V;
50Ω ≤ RL ≤ 65Ω
P_10.3.16
CANH, CANL Dominant
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_d_N 1.5 – 5.0 V 1)CAN Normal Mode;
VTXD = 0 V;
VCAN = 5 V;
RL = 2240Ω
P_10.3.55
CANH, CANL Dominant
Output Voltage Difference
Vdiff = VCANH - VCANL
Vdiff_d_N 1.4 – 3.3 V 1)CAN Normal Mode;
VTXD = 0 V;
VCAN = 5 V;
45Ω ≤ RL ≤ 70Ω
P_10.3.56
Driver Symmetry
VSYM = VCANH + VCANL
VSYM 4.5 – 5.5 V 2)CAN Normal Mode;
VTXD = 0 V / 5 V;
VCAN = 5 V;
CSPLIT = 4.7nF;
RL = 60Ω;
P_10.3.42
CANH Short Circuit Current ICANHsc -115 -80 -50 mA CAN Normal Mode;
VCANHshort = -3 V
P_10.3.17
Table 17 Electrical Characteristics (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; 4.75 V < VCAN < 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Uni
t
Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 75 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
CANL Short Circuit Current ICANLsc 50 80 115 mA CAN Normal Mode
VCANLshort = 18 V
P_10.3.18
Leakage Current
(unpowered device)
ICANH,lk
ICANL,lk
– 5 7.5 µA VS = VCAN = 0V;
0V < VCANH,L ≤ 5V;
3)Rtest = 0 / 47 kΩ
P_10.3.19
Receiver Output RXD
HIGH level Output Voltage VRXD,H 0.8 ×
VCC1
––VCAN Normal Mode
IRXD(CAN) = -2 mA;
P_10.3.21
LOW Level Output Voltage VRXD,L – – 0.2 ×
VCC1
VCAN Normal Mode
IRXD(CAN) = 2 mA;
P_10.3.22
Transmission Input TXD
HIGH Level Input Voltage
Threshold
VTXD,H – – 0.7 ×
VCC1
VCAN Normal Mode
recessive state
P_10.3.23
LOW Level Input Voltage
Threshold
VTXD,L 0.3 ×
VCC1
––VCAN Normal Mode
dominant state
P_10.3.24
TXD Input Hysteresis VTXD,hys 0.08 ×
VCC1
0.12 ×
VCC1
0.5 ×
VCC1
V1) P_10.3.25
TXD Pull-up Resistance RTXD 20 40 80 kΩ– P_10.3.26
CAN Transceiver Enabling
Time
tCAN,EN 81318µs
4)CSN = HIGH to first
valid transmitted TXD
dominant
P_10.3.27
Dynamic CAN-Transceiver Characteristics
Min. Dominant Time for Bus
Wake-up
tWake1 0.50 – 1.8 µs -12V ≤ VCM(CAN) ≤ +12 V;
CAN Wake capable
Mode
P_10.3.28
Wake-up Time-out,
Recessive Bus
tWake2 0.8 – 10 ms 4)CAN Wake capable
Mode
P_10.3.29
WUP Wake-up
Reaction Time
tWU_WUP – – 100 µs 4)5)6) Wake-up reaction
time after a valid WUP
on CAN bus;
P_10.3.44
Loop delay
(recessive to dominant)
tLOOP,f – 150 255 ns 2)CAN Normal Mode
CL = 100 pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF
P_10.3.30
Table 17 Electrical Characteristics (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; 4.75 V < VCAN < 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Uni
t
Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 76 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
Loop delay
(dominant to recessive)
tLOOP,r – 150 255 ns 2)CAN Normal Mode
CL = 100 pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF
P_10.3.31
Propagation Delay
TXD LOW to bus dominant
td(L),T – 50 – ns CAN Normal Mode
CL = 100pF;
50Ω ≤ RL ≤ 65Ω;
VCAN = 5 V;
P_10.3.32
Propagation Delay
TXD HIGH to bus recessive
td(H),T – 50 – ns CAN Normal Mode
CL = 100 pF;
50Ω ≤ RL ≤ 65Ω;
VCAN = 5 V;
P_10.3.33
Propagation Delay
bus dominant to RXD LOW
td(L),R – 100 – ns CAN Normal Mode
CL = 100pF;
50Ω ≤ RL ≤ 60Ω;
VCAN = 5 V;
CRXD = 15 pF
P_10.3.34
Propagation Delay
bus recessive to RXD HIGH
td(H),R – 100 – ns CAN Normal Mode
CL = 100pF;
50Ω ≤ RL ≤ 60Ω;
VCAN = 5 V;
CRXD = 15 pF
P_10.3.35
Received Recessive Bit
Width
(CAN FD up to 2Mbps)
tbit(RXD) 400 – 550 ns CAN Normal Mode
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 500ns;
Timing definition
according to Figure 31
P_10.3.46
TransmittedRecessive Bit
Width
(CAN FD up to 2Mbps)
tbit(BUS) 435 – 530 ns CAN Normal Mode
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 500ns;Timing
definition according to
Figure 31
P_10.3.47
Table 17 Electrical Characteristics (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; 4.75 V < VCAN < 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Uni
t
Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 77 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
Receiver Timing Symmetry
(CAN FD up to 2Mbps)
ΔtRec -65 – 40 ns CAN Normal Mode
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 500ns;Timing
definition according to
Figure 31
P_10.3.48
Received Recessive Bit
Width
(CAN FD up to 5 Mbps)
tbit(RXD) 120 – 220 ns CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 200 ns;
Parameter definition in
according to
Figure 31.
P_10.3.52
Transmitted Recessive Bit
Width
(CAN FD up to 5 Mbps)
tbit(BUS) 155 – 210 ns CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 200 ns;
Parameter definition in
according to
Figure 31.
P_10.3.53
Receiver Timing Symmetry
(CAN FD up to 5 Mbps)
∆tRec -45 – 15 ns CAN Normal Mode;
CL = 100pF;
RL = 60 Ω;
VCAN = 5 V;
CRXD = 15 pF;
tbit(TXD) = 200 ns;
Parameter definition in
according to
Figure 31.
P_10.3.54
TXD Permanent Dominant
Time-out
tTxD_CAN_TO 1.6 2 2.4 ms 4)CAN Normal Mode P_10.3.36
BUS Permanent Dominant
Time-out
tBUS_CAN_TO 1.6 2 2.4 ms 4)CAN Normal Mode P_10.3.37
Timeout for bus inactivity tSILENCE 0.6 – 1.2 s 4) P_10.3.50
Bus Bias reaction time tBias – – 200 µs 4) P_10.3.51
Table 17 Electrical Characteristics (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; 4.75 V < VCAN < 5.25 V; RL = 60Ω; CAN Normal Mode; all voltages with
respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Uni
t
Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 78 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
Figure 30 Timing Diagrams for Dynamic Characteristics
1) Not subject to production test, specified by design.
2) VSYM shall be observed during dominant and recessive state and also during the transition dominant to recessive and
vice versa while TXD is simulated by a square signal (50% duty cycle) with a frequency of up to 1 MHz (2 MBit/s);
3) Rtest between supply (VS / VCAN) and 0V (GND);
4) Not subject to production test, tolerance defined by internal oscillator tolerance;
5) Wake-up is signalized via INT pin activation in SBC Stop Mode and via VCC1 ramping up with wake from SBC Sleep
Mode;
6) Time starts with end of last dominant phase of WUP;
td(L),R
t
VDIFF
tLOOP,f
td(H),R
tLO O P,r
td(L), T
t
GND
V
TXDCAN
Vcc1
td(H),T
Vdiff, rd_N Vdiff, dr_N
t
GND
0.2 x Vcc1
0.8 x Vcc1
VRXDCAN
V
cc1
Data Sheet 79 Rev. 1.00
2017-07-31
TLE9263BQXV33
High Speed CAN Transceiver
Figure 31 From ISO 11898-2: tloop, tbit(TXD), tbit(Bus), tbit(RXD) definitions
500mV
TXDCAN
70%
30%
RXDCAN
V
diff
=CANH-CANL
30%
70%
900mV
5x t
Bit(TXD)
t
Bit(TXD)
t
Loop_f
t
Bit(Bus)
t
Loop_r
t
Bit(RXD)
Data Sheet 80 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11 LIN Transceiver
11.1 Block Description
Figure 32 Block Diagram
11.1.1 LIN Specifications
The LIN network is standardized by international regulations. The device is compliant to the specification LIN
2.2. The physical layer specification LIN 2.2a is a super set of the previous LIN specifications, like LIN 2.0 or LIN
1.3. The integrated LIN transceivers are according to the LIN 2.2 standard.
The device is compliant to the physical layer standard SAE-J2602-2. The SAE-J2602-2 standard differs from the
LIN 2.2 standard mainly by the lower data rate (10.4 kbit/s).
Driver
Temp.-
Protection
Current
Limit
Output
Stage
TxD Input
Receiver
RXDLIN
LIN
TXDLIN
VSHS
R
BUS
Filter
Timeout
R
TxD
VCC1
To SPI Diagnostic
SPI Mode Control
VCC1
Wake
Receiver
VSHS
Data Sheet 81 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11.2 Functional Description
The LIN Bus is a single wire, bi-directional bus, used for in-vehicle networks. The LIN transceivers implemented
inside the TLE9263BQXV33 are the interface between the micro controller and the physical LIN Bus. The digital
output data from the micro controller are driven to the LIN bus via the TXD input pin on the TLE9263BQXV33.
The transmit data stream on the TXD input is converted to a LIN bus signal with optimized slew rate to
minimize the EME level of the LIN network. The RXD output sends back the information from the LIN bus to the
micro controller. The receiver has an integrated filter network to suppress noise on the LIN Bus and to increase
the EMI (Electro Magnetic Immunity) level of the transceiver.
Two logical states are possible on the LIN Bus according to the LIN Specification 2.2.
Every LIN network consists of a master node and one or more slave nodes. To configure the TLE9263BQXV33
for master node applications, a resistor in the range of 1 kΩ and a reverse diode must be connected between
the LIN bus and the power supply VSHS.
The different transceiver modes can be controlled via the SPI LIN1 and LIN2 bits.
Figure 33 shows the possible transceiver mode transitions when changing the SBC mode.
Figure 33 LIN Mode Control Diagram
11.2.1 LIN OFF Mode
The LIN OFF Mode is the default mode after power-up of the SBC. It is available in all SBC Modes and is
intended to completely stop LIN activities or when LIN communication is not needed. In LIN OFF Mode, a
wake-up event on the bus will be ignored.
SBC Normal Mode
SBC Mode LIN Transceiver Mode
SBC Stop Mode
SBC Sleep Mode
SBC Restart Mode
Receive Only Normal Mode OFFWake Capable
Receive Only OFFWake Capable
OFFWoken
1
OFFWake Capable
Normal Mode
Behavior after SBC Restart Mode - not coming from SBC Sleep Mode due to a wake up of the respective transceiver:
If the transceivers had been configured to Normal Mode, or Receive Only Mode, then the mode will be changed to Wake
Capable. If it was Wake Capable, then it will remain Wake Capable. If it had been OFF before SBC Restart Mode, then it
will remain OFF.
Behavior in SBC Development Mode:
LIN default value in SBC INIT MODE and entering SBC Normal Mode from SBC Init Mode is ON instead of OFF.
1
after a wake event on LIN Bus
SBC Fail-Safe Mode Wake Capable
Data Sheet 82 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11.2.2 LIN Normal Mode
The LIN Transceiver is enabled via SPI in SBC Normal Mode. LIN Normal Mode is designed for normal data
transmission/reception within the LIN network. The Mode is available in SBC Normal Mode and in SBC Stop
Mode.
Transmission
The signal from the microcontroller is applied to the TXDLIN input of the SBC. The bus driver switches the
LIN output stage to transfer this input signal to the LIN bus line.
Enabling Sequence
The LIN transceiver requires an enabling time tLIN,EN before a message can be sent on the bus. This means that
the TXDLIN signal can only be pulled LOW after the enabling time. If this is not ensured, then the TXDLIN needs
to be set back to high (=recessive) until the enabling time is completed.
Only the next dominant bit will be transmitted on the bus.
Figure 34 shows different scenarios and explanations for LIN enabling.
Figure 34 LIN Transceiver Enabling Sequence
Reduced Electromagnetic Emission
To reduce electromagnetic emissions (EME), the bus driver controls LIN slopes symmetrically. The
configuration of the different slopes is described in Chapter 11.2.8.
Reception
Analog LIN bus signals are converted into digital signals at RXD via the differential input receiver.
11.2.3 LIN Receive Only Mode
In LIN Receive Only Mode (RXD only), the driver stage is de-activated but reception is still possible. This mode
is accessible by an SPI command and is available in SBC Normal and SBC Stop Mode.
t
V
LI N_ BUS
t
LIN, EN
t
V
TXDLIN
t
LIN
Mode
LIN
NO RMA L
LIN O FF
LIN ,EN
t
LIN, EN
t
recessive TXD level
requi red before start of
tr ansm issi on
t
LIN, EN not ensured , no
tr ansm issi on on bus
Cor rect sequence ,
Bus is enabled after t LIN, EN
tLIN, EN not ensured ,
no tr ansm ission on bus
recessive TXD
level required
Recessive
Dominant
Data Sheet 83 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11.2.4 LIN Wake Capable Mode
This mode can be used in SBC Stop, Sleep, Restart and Normal Mode by programming via SPI and it is used to
monitor bus activities. It is automatically accessed in SBC Fail-Safe Mode. A wake up is detected, if a recessive
to dominant transition on the LIN bus is followed by a dominant level of longer than tWK,Bus, followed by a
dominant to recessive transition. The dominant to recessive transition will cause a wake up of the LIN
transceiver. A wake-up results in a different behavior of the SBC, as described in below Table 18. As a
signalization to the microcontroller, the RXD_LIN pin is set LOW and will stay LOW until the LIN transceiver is
changed to any other mode. After a wake-up event the transceiver can be switched to LIN Normal Mode for
communication.
Rearming the transceiver for wake capability
After a BUS wake-up event, the transceiver is woken. However, the LIN1 and LIN2 transceiver mode bits will
still show wake capable (=‘01’) so that the RXD signal will be pulled low. There are two possibilities how the
LIN transceiver’s wake capable mode is enabled again after a wake event:
•The LIN transceiver mode must be toggled, i.e. switched to LIN Normal Mode, LIN Receive Only Mode or LIN
Off, before switching to LIN Wake Capable Mode again.
•Rearming is done automatically when the SBC is changed to SBC Stop, SBC Sleep, or SBC Fail-Safe Mode
to ensure wake-up capability.
Wake-Up in SBC Stop and SBC Normal Mode
In SBC Stop Mode, if a wake-up is detected, it is signaled by the INT output and in the WK_STAT_1 SPI register.
It is also signaled by RXDLIN put to LOW. The same applies for the SBC Normal Mode. The microcontroller
should set the device to SBC Normal Mode, there is no automatic transition to Normal Mode.
For functional safety reasons, the watchdog will be automatically enabled in SBC Stop Mode after a Bus wake
event in case it was disabled before (if bit WD_EN_ WK_BUS was configured to HIGH before).
Wake-Up in SBC Sleep Mode
Wake-up is possible via a LIN message (filter time t > tWK,Bus). The wake-up automatically transfers the SBC into
the SBC Restart Mode and from there to Normal Mode the corresponding RXD pin in set to LOW. The
microcontroller is able to detect the low signal on RXD and to read the wake source out of the WK_STAT_1
register via SPI. No interrupt is generated when coming out of Sleep Mode. The microcontroller can now
switch the LIN transceiver into LIN Normal Mode via SPI to start communication.
Table 18 Action due to a LIN BUS Wake-up
SBC Mode SBC Mode after Wake VCC1 INT RXD
Normal Mode Normal Mode ON LOW LOW
Stop Mode Stop Mode ON LOW LOW
Sleep Mode Restart Mode Ramping Up HIGH LOW
Restart Mode Restart Mode ON HIGH LOW
Fail-Safe Mode Restart Mode Ramping up HIGH LOW
Data Sheet 84 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11.2.5 TXD Time-out Feature
If the TXD signal is dominant for the time t >tTxD_LIN _TO, the TXD time-out function deactivates the LIN
transmitter output stage temporarily. The transceiver remains in recessive state. The TXD time-out functions
prevents the LIN bus from being blocked by a permanent LOW signal on the TXD pin, caused by a failure. The
failure is stored in the SPI flag LIN1_FAIL and LIN2_FAIL. The LIN transmitter stage is activated again after the
dominant time-out condition is removed. The transceiver configuration stays unchanged.
Figure 35 TXD Time-Out Function
11.2.6 Bus Dominant Clamping
If the LIN bus signal is dominant for a time t > tBUS_LIN_TO in LIN Normal and Receive Only Mode, then a bus
dominant clamping is detected and the SPI bit LIN1_FAIL and LIN2_FAIL is set. The transceiver configuration
stays unchanged.
11.2.7 Undervoltage Detection
In case the supply voltage is dropping below the VSHS undervoltage detection threshold (VSHS < VSHS,UVD), the
TLE9263BQXV33 disables the output and receiver stages. If the power supply reaches a higher level than the
undervoltage detection threshold (VSHS > VSHS,UVD), the TLE9263BQXV33 continues with normal operation.
The transceiver configuration stays unchanged.
TxD
LIN
ttorec
ttimeout
Normal Communication
Normal Communication
TxD Time-Out due to
microcontroller error Release after TxD
Time-out
Recovery of the
microcontroller error
t
t
Data Sheet 85 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11.2.8 Slope Selection
The LIN transceiver offers a LIN Low-Slope Mode for 10.4 kBaud communication and a LIN Normal-Slope Mode
for 20 kBaud communication. The only difference is the behavior of the transmitter. In LIN Low-Slope Mode,
the
transmitter uses a lower slew rate to further reduce the EME compared to Normal-Slope Mode. This complies
with SAE J2602 requirements.By default, the device works in LIN Normal-Slope Mode. The selection of LIN
Low-Slope Mode is done by an SPI bit LIN_LSM and will become effective as soon as CSN goes ‘HIGH’. Only the
LIN Slope is changed. The selection is accessible in SBC Normal Mode only.
11.2.9 Flash Programming via LIN
The device allows LIN flash programming, e.g. of another LIN Slave with a communication of up to 115 kBaud.
This feature is enabled by de-activating the slope control mechanism via a SPI command (bit LIN_FLASH) and
will become effective as soon as CSN goes ‘HIGH’. The SPI bit can be set in SBC Normal Mode.
Note: It is recommended to perform flash programming only at nominal supply voltage VSHS = 13.5V to
ensure stable data communication.
