1113E100M00000BX - Vectron International

REV DESCRIPTION DATE PREP APPD

14428

4/30/09

DF/

DATE

VECTRON INTERNATIONAL

MOUNT HOLLY SPRINGS, PA 17065

PREPARED BY

Stan Carpenter 10/26/00

Oscillator Specification, Hybrid Clock

QUALITY