Data Sheet 86 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
11.3 Electrical Characteristics
Table 19 Electrical Characteristics
VSHS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, RL = 500 Ω, all voltages with respect to ground, positive current
flowing into pin (unless otherwise specified)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Receiver Output (RXD pin)
HIGH Level Output Voltage VRXD,H 0.8 ×
VCC1
––VIRXD = -1.6 mA;
VBus = VSHS
P_11.3.1
LOW Level Output Voltage VRXD,L ––0.2 ×
VCC1
VIRXD = 1.6 mA
VBus = 0 V
P_11.3.2
Transmission Input (TXD pin)
HIGH Level Input Voltage VTXD,H 0.7 ×
VCC1
– – V Recessive State P_11.3.3
TXD Input Hysteresis VTXD,hys 0.08 ×
VCC1
0.12 ×
VCC1
0.5 ×
VCC1
V1) P_11.3.4
LOW Level Input Voltage VTXD,L ––0.3 ×
VCC1
V Dominant State P_11.3.5
TXD Pull-up Resistance RTXD 20 40 80 kΩVTXD = 0 V P_11.3.6
LIN Bus Receiver (LIN Pin)
Receiver Threshold Voltage,
Recessive to Dominant Edge
VBus,rd 0.4 ×
VSHS
0.45 ×
VSHS
– V P_11.3.7
Receiver Dominant State VBus,dom ––0.4 ×
VSHS
V LIN 2.2 Param. 17 P_11.3.8
Receiver Threshold Voltage,
Dominant to Recessive Edge
VBus,dr – 0.55 ×
VSHS
0.60 ×
VSHS
V P_11.3.9
Receiver Recessive State VBus,rec 0.6 ×
VSHS
– – V LIN 2.2 Param 18 P_11.3.10
Receiver Center Voltage VBus,c 0.475
× VSHS
0.5 ×
VSHS
0.525
× VSHS
V LIN 2.2 Param 19
6 V < VSHS < 18 V
P_11.3.11
Receiver Hysteresis VBus,hys 0.07 ×
VSHS
0.1 ×
VSHS
0.175
× VSHS
V Vbus,hys = Vbus,dr - Vbus,rd
LIN 2.2 Param 20
P_11.3.12
Wake-up Threshold Voltage VBus,wk 0.40 ×
VSHS
0.5 ×
VSHS
0.6 ×
VSHS
V – P_11.3.13
Dominant Time for Bus
Wake-up
tWK,Bus 30 – 150 µs 2) P_11.3.14
Data Sheet 87 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
LIN Bus Transmitter (LIN Pin)
Bus Serial Diode Voltage
Drop
Vserdiode 0.4 0.7 1.0 V 1) VTXD = VCC1;
LIN 2.2 Param 21
P_11.3.15
Bus Recessive Output
Voltage
VBUS,ro 0.8 ×
VSHS
–VSHS VVTXD = HIGH Level P_11.3.16
Bus Short Circuit Current IBUS,sc 40 100 150 mA VBUS = 18 V;
LIN 2.2 Param 12
P_11.3.17
Leakage Current
Loss of Ground
IBUS,lk1 -1000 -450 20 µA VSHS = 12 V = GND;
0 V < VBUS < 18 V;
LIN 2.2 Param 15
P_11.3.18
Leakage Current
Loss of Battery
IBUS,lk2 ––20µAVSHS = 0 V;
VBUS = 18 V;
LIN 2.2 Param 16
P_11.3.19
Leakage Current
Driver Off
IBUS,lk3 -1––mAVSHS = 18 V;
VBUS = 0 V;
LIN 2.2 Param 13
P_11.3.20
Leakage Current
Driver Off
IBUS,lk4 ––20µAVSHS = 8 V;
VBUS = 18 V;
LIN 2.2 Param 14
P_11.3.21
Bus Pull-up Resistance RBUS 20 30 47 kΩNormal Mode
LIN 2.2 Param 26
P_11.3.22
LIN Input Capacitance CBUS 20 25 pF 1) P_11.3.23
Receiver propagation delay
bus dominant to RXD LOW
td(L),R –16µsVCC = 3.3 V;
CRXD = 20 pF;
LIN 2.2 Param 31
P_11.3.24
Receiver propagation delay
bus recessive to RXD HIGH
td(H),R –16µsVCC = 3.3 V;
CRXD = 20 pF;
LIN 2.2 Param 31
P_11.3.25
Receiver delay symmetry tsym,R -2 – 2 µs tsym,R = td(L),R - td(H),R;
LIN 2.2 Param 32
P_11.3.26
LIN Transceiver Enabling
Time
tLIN,EN 8 1318µs
2)CSN = HIGH to first valid
transmitted TXD dominant
P_11.3.27
Bus Dominant Time Out tBUS_LIN
_TO
16 20 24 ms 1)2) P_11.3.28
TXD Dominant Time Out tTxD_LIN
_TO
16 20 24 ms 1)2)VTXD = 0 V P_11.3.29
TXD Dominant Time Out
Recovery Time
ttorec 5 1014µs
1)2) P_11.3.30
Table 19 Electrical Characteristics (cont’d)
VSHS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, RL = 500 Ω, all voltages with respect to ground, positive current
flowing into pin (unless otherwise specified)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Data Sheet 88 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
Duty Cycle D1
(For worst case at 20 kbit/s)
LIN 2.2 Normal Slope
D1 0.396 – – 3) THRec(max) = 0.744 × VSHS;
THDom(max) = 0.581 × VSHS;
VSHS = 7.0 … 18 V;
tbit = 50 µs;
D1 = tbus_rec(min)/2 tbit;
LIN 2.2 Param 27
P_11.3.31
Duty Cycle D2
(for worst case at 20 kbit/s)
LIN 2.2 Normal Slope
D2 ––0.581 3)THRec(min.) = 0.422 × VSHS;
THDom(min.) = 0.284 × VSHS;
VSHS = 7.6 … 18 V;
tbit = 50 µs;
D2 = tbus_rec(max)/2 tbit;
LIN 2.2 Param 28
P_11.3.32
Duty Cycle D3
(for worst case at 10.4 kbit/s)
SAE J2602 Low Slope
D3 0.417 – – 3)THRec(max) = 0.778 × VSHS
THDom(max) = 0.616 × VSHS;
VSHS = 7.0 … 18 V;
tbit = 96 µs;
D3 = tbus_rec(min)/2 tbit;
LIN 2.2 Param 29
P_11.3.33
Duty Cycle D4
(for worst case at 10.4 kbit/s)
SAE J2602 Low Slope
D4 ––0.590 3)THRec(min.) = 0.389 ×
VSHS;
THDom(min.) = 0.251 ×
VSHS;
VSHS = 7.6 … 18 V;
tbit = 96 µs;
D4 = tbus_rec(max)/2 tbit;
LIN 2.2 Param 30
P_11.3.34
1) Not subject to production test, specified by design.
2) Not subject to production test, tolerance defined by internal oscillator tolerance
3) Bus load conditions concerning LIN Specification 2.2 CLIN, RLIN = 1 nF, 1 kΩ / 6.8 nF, 660 Ω/ 10 nF, 500 Ω
Table 19 Electrical Characteristics (cont’d)
VSHS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, RL = 500 Ω, all voltages with respect to ground, positive current
flowing into pin (unless otherwise specified)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Data Sheet 89 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
Figure 36 Simplified Test Circuit for Dynamic Characteristics
GND
LIN
100 nF
VSHS
C
LIN
TxD
WK
R
LIN
RxD
C
RxD
Data Sheet 90 Rev. 1.00
2017-07-31
TLE9263BQXV33
LIN Transceiver
Figure 37 Timing Diagram for Dynamic Characteristics
tBit tBit tBit
tBus _dom (max ) tBus_rec (min )
Thresholds of
receiving node 1
Thresholds of
receiving node 2
THRec (max)
THDom (max)
THRec(min )
THDom(min )
tBus _dom (min ) tBus_rec(max )
td(L ),R (1) td(H),R(1)
td(H),r(2)
t(L ),R (2)
V
SUP
(Transceiver supply
of transmitting
node )
TxD
(input to
transmitting node )
RxD
(output of r eceivi ng
node 1)
RxD
(output of receiving
node 2)
Duty Cycle 1 = tBUS_ rec(min ) / (2 x t
BIT)
Duty Cycle 2 = tBUS_ rec(max ) / (2 x tBIT)
Data Sheet 91 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
12 Wake and Voltage Monitoring Inputs
12.1 Block Description
Figure 38 Wake Input Block Diagram
Features
• Three High-Voltage inputs with a 3V (typ.) threshold voltage
• Alternate Measurement function for high-voltage sensing via WK1 and WK2
• Wake-up capability for power saving modes
• Edge sensitive wake feature LOW to HIGH and HIGH to LOW
• Pull-up and Pull-down current sources, configurable via SPI
• Selectable configuration for static sense or cyclic sense working with TIMER1, TIMER2
• In SBC Normal and SBC Stop Mode the level of the WK pin can be read via SPI even if the respective WK is
not enabled as a wake source.
MONx_Input_Circuit_ext.vsd
+
-
t
WK
WKx
Internal Supply
Logic
I
PD_WK
I
PU_WK
V
Ref
Data Sheet 92 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
12.2 Functional Description
The wake input pins are edge-sensitive inputs with a switching threshold of typically 3V. This means that both
transitions, HIGH to LOW and LOW to HIGH, result in a signalization by the SBC. The signalization occurs either
in triggering the interrupt in SBC Normal Mode and SBC Stop Mode or by a wake up of the device in SBC Sleep
and SBC Fail-Safe Mode.
Two different wake detection modes can be selected via SPI:
• Static sense: WK inputs are always active
• Cyclic sense: WK inputs are only active for a certain time period (see Chapter 5.2.1)
Two different filter times of 16µs or 64µs can be selected to avoid a parasitic wake-up due to transients or EMC
disturbances in static sense configuration.
The filter time (tFWK1, tFWK2) is triggered by a level change crossing the switching threshold and a wake signal is
recognized if the input level will not cross again the threshold during the selected filter time.
Figure 39 shows a typical wake-up timing and parasitic filter.
Figure 39 Wake-up Filter Timing for Static Sense
The wake-up capability for each WK pin can be enabled or disabled via SPI command in the WK_CTRL_2
register.
The wake source for a wake via a WKx pin can always be read in the register WK_STAT_1 at the bits WK1_WU,
WK2_WU, and WK3_WU.
The actual voltage level of the WK pin (LOW or HIGH) can always be read in SBC Normal and SBC Stop Mode in
the register WK_LVL_STAT. During Cyclic Sense, the register show the sampled levels of the respective WK pin.
If FO2...3 are configured as WK inputs in its alternative function (16µs static filter time), then the wake events
will be signalled in the register WK_STAT_2.
V
WK,th
t
V
WK
t
WK,f
No Wake Event Wake Event
V
WK,th
t
WK,f
t
V
INT
t
INT
Data Sheet 93 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
12.2.1 Wake Input Configuration
To ensure a defined and stable voltage levels at the internal comparator input it is possible to configure
integrated current sources via the SPI register WK_PUPD_CTRL. In addition, the wake detection modes
(including the filter time) can be configured via the SPI register WK_FLT_CTRL. An example illustration for the
automatic switching configuration is shown in Figure 40.
Note: If there is no pull-up or pull-down configured on the WK input, then the respective input should be
tied to GND or VS on board to avoid unintended floating of the pin and subsequent wake events.
Figure 40 Illustration for Pull-Up / Down Current Sources with Automatic Switching Configuration
Config A and B are intended for static sense with two different filter times.
Table 20 Pull-Up / Pull-Down Resistor
WKx_PUPD_
1
WKx_PUPD_
0
Current Sources Note
00no current
source
WKx input is floating if left open (default setting)
0 1 pull-down WKx input internally pulled to GND
1 0 pull-up WKx input internally pulled to internal 5V supply
1 1 Automatic
switching
If a high level is detected at the WKx input the pull-up source
is activated, if low level is detected the pull down is activated.
Table 21 Wake Detection Configuration and Filter Time
WKx_FLT_1 WKx_FLT_0 Filter Time Description
0 0 Config A static sense, 16µs filter time
0 1 Config B static sense, 64µs filter time
1 0 Config C Cyclic sense, Timer 1, 16µs filter time. Period, On-time
configurable in register TIMER1_CTRL
1 1 Config D Cyclic sense, Timer 2, 16µs filter time. Period, On-time
configurable in register TIMER2_CTRL
I
WK
I
WKth _mi n
I
WKth _max
V
WKth
Data Sheet 94 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
Config C or D are intended for cyclic sense configuration. With the filter settings, the respective timer needs to
be assigned to one or more HS output, which supplies an external circuit connected to the WKx pin, e.g. HS1
controlled by Timer 2 (HS1 = 010) and connected to WK3 via an switch circuitry - see also Chapter 5.2.
Data Sheet 95 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
12.2.2 Alternate Measurement Function with WK1 and WK2
12.2.2.1 Block Description
This function provides the possibility to measure a voltage, e.g. the unbuffered battery voltage, with the
protected WK1 HV-input. The measured voltage is routed out at WK2. It allows for example a voltage
compensation for LED lighting by changing the duty cycle of the High-Side outputs. A simple voltage divider
needs to be placed externally to provide the correct voltage level to the microcontroller A/D converter input.
The function is available in SBC Normal Mode and it is disabled in all other modes to allow a low-quiescent
current operation.The measurement function can be used instead of the WK1 and WK2 wake and level
signalling capability.
The benefits of the function is that the signal is measured by a HV-input pin and that there is no current flowing
through the resistor divider during low-power modes.
The functionality is shown in a simplified application diagram in Figure 60.
12.2.2.2 Functional Description
This measurement function is by default disabled. In this case, WK1 and WK2 have the regular wake and
voltage level signalization functionality. The switch S1 is open for this configuration (see Figure 60).
The measurement function can be enabled via the SPI bit WK_MEAS.
If WK_MEAS is set to ‘1’, then the measurement function is enabled and switch S1 is closed in SBC Normal
Mode. S1 is open in all other SBC modes. If this function the pull-up and down currents of WK1 and WK2 are
disabled, and the internal WK1 and WK2 signals are gated. In addition, the settings for WK1 and WK2 in the
registers WK_PUPD_CTRL, WK_FLT_CTRL and WK_CTRL_2 are ignored but changing these setting is not
prevented. The registers WK_STAT_1 and WK_LVL_STAT are not updated with respect to the inputs WK1 and
WK2.
However, if only WK1 or WK2 are set as wake sources and a SBC Sleep Mode command is set, then the SPI_FAIL
flag will be set and the SBC will be changed into SBC Restart Mode (see Chapter 5.1 also for wake capability
of WK1 and WK2).
Table 22 Differences between Normal WK Function and Measurement Function
Affected Settings/Modules for
WK1 and WK2 Inputs
WK_MEAS = 0 WK_MEAS = 1
S1 configuration ‘open’ ‘closed’ in SBC Normal Mode,
‘open’ in all other SBC Modes
Internal WK1 & WK2 signal
processing
Default wake and level signaling
function, WK_STAT_1, WK_STAT_2
are updated accordingly
‘WK1...2 inputs are gated internally,
WK_STAT_1, WK_STAT_2 are not
updated
WK1_EN, WK2_EN Wake-up via WK1 and WK2 possible if
bits are set
setting the bits is ignored and not
prevented. If only WK1_EN, WK2_EN
are set while trying to go to SBC Sleep
Mode, then the SPI_FAIL flag will be
set and the SBC will be changed into
SBC Restart Mode.
WK_PUPD_CTRL normal configuration is possible no pull-up or pull-down enabled
WK_FLT_CTRL normal configuration is possible setting the bits is ignored and not
prevented
Data Sheet 96 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
Note: There is a diode in series to the switch S1 (not shown in the Figure 60), which will influence the
temperature behavior of the switch.
12.3 Electrical Characteristics
Table 23 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
WK1...WK3 Input Pin Characteristics
Wake-up/monitoring
threshold voltage
VWKth 2 3 4 V without external
serial resistor RS (with
RS:
ΔV = IPD/PU * RS);
hysteresis included
P_12.3.1
Threshold hysteresis VWKNth,hys 0.1 - 0.7 V without external
serial resistor RS (with
RS:
ΔV = IPD/PU * RS);
P_12.3.2
WK pin Pull-up Current IPU_WK -20 -10 -3 µA VWK_IN = 4V P_12.3.3
WK pin Pull-down
Current
IPD_WK 31020µAVWK_IN = 2V P_12.3.4
Input leakage current ILK,l -2 2 µA 0 V < VWK_IN < 40V P_12.3.5
Drop Voltage across S1
switch
VDrop,S1 – 1000 1100 mV 1)Drop Voltage
between WK1 and
WK2 when enabled
for voltage
measurement; IWK1 =
500µA;
Tj = 25°C
Refer to Figure 41
1) Not subject to production test; specified by design
P_12.3.13
Timing
Wake-up filter time 1 tFWK1 12 16 20 µs 2)SPI Setting
2) Not subject to production test, tolerance defined by internal oscillator tolerance
P_12.3.6
Wake-up filter time 2 tFWK2 50 64 80 µs 2)SPI Setting P_12.3.7
Data Sheet 97 Rev. 1.00
2017-07-31
TLE9263BQXV33
Wake and Voltage Monitoring Inputs
Figure 41 Typical Drop Voltage Characteristics of S1 (between WK1 & WK2)
800
900
1000
1100
A
GEDROPOFSWITCHS1(mV)
VS = 13.5V
250 μA
500 μA
500
600
700
50 0 50 100 150
VS1,VOLT
A
Tj JUNCTIONTEMPERATURE(°C)
50 μA
100 μA
Data Sheet 98 Rev. 1.00
2017-07-31
TLE9263BQXV33
Interrupt Function
13 Interrupt Function
13.1 Block and Functional Description
Figure 42 Interrupt Block Diagram
The interrupt is used to signalize special events in real time to the microcontroller. The interrupt block is
designed as a push/pull output stage as shown in Figure 42. An interrupt is triggered and the INT pin is pulled
low (active low) for tINT in SBC Normal and Stop Mode and it is released again once tINT is expired. The minimum
HIGH-time of INT between two consecutive interrupts is tINTD. An interrupt does not cause a SBC mode change.
Two different interrupt classes could be selected via the SPI bit INT_ GLOBAL:
• Class 1 (wake interrupt - INT_ GLOBAL=0): all wake-up events stored in the wake status SPI register
(WK_STAT_1 and WK_STAT_2) cause an interrupt (default setting). An interrupt is only triggered if the
respective function is also enabled as a wake source (including GPIOx if configured as a wake input).
• Class 2 (global interrupt - INT_ GLOBAL=1): in addition to the wake-up events, all signalled failures stored in
the other status registers cause an interrupt (the register WK_LVL_STAT is not generating interrupts)
Note: The errors which will cause SBC Restart or SBC Fail-Safe Mode (Vcc1_UV, WD_FAIL, VCC1_SC, TSD2,
FAILURE) are the exceptions of an INT generation on status bits. Also POR and DEV_STAT_x and will
not generate interrupts.
In addition to this behavior, an INT will be triggered when the SBC is sent to SBC Stop Mode and not all bits
were cleared in the WK_STAT_1 and WK_STAT_2register.
The SPI status registers are updated at every falling edge of the INT pulse. All interrupt events are stored in the
respective register (except the register WK_LVL_STAT) until the register is read and cleared via SPI command.
A second SPI read after reading out the respective status register is optional but recommended to verify that
the interrupt event is not present anymore. The interrupt behavior is shown in Figure 43 for class 1 interrupts.
The behavior for class 2 is identical.
The INT pin is also used during SBC Init Mode to select the hardware configuration of the device. See
Chapter 5.1.1 for further information.
Interrupt logic
INT
Time
out
V
cc1
Data Sheet 99 Rev. 1.00
2017-07-31
TLE9263BQXV33
Interrupt Function
Figure 43 Interrupt Signalization Behavior
Interrupt_Behavior.vsd
INT
WK1 WK2
t
INT
t
INTD
Update of
WK_STAT register
SPI
Read & Clear
Update of
WK_STAT register
WK_STAT
contents
Scenario 1
WK1 no WK WK2 no WK
optional
SPI
Read & Clear
WK_STAT
contents
Scenario 2
WK1 + WK2 no WK
No SPI Read & Clear
Command sent
Data Sheet 100 Rev. 1.00
2017-07-31
TLE9263BQXV33
Interrupt Function
13.2 Electrical Characteristics
Table 24 Electrical Characteristics
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Interrupt Output; Pin INT
INT High Output Voltage VINT,H 0.8 ×
VCC1
––V
1)IINT = -1 mA;
INT = OFF
1) Output Voltage Value also determines device configuration during SBC Init Mode
P_13.2.1
INT Low Output Voltage VINT,L – – 0.2 ×
VCC1
V1)IINT = 1 mA;INT = ON P_13.2.2
INT Pulse Width tINT 80 100 120 µs 2)
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
P_13.2.3
INT Pulse Minimum Delay
Time
tINTD 80 100 120 µs 2) between
consecutive pulses
P_13.2.4
Configuration Select; Pin INT
Config Pull-down
Resistance
RCFG 180 250 350 kΩVINT = 3.3 V P_13.2.5
Config Select Filter Time tCFG_F 5 10 14 µs P_13.2.6
Data Sheet 101 Rev. 1.00
2017-07-31
TLE9263BQXV33
Fail Outputs
14 Fail Outputs
14.1 Block and Functional Description
Figure 44 Simplified Fail Output Block Diagram for FO1/2 and for FO3/TEST
The fail outputs consist of a failure logic block and three open-drain outputs (FO1, FO2, FO3) with active-low
signalization.
The fail outputs are activated due to following failure conditions:
•Watchdog trigger failure (For config 3&4 only after the 2nd watchdog trigger failure and for config 1&2 after
1st watchdog trigger failure)
•Thermal shutdown TSD2
•VCC1 short to GND
•VCC1 overvoltage (only if the SPI bit VCC1_OV_RST is set)
•After 4 consecutive VCC1 undervoltage event (see Chapter 15.6 for details)
At the same time SBC Fail-Safe Mode is entered (exceptions are watchdog trigger failures depending on
selected
configurations - see Chapter 5.1.1).
The fail output activation is signalled in the SPI bit FAILURE of the register DEV_STAT.
For testing purposes only the Fail Outputs can also be activated via SPI by setting the bit FO_ON. This bit is
independent of the FO failure bits. In case that there is no failure condition, the FO outputs can also be turned
off again via SPI, i.e. no successful watchdog trigger is needed.
The entry of SBC Fail-Safe Mode due to a watchdog failure can be configured as described in Chapter 5.1.1.
In order to deactivate the fail outputs in SBC Normal Mode the failure conditions must not be present anymore
(e.g. TSD2, VCC1 short circuit, etc) and the bit FAILURE needs to be cleared via SPI command.
In case of a watchdog failure the correct procedure to deactivate the fail outputs is:
• a successful WD trigger, i.e. WD_FAIL must be cleared
• clearing of the FAILURE bit
WD_FAIL will also be cleared when going to SBC Sleep or SBC Fail-Safe Mode due to another failure (not a WD
failure) or if the watchdog is disabled in SBC Stop Mode
Failure logic
FO1/2
FO3/TEST
5V_int
R
TEST
SBC Init
Mode
Failure Logic
T
test
T
FO_PL
Data Sheet 102 Rev. 1.00
2017-07-31
TLE9263BQXV33
Fail Outputs
Note: The Fail output pin is triggered for any of the above described failures. No FAILURE is caused for the
1st watchdog failure if selected for Config2.
The three fail outputs are activated simultaneously with following output functionalities:
•FO1: Static fail output
• FO2: 1.25Hz, 50% (typ.) duty cycle, e.g. to generate an indicator signal
•FO3: 100Hz PWM, 20% (typ.) duty cycle, e.g. to generate a dimmed rear light from a break light.
Note: The duty cycle for FO3 can be configured via SPI option to 20%, 10%, 5% or 2.5%. Default value is
20%. See the register FO_DC for configuration.
14.1.1 General Purpose I/O Functionality of FO2 and FO3 as Alternate Function
In case that FO2 and FO3 are not used in the application, those pins can also be configured with an alternate
function as high-voltage (VSHS related) General Purpose I/O pins.
Figure 45 Simplified General Purpose I/O block diagram for FO2 and FO3/TEST
The pins are by default configured as FO pins. The configuration is done via the SPI register GPIO_CTRL. The
alternate function can be:
• Wake Inputs: The detection threshold VGPIOI,th is similar as for the WK inputs. The wake-up detection behavior
is the same as for WKx pins. Wake events are stored and reported in WK_STAT_2.
• Low-Side Switches: The switch is able to drive currents of up to 10mA (see also VGPIOL,L1). It is self-protected
with regards to current limitation. No other diagnosis is implemented.
•High-Side Switches: The switch is able to drive currents up to 10mA (see also VGPIOH,H1). It is self-protected
with regards to current limitation. No other diagnosis is implemented.
•If configured as GPIO then the respective level at the pin will be shown in WK_LVL_STAT in SBC Normal and
Stop Mode. This is also the case if configured as LS/HS and can serve as a feedback about the respective
state. GPIO2 is shared with the TEST level bit.
Table 25 describes the behavior of the FO/GPIO pins in their different configurations and SBC modes.
Config &
Control Logic
FOx/
GPIOx
VSHS
Data Sheet 103 Rev. 1.00
2017-07-31
TLE9263BQXV33
Fail Outputs
Explanation of FO/GPIO states:
• configurable: settings can be changed in this SBC mode
• fixed: settings stay as configured in SBC Normal Mode
• active: FOx is activated due to a failure leading to SBC Restart or Fail-Safe Mode.
Restart Behavior:
The behavior during SBC Restart and Fail-Safe Mode as well as the transition to SBC Normal Mode is as follows:
• if configured as Wake Input: it will stay wake capable during SBC Restart Mode and OFF while in SBC Fail-
Safe Mode. It will resume wake capability when leaving SBC Restart Mode (SPI register is not modified)
• if configured as Low-Side or High-Side: They will be disabled during SBC Restart and Fail-Safe Mode. After
leaving SBC Restart Mode the previously configured function will be resumed (SPI register is not modified)
• if configured as FO and activated due to a failure: FO will stay activated during SBC Restart Mode and when
entering SBC Normal Mode (SPI register is not modified)
Note: In order to avoid unintentional entry of SBC Development Mode care must be taken that the level of
FO3/TEST is HIGH during device power up and SBC Init Mode.
Note: The FOx drivers are supplied via VS. However, the GPIO HS switches (FO2, FO3/TEST) are supplied by
VSHS
Table 25 Fail-Output and GPIO configuration behavior during the respective SBC Modes
FOx
Configuration
SBC Normal
Mode
SBC Stop Mode SBC Sleep Mode SBC Restart
Mode
SBC Fail-Safe Mode
FOx (default)
configurable
fixed fixed active / fixed active
OFF OFF OFF OFF OFF
Wake Input wake capable wake capable wake capable OFF
Low-Side fixed fixed OFF OFF
High-Side fixed fixed OFF OFF
Data Sheet 104 Rev. 1.00
2017-07-31
TLE9263BQXV33
Fail Outputs
14.2 Electrical Characteristics
Table 26 Electrical Characteristics
VSHS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.1)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Pin FO1
FO1 low output voltage
(active)
VFO,L1 –– 1.0VIFO = 4mA P_14.2.1
FO1 high output current
(inactive)
IFO,H 0– 2µAVFO = 28V P_14.2.2
Pin FO2
FO2 side indicator
frequency
fFO2SI 1.00 1.25 1.50 Hz 3) P_14.2.3
FO2 side indicator duty
cycle
dFO2SI 45 50 55 % 3) P_14.2.4
Pin FO3/TEST2)
Pull-up Resistance at pin
FO3/TEST
RTEST 2.5 5 10 kΩVTEST =0V;
SBC Init Mode
P_14.2.5
TEST Input Filter Time tTEST 50 64 80 µs 3) P_14.2.6
FO3 pulsed
light frequency
fFO3PL 80 100 120 Hz 3) P_14.2.7
FO3 pulsed
light duty cycle
dFO3PL 16 20 24 % 3)4)default setting P_14.2.8
Alternate FO2...3
Electrical Characteristics: GPIO
GPIO low-side output
voltage (active)
VGPIOL,L1 –– 1VIGPIO = 10mA P_14.2.9
GPIO low-side output
voltage (active)
VGPIOL,L2 –– 5mV
5)IGPIO = 50µA P_14.2.17
GPIO high-side output
voltage (active)
VGPIOH,H1 VSHS-1 – – V IGPO = -10mA P_14.2.10
GPIO high-side output
voltage (active)
VGPIOH,H2 VSHS-5 – – mV 5)IGPO = -50µA P_14.2.18
GPIO input threshold
voltage
VGPIOI,th 1.5 2.5 3.5 V 6) hysteresis included P_14.2.11
GPIO input threshold
hysteresis
VGPIOI,hys 100 400 700 mV 5) P_14.2.12
GPIO low-side current
limitation
IGPIOL,max 10 – 30 mA VGPIO = 28V P_14.2.13
GPIO high-side current
limitation
IGPIOH,max -45 – -10 mA VGPIO = 0V P_14.2.14
Data Sheet 105 Rev. 1.00
2017-07-31
TLE9263BQXV33
Fail Outputs
1) The FOx drivers are supplied via VS. However, the GPIO HS switches (FO2, FO3/TEST) are supplied by VSHS
2) The external capacitance on this pin must be limited to less than 10nF to ensure proper detection of SBC
Development Mode and SBC User Mode operation.
3) Not subject to production test, tolerance defined by internal oscillator tolerance.
4) The duty cyclic is adjustable via the SPI bits FO_DC.
5) Not subject to production test, specified by design.
6) Applies also for TEST voltage input level
Data Sheet 106 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15 Supervision Functions
15.1 Reset Function
Figure 46 Reset Block Diagram
15.1.1 Reset Output Description
The reset output pin RO provides a reset information to the microcontroller, for example, in the event that the
output voltage has fallen below the undervoltage threshold VRT1/2/3/4. In case of a reset event, the reset output
RO is pulled to low after the filter time tRF and stays low as long as the reset event is present plus a reset delay
time tRD1. When connecting the SBC to battery voltage, the reset signal remains LOW initially. When the output
voltage Vcc1 has reached the reset default threshold VRT1,r, the reset output RO is released to HIGH after the
reset delay time tRD1. A reset can also occur due to a watchdog trigger failure. The reset threshold can be
adjusted via SPI, the default reset threshold is VRT1,f. The RO pin has an integrated pull-up resistor. In case reset
is triggered, it will be pulled low for Vcc1 ≥ 1V and for VS ≥ VPOR,f (see also Chapter 15.3).
The timings for the RO triggering regarding VCC1 undervoltage and watchdog trigger is shown in Figure 47.
Reset logic
Incl. filter & delay
RO
VCC1
Data Sheet 107 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
Figure 47 Reset Timing Diagram
15.1.2 Soft Reset Description
In SBC Normal and SBC Stop Mode, it is also possible to trigger a device internal reset via a SPI command in
order to bring the SBC into a defined state in case of failures. In this case the microcontroller must send a SPI
command and set the MODE bits to ‘11’ in the M_S_CTRL register. As soon as this command becomes valid,
the SBC is set back to SBC INIT Mode and all SPI registers are set to their default values (see SPI Chapter 16.5
and Chapter 16.6).
Two different soft reset configurations are possible via the SPI bit SOFT_ RESET_RO:
• The reset output (RO) is triggered when the soft reset is executed (default setting, the same reset delay time
tRD1 applies)
• The reset output (RO) is not triggered when the soft reset is executed
Note: The device must be in SBC Normal Mode or SBC Stop Mode when sending this command.
Otherwise, the command will be ignored.
The reset threshold can be
configured via SPI in SBC
Normal Mode , default is VRT 1
tRD1 tLW
SBC Init
RO
SPI
t
VCC
VRT1
undervoltage
tRD1
SBC Normal
t
t
tLW
t < tRF
tRF
tCW
SBC Restart SBC Normal
SPI
Init
tCW tOW
WD
Trigger
tCW tOW
WD
Trigger
SPI
Init
tLW= long open window
tCW= closed window
tOW= open window
Data Sheet 108 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.2 Watchdog Function
The watchdog is used to monitor the software execution of the microcontroller and to trigger a reset if the
microcontroller stops serving the watchdog due to a lock up in the software.
Two different types of watchdog functions are implemented and can be selected via the bit WD_WIN:
• Time-Out Watchdog (default value)
• Window Watchdog
The respective watchdog functions can be selected and programmed in SBC Normal Mode. The configuration
stays unchanged in SBC Stop Mode.
Please refer to Table 27 to match the SBC Modes with the respective watchdog modes.
The watchdog timing is programmed via SPI command. As soon as the watchdog is programmed, the timer
starts with the new setting and the watchdog must be served. The watchdog is triggered by sending a valid
SPI-write command to the watchdog configuration register. The trigger SPI command is executed when the
Chip Select input (CSN) becomes HIGH.
When coming from SBC Init, SBC Restart Mode or in certain cases from SBC Stop Mode, the watchdog timer is
always started with a long open window. The long open window (tLW = 200ms) allows the microcontroller to
run its initialization sequences and then to trigger the watchdog via SPI.
The watchdog timer period can be selected via the watchdog timing bit field (WD_TIMER) and is in the range
of 10 ms to 1000 ms. This setting is valid for both watchdog types.
The following watchdog timer periods are available:
• WD Setting 1: 10ms
• WD Setting 2: 20ms
• WD Setting 3: 50ms
• WD Setting 4: 100ms
• WD Setting 5: 200ms
• WD Setting 6: 500ms
• WD Setting 7: 1000ms
In case of a watchdog reset, SBC Restart or SBC Fail-Safe Mode is entered according to the configuration and
the SPI bits WD_FAIL are set. Once the RO goes HIGH again the watchdog immediately starts with a long open
window the SBC enters automatically SBC Normal Mode.
In SBC Development Mode the watchdog is OFF and therefore no reset and interrupt are generated due to a
watchdog failure.
Table 27 Watchdog Functionality by SBC Modes
SBC Mode Watchdog Mode Remarks
INIT Mode Starts with Long Open
Window
Watchdog starts with Long Open Window after RO is
released
Normal Mode WD Programmable Window Watchdog, Time-Out watchdog or switched
OFF for SBC Stop Mode
Stop Mode Watchdog is fixed or OFF
Sleep Mode OFF SBC will start with Long Open Window when
entering SBC Normal Mode.
Restart Mode OFF SBC will start with Long Open Window when
entering SBC Normal Mode.
Data Sheet 109 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
Depending on the configuration, the WD_FAIL bits will be set after a watchdog trigger failure as follows:
• In case an incorrect WD trigger is received (triggering in the closed watchdog window or when the watchdog
counter expires without a valid trigger) then the WD_FAIL bits will be increased (showing the number of
incorrect WD triggers)
• For config 2: the bits can have the maximum value of ‘01’
• For config 1, 3 and 4: the bits can have the maximum value of ‘10’
The WD_FAIL bits are cleared automatically when following conditions apply:
• After a successful watchdog trigger
• When the watchdog is OFF: in SBC Stop Mode after successfully disabling it, in SBC Sleep Mode, or in SBC
Fail-Safe Mode (except for a watchdog failure)
15.2.1 Time-Out Watchdog
The time-out watchdog is an easier and less secure watchdog than a window watchdog as the watchdog
trigger can be done at any time within the configured watchdog timer period.
A correct watchdog service immediately results in starting a new watchdog timer period. Taking the
tolerances of the internal oscillator into account leads to the safe trigger area as defined in Figure 48.
If the time-out watchdog period elapses, a watchdog reset is created by setting the reset output RO low and
the SBC switches to SBC Restart or SBC Fail-Safe Mode.
Figure 48 Time-out Watchdog Definition
open window
t /
[t
WD_TIMER
]
safe trigger area
Wd1_TimeOut_per. vsd
Watchdog Timer Period (WD_TIMER)
uncertainty
Typical timout watchdog trigger period
t
WD
x 1.80
t
WD
x 1.20
t
WD
x 1.50
Data Sheet 110 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.2.2 Window Watchdog
Compared to the time-out watchdog the characteristic of the window watchdog is that the watchdog timer
period is divided between an closed and an open window. The watchdog must be triggered within the open
window.
A correct watchdog trigger results in starting the window watchdog period by a closed window followed by an
open window.
The watchdog timer period is at the same time the typical trigger time and defines the middle of the open
window. Taking the oscillator tolerances into account leads to a safe trigger area of:
tWD x 0.72 < safe trigger area < tWD x 1.20.
The typical closed window is defined to a width of 60% of the selected window watchdog timer period. Taking
the tolerances of the internal oscillator into account leads to the timings as defined in Figure 49.
A correct watchdog service immediately results in starting the next closed window.
Should the trigger signal meet the closed window or should the watchdog timer period elapse, then a
watchdog reset is created by setting the reset output RO low and the SBC switches to SBC Restart or SBC Fail-
Safe Mode.
Figure 49 Window Watchdog Definition
closed window open window
t /
[t
WD_TIMER
]
safe trigger area
t
WD
x 0.72 t
WD
x 1.20
uncertainty uncertainty
t
WD
x 0.48 t
WD
x 1.80
Watchdog Timer Period (WD_TIMER)
Typ. closed window Typ. open window
t
WD
x 0.6
t
WD
x 1.0
t
WD
x 0.9
Data Sheet 111 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.2.3 Watchdog Setting Check Sum
A check sum bit is part of the SPI commend to trigger the watchdog and to set the watchdog setting.
The sum of the 8 data bits in the register WWD_CTRL needs to have even parity (see Equation (15.1)). This is
realized by either setting the bit CHECKSUM to 0 or 1. If the check sum is wrong, then the SPI command is
ignored, i.e. the watchdog is not triggered or the settings are not changed and the bit SPI_FAIL is set.
The checksum is calculated by taking all 8 data bits into account. The written value of the reserved bit 3 of the
WWD_CTRL register is considered (even if read as ‘0’ in the SPI output) for checksum calculation, i.e. if a 1 is
written on the reserved bit position, then a 1 will be used in the checksum calculation.
(15.1)
CHKSUM Bit15 …Bit8⊕⊕=
Data Sheet 112 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.2.4 Watchdog during SBC Stop Mode
The watchdog can be disabled for SBC Stop Mode in SBC Normal Mode. For safety reasons, there is a special
sequence to be followed in order to disable the watchdog as described in Figure 50. Two different SPI bits
(WD_STM_ EN_0, WD_STM_ EN_1) in the registers WK_CTRL_1 and WD_CTRL need to be set.
Figure 50 Watchdog disabling sequence in SBC Stop Mode
If a sequence error occurs, then the bit WD_STM_ EN_1 will be cleared and the sequence has to be started
again.
The watchdog can be enabled by triggering the watchdog in SBC Stop Mode or by switching back to SBC
Normal Mode via SPI command. In both cases the watchdog will start with a long open window and the bits
WD_STM_EN_1 and WD_STM_ EN_0 are cleared. After the long open window the watchdog has to be served
as configured in the WD_CTRL register.
Note: The bit WD_STM_ EN_0 will be cleared automatically when the sequence is started and it was 1
before.
Correct WD disabling
sequence
Set bit
WD_STM_EN_1 = 1
Set bit
WD_STM_EN_0 = 1
with next WD Trigger
WD is switched off
Sequence Errors
•Missing to set bit
WD_STM_EN_0 with the
next watchdog trigger after
having set WD_STM_EN_1
•Staying in Normal Mode
instead of going to Stop
Mode with the next trigger
Change to
SBC Stop Mode
Before subsequent WD Trigger
Will enable the WD :
•Switching back to SBC
Normal Mode
•Triggering the watchdog
Data Sheet 113 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.2.5 Watchdog Start in SBC Stop Mode due to Bus Wake
In SBC Stop Mode the Watchdog can be disabled. In addition a feature is available which will start the
watchdog with any BUS wake (CAN or LIN) during SBC Stop Mode. The feature is enabled by setting the bit
WD_EN_ WK_BUS = 1
(= default value after POR). The bit can only be changed in SBC Normal Mode and needs to be programmed
before starting the watchdog disable sequence.
A wake on CAN and LINx will generate an interrupt and the RXD pin for LINx or CAN is pulled to low. By these
signals the microcontroller is informed that the watchdog is startedwith a long open window. After the long
open window the watchdog has to be served as configured in the WD_CTRL register.
To disable the watchdog again, the SBC needs to be switched to Normal Mode and the sequence needs to be
sent again.
Data Sheet 114 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.3 VS Power On Reset
At power up of the device, the VS Power on Reset is detected when VS > VPOR,r and the SPI bit POR is set to
indicate that all SPI registers are set to POR default settings. VCC1 is starting up and the reset output will be
kept LOW and will only be released once VCC1 has crossed VRT1,r and after tRD1 has elapsed.
In case VS < VPOR,f, an device internal reset will be generated and the SBC is switched OFF and will restart in
INIT mode at the next VS rising. This is shown in Figure 51.
Figure 51 Ramp up / down example of Supply Voltage
t
VCC1
t
V
POR,f
RO
t
VS
V
POR,r
t
RD1
V
RT1,r
V
RTx,f
t
SBC Mode
SBC OFF SBC OFFSBC INIT MODE Any SBC MODE
SPI
Command
The reset threshold can be
configured via SPI in SBC
Normal Mode , default is V
RT1
Re-
start
SBC Restart Mode is
entered whenever the
Reset is triggered
Data Sheet 115 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.4 Undervoltage VS and VSHS
If the supply voltage VS reaches the undervoltage threshold VS,UV then the SBC does the following measures:
• SPI bit VS_UV is set. No other error bits are set. The bit can be cleared once the condition is not present
anymore,
• VCC3 is disabled (see Chapter 8.2) unless the control bit VCC3_VS_ UV_OFF is set
• The VCC1 short circuit protection becomes inactive (see Chapter 15.7). However, the thermal protection
of the device remains active.
If the undervoltage threshold is exceeded (VS rising) then functions will be automatically enabled again.
If the supply voltage VSHS passes below the undervoltage threshold (VSHS,UVD) the SBC does the following
measures:
• HS1...4 are acting accordingly to the SPI setting (see Chapter 9)
• LINx: Transmitter and Receiver are disabled during the VSHS undervoltage condition (see Chapter 11.2.7);
•SPI bit VSHS_UV is set. No other error bits are set. The bit can be cleared once the condition is not present
anymore,
• VCC1, VCC2, WKx and CAN are not affected by VSHS undervoltage
15.5 Overvoltage VSHS
If the supply voltage VSHS reaches the overvoltage threshold (VSHS,OVD) the SBC triggers the following
measures:
• HS1...4 are acting accordingly to the SPI setting (see Chapter 9)
• SPI bit VSHS_OV is set. No other error bits are set. The bit can be cleared once the condition is not present
anymore,
• VCC1, VCC2, VCC3, WKx, LIN and CAN are not affected by VS overvoltage
15.6 VCC1 Over-/ Undervoltage and Undervoltage Prewarning
15.6.1 VCC1 Undervoltage and Undervoltage Prewarning
A first-level voltage detection threshold is implemented as a prewarning for the microcontroller. The
prewarning event is signaled with the bit VCC1_ WARN. No other actions are taken.
As described in Chapter 15.1 and Figure 52, a reset will be triggered (RO pulled ‘low’) when the VCC1 output
voltage falls below the selected undervoltage threshold (VRTx). The bit VCC1_UV is set and the SBC will enter
SBC Restart Mode.
Note: The VCC1_ WARN or VCC1_UV bits are not set in Sleep Mode as VCC1 = 0V in this case
Data Sheet 116 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
Figure 52 VCC1 Undervoltage Timing Diagram
An additional safety mechanism is implemented to avoid repetitive VCC1 undervoltage resets due to high
dynamic loads on VCC1:
• A counter is increased for every consecutive VCC1 undervoltage event (regardless on the selected reset
threshold),
• The counter is active in SBC Init-, Normal-, and Stop Mode,
•For VS < VS,UV the counter will be stopped in SBC Normal Mode (i.e. the VS UV comparator is always enabled
in SBC Normal Mode),
• A 4th consecutive VCC1 undervoltage event will lead to SBC Fail-Safe Mode entry and to setting the bit
VCC1_UV _FS
• This counter is cleared:
– when SBC Fail-Safe Mode is entered,
– when the bit VCC1_UV is cleared,
– when a Soft Reset is triggered.
Note: It is recommended to clear the VCC1_UV bit once it was set and detected.
15.6.2 VCC1 Overvoltage
For fail-safe reasons a configurable VCC1 overvoltage detection feature is implemented for SBC Init- and
Normal Mode.
In case the VCC1,OV,r threshold is crossed, the SBC triggers following measures depending on the configuration:
• The bit VCC1_ OV is always set;
•If the bit VCC1_OV_RST is set and CFGP = ‘1’, then SBC Restart Mode is entered. The FOx outputs are
activated. After the reset delay time (tRD1), the SBC Restart Mode is left and SBC Normal Mode is resumed
even if the VCC1 overvoltage event is still present (see also Figure 53). The VCC1_OV_RST bit is cleared
automatically;
•If the bit VCC1_OV_RST is set and CFGP = ‘0’, then SBC Fail-Safe Mode is entered and FOx outputs are
activated.
Note: Before entering SBC Stop Mode the bit VCC1_OV_RST must be set to ‘0’ to avoid unintentional SBC
Restart or Fail-Safe Mode entry. The status bit VCC1_ OV could be set unintentionally. The reason is
RO
t
VCC1
V
RTx
t
RD1
SBC Normal
t
t
RF
SBC Restart SBC Normal
Data Sheet 117 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
that external noise could be coupled into the VCC1 supply line. Especially, in case the VCC1 output
current in SBC STOP Mode is below the active peak threshold (IVCC1,Ipeak).
Figure 53 VCC1 Overvoltage Timing Diagram
15.7 VCC1 Short Circuit and VCC3 Diagnostics
The short circuit protection feature for VCC1 is implemented as follows (VS needs to be higher than VS,UV):
• If VCC1 is not above the VRTx within tVCC1,SC after device power up or after waking from SBC Sleep Mode then
the SPI bit VCC1_SC bit is set, VCC1 is turned OFF, the FOx pins are enabled, FAILURE is set and SBC Fail-
Safe Mode is entered. The SBC can be activated again via wake on CAN, LINx, WKx.
• The same behavior applies, if VCC1 falls below VRTx for longer than tVCC1,SC.
VCC3 diagnosis features are implemented as follows:
• Load Sharing: The external PNP is disabled when VS < VS,UV if VCC3_VS_ UV_OFF = 0 or when in SBC Stop
Mode if VCC3_LS_ STP_ON = ‘0’. All other diagnostic features are disabled because they are provided via
VCC1.
• Stand-alone configuration: The external PNP is disabled when VCC3 < VS,UV if VCC3_VS_ UV_OFF = 0. The
overcurrent limitation is signalled via the bit VCC3_OC according to the selected shunt resistor, VCC3
undervoltage is signalled via the bit VCC3_UV and the regulator is disabled due to VS undervoltage when VS,UV
is reached.
Note: Neither VCC1_SC nor VCC3_UV flags are set during power up of VCC1 or turn on of VCC3 respectively.
15.8 VCC2 Undervoltage and VCAN Undervoltage
An undervoltage warning is implemented for VCC2 and VCAN as follows:
•VCC2 undervoltage Detection: In case VCC2 will drop below the VCC2,UV,f threshold, then the SPI bit VCC2_UV
is set and can be only cleared via SPI.
•VCAN undervoltage Detection: In case the voltage on VCAN will drop below the VCAN_UV threshold, then the SPI
bit VCAN_UV is set and can be only cleared via SPI.
Note: The VCC2_UV flag is not set during turn-on or turn-off of VCC2.
RO
t
VCC1
t
RD1
SBC Normal
t
t
VCC1,OV_F
SBC Restart SBC Normal
V
CC1,OV
Data Sheet 118 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.9 Thermal Protection
Three independent and different thermal protection features are implemented in the SBC according to the
system impact:
• Individual thermal shutdown of specific blocks
• Temperature prewarning of main microcontroller supply VCC1
• SBC thermal shutdown due to VCC1 overtemperature
15.9.1 Individual Thermal Shutdown
As a first-level protection measure the output stages VCC2, CAN, LINx, and HSx are independently switched
OFF if the respective block reaches the temperature threshold TjTSD1. Then the TSD1 bit is set. This bit can only
be cleared via SPI once the overtemperature is not present anymore. Independent of the SBC Mode the
thermal shutdown protection is only active if the respective block is ON.
The respective modules behave as follows:
• VCC2: Is switched to OFF and the control bits VCC2_ON are cleared. The status bit VCC2_OT is set. Once the
overtemperature condition is not present anymore, then VCC2 has to be configured again by SPI.
• VCC3 as a stand-alone regulator: Is switched to OFF and the control bits VCC3_ON are cleared. The status
bit VCC3_OT is set. Once the overtemperature condition is not present anymore VCC3 has to be configured
again by SPI. It is recommended to clear the VCC3_OT bit before enabling the regulator again.
• VCC3 in load sharing configuration: in case of overtemperature at VCC3 the bit VCC3_OT is set and VCC3 is
switched off. The regulator will be switched on again automatically once the overtemperature event is not
present anymore. Also in this case it is recommended to clear the VCC3_OT bit right away.
• CAN: The transmitter is disabled and stays in CAN Normal Mode acting like CAN Receive only mode. The
status bits CAN_FAIL = ‘01’ are set. Once the overtemperature condition is not present anymore, then the
CAN transmitter is automatically switched on.
• LINx: The transmitter is disabled and stays in LIN Normal Mode acting like LIN Receive only mode. The status
bits LIN1_FAIL and LIN2_FAIL respectively are set to ‘01’. Once the overtemperature condition is not present
anymore, then the LIN transmitter is automatically switched on.
• HSx: If one or more HSx switches reach the TSD1 threshold, then all HSx switches are turned OFF and the
control bits for HSx are cleared (see registers HS_CTRL1 and HS_CTRL2). The status bits HSx_OC_OT are
set (see register HS_OC_OT_STAT). Once the overtemperature condition is not present anymore, then HSx
has to be configured again by SPI.
Note: The diagnosis bits are not cleared automatically and have to be cleared via SPI once the
overtemperature condition is not present anymore.
Data Sheet 119 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.9.2 Temperature Prewarning
As a next level of thermal protection a temperature prewarning is implemented if the main supply VCC1
reaches the thermal prewarning temperature threshold TjPW. Then the status bit TPW is set. This bit can only
be cleared via SPI once the overtemperature is not present anymore. Independent of the SBC Mode the
thermal prewarning is only active if the VCC1 is ON.
15.9.3 SBC Thermal Shutdown
As a highest level of thermal protection a temperature shutdown of the SBC is implemented if the main supply
VCC1 reaches the thermal shutdown temperature threshold TjTSD2. Once a TSD2 event is detected SBC Fail-
Safe Mode is entered for tTSD2 to allow the device to cool down. After this time has expired, the SBC will
automatically change via SBC Restart Mode to SBC Normal Mode (see also Chapter 5.1.6).
When a TSD2 event is detected, then the status bit TSD2 is set. This bit can only be cleared via SPI in SBC
Normal Mode once the overtemperature is not present anymore. Independent of the SBC Mode the thermal
shutdown is only active if VCC1 is ON.
Data Sheet 120 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
15.10 Electrical Characteristics
Table 28 Electrical Specification
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
VCC1 Monitoring; VCC1 = 3.3V Version
Undervoltage Prewarning
Threshold Voltage PW,f
3.3V option
VPW,f 3.0 3.1 3.2 V VCC1 falling,
SPI bit is set
P_15.10.36
Undervoltage Prewarning
Threshold Voltage PW,r
3.3V option
VPW,r 3.10 3.2 3.28 V VCC1 rising P_15.10.71
Reset Threshold
Voltage RT1,f
3.3V option
VRT1,f 2.95 3.05 3.15 V default setting;
VCC1 falling
P_15.10.37
Reset Threshold
Voltage RT1,r
3.3V option
VRT1,r 3.0 3.1 3.2 V default setting;
VCC1 rising
P_15.10.38
Reset Threshold
Voltage RT2,f
3.3V option
VRT2,f 2.5 2.6 2.7 V VCC1 falling P_15.10.39
Reset Threshold
Voltage RT2,r
3.3V option
VRT2,r 2.55 2.65 2.75 V VCC1 rising P_15.10.40
Reset Threshold
Voltage RT3,f
3.3V option
VRT3,f 2.2 2.3 2.4 V SPI option;
VS ≥ 4V;
VCC1 falling
P_15.10.41
Reset Threshold
Voltage RT3,r
3.3V option
VRT3,r 2.25 2.35 2.45 V VS ≥ 4V;
VCC1 rising
P_15.10.42
Reset Threshold
Voltage RT4,f
3.3V option
VRT4,f 2.0 2.1 2.2 V VS ≥ 4V;
VCC1 falling
P_15.10.43
Reset Threshold
Voltage RT4,r
3.3V option,
VRT4,r 2.05 2.15 2.25 V VS ≥ 4V;
VCC1 rising,
P_15.10.44
Reset Threshold Hysteresis
3.3V option
VRT,hys 30 67 140 mV – P_15.10.45
VCC1 Overvoltage Detection
Threshold Voltage
3.3V option
VCC1,OV,r 3.5 – 3.7 V rising VCC1 P_15.10.70
Data Sheet 121 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
VCC1 Overvoltage Detection
Threshold Voltage
3.3V option
VCC1,OV,f 3.40 – 3.60 V falling VCC1 P_15.10.73
VCC1 OV Detection Filter
Time
tVCC1,OV_F 51014us
2) P_15.10.51
VCC1 Short to GND Filter
Time
tVCC1,SC 3.2 4 4.8 ms 2) P_15.10.12
Reset Generator; Pin RO
Reset Low Output Voltage VRO,L –0.20.4VIRO = 1 mA for
VCC1 ≥ 1 V &
VS≥VPOR,f
P_15.10.14
Reset High Output Voltage VRO,H 0.8 x
VCC1
–VCC1 +
0.3 V
VIRO = -20 µA P_15.10.15
Reset Pull-up Resistor RRO 10 20 40 kΩVRO = 0 V P_15.10.16
Reset Filter Time tRF 41026µs
2)VCC1 < VRT1x
to RO = L see also
Chapter 15.3
P_15.10.17
Reset Delay Time tRD1 1.5 2 2.5 ms 1) 2) P_15.10.18
VCC2 Monitoring
VCC2 Undervoltage
Threshold Voltage (falling)
VCC2,UV,f 4.5 – 4.75 V VCC2 falling P_15.10.19
VCC2 Undervoltage
Threshold Voltage (rising)
VCC2,UV,r 4.6 – 4.9 V VCC2 rising P_15.10.77
VCC2 Undervoltage
detection hysteresis
VCC2,UV, hys 20 100 250 mV – P_15.10.20
VCC3 Monitoring
VCC3 Undervoltage
Detection
VCC3,UV 2.65 2.85 3.00 V 3.3V option or
VCC3_ V_CFG=0
hysteresis
included
P_15.10.47
VCC3 Undervoltage
Detection
VCC3,UV 1.45 1.52 1.65 V VCC3_ V_CFG=1
hysteresis
included
P_15.10.61
VCC3 Undervoltage
detection hysteresis
VCC3,UV, hys 20 100 250 mV – P_15.10.22
Table 28 Electrical Specification (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 122 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
VCAN Monitoring
CAN Supply undervoltage
detection threshold
VCAN_UV 4.45 – 4.85 V CAN Normal
Mode,
hysteresis
included;
P_15.10.23
Watchdog Generator
Long Open Window tLW 160 200 240 ms 2) P_15.10.24
Internal Oscillator fCLKSBC 0.8 1.0 1.2 MHz – P_15.10.25
Minimum Waiting time during SBC Fail-Safe Mode
Min. waiting time Fail-Safe tFS,min 80 100 120 ms 2)3) P_15.10.75
Power-on Reset, Over- / Undervoltage Protection
VS Power on reset rising VPOR,r – 4.5 V VS increasing P_15.10.26
VS Power on reset falling VPOR,f – 3 V VS decreasing P_15.10.27
VS Undervoltage Detection
Threshold
3.3V option
VS,UV 3.7 – 4.4 V Supply UV
threshold for VCC3
and VCC1 SC
detection;
hysteresis
included
P_25.10.46
VSHS Overvoltage Detection
Threshold
VSHS,OVD 20 22 V Supply OV
supervision for
HSx;
hysteresis
included
P_15.10.28
VSHS Overvoltage Detection
hysteresis
VSHS,OVD,hys 100 500 – mV 4) P_15.10.29
VSHS Undervoltage
Detection Threshold
VSHS,UVD 4.8 5.5 V Supply UV
supervision for
LINx, HSx, and HS
of GPIOx;
hysteresis
included
P_15.10.30
VSHS Undervoltage
Detection hysteresis
VSHS,UVD,hys 50 200 350 mV 4) P_15.10.31
Overtemperature Shutdown4)
Thermal Prewarning
Temperature
TjPW 125 145 165 °C P_15.10.32
Thermal Shutdown TSD1 TjTSD1 165 185 200 °C P_15.10.33
Table 28 Electrical Specification (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 123 Rev. 1.00
2017-07-31
TLE9263BQXV33
Supervision Functions
Thermal Shutdown TSD2 TjTSD2 165 185 200 °C P_15.10.34
Thermal Shutdown
hysteresis
TjTSD,hys 5 15 25 °C P_15.10.68
Deactivation time after
thermal shutdown TSD2
tTSD2 0.8 1 1.2 s 2) P_15.10.35
1) The reset delay time will start when VCC1 crosses above the selected Vrtx threshold
2) Not subject to production test, tolerance defined by internal oscillator tolerance.
3) This time applies for all failure entries except a device thermal shutdown (TSD2 has a typ. 1s waiting time tTSD2)
4) Not subject to production test, specified by design.
Table 28 Electrical Specification (cont’d)
VS = 5.5 V to 28 V; Tj = -40 °C to +150 °C; SBC Normal Mode; all voltages with respect to ground; positive current
defined flowing into pin; unless otherwise specified.
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
Data Sheet 124 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16 Serial Peripheral Interface
16.1 SPI Block Description
The 16-bit wide Control Input Word is read via the data input SDI, which is synchronized with the clock input
CLK provided by the microcontroller. The output word appears synchronously at the data output SDO (see
Figure 54).
The transmission cycle begins when the chip is selected by the input CSN (Chip Select Not), LOW active. After
the CSN input returns from LOW to HIGH, the word that has been read is interpreted according to the content.
The SDO output switches to tristate status (high impedance) at this point, thereby releasing the SDO bus for
other use.The state of SDI is shifted into the input register with every falling edge on CLK. The state of SDO is
shifted out of the output register after every rising edge on CLK. The SPI of the SBC is not daisy chain capable.
Figure 54 SPI Data Transfer Timing (note the reversed order of LSB and MSB shown in this figure
compared to the register description)
00
+
1 2 3 4 5 6 7 8 9 10 15 1
+
0 1 2 3 4 5 6 11 12 13 147 8 9 10 15
CSN high to low: SDO is enabled. Status information transferred to output shift register
CSN low to high: data from shift register is transferred to output functions
SDI: will accept data on the falling edge of CLK signal
SDO: will change state on the rising edge of CLK signal
Actual status
11 12 13 14
Actual data New data
New status
SDO
SDI
CSN
CLK
time
time
time
time
ERR
ERR
-0
+1
+
Data Sheet 125 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.2 Failure Signalization in the SPI Data Output
When the microcontroller sends a wrong SPI command to the SBC, the SBC ignores the information. Wrong
SPI commands are either invalid SBC mode commands or commands which are prohibited by the state
machine to avoid undesired device or system states (see below). In this case the diagnosis bit ‘SPI_FAIL’ is set
and the SPI Write command is ignored (mostly no partial interpretation). This bit can be only reset by actively
clearing it via a SPI command.
Invalid SPI Commands leading to SPI_FAIL are listed below:
• Illegal state transitions: Going from SBC Stop to SBC Sleep Mode. In this case the SBC enters in addition the
SBC Restart Mode;
Trying to go to SBC Stop or SBC Sleep mode from SBC Init Mode. In this case SBC Normal Mode is entered;
• Uneven parity in the data bit of the WD_CTRL register. In this case the watchdog trigger is ignored or the
new watchdog settings are ignored respectively;
• In SBC Stop Mode: attempting to change any SPI settings, e.g. changing the watchdog configuration, PWM
settings and HS configuration settings during SBC Stop Mode, etc.;
the SPI command is ignored in this case;
only WD trigger, returning to Normal Mode, triggering a SBC Soft Reset, and Read & Clear status registers
commands are valid SPI commands in SBC Stop Mode;
• When entering SBC Stop Mode and WK_STAT_1 and WK_STAT_2 are not cleared; SPI_FAIL will not be set
but the INT pin will be triggered;
• Changing from SBC Stop to Normal Mode and changing the other bits of the M_S_CTRL register. The other
modifications will be ignored;
• SBC Sleep Mode: attempt to go to Sleep Mode when all bits in the BUS_CTRL_1, BUS_CTRL_2 and
WK_CTRL_2 registers are cleared. In this case the SPI_FAIL bit is set and the SBC enters Restart Mode.
Even though the Sleep Mode command is not entered in this case, the rest of the command (e.g modifying
VCC2 or VCC3) is executed and the values stay unchanged during SBC Restart Mode;
Note: At least one wake source must be activated in order to avoid a deadlock situation in SBC Sleep Mode,
i.e. the SBC would not be able to wake up anymore.
If the only wake source is a timer and the timer is OFF then the SBC will wake immediately from Sleep Mode
and enter Restart Mode;
No failure handling is done for the attempt to go to SBC STOP Mode when all bits in the registers
BUS_CTRL_1, BUS_CTRL_2 and WK_CTRL_2 are cleared because the microcontroller can leave this mode
via SPI;
• If VCC3 load sharing VCC3_LS is enabled and the microcontroller tries to clear the bit, then the rest of the
command executed but VCC3_LS will remain set;
• Attempt to enter SBC Sleep Mode if WK_MEAS is set to ‘1’ and only WK1_EN or WK2_EN are set as wake
sources. Also in this case the SPI_FAIL bit is set and the SBC enters Restart Mode;
• Setting a longer or equal on-time than the timer period of the respective timer;
• SDI stuck at HIGH or LOW, e.g. SDI received all ‘0’ or all ‘1’;
Note: There is no SPI fail information for unused addresses.
Signalization of the ERR Flag (high active) in the SPI Data Output (see Figure 54):
The ERR flag presents an additional diagnosis possibility for the SPI communication. The ERR flag is being set
for following conditions:
• in case the number of received SPI clocks is not 0 or 16,
• in case RO is LOW and SPI frames are being sent at the same time.
Data Sheet 126 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: In order to read the SPI ERR flag properly, CLK must be low when CSN is triggered, i.e. the ERR bit is
not valid if the CLK is high on a falling edge of CSN
The number of received SPI clocks is not 0 or 16:
The number of received input clocks is supervised to be 0- or 16 clock cycles and the input word is discarded
in case of a mismatch (0 clock cycle to enable ERR signalization). The error logic also recognizes if CLK was high
during CSN edges. Both errors - 0 bit and 16 bit CLK mismatch or CLK high during CSN edges - are flagged in
the following SPI output by a “HIGH” at the data output (SDO pin, bit ERR) before the first rising edge of the
clock is received. The complete SPI command is ignored in this case.
RO is LOW and SPI frames are being sent at the same time:
The ERR flag will be set when the RO pin is triggered (during SBC Restart) and SPI frames are being sent to the
SBC at the same time. The behavior of the ERR flag will be signalized at the next SPI command for below
conditions:
• if the command begins when RO is HIGH and it ends when RO is LOW,
• if a SPI command will be sent while RO is LOW,
• If a SPI command begins when RO is LOW and it ends when RO is HIGH.
and the SDO output will behave as follows:
• always when RO is LOW then SDO will be HIGH,
• when a SPI command begins with RO is LOW and ends when RO is HIGH, then the SDO should be ignored
because wrong data will be sent.
Note: It is possible to quickly check for the ERR flag without sending any data bits. i.e. only the CSN is pulled
low and SDO is observed - no SPI Clocks are sent in this case
Note: The ERR flag could also be set after the SBC has entered SBC Fail-Safe Mode because the SPI
communication is stopped immediately.
Data Sheet 127 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.3 SPI Programming
For the TLE9263BQXV33, 7 bits are used or the address selection (BIT6...0). Bit 7 is used to decide between
Read Only and Read & Clear for the status bits, and between Write and Read Only for configuration bits. For
the actual configuration and status information, 8 data bits (BIT15...8) are used.
Writing, clearing and reading is done byte wise. The SPI status bits are not cleared automatically and must be
cleared by the microcontroller, e.g. if the TSD2 was set due to overtemperature. The configuration bits will be
partially automatically cleared by the SBC - please refer to the individual registers description for detailed
information. During SBC Restart Mode the SPI communication is ignored by the SBC, i.e. it is not interpreted.
There are two types of SPI registers:
• Control registers: Those are the registers to configure the SBC, e.g. SBC mode, watchdog trigger, etc
• Status registers: Those are the registers where the status of the SBC is signalled, e.g. wake events,
warnings, failures, etc.
For the status registers, the requested information is given in the same SPI command in DO.
For the control registers, also the status of the respective byte is shown in the same SPI command. However,
if the setting is changed this is only shown with the next SPI command (it is only valid after CSN high) of the
same register.
The SBC status information from the SPI status registers, is transmitted in a compressed way with each SPI
response on SDO in the so called Status Information Field register (see also Figure 55). The purpose of this
register is to quickly signal the information to the microcontroller if there was a change in one of the SPI status
registers. In this way, the microcontroller does not need to read constantly all the SPI status registers but only
those registers, which were changed.
Each bit in the Status Information Field represents a SPI status register (see Table 29). As soon as one bit is set
in one of the status registers, then the respective bit in the Status Information Field register will be set. The
register WK_LVL_STAT is not included in the status Information field. This is listed in Table 29.
For Example if bit 0 in the Status Information Field is set to 1, one or more bits of the register 100 0001
(SUP_STAT_1) is set to 1. Then this register needs to be read in a second SPI command. The bit in the Status
Information Field will be set to 0 when all bits in the register 100 0001 are set back to 0.
Table 29 Status Information Field
Bit in Status
Information Field
Corresponding Address
Bit
Status Register Description
0 100 0001 SUP_STAT_1: Supply Status -VSHS fail, VCCx fail, POR
1 100 0010 THERM_STAT: Thermal Protection Status
2 100 0011 DEV_STAT: Device Status - Mode before Wake, WD Fail,
SPI Fail, Failure
3 100 0100 BUS_STAT: Bus Failure Status: CAN, LINx; BUS_STAT_1
& BUS_STAT_2 are a combinational OR
4 100 0110 WK_STAT_1, WK_STAT_2: Wake Source Status;
Status bit is set as combinational OR of both registers
5 100 0000 SUP_STAT_2: VCC1_WARN/OV, VCC3 Status
6 101 0100 HS_OC_OT_STAT: High-Side Over Load Status
7 101 0101 HS_OL_STAT: High-Side Open Load Status
Data Sheet 128 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Figure 55 SPI Operation Mode
0 1 2 3 4 5 76 8 9 10 11 12 13 1514
Data Bits
DI
Address Bits
x x x x x x xx
R/W
0 1 2 3 4 5 76 8 9 10 11 12 13 1514
Data Bits
DO
Status Information Field
x x x x x x xx
Register content of
selected address
LSB MSB
time
LSB is sent first in SPI message
Data Sheet 129 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.4 SPI Bit Mapping
The following figures show the mapping of the registers and the SPI bits of the respective registers.
The Control Registers ‘000 0000’ to ‘001 1110’ are Read/Write Register. Depending on bit 7 the bits are only
read (setting bit 7 to ‘0’) or also written (setting bit 7 to ‘1’). The new setting of the bit after write can be seen
with a new read / write command.
The registers ‘100 0000’ to ‘111 1110’ are Status Registers and can be read or read with clearing the bit (if
possible) depending on bit 7. To clear a Data Byte of one of the Status Registers bit 7 must be set to 1. The
registers WK_LVL_STAT, and FAM_PROD_STAT are an exception as they show the actual voltage level at the
respective WK pin (LOW/HIGH), or a fixed family/ product ID respectively and can thus not be cleared. It is
recommended for proper diagnosis to clear respective status bits for wake events or failure. However, in
general it is possible to enable drivers without clearing the respective failure flags.
When changing to a different SBC Mode, certain configurations bits will be cleared automatically or modified:
• The SBC Mode bits are updated to the actual status, e.g. when returning to Normal Mode
• When changing to a low-power mode (Stop/Sleep), the diagnosis bits of the switches and transceivers are
not cleared. FOx will stay activated if it was triggered before.
• When changing to SBC Stop Mode, the CAN and LIN control bits will not be modified.
• When changing to SBC Sleep Mode, the CAN and LIN control bits will be modified if they were not OFF or
wake capable before.
• HSx, VCC2 and VCC3 will stay on when going to Sleep-/Stop Mode (configuration can only be done in
Normal Mode). Diagnosis is active (OC, OL, OT). In case of a failure the switch is turned off and no wake-up
is issued
• The configuration bits for HSx and VCC2 in stand-alone configuration are cleared in SBC Restart Mode. FOx
will stay activated if it was triggered before. Depending on the respective configuration, CAN/LIN
transceivers will be either OFF, woken or still wake capable.
Note: The detailed behavior of the respective SPI bits and control functions is described in Chapter 16.5,
Chapter 16.6.and in the respective module chapter. The bit type be marked as ‘rwh’ in case the SBC
will modify respective control bits.
Data Sheet 130 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Figure 56 SPI Register Mapping
1 0 0 0 1 1 1
WK_STAT_2 rc 4
0 0 1 0 1 1 1
GPIO_CTRL rw
-
1 0 0 0 1 0 1
BUS_STAT_2 rc
15 14 13 12 11 10 89 7 6 5 4 3 2 01
7 Address Bits [bits 0... 6]
for Register Selection
8 Data Bits [bits 8...15]
for Configuration & Status Information
LSBMSB
0 0 0 0 0 0 1
M_S_CTRL
Reg.
Type
rw
0 0 0 0 0 1 0
rwHW_CTRL
0 0 0 0 0 1 1
WD_CTRL rw
0 0 0 0 1 0 0
BUS_CTRL_1 rw
0 0 0 0 1 1 0
WK_CTRL_1 rw
0 0 0 1 0 0 0WK_PUPD_CTRL rw
0 0 0 1 0 0 1WK_FLT_CTRL rw
0 0 0 1 1 0 0TIMER1_CTRL rw
0 0 1 0 0 0 0
SW_SD_CTRL rw
0 0 1 0 1 0 0HS_CTRL_1 rw
0 0 1 0 1 0 1
HS_CTRL_2 rw
0 0 1 1 0 0 0
PWM1_CTRL rw
0 0 1 1 0 0 1
PWM2_CTRL rw
1 0 0 0 0 0 1SUP_STAT_1 rc
1 0 0 0 0 1 0
THERM_STAT rc
1 0 0 0 0 1 1
DEV_STAT rc
1 0 0 0 1 0 0
BUS_STAT_1 rc
1 0 0 0 1 1 0WK_STAT_1 rc
1 0 0 1 0 0 0
WK_LVL_STAT r
1 0 1 0 1 0 0
HS_OC_OT_STAT rc
1 0 1 0 1 0 1
HS_OL_STAT rc
0 0 0 1 1 0 1
TIMER2_CTRL rw
0 0 0 0 1 1 1
WK_CTRL_2 rw
0 0 1 1 1 0 0PWM_FREQ_CTRL rw
1 1 1 1 1 1 0FAM_PROD_STAT r
0 0 1 1 1 1 0
SYS_STAT_CTRL rw
0 0 0 0 1 0 1
BUS_CTRL_2 rw
1 0 0 0 0 0 0SUP_STAT_2 rc
3
0
1
2
3
4
6
7
5
Status Information
Field Bit
Control RegistersStatus Registers
Data Sheet 131 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Figure 57 TLE9263BQXV33 SPI Bit Mapping
15 14 13 12 11 10 9 8 7 6...0
Data Bit 15…8
D7 D6 D5 D4 D3 D2 D1 D0
M_S_CTRL MODE_1 MODE_0 VCC3_ON VCC2_ON_1 VCC2_ON_0 VCC1_OV_RST VCC1_RT_1 VCC1_RT_0 read/write 0000001
HW_CTRL VCC3_V_CFG
SOFT_RESET_RO
FO_ON
VCC3_VS_UV_OFF
VCC3_LS reserved
VCC3_LS_STP_ON
CFG read/write 0000010
WD_CTRL CHECKSUM WD_STM_EN_0 WD_WIN WD_EN_WK_BUS reserved WD_TIMER_2 WD_TIMER_1 WD_TIMER_0 read/write 0000011
BUS_CTRL_1 LIN_FLASH LIN_LSM LIN_TXD_TO LIN1_1 LIN1_0 reserved CAN_1 CAN_0 read/write 0000100
BUS_CTRL_2 reserved reserved I_PEAK_TH reserved reserved reserved LIN2_1 LIN2_0 read/write 0000101
WK_CTRL_1 TIMER2_WK_EN TIMER1_WK_EN reserved reserved reserved WD_STM_EN_1 reserved reserved read/write 0000110
WK_CTRL_2 INT_GLOBAL reserved WK_MEAS reserved reserved WK3_EN WK2_EN WK1_EN read/write 0000111
WK_PUPD_CTRL reserved reserved WK3_PUPD_1 WK3_PUPD_0 WK2_PUPD_1 WK2_PUPD_0 WK1_PUPD_1 WK1_PUPD_0 read/write 0001000
WK_FLT_CTRL reserved reserved WK3_FLT_1 WK3_FLT_0 WK2_FLT_1 WK2_FLT_0 WK1_FLT_1 WK1_FLT_0 read/write 0001001
TIMER1_CTRL reserved TIMER1_ON_2 TIMER1_ON_1 TIMER1_ON_0 reserved TIMER1_PER_2 TIMER1_PER_1 TIMER1_PER_0 read/write 0001100
TIMER2_CTRL reserved TIMER2_ON_2 TIMER2_ON_1 TIMER2_ON_0 reserved TIMER2_PER_2 TIMER2_PER_1 TIMER2_PER_0 read/write 0001101
SW_SD_CTRL reserved HS_OV_SD_EN HS_UV_SD_EN HS_OV_UV_REC reserved reserved reserved reserved read/write 0010000
HS_CTRL_1 reserved HS2_2 HS2_1 HS2_0 reserved HS1_2 HS1_1 HS1_0 read/write 0010100
HS_CTRL_2 reserved HS4_2 HS4_1 HS4_0 reserved HS3_2 HS3_1 HS3_0 read/write 0010101
GPIO_CTRL FO_DC_1 FO_DC_0 GPIO2_2 GPIO2_1 GPIO2_0 GPIO1_2 GPIO1_1 GPIO1_0 read/write 0010111
PWM1_CTRL PWM1_DC_7 PWM1_DC_6 PWM1_DC_5 PWM1_DC_4 PWM1_DC_3 PWM1_DC_2 PWM1_DC_1 PWM1_DC_0 read/write 0011000
PWM2_CTRL PWM2_DC_7 PWM2_DC_6 PWM2_DC_5 PWM2_DC_4 PWM2_DC_3 PWM2_DC_2 PWM2_DC_1 PWM2_DC_0 read/write 0011001
PWM_FREQ_CTRL reserved reserved reserved reserved reserved PWM2_FREQ_0 reserved PWM1_FREQ_0 read/write 0011100
SYS_STAT_CTRL SYS_STAT_7 SYS_STAT_6 SYS_STAT_5 SYS_STAT_4 SYS_STAT_3 SYS_STAT_2 SYS_STAT_1 SYS_STAT_0 read/write 0011110
SUP_STAT_2 reserved VS_UV reserved VCC3_OC VCC3_UV VCC3_OT VCC1_OV VCC1_WARN read/clear 1000000
SUP_STAT_1 POR VSHS_UV VSHS_OV VCC2_OT VCC2_UV VCC1_SC VCC1_UV_FS VCC1_UV read/clear 1000001
THERM_STAT reserved reserved reserved reserved reserved TSD2 TSD1 TPW read/clear 1000010
DEV_STAT DEV_STAT_1 DEV_STAT_0 reserved reserved WD_FAIL_1 WD_FAIL_0 SPI_FAIL FAILURE read/clear 1000011
BUS_STAT_1 reserved LIN1_FAIL_1 LIN1_FAIL_0 reserved reserved CAN_FAIL_1 CAN_FAIL_0 VCAN_UV read/clear 1000100
BUS_STAT_2 reserved reserved reserved reserved reserved LIN2_FAIL_1 LIN2_FAIL_0 reserved read/clear 1000101
WK_STAT_1 LIN2_WU LIN1_WU CAN_WU TIMER_WU reserved WK3_WU WK2_WU WK1_WU read/clear 1000110
WK_STAT_2 reserved reserved GPIO2_WU GPIO1_WU reserved reserved reserved reserved read/clear 1000111
WK_LVL_STAT SBC_DEV_LVL CFGP GPIO2_LVL GPIO1_LVL reserved WK3_LVL WK2_LVL WK1_LVL read 1001000
HS_OC_OT_STAT reserved reserved reserved reserved HS4_OC_OT HS3_OC_OT HS2_OC_OT HS1_OC_OT read/clear 1010100
HS_OL_STAT reserved reserved HS4_OL HS3_OL HS2_OL HS1_OL read/clear 1010101
FAM_PROD_STAT FAM_3 FAM_2 FAM_1 FAM_0 PROD_3 PROD_2 PROD_1 PROD_0 read 1111110
F A M I LY A N D P R O D U C T R E G I S T E R S
S T A T U S R E G I S T E R S
Register Short Name
Access
Mode
Address
A6…A0
C O N T R O L R E G I S T E R S
Data Sheet 132 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.5 SPI Control Registers
READ/WRITE Operation (see also Chapter 16.3):
• The ‘POR / Soft Reset Value’ defines the register content after POR or SBC Reset.
• The ‘Restart Value’ defines the register content after SBC Restart, where ‘x’ means the bit is unchanged.
• One 16-bit SPI command consist of two bytes:
- the 7-bit address and one additional bit for the register access mode and
- following the data byte
The numbering of following bit definitions refers to the data byte and correspond to the bits D0...D7 and to
the SPI bits 8...15 (see also figure before).
• There are three different bit types:
- ‘r’ = READ: read only bits (or reserved bits)
- ‘rw’ = READ/WRITE: readable and writable bits
- ‘rwh’ = READ/WRITE/Hardware: readable/writable bits, which can also be modified by the SBC hardware
• Reserved bits are marked as “Reserved” and always read as “0”. The respective bits shall also be
programmed as “0”.
• Reading a register is done byte wise by setting the SPI bit 7 to “0” (= Read Only).
• Writing to a register is done byte wise by setting the SPI bit 7 to “1”.
• SPI control bits are in general not cleared or changed automatically. This must be done by the
microcontroller via SPI programming. Exceptions to this behavior are stated at the respective register
description and the respective bit type is marked with a ‘h’ meaning that the SBC is able to change the
register content.
The registers are addressed wordwise.
Data Sheet 133 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.5.1 General Control Registers
Notes
1. It is not possible to change from Stop to Sleep Mode via SPI Command. See also the State Machine Chapter
2. After entering SBC Restart Mode, the MODE bits will be automatically set to SBC Normal Mode. The VCC2_ON
bits will be automatically set to OFF after entering SBC Restart Mode and after OT.
3. The SPI output will always show the previously written state with a Write Command (what has been
programmed before)
M_S_CTRL
Mode- and Supply Control (Address 000 0001B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 00x0 00xxB
76543210
MODE_1 MODE_0 VCC3_ON VCC2_ON_1 VCC2_ON_0 VCC1_OV_RST VCC1_RT_1 VCC1_RT_0
r
rwh rwh rwh rwh rwh rwh rw rw
Field Bits Type Description
MODE 7:6 rwh SBC Mode Control
00B , SBC Normal Mode
01B , SBC Sleep Mode
10B , SBC Stop Mode
11B , SBC Reset: Soft Reset is executed (configuration of RO
triggering in bit SOFT_ RESET_RO)
VCC3_ON 5rwhVCC3 Mode Control
0B , VCC3 OFF
1B , VCC3 is enabled (as independent voltage regulator)
VCC2_ON 4:3 rwh VCC2 Mode Control
00B , VCC2 off
01B , VCC2 on in Normal Mode
10B , VCC2 on in Normal and Stop Mode
11B , VCC2 always on (except in SBC Fail-Safe Mode)
VCC1_OV_R
ST
2rwhVCC1 Overvoltage leading to Restart / Fail-Safe Mode enable
0B , VCC1_ OV is set in case of VCC1_OV; no SBC Restart or Fail-
Safe is entered for VCC1_OV
1B , VCC1_ OV is set in case of VCC1_OV; depending on the
device configuration SBC Restart or SBC Fail-Safe Mode is
entered (see Chapter 5.1.1);
VCC1_RT 1:0 rw VCC1 Reset Threshold Control
00B , Vrt1 selected (highest threshold)
01B , Vrt2 selected
10B , Vrt3 selected
11B , Vrt4 selected
Data Sheet 134 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. Clearing the FO_ON bit will not disable the FOx outputs for the case a failure occurred which triggered the FOx
outputs. In this case the FOx outputs have to be disabled by clearing the FAILURE bit.
HW_CTRL
Mode- and Supply Control (Address 000 0010B)
POR / Soft Reset Value: y000 y000B; Restart Value: xx0x x00xB
76543210
VCC3_V_CFG SOFT_RESET_
RO FO_ON VCC3_VS_UV
_OFF VCC3_LS Reserved VCC3_LS_ST
P_ON CFG
r
rw rw rwh rw rw r rw rw
Field Bits Type Description
VCC3_
V_CFG
7rwVCC3 Output Voltage Configuration (if conf igured as independent
voltage regulator)
0B , VCC3 has same output voltage as VCC1
1B , VCC3 is configured to either 3.3V or 1.8V (depending on VCC1
derivative)
SOFT_
RESET_RO
6rwSoft Reset Configuration
0B , RO will be triggered (pulled low) during a Soft Reset
1B , No RO triggering during a Soft Reset
FO_ON 5rwhFailure Output Activation (FO1..3)
0B , FOx not activated by software, FO can be activated by
defined failures (see Chapter 14)
1B , FOx activated by software (via SPI)
VCC3_VS_
UV_OFF
4rwVCC3 VS_UV shutdown configuration
0B , VCC3 will be disabled automatically at VS_UV
1B , VCC3 will stay enabled even below VS_UV
VCC3_LS 3rwVCC3 Configuration
0B , VCC3 operating as a stand-alone regulator
1B , VCC3 in load sharing operation with VCC1
Reserved 2r Reserved, always reads as 0
VCC3_LS_
STP_ON
1rwVCC3 Load Sharing in SBC Stop Mode configuration
0B , VCC3 in LS configuration during SBC Stop Mode and high-
power mode: disabled
1B , VCC3 in LS configuration during SBC Stop Mode and high-
power mode: enabled
CFG 0rwConfiguration Select (see also Table 5)
0B , Depending on hardware configuration, SBC Restart or Fail-
Safe Mode is reached after the 2. watchdog trigger failure
(=default) - Config 3/4
1B , Depending on hardware configuration, SBC Restart or Fail-
Safe Mode is reached after the 1. watchdog trigger failure -
Config 1/2
Data Sheet 135 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
If the FO_ON bit is set by the software then it will be cleared by the SBC after SBC Restart Mode was entered
and the FOx outputs will be disabled. See also Chapter 14 for FOx activation and deactivation.
2. After triggering a SBC Soft Reset the bits VCC3_V_CFG and VCC3_LS are not reset if they were set before, i.e. it
stays unchanged, which is stated by the ‘y’ in the POR / Soft Reset Value. POR value: 0000 0000 and Soft Reset
value: xx00 x00x
3. VCC3_LS_STP_ON: Is a combination of load sharing and VCC1 active peak in Stop mode
Data Sheet 136 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. See also Chapter 15.2.4 for more information on disabling the watchdog in SBC Stop Mode.
2. See Chapter 15.2.5 for more information on the effect of the bit WD_EN_WK_BUS.
3. See Chapter 15.2.3 for calculation of checksum.
WD_CTRL
Watchdog Control (Address 000 0011B)
POR / Soft Reset Value: 0001 0100B; Restart Value: x0xx 0100B
76543210
CHECKSUM WD_STM_
EN_0 WD_WIN WD_EN_
WK_BUS Reserved WD_TIMER_2 WD_TIMER_1 WD_TIMER_0
r
rw rwh rw rw r rwh rwh rwh
Field Bits Type Description
CHECKSUM 7rwWatchdog Setting Check Sum Bit
The sum of bits 7:0 needs to have even parity (see Chapter 15.2.3)
0B , Counts as 0 for checksum calculation
1B , Counts as 1 for checksum calculation
WD_STM_
EN_0
6rwhWatchdog Deactivation during Stop Mode, bit 0
(Chapter 15.2.4)
0B , Watchdog is active in Stop Mode
1B , Watchdog is deactivated in Stop Mode
WD_WIN 5rwWatchdog Type Selection
0B , Watchdog works as a Time-Out watchdog
1B , Watchdog works as a Window watchdog
WD_EN_
WK_BUS
4rwWatchdog Enable after Bus (CAN/LIN) Wake in SBC Stop Mode
0B , Watchdog will not start after a CAN/LINx wake
1B , Watchdog starts with a long open window after CAN/LINx
Wake
Reserved 3r Reserved, always reads as 0
WD_TIMER 2:0 rwh Watchdog Timer Period
000B , 10ms
001B , 20ms
010B , 50ms
011B , 100ms
100B , 200ms
101B , 500ms
110B , 1000ms
111B , reserved
Data Sheet 137 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. Changes in the bits LIN_FLASH, LIN_LSM, and LIN_TXD_ TO will be effective immediately once CSN goes to
‘1’ and applies for both LIN transceivers.’
2. The reset values for the LINx and CAN transceivers are marked with ‘y’ because they will vary depending on
the cause of change - see below.
3. see Figure 26 and Figure 33 for detailed state changes of LIN and CAN Transceiver for different SBC modes.
4. Failure Handling Mechanism: When the device enters Fail-Safe Mode due to a failure (TSD2, WD-Failure,...),
then the wake registers BUS_CTRL_1, BUS_CTRL_2 and WK_CTRL_2 are reset to following values (=wake
sources) ‘xxx0 1001’, ‘0000 0001’ and ‘x0x0 0111’ in order to ensure that the device can be woken again.
BUS_CTRL_1
Bus Control (Address 000 0100B)
POR / Soft Reset Value: 0010 0000B; Restart Value: xxxy y0yyB
76543210
LIN_FLASH LIN_LSM LIN_TXD_TO LIN1_1 LIN1_0 Reserved CAN_1 CAN_0
r
rw rw rw rwh rwh r rwh rwh
Field Bits Type Description
LIN_FLASH 7rwLINx Flash Programming Mode
0B , Slope control mechanism active
1B , Deactivation of slope control for baud rates up to 115kBaud
LIN_LSM 6rwLINx Low-Slope Mode Selection
0B , LIN Normal-Mode is activated
1B , LIN Low-Slope Mode (10.4kBaud) activated
LIN_TXD_
TO
5rwLINx TXD Time-Out Control
0B , TXD Time-Out feature disabled
1B , TXD Time-Out feature enabled
LIN1 4:3 rwh LIN1-Module Mode
00B , LIN1 OFF
01B , LIN1 is wake capable
10B , LIN1 Receive Only Mode
11B , LIN1 Normal Mode
Reserved 2r Reserved, always reads as 0
CAN 1:0 rwh HS-CAN Module Modes
00B , CAN OFF
01B , CAN is wake capable
10B , CAN Receive Only Mode
11B , CAN Normal Mode
Data Sheet 138 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. The bit I_PEAK_TH can be modified in SBC Init and Normal Mode. In SBC Stop Mode this bit is Read only but
SPI_FAIL will not be set when trying to modify the bit in SBC STOP Mode and no INT is triggered in case INT_
GLOBAL is set.
2. see Figure 26 and Figure 33 for detailed state changes of LIN and CAN Transceiver for different SBC modes
3. Failure Handling Mechanism: When the device enters Fail-Safe Mode due to a failure (TSD2, WD-Failure,...),
then the wake registers BUS_CTRL_1, BUS_CTRL_2 and WK_CTRL_2 are reset to following values (=wake
sources) ‘xxx0 1001’, ‘0000 0001’ and ‘x0x0 0111’ in order to ensure that the device can be woken again.
BUS_CTRL_2
Bus Control (Address 000 0101B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 00x0 00yyB
76543210
Reserved Reserved I_PEAK_TH Reserved Reserved Reserved LIN2_1 LIN2_0
r
r r rw r r r rwh rwh
Field Bits Type Description
Reserved 7:6 r Reserved, always reads as 0
I_PEAK_TH 5rwVCC1 Active Peak Threshold Selection
0B , low VCC1 active peak threshold selected (ICC1,peak_1)
1B , higher VCC1 active peak threshold selected (ICC1,peak_2)
Reserved 4:2 r Reserved, always reads as 0
LIN2 1:0 rwh LIN2-Module Modes
00B , LIN2 OFF
01B , LIN2 is wake capable
10B , LIN2 Receive Only Mode
11B , LIN2 Normal Mode
Data Sheet 139 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
WK_CTRL_1
Internal Wake Input Control (Address 000 0110B)
POR / Soft Reset Value: 0000 0000B; Restart Value: xx00 0000B
76543210
TIMER2_WK_
EN
TIMER1_WK_
EN Reserved Reserved Reserved WD_STM_
EN_1 Reserved Reserved
r
rw rw r r r rwh r r
Field Bits Type Description
TIMER2_WK
_EN
7rwTimer2 Wake Source Control (for cyclic wake)
0B , Timer2 wake disabled
1B , Timer2 is enabled as a wake source
TIMER1_WK
_EN
6rwTimer1 Wake Source Control (for cyclic wake)
0B , Timer1 wake disabled
1B , Timer1 is enabled as a wake source
Reserved 5:3 r Reserved, always reads as 0
WD_STM_
EN_1
2rwhWatchdog Deactivation during Stop Mode, bit 1
(Chapter 15.2.4)
0B , Watchdog is active in Stop Mode
1B , Watchdog is deactivated in Stop Mode
Reserved 1:0 r Reserved, always reads as 0
Data Sheet 140 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. WK_MEAS is by default configured for standard WK functionality (WK1 and WK2). The bits WK1_EN and
WK2_EN are ignored in case WK_MEAS is activated. If the bit is set to ‘1’ then the measurement function is
enabled during Normal Mode & the bits WK1_EN and WK2_EN are ignored. The bits WK1/”_LVL bits need to be
ignored as well.
2. The wake sources LINx and CAN are selected in the register BUS_CTRL_1 and BUS_CTRL_2 by setting the
respective bits to ‘wake capable’
3. Failure Handling Mechanism: When the device enters Fail-Safe Mode due to a failure (TSD2, WD-Failure,...),
then the wake registers BUS_CTRL_1, BUS_CTRL_2 and WK_CTRL_2 are reset to following values (=wake
sources) ‘xxx0 1001’, ‘0000 0001’ and ‘x0x0 0111’ in order to ensure that the device can be woken again.
WK_CTRL_2
External Wake Source Control (Address 000 0111B)
POR / Soft Reset Value: 0000 0111B; Restart Value: x0x0 0xxxB
76543210
INT_GLOBAL Reserved WK_MEAS Reserved Reserved WK3_EN WK2_EN WK1_EN
w r
rwrrwr rrwrwrw
Field Bits Type Description
INT_
GLOBAL
7rwGlobal Interrupt Configuration (see also Chapter 13.1)
0B , Only wake sources trigger INT (default)
1B , All status information register bits will trigger INT (including
all wake sources)
Reserved 6r Reserved, always reads as 0
WK_MEAS 5rwWK / Measurement selection (see also Chapter 12.2.2)
0B , WK functionality enabled for WK1 and WK2
1B , Measurement functionality enabled; WK1 & WK2 are
disabled as wake sources, i.e. bits WK1/2_EN bits are ignored
Reserved 4:3 r Reserved, always reads as 0
WK3_EN 2rwWK3 Wake Source Control
0B , WK3 wake disabled
1B , WK3 is enabled as a wake source
WK2_EN 1rwWK2 Wake Source Control
0B , WK2 wake disabled
1B , WK2 is enabled as a wake source
WK1_EN 0rwWK1 Wake Source Control
0B , WK1 wake disabled
1B , WK1 is enabled as a wake source
Data Sheet 141 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
WK_PUPD_CTRL
Wake Input Level Control (Address 000 1000B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 00xx xxxxB
76543210
Reserved Reserved WK3_PUPD_1 WK3_PUPD_0 WK2_PUPD_1 WK2_PUPD_0 WK1_PUPD_1 WK1_PUPD_0
r
r r rw rw rw rw rw rw
Field Bits Type Description
Reserved 7:6 r Reserved, always reads as 0
WK3_PUPD 5:4 rw WK3 Pull-Up / Pull-Down Configuration
00B , No pull-up / pull-down selected
01B , Pull-down resistor selected
10B , Pull-up resistor selected
11B , Automatic switching to pull-up or pull-down
WK2_PUPD 3:2 rw WK2 Pull-Up / Pull-Down Configuration
00B , No pull-up / pull-down selected
01B , Pull-down resistor selected
10B , Pull-up resistor selected
11B , Automatic switching to pull-up or pull-down
WK1_PUPD 1:0 rw WK1 Pull-Up / Pull-Down Configuration
00B , No pull-up / pull-down selected
01B , Pull-down resistor selected
10B , Pull-up resistor selected
11B , Automatic switching to pull-up or pull-down
Data Sheet 142 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: When selecting a filter time configuration, the user must make sure to also assign the respective
timer to at least one HS switch during cyclic sense operation
WK_FLT_CTRL
Wake Input Filter Time Control (Address 000 1001B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 00xx xxxxB
76543210
Reserved Reserved WK3_FLT_1 WK3_FLT_0 WK2_FLT_1 WK2_FLT_0 WK1_FLT_1 WK1_FLT_0
r
r r rw rw rw rw rw rw
Field Bits Type Description
Reserved 7:6 r Reserved, always reads as 0
WK3_FLT 5:4 rw WK3 Filter Time Configuration
00B , Configuration A: Filter with 16µs filter time (static sensing)
01B , Configuration B: Filter with 64µs filter time (static sensing)
10B , Configuration C: Filtering at the end of the on-time;
a filter time of 16µs (cyclic sensing) is selected, Timer1
11B , Configuration D: Filtering at the end of the on-time;
a filter time of 16µs (cyclic sensing) is selected, Timer2
WK2_FLT 3:2 rw WK2 Filter Time Configuration
00B , Configuration A: Filter with 16µs filter time (static sensing)
01B , Configuration B: Filter with 64µs filter time (static sensing)
10B , Configuration C: Filtering at the end of the on-time;
a filter time of 16µs (cyclic sensing) is selected, Timer1
11B , Configuration D: Filtering at the end of the on-time;
a filter time of 16µs (cyclic sensing) is selected, Timer2
WK1_FLT 1:0 rw WK1 Filter Time Configuration
00B , Configuration A: Filter with 16µs filter time (static sensing)
01B , Configuration B: Filter with 64µs filter time (static sensing)
10B , Configuration C: Filtering at the end of the on-time;
a filter time of 16µs (cyclic sensing) is selected, Timer1
11B , Configuration D: Filtering at the end of the on-time;
a filter time of 16µs (cyclic sensing) is selected, Timer2
Data Sheet 143 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. A timer must be first assigned and is then automatically activated as soon as the on-time is configured.
2. If cyclic sense is selected and the HS switches are cleared during SBC Restart Mode, then also the timer
settings (period and on-time) are cleared to avoid incorrect switch detection.
3. In case the timer are set as wake sources and cyclic sense is running, then both cyclic sense and cyclic wake
will be active at the same time.
TIMER1_CTRL
Timer1 Control and Selection (Address 000 1100B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0000B
76543210
Reserved TIMER1_
ON_2
TIMER1_
ON_1
TIMER1_
ON_0 Reserved TIMER1_
PER_2
TIMER1_
PER_1
TIMER1_
PER_0
r
r rwh rwh rwh r rwh rwh rwh
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
TIMER1_
ON
6:4 rwh Timer1 On-Time Configuration
000B , OFF / Low (timer not running, HSx output is low)
001B , 0.1ms on-time
010B , 0.3ms on-time
011B , 1.0ms on-time
100B , 10ms on-time
101B , 20ms on-time
110B , OFF / HIGH (timer not running, HSx output is high)
111B , reserved
Reserved 3r Reserved, always reads as 0
TIMER1_
PER
2:0 rwh Timer1 Period Configuration
000B , 10ms
001B , 20ms
010B , 50ms
011B , 100ms
100B , 200ms
101B , 1s
110B , 2s
111B , reserved
Data Sheet 144 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. A timer must be first assigned and is then automatically activated as soon as the on-time is configured.
2. If cyclic sense is selected and the HS switches are cleared during SBC Restart Mode, then also the timer
settings (period and on-time) are cleared to avoid incorrect switch detection.
TIMER2_CTRL
Timer2 Control and selection (Address 000 1101B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0000B
76543210
Reserved TIMER2_
ON_2
TIMER2_
ON_1
TIMER2_
ON_0 Reserved TIMER2_
PER_2
TIMER2_
PER_1
TIMER2_
PER_0
r
r rwh rwh rwh r rwh rwh rwh
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
TIMER2_
ON
6:4 rwh Timer2 On-Time Configuration
000B , OFF / Low (timer not running, HSx output is low)
001B , 0.1ms on-time
010B , 0.3ms on-time
011B , 1.0ms on-time
100B , 10ms on-time
101B , 20ms on-time
110B , OFF / HIGH (timer not running, HSx output is high)
111B , reserved
Reserved 3r Reserved, always reads as 0
TIMER2_
PER
2:0 rwh Timer2 Period Configuration
000B , 10ms
001B , 20ms
010B , 50ms
011B , 100ms
100B , 200ms
101B , 1s
110B , 2s
111B , reserved
Data Sheet 145 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
SW_SD_CTRL
Switch Shutdown Control (Address 001 0000B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0xxx 0000B
76543210
Reserved HS_OV_SD_E
N
HS_UV_SD_E
N
HS_OV_UV_R
EC Reserved Reserved Reserved Reserved
r
rrwrwrwr r r r
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
HS_OV_SD_
EN
6rwShutdown Disabling of HS1...4 in case of VSHS OV
0B , shutdown enabled in case of VSHS OV
1B , shutdown disabled in case of VSHS OV
HS_UV_SD_
EN
5rwShutdown Disabling of HS1...4 in case of VSHS UV
0B , shutdown enabled in case of VSHS UV
1B , shutdown disabled in case of VSHS UV
HS_OV_UV_
REC
4rwSwitch Recovery after Removal of VSHS OV/UV for HS1...4
0B , Switch recovery is disabled
1B , Previous state before VSHS OV/UV is enabled after OV/UV
condition is removed
Reserved 3:0 r Reserved, always reads as 0
Data Sheet 146 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: The bits for the switches are also reset in case of overcurrent and overtemperature.
HS_CTRL1
High-Side Switch Control 1 (Address 001 0100B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0000B
76543210
Reserved HS2_2 HS2_1 HS2_0 Reserved HS1_2 HS1_1 HS1_0
r
rw rwh rwh rwh r rwh rwh rwh
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
HS2 6:4 rwh HS2 Configuration
000B , Off
001B , On
010B , Controlled by Timer1
011B , Controlled by Timer2
100B , Controlled by PWM1
101B , Controlled by PWM2
110B , Reserved
111B , Reserved
Reserved 3r Reserved, always reads as 0
HS1 2:0 rwh HS1 Configuration
000B , Off
001B , On
010B , Controlled by Timer1
011B , Controlled by Timer2
100B , Controlled by PWM1
101B , Controlled by PWM2
110B , Reserved
111B , Reserved
Data Sheet 147 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: The bits for the switches are also reset in case of overcurrent and overtemperature.
HS_CTRL2
High-Side Switch Control 2 (Address 001 0101B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0000B
76543210
Reserved HS4_2 HS4_1 HS4_0 Reserved HS3_2 HS3_1 HS3_0
r
r rwh rwh rwh r rwh rwh rwh
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
HS4 6:4 rwh HS4 Configuration
000B , Off
001B , On
010B , Controlled by Timer1
011B , Controlled by Timer2
100B , Controlled by PWM1
101B , Controlled by PWM2
110B , Reserved
111B , Reserved
Reserved 3r Reserved, always reads as 0
HS3 2:0 rwh HS3 Configuration
000B , Off
001B , On
010B , Controlled by Timer1
011B , Controlled by Timer2
100B , Controlled by PWM1
101B , Controlled by PWM2
110B , Reserved
111B , Reserved
Data Sheet 148 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: When selecting a filter time configuration, the user must make sure to also assign the respective
timer to at least one HS switch during cyclic sense operation
GPIO_CTRL
GPIO Configuration Control (Address 001 0111B)
POR / Soft Reset Value: 0000 0000B; Restart Value: xxxx xxxxB
76543210
FO_DC_1 FO_DC_0 GPIO2_2 GPIO2_1 GPIO2_0 GPIO1_2 GPIO1_1 GPIO1_0
r
rw rw rw rw rw rw rw rw
Field Bits Type Description
FO_DC 7:6 rw Duty Cycle Configuration of FO3 (if selected)
00B , 20%
01B , 10%
10B , 5%
11B , 2.5%
GPIO2 5:3 rw GPIO2 Configuration
000B , FO3 selected
001B , FO3 selected
010B , FO3 selected
011B , FO3 selected
100B , OFF
101B , Wake input enabled (16µs static filter)
110B , Low-Side Switch ON
111B , High-Side Switch ON
GPIO1 2:0 rw GPIO1 Configuration
000B , FO2 selected
001B , FO2 selected
010B , FO2 selected
011B , FO2 selected
100B , OFF
101B , Wake input enabled (16µs static filter)
110B , Low-Side Switch ON
111B , High-Side Switch ON
Data Sheet 149 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: The min. On-time during PWM is limited by the actual Ton and Toff time of the respective HS switch,
e.g. the PWM setting ‘000 0001’ could not be realized.
Note: The min. On-time during PWM is limited by the actual Ton and Toff time of the respective HS switch,
e.g. the PWM setting ‘000 0001’ could not be realized.
PWM1_CTRL
PWM1 Configuration Control (Address 001 1000B)
POR / Soft Reset Value: 0000 0000B; Restart Value: xxxx xxxxB
76543210
PWM1_DC_7 PWM1_DC_6 PWM1_DC_5 PWM1_DC_4 PWM1_DC_3 PWM1_DC_2 PWM1_DC_1 PWM1_DC_0
r
rw rw rw rw rw rw rw rw
Field Bits Type Description
PWM1_DC 7:0 rw PWM1 Duty Cycle (bit0=LSB; bit7=MSB)
0000 0000B, 100% OFF
xxxx xxxx B, ON with DC fraction of 255
1111 1111B, 100% ON
PWM2_CTRL
PWM2 Configuration Control (Address 001 1001B)
POR / Soft Reset Value: 0000 0000B; Restart Value: xxxx xxxxB
76543210
PWM2_DC_7 PWM2_DC_6 PWM2_DC_5 PWM2_DC_4 PWM2_DC_3 PWM2_DC_2 PWM2_DC_1 PWM2_DC_0
r
rw rw rw rw rw rw rw rw
Field Bits Type Description
PWM2_DC 7:0 rw PWM2 Duty Cycle (bit0=LSB; bit7=MSB)
0000 0000B, 100% OFF
xxxx xxxxB, ON with DC fraction of 255
1111 1111B, 100% ON
Data Sheet 150 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: The min. On-time during PWM is limited by the actual Ton and Toff time of the respective HS switch,
e.g. the PWM setting ‘000 0001’ could not be realized.
Notes
1. The SYS_STATUS_CTRL register is an exception for the default values, i.e. it will keep its configured value also
after a Soft Reset.
2. This byte is intended for storing system configurations of the ECU by the microcontroller and is only accessible
in SBC Normal Mode. The byte is not accessible by the SBC and is also not cleared after Fail-Safe or SBC
Restart Mode. It allows the microcontroller to quickly store system configuration without loosing the data.
PWM_FREQ_CTRL
PWM Frequency Configuration Control (Address 001 1100B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0x0xB
76543210
Reserved Reserved Reserved Reserved Reserved PWM2_FREQ Reserved PWM1_FREQ
r
rrrrrrwrrw
Field Bits Type Description
Reserved 7:3 r Reserved, always reads as 0
PWM2_
FREQ
2rwPWM2 Frequency Selection
0B , 200Hz configuration
1B , 400Hz configuration
Reserved 1r Reserved, always reads as 0
PWM1_
FREQ
0rwPWM1 Frequency Selection
0B , 200Hz configuration
1B , 400Hz configuration
SYS_STATUS_CTRL
System Status Control (Address 001 1110B)
POR Value: 0000 0000B; Restart Value/Soft Reset Value: xxxx xxxxB
76543210
SYS_STAT_7 SYS_STAT_6 SYS_STAT_5 SYS_STAT_4 SYS_STAT_3 SYS_STAT_2 SYS_STAT_1 SYS_STAT_0
r
rw rw rw rw rw rw rw rw
Field Bits Type Description
SYS_STAT 7:0 rw System Status Control Byte (bit0=LSB; bit7=MSB)
Dedicated byte for system configuration, access only by
microcontroller. Cleared after power up and Soft Reset
Data Sheet 151 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.6 SPI Status Information Registers
READ/CLEAR Operation (see also Chapter 16.3):
• One 16-bit SPI command consist of two bytes:
- the 7-bit address and one additional bit for the register access mode and
- following the data byte
The numbering of following bit definitions refers to the data byte and correspond to the bits D0...D7 and to
the SPI bits 8...15 (see also figure).
• There are two different bit types:
- ‘r’ = READ: read only bits (or reserved bits)
- ‘rc’ = READ/CLEAR: readable and clearable bits
• Reading a register is done byte wise by setting the SPI bit 7 to “0” (= Read Only)
• Clearing a register is done byte wise by setting the SPI bit 7 to “1”
• SPI status registers are in general not cleared or changed automatically (an exception are the WD_FAIL
bits). This must be done by the microcontroller via SPI command
The registers are addressed wordwise.
Data Sheet 152 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.6.1 General Status Registers
Notes
1. The VCC1 undervoltage prewarning threshold VPW,f / VPW,r is a fixed threshold and independent of the VCC1
undervoltage reset thresholds.
SUP_STAT_2
Supply Voltage Fail Status (Address 100 0000B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0x0x xxxxB
76543210
Reserved VS_UV Reserved VCC3_OC VCC3_UV VCC3_OT VCC1_OV VCC1_WARN
r
r rc r rc rc rc rc rc
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
VS_UV 6rcVS Undervoltage Detection (VS,UV)
0B , No VS undervoltage detected
1B , VS undervoltage detected
Reserved 5r Reserved, always reads as 0
VCC3_OC 4rcVCC3 Overcurrent Detection
0B , No OC
1B , OC detected
VCC3_UV 3rcVCC3 Undervoltage Detection
0B , No VCC3 UV detection
1B , VCC3 UV Fail detected
VCC3_OT 2rcVCC3 Overtemperature Detection
0B , No overtemperature
1B , VCC3 overtemperature detected
VCC1_
OV
1rcVCC1 Overvoltage Detection (VCC1,OV,r)
0B , No VCC1 overvoltage warning
1B , VCC1 overvoltage detected
VCC1_
WARN
0rcVCC1 Undervoltage Prewarning (VPW,f)
0B , No VCC1 undervoltage prewarning
1B , VCC1 undervoltage prewarning detected
Data Sheet 153 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. The MSB of the POR/Soft Reset value is marked as ‘y’: the default value of the POR bit is set after Power-on
reset (POR value = 1000 0000). However it will be cleared after a SBC Soft Reset command (Soft Reset value =
0000 0000).
2. During Sleep Mode, the bits VCC1_SC,VCC1_OV and VCC1_UV will not be set when VCC1 is off
3. The VCC1_UV bit is never updated in SBC Restart Mode, in SBC Init Mode it is only updated after RO was
released for the first time, it is always updated in SBC Normal and Stop Mode, and it is always updated in any
SBC modes in a VCC1_SC condition (after VCC1_UV = 1 for >4ms).
SUP_STAT_1
Supply Voltage Fail Status (Address 100 0001B)
POR / Soft Reset Value: y000 0000B; Restart Value: xxxx xx0xB
76543210
POR VSHS_UV VSHS_OV VCC2_OT VCC2_UV VCC1_SC VCC1_UV_FS VCC1_UV
r
rc rc rc rc rc rc rc rc
Field Bits Type Description
POR 7rcPower-On Reset Detection
0B , No POR
1B , POR occurred
VSHS_UV 6rcVSHS Undervoltage Detection (VSHS,UVD)
0B , No VSHS-UV
1B , VSHS-UV detected
VSHS_OV 5rcVSHS Overvoltage Detection (VSHS,OVD)
0B , No VSHS-OV
1B , VSHS-OV detected
VCC2_OT 4rcVCC2 Overtemperature Detection
0B , No overtemperature
1B , VCC2 overtemperature detected
VCC2_UV 3rcVCC2 Undervoltage Detection (VCC2,UV,f)
0B , No VCC2 undervoltage
1B , VCC2 undervoltage detected
VCC1_SC 2rcVCC1 Short to GND Detection (<Vrtx for t>4ms after switch on)
0B , No short
1B , VCC1 short to GND detected
VCC1_UV
_FS
1rcVCC1 UV-Detection (due to Vrtx reset)
0B , No Fail-Safe Mode entry due to 4th consecutive VCC1_UV
1B , Fail-Safe Mode entry due to 4th consecutive VCC1_UV
VCC1_UV 0rcVCC1 UV-Detection (due to Vrtx reset)
0B , No VCC1_UV detection
1B , VCC1 UV-Fail detected
Data Sheet 154 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: TSD1 and TSD2 are not reset automatically, even if the temperature pre warning or TSD1 OT
condition is not present anymore. Also TSD2 is not reset.
THERM_STAT
Thermal Protection Status (Address 100 0010B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0xxxB
76543210
Reserved Reserved Reserved Reserved Reserved TSD2 TSD1 TPW
r
rrrrrrcrcrc
Field Bits Type Description
Reserved 7:3 r Reserved, always reads as 0
TSD2 2rcTSD2 Thermal Shut-Down Detection
0B , No TSD2 event
1B , TSD2 OT detected - leading to SBC Fail-Safe Mode
TSD1 1rcTSD1 Thermal Shut-Down Detection
0B , No TSD1 fail
1B , TSD1 OT detected
TPW 0rcThermal Pre Warning
0B , No Thermal Pre warning
1B , Thermal Pre warning detected
Data Sheet 155 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. The bits DEV_STAT show the status of the device before it went through Restart. Either the device came from
regular Sleep Mode (‘10’) or a failure (‘01’ - SBC Restart or SBC Fail-Safe Mode: WD fail, TSD2 fail, VCC_UV fail
or VCC1_OV if bit VCC1_OV_RST is set) occurred. Failure is also an illegal command from SBC Stop to SBC
Sleep Mode or going to SBC Sleep Mode without activation of any wake source. Coming from SBC Sleep Mode
(‘10’) will also be shown if there was a trial to enter SBC Sleep Mode without having cleared all wake flags
before.
2. The WD_FAIL bits are configured as a counter and are the only status bits, which are cleared automatically
by the SBC. They are cleared after a successful watchdog trigger and when the watchdog is stopped (also in
SBC Sleep and Fail-Safe Mode unless it was reached due to a watchdog failure). See also Chapter 14.1.
3. The SPI_FAIL bit is cleared only by SPI command
4. In case of Config 2/4 the WD_Fail counter is frozen in case of WD trigger failure until a successful WD trigger.
5. If CFG = ‘0’ then a 1st watchdog failure will not trigger the FO outputs or the FAILURE bit but only force the SBC
into SBC Restart Mode.
DEV_STAT
Device Information Status (Address 100 0011B)
POR / Soft Reset Value: 0000 0000B; Restart Value: xx00 xxxxB
76543210
DEV_STAT_1 DEV_STAT_0 Reserved Reserved WD_FAIL_1 WD_FAIL_0 SPI_FAIL FAILURE
r
rc rc r r rh rh rc rc
Field Bits Type Description
DEV_STAT 7:6 rc Device Status before Restart Mode
00B , Cleared (Register must be actively cleared)
01B , Restart due to failure (WD fail, TSD2, VCC1_UV); also after a
wake from Fail-Safe Mode
10B , Sleep Mode
11B , Reserved
Reserved 5:4 r Reserved, always reads as 0
WD_FAIL 3:2 rh Number of WD-Failure Events (1/2 WD failures depending on
CFG)
00B , No WD Fail
01B , 1x WD Fail, FOx activation - Config 2 selected
10B , 2x WD Fail, FOx activation - Config 1 / 3 / 4 selected
11B , Reserved (never reached)
SPI_FAIL 1rcSPI Fail Information
0B , No SPI fail
1B , Invalid SPI command detected
FAILURE 0rcActivation of Fail Output FO
0B , No Failure
1B , Failure occurred
Data Sheet 156 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Notes
1. The VCAN_UV comparator is enabled if the mode bit CAN_1 = ‘1’, i.e. in CAN Normal or CAN Receive Only Mode.
BUS_STAT_1
Bus Communication Status (Address 100 0100B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0xx0 0xxxB
76543210
Reserved LIN1_FAIL_1 LIN1_FAIL_0 Reserved Reserved CAN_FAIL_1 CAN_FAIL_0 VCAN_UV
r
rrcrcr rrcrcrc
Field Bits Type Description
Reserved 7r Reserved, always reads as 0
LIN1_FAIL 6:5 rc LIN1 Failure Status
00B , No error
01B , LIN1 TSD
10B , LIN1_TXD_DOM: TXD dominant time out for more than 20ms
11B , LIN1_BUS_DOM: BUS dominant time out for more than
20ms
Reserved 4:3 r Reserved, always reads as 0
CAN_FAIL 2:1 rc CAN Failure Status
00B , No error
01B , CAN TSD
10B , CAN_TXD_DOM: TXD dominant time out for longer than
tTxD_CAN_TO
11B , CAN_BUS_DOM: BUS dominant time out for longer than
tBUS_CAN_TO
VCAN_UV 0rcUndervoltage CAN Bus Supply
0B , Normal operation
1B , CAN Supply undervoltage detected. Transmitter disabled
Data Sheet 157 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: CAN and LINx Recovery Conditions:
1.) TXD Time Out: TXD goes High or transmitter is set to wake capable or switched off;
2.). Bus dominant time out: Bus will become recessive or transceiver is set to wake capable or
switched off.
3.) Supply undervoltage: as soon as the threshold is crossed again, i.e. VSHS > VS_UV for LINx and
VCAN > VCAN_UV for CAN
4.) In all cases (also for TSD shutdown): to enable the Bus transmission again, TXD needs to be HIGH
for a certain time (transmitter enable time).
BUS_STAT_2
Bus Communication Status (Address 100 0101B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 0xx0B
76543210
Reserved Reserved Reserved Reserved Reserved LIN2_FAIL_1 LIN2_FAIL_0 Reserved
r
rrrrrrcrcr
Field Bits Type Description
Reserved 7:3 r Reserved, always reads as 0
LIN2_FAIL 2:1 rc LIN2 Failure Status
00B , No error
01B , LIN2 TSD shutdown
10B , LIN2_TXD_DOM: TXD dominant time out for more than 20ms
11B , LIN2_BUS_DOM: BUS dominant time out for more than
20ms
Reserved 0r Reserved, always reads as 0
Data Sheet 158 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: The respective wake source bit will also be set when the device is woken from SBC Fail-Safe Mode
WK_STAT_1
Wake-up Source and Information Status (Address 100 0110B)
POR / Soft Reset Value: 0000 0000B; Restart Value: xxxx 0xxxB
76543210
LIN2_WU LIN1_WU CAN_WU TIMER_WU Reserved WK3_WU WK2_WU WK1_WU
r
rc rc rc rc r rc rc rc
Field Bits Type Description
LIN2_WU 7rcWake up via LIN2 Bus
0B , No Wake up
1B , Wake up
LIN1_WU 6rcWake up via LIN1 Bus
0B , No Wake up
1B , Wake up
CAN_WU 5rcWake up via CAN Bus
0B , No Wake up
1B , Wake up
TIMER_WU 4rcWake up via TimerX
0B , No Wake up
1B , Wake up
Reserved 3r Reserved, always reads as 0
WK3_WU 2rcWake up via WK3
0B , No Wake up
1B , Wake up
WK2_WU 1rcWake up via WK2
0B , No Wake up
1B , Wake up
WK1_WU 0rcWake up via WK1
0B , No Wake up
1B , Wake up
Data Sheet 159 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
WK_STAT_2
Wake-up Source and Information Status (Address 100 0111B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 00xx 0000B
76543210
Reserved Reserved GPIO2_WU GPIO1_WU Reserved Reserved Reserved Reserved
r
rrrcrcrrrr
Field Bits Type Description
Reserved 7:6 r Reserved, always reads as 0
GPIO2_WU 5rcWake up via GPIO2
0B , No Wake up
1B , Wake up
GPIO1_WU 4rcWake up via GPIO1
0B , No Wake up
1B , Wake up
Reserved 3:0 r Reserved, always reads as 0
Data Sheet 160 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: GPIOx_LVL is updated in SBC Normal and Stop Mode if configured as wake input, low-side switch or
high-side switch.
In cyclic sense or wake mode, the registers contain the sampled level, i.e. the registers are updated
after every sampling. The GPIOs are not capable of cyclic sensing.
If selected as GPIO then the respective level is shown even if configured as low-side or high-side.
WK_LVL_STAT
WK Input Level (Address 100 1000B)
POR / Soft Reset Value: xx00 0xxxB; Restart Value: xxxx 0xxxB
76543210
SBC_DEV
_LVL CFGP GPIO2_LVL GPIO1_LVL Reserved WK3_LVL WK2_LVL WK1_LVL
r
rrrrrrrr
Field Bits Type Description
SBC_DEV
_LVL
7r Status of SBC Operating Mode at FO3/TEST Pin
0B , User Mode activated
1B , SBC Development Mode activated
CFGP 6r Device Configuration Status
0B , No external pull-up resistor connected on INT (Config 2/4)
1B , External pull-up resistor connected on INT (Config 1/3)
GPIO2_LVL 5r Status of GPIO2 (if selected as GPIO)
0B , Low Level (=0)
1B , High Level (=1)
GPIO1_LVL 4r Status of GPIO1 (if selected as GPIO)
0B , Low Level (=0)
1B , High Level (=1)
Reserved 3r Reserved, always reads as 0
WK3_LVL 2r Status of WK3
0B , Low Level (=0)
1B , High Level (=1)
WK2_LVL 1r Status of WK2
0B , Low Level (=0)
1B , High Level (=1)
WK1_LVL 0r Status of WK1
0B , Low Level (=0)
1B , High Level (=1)
Data Sheet 161 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Note: The OC/OT bit might be set for VPOR,f < VS < 5.5V (see also Chapter 4.2)
HS_OC_OT_STAT
High-Side Switch Overload Status (Address 101 0100B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 xxxxB
76543210
Reserved Reserved Reserved Reserved HS4_OC_OT HS3_OC_OT HS2_OC_OT HS1_OC_OT
r
rrrrrcrcrcrc
Field Bits Type Description
Reserved 7:4 r Reserved, always reads as 0
HS4_OC_OT 3rcOvercurrent & Overtemperature Detection HS4
0B , No OC or OT
1B , OC or OT detected
HS3_OC_OT 2rcOvercurrent & Overtemperature Detection HS3
0B , No OC or OT
1B , OC or OT detected
HS2_OC_OT 1rcOvercurrent & Overtemperature Detection HS2
0B , No OC or OT
1B , OC or OT detected
HS1_OC_OT 0rcOvercurrent & Overtemperature Detection HS1
0B , No OC or OT
1B , OC or OT detected
Data Sheet 162 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
HS_OL_STAT
High-Side Switch Open-Load Status (Address 101 0101B)
POR / Soft Reset Value: 0000 0000B; Restart Value: 0000 xxxxB
76543210
Reserved Reserved Reserved Reserved HS4_OL HS3_OL HS2_OL HS1_OL
r
rrrrrcrcrcrc
Field Bits Type Description
Reserved 7:4 r Reserved, always reads as 0
HS4_OL 3rcOpen-Load Detection HS4
0B , No OL
1B , OL detected
HS3_OL 2rcOpen-Load Detection HS3
0B , No OL
1B , OL detected
HS2_OL 1rcOpen-Load Detection HS2
0B , No OL
1B , OL detected
HS1_OL 0rcOpen-Load Detection HS1
0B , No OL
1B , OL detected
Data Sheet 163 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.6.2 Family and Product Information Register
Notes
1. The actual default register value after POR, Soft Reset or Restart of PROD will depend on the respective
product. Therefore the value ‘y’ is specified.
2. SWK = Selective Wake feature in CAN Partial Networking standard
FAM_PROD_STAT
Family and Product Identification Register (Address 111 1110B)
POR / Soft Reset Value: 0011 yyyy B; Restart Value: 0011 yyyyB
76543210
FAM_3 FAM_2 FAM_1 FAM_0 PROD_3 PROD_2 PROD_1 PROD_0
r
rrrrrrrr
Field Bits Type Description
FAM 7:4 r SBC Family Identifier (bit4=LSB; bit7=MSB)
0 001B, Driver SBC Family
0 010B, DC/DC-SBC Family
0 011B, Mid-Range SBC Family
0 100B, Multi-CAN SBC Family
0 101B, Lite-CAN SBC Family
0 111B, Mid-Range+ SBC Family
x x x xB, reserved for future products
PROD 3:0 r SBC Product Identifier (bit0=LSB; bit3=MSB)
0 0 0 1B, reserved
0 1 0 1B, TLE9261QXV33 (VCC1 = 3.3V, no LIN, VCC3, no SWK)
1 0 0 1B, TLE9262QXV33 (VCC1 = 3.3V, 1 LIN, VCC3, no SWK)
1 1 0 1B, TLE9263QXV33 (VCC1 = 3.3V, 2 LIN, VCC3, no SWK)
Data Sheet 164 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
16.7 Electrical Characteristics
Table 30 Electrical Characteristics
VS = 5.5 V to 28 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
SPI frequency
Maximum SPI frequency fSPI,max ––4.0MHz
1) P_16.7.1
SPI Interface; Logic Inputs SDI, CLK and CSN
H-input Voltage Threshold VIH – – 0.7*
VCC1
V – P_16.7.2
L-input Voltage Threshold VIL 0.3*
VCC1
– – V – P_16.7.3
Hysteresis of input Voltage VIHY 0.08 ×
VCC1
0.12 ×
VCC1
0.5 ×
VCC1
V1) P_16.7.4
Pull-up Resistance at pin CSN RICSN 20 40 80 kΩVCSN = 0.7 x VCC1 P_16.7.5
Pull-down Resistance at pin
SDI and CLK
RICLK/SDI 20 40 80 kΩVSDI/CLK =
0.2 x VCC1
P_16.7.6
Input Capacitance at pin
CSN, SDI or CLK
CI–10–pF
1) P_16.7.7
Logic Output SDO
H-output Voltage Level VSDOH VCC1 -
0.4
VCC1 -
0.2
–VIDOH = -1.6 mA P_16.7.8
L-output Voltage Level VSDOL –0.20.4VIDOL = 1.6 mA P_16.7.9
Tristate Leakage Current ISDOLK -10 – 10 µA VCSN = VCC1;
0 V < VDO < VCC1
P_16.7.10
Tristate Input Capacitance CSDO –1015pF
1) P_16.7.11
Data Input Timing1)
Clock Period tpCLK 250 – – ns – P_16.7.12
Clock High Time tCLKH 125 – – ns – P_16.7.13
Clock Low Time tCLKL 125 – – ns – P_16.7.14
Clock Low before CSN Low tbef 125 – – ns – P_16.7.15
CSN Setup Time tlead 250 – – ns – P_16.7.16
CLK Setup Time tlag 250 – – ns – P_16.7.17
Clock Low after CSN High tbeh 125 – – ns – P_16.7.18
SDI Set-up Time tDISU 100 – – ns – P_16.7.19
SDI Hold Time tDIHO 50 – – ns – P_16.7.20
Input Signal Rise Time at pin
SDI, CLK and CSN
trIN – – 50 ns – P_16.7.21
Data Sheet 165 Rev. 1.00
2017-07-31
TLE9263BQXV33
Serial Peripheral Interface
Figure 58 SPI Timing Diagram
Note: Numbers in drawing correlate to the last 2 digits of the Number field in the Electrical Characteristics
table.
Input Signal Fall Time at pin
SDI, CLK and CSN
tfIN – – 50 ns – P_16.7.22
Delay Time for Mode
Changes2)
tDel,Mode – – 6 µs includes internal
oscillator
tolerance
P_16.7.23
CSN High Time tCSN(high) 3 – – µs – P_16.7.24
Data Output Timing1)
SDO Rise Time trSDO –3080nsCL = 100 pF P_16.7.25
SDO Fall Time tfSDO –3080nsCL = 100 pF P_16.7.26
SDO Enable Time tENSDO – – 50 ns low impedance P_16.7.27
SDO Disable Time tDISSDO – – 50 ns high impedance P_16.7.28
SDO Valid Time tVASDO ––50nsCL = 100 pF P_16.7.29
1) Not subject to production test; specified by design
2) Applies to all mode changes triggered via SPI commands
Table 30 Electrical Characteristics (cont’d)
VS = 5.5 V to 28 V, Tj = -40 °C to +150 °C, all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Parameter Symbol Values Unit Note or
Test Condition
Number
Min. Typ. Max.
CSN
CLK
SDI
SDO
1413
not defined LSB MSB
Flag LSB MSB
16
27 29
19
17
28
24
20
15 18
Data Sheet 166 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
17 Application Information
17.1 Application Diagram
Note: The following information is given as a hint for the implementation of the device only and shall not
be regarded as a description or warranty of a certain functionality, condition or quality of the device.
Figure 59 Simplified Application Diagram
C
1
R
13
C
15
VSH S
LIN1
S
1
VBAT
C
11
R
10
CANH
C
12
R
11
CANL
R
2
V
SS
V
DD
CSN
CLK
SDI
SDO
µC
INT
CSN
CLK
SDO
SDI
FOx
VCC1
C
4
V
CC1
C
5
WK1
HS1
VS
Reset
INT
RO
VCAN
GND
Q1
V
CC
GND
IC1
V
S
LOGIC
State
Machine
Application _information
_ TLE 9263 . vsd
V
S
T1
CANH
CANL
CAN cell
VBAT
VBAT VS
TLE9263
V
S
VCC3REF
Q2
LIN1
LI N cell
HS2
HS3
VSHS
HS4
LH
V
CC2
WK3
WK2
R
1
S
2
R
4
S
3
R
6
R
5
R
3
Hall1
Hall2
Q1
Q2
Q1
Q2
D
1
C
7
R
8
D
3
Other l oads , e.g .
sensor , opam p , ...
C
8
R
7
D
4
R
14
C
16
LIN2
LI N cel l
VSHS
LIN2
TxD LIN2
RxD LIN2
TxD CAN
RxD CAN
TxD LIN2
RxD LIN2
TxD CAN
RxD CAN
TxD LIN1
RxD LIN1
TxD LIN1
RxD LIN1
VCC2
VSHS
VSHS
VSHS
VSH S
D
2
C
2
C
3
Note: The external capacitance on FO3/TEST must be
<=10nF in oder to ensure proper detection of SBC
Development Mode und SBC user mode operation
T
2
C
13
R
12
V
CC3
VCC3B
VCC3SH
C
14
C
9
C
10
C
6
V
CC 2
D
6
D
5
R
9
C
17
C
18
Data Sheet 167 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
Note: Unused outputs are recommended to be left unconnected on the application board. If unused
output pins are routed to an external connector which leaves the ECU, then these pins should have
provision for a zero ohm jumper (depopulated if unused) or ESD protection.
Table 31 Bill of Material for Simplified Application Diagram
Ref. Typical Value Purpose / Comment
Capacitances
C1 68µF Buffering capacitor to cut off battery spikes, depending on application
C2 100nF EMC, blocking capacitor
C3 22µF Buffering capacitor to cut off battery spikes from VSHS as separate supply
input; Depending on application, only needed if VSHS is not connected to
VS;
C4 2.2µF low ESR As required by application, min. 470nF for stability and max. 68µF
recommended
C5 100nF ceramic Spike filtering, improve stability of supply for microcontroller;
not needed for SBC
C6 2.2µF low ESR Blocking capacitor, min. 470nF for stability;
if used for CAN supply place a 100nF ceramic capacitor in addition very
close to VCAN pin for optimum EMC behavior
C7 33nF As required by application, mandatory protection for off-board
connections
C8 33nF As required by application, mandatory protection for off-board
connections
C17 47pF Only required in case of off-board connection to optimize EMC behavior,
place close to pin
C18 47pF Only required in case of off-board connection to optimize EMC behavior,
place close to pin
C9 10nF Spike filtering, as required by application, mandatory protection for off-
board connections (see also Simplified Application Diagram with the
Alternate Measurement Function)
C10 10nF Spike filtering, as required by application, mandatory protection for off-
board connections
C11 10nF Spike filtering, as required by application, mandatory protection for off-
board connections
C12 4.7nF / OEM dependent Split termination stability
C13 10µF low ESR Stability of VCC3, ceramic capacitor, e.g. Murata 10 µF/10 V
GCM31CR71A106K64L or 2x 4.7 µF/10 V
C14 47nF Only required in case of off-board connection to optimize EMC behavior,
place close to connector
C15 1nF / OEM dependent LIN master termination
C16 1nF / OEM dependent LIN master termination
Resistances
R1 10kΩWetting current of the switch, as required by application
Data Sheet 168 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
R2 10kΩLimit the WK pin current, e.g. for ISO pulses
R3 10kΩWetting current of the switch, as required by application
R4 10kΩLimit the WK pin current, e.g. for ISO pulses
R5 10kΩWetting current of the switch, as required by application
R6 10kΩLimit the WK pin current, e.g. for ISO pulses
R7 depending on LED config. LED current limitation, as required by application
R8 depending on LED config. LED current limitation, as required by application
R9 47kΩSelection of hardware configuration 1/3, i.e. in case of WD failure SBC
Restart Mode is entered.
If not connected, then hardware configuration 2/4 is selected
R10 60Ω / OEM dependent CAN bus termination
R11 60Ω / OEM dependent CAN bus termination
R12 1Ω shunt, depending on
required current
limitation or load sharing
ratio
Sense shunt for ICC3 current limitation (configured to typ. 235mA with 1Ω
shunt) for stand-alone configuration;
Setting of load sharing ratio (here ICC3/ICC1 = 1) in load sharing
configuration.
R13 1kΩ / OEM dependent LIN master termination (if configured as a LIN master)
R14 1kΩ / OEM dependent LIN master termination (if configured as a LIN master)
R15 10kΩWK1 pin current limitation, e.g. for ISO pulses, for alternate measurement
function (see also Simplified Application Diagram with the Alternate
Measurement Function)
R16 depending on
application and
microcontroller
Voltage Divider resistor to adjust measurement voltage to
microcontroller ADC input range (see also Simplified Application Diagram
with the Alternate Measurement Function)
R17 depending on
application and
microcontroller
Voltage Divider resistor to adjust measurement voltage to
microcontroller ADC input range (see also Simplified Application Diagram
with the Alternate Measurement Function)
Active Components
D1 e.g. BAS 3010A, Infineon Reverse polarity protection for VS supply pins
D2 e.g. BAS 3010A, Infineon Reverse polarity protection for VSHS supply pin; if separate supplies are
not needed, then connect VSHS to VS pins
D3 LED As required by application, configure series resistor accordingly
D4 LED As required by application, configure series resistor accordingly
D5 e.g. BAS70 Requested by LIN standard; reverse polarity protection of network
D6 e.g. BAS70 Requested by LIN standard; reverse polarity protection of network
T1 e.g. BCR191W High active FO control
T2 BCP 52-16, Infineon Power element of VCC3, current limit or load sharing ratio to be
configured via shunt
MJD 253, ON Semi Alternative power element of VCC3
µC e.g. TC2xxx Microcontroller
Table 31 Bill of Material for Simplified Application Diagram (cont’d)
Ref. Typical Value Purpose / Comment
Data Sheet 169 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
Note: This is a simplified example of an application circuit. The function must be verified in the real
application.
Figure 60 Simplified Application Diagram with the Alternate Measurement Function via WK1 and WK2
Note: This is a very simplified example of an application circuit. The function must be verified in the real
application.WK1 must be connected to signal to be measured and WK2 is the output to the
microcontroller supervision function. The maximum current into WK1 must be <500uA. The
minimum current into WK1 should be >5uA to ensure proper operation.
C
1
e.g.
470uF
C
2
V
SS
V
DD
CSN
CLK
SDI
SDO
µC
TxD CAN
RxD CAN
INT
CSN
CLK
SDO
SDI
TxD CAN
RxD CAN
VCC1
C
4
V
CC1
C
5
WK1
VS
Reset
INT
RO
GND
V
S
LOGIC
State
Machine
VBAT
VBAT VS
TLE9263
WK2
R
6
ADC_x
Vbat_uC
D
1
D
2
≥10k
C
9
≥10n
Vbat_uC
R
16
R
17
max.
500uA
ISO Pulse
protection
S
1
TxD LIN1
RxD LIN1
TxD LIN1
RxD LIN1
Note:
Max. WK1 input current shall be
be limited to 500µA to ensure
accuracy and proper operation ;
TxD LIN2
RxD LIN2
TxD LIN2
RxD LIN2
Data Sheet 170 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
Figure 61 Hint for Increasing the Robustness of pin FO3/TEST during Debugging or Programming
FO3/
TEST
R
EXT
Connector
/Jumper
5V_int
R
TEST
SBC Init
Mode
Failure Logic
T
test
T
FO_PL
Data Sheet 171 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
17.2 ESD Tests
Note: Tests for ESD robustness according to IEC61000-4-2 “gun test” (150pF, 330Ω) has been performed.
The results and test conditions are available in a test report. The target values for the test are listed
in Table 32 below.
EMC and ESD susceptibility tests according to SAE J2962-2 (2010) have been performed. Tested by external
test house (UL LLC).
Table 32 ESD “Gun Test”
Performed Test Result Unit Remarks
ESD at pin CANH, CANL,
LIN, VS, WK1..3, HSx, VCC2,
VCC3 versus GND
>6 kV 1)2)positive pulse
1) ESD Test “Gun Test” is specified with external components for pins VS, WK1..3, HSx, VCC3 and VCC2. See the
application diagram in Chapter 17.1 for more information.
2) ESD susceptibility “ESD GUN” according LIN EMC 1.3 Test Specification, Section 4.3 (IEC 61000-4-2). Tested by external
test house (IBEE Zwickau, EMC Test report Nr. 04-01-17)
ESD at pin CANH, CANL,
LIN, VS, WK1..3, HSx, VCC2,
VCC3 versus GND
< -6 kV 1)2)negative pulse
Data Sheet 172 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
17.3 Thermal Behavior of Package
Below figure shows the thermal resistance (Rth_JA) of the device vs. the cooling area on the bottom of the PCB
for Ta = 85°C. Every line reflects a different PCB and thermal via design.
Figure 62 Thermal Resistance (Rth_JA) vs. Cooling Area
Data Sheet 173 Rev. 1.00
2017-07-31
TLE9263BQXV33
Application Information
Figure 63 Board Setup
Board setup is defined according to JESD 51-2,-5,-7.
Board: 76.2x114.3x1.5mm3 with 2 inner copper layers (35µm thick), with thermal via array under the exposed
pad contacting the first inner copper layer and 300mm2 cooling area on the bottom layer (70µm).
PCB (top view)
PCB (bottom view) Detail SolderArea
1
,
5 mm
1
,
5 mm
70µm modelled (traces)
35µm, 90% metalization*
35µm, 90% metalization*
70µm / 5% metalization + cooling area
*: means percentual Cu metalization on each layer
Cross Section (JEDEC 1s0p) with Cooling AreaCross Section (JEDEC 2s2p) with Cooling Area
Data Sheet 174 Rev. 1.00
2017-07-31
TLE9263BQXV33
Package Outlines
18 Package Outlines
Figure 64 PG-VQFN-48-31
Note: Dimensions in mm.
The tie bars have an internal connection to the exposed pad.
For assembly recommendations please also refer to the documents "Recommendations for Board
Assembly (VQFN and IQFN)" and "VQFN48 Layout Hints" on the Infineon website
(www.infineon.com).
The PG-VQFN-48-31 package is a leadless exposed pad power package featuring Lead Tip Inspection (LTI) to
support Automatic Optical Inspection (AOI).
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant
with government regulations the device is available as a green product. Green products are RoHS-Compliant
(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
PG-VQFN-48-29, -31-PO V03
7±0.1 A
6.8
7
±0.1
B
11 x 0.5 = 5.5
0.5
0.5
±0.07
0.1
±0.05
0.15
±0.05
(6)
(5.2)
0.9 MAX.
(0.65)
+0.03
1) 2)
48x
0.08
(0.2)
0.05 MAX.
C
(5.2)
(6)
0.1
±0.03
±0.05
0.23
M
48x
0.1 A B C
1) Vertical burr 0.03 max., all sides
2) This four metal areas have exposed diepad potential
Index Marking
SEATING PLANE
Index Marking
6.8
12 1
13
24
25 36
(0.35)
37
48
0.4 x 45°
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.Dimensions in mm
Data Sheet 175 Rev. 1.00
2017-07-31
TLE9263BQXV33
Revision History
19 Revision History
Revision Date Changes
Rev. 1.00 2017-07-31 Initial Release
Trademarks of Infineon Technologies AG
µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™,
DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™,
HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OPTIGA™,
OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™,
SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™.
Trademarks updated November 2015
Other Trademarks
All referenced product or service names and trademarks are the property of their respective owners.
Edition 2017-07-31
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2017 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email: erratum@infineon.com
IMPORTANT NOTICE
The information given in this document shall in no
event be regarded as a guarantee of conditions or
characteristics ("Beschaffenheitsgarantie").
With respect to any examples, hints or any typical
values stated herein and/or any information regarding
the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities
of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any
third party.
In addition, any information given in this document is
subject to customer's compliance with its obligations
stated in this document and any applicable legal
requirements, norms and standards concerning
customer's products and any use of the product of
Infineon Technologies in customer's applications.
The data contained in this document is exclusively
intended for technically trained staff. It is the
responsibility of customer's technical departments to
evaluate the suitability of the product for the intended
application and the completeness of the product
information given in this document with respect to
such application.
For further information on technology, delivery terms
and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain
dangerous substances. For information on the types
in question please contact your nearest Infineon
Technologies office.
Except as otherwise explicitly approved by Infineon
Technologies in a written document signed by
authorized representatives of Infineon Technologies,
Infineon Technologies’ products may not be used in
any applications where a failure of the product or any
consequences of the use thereof can reasonably be
expected to result in personal injury.
Please read the Important Notice and Warnings at the end of this document
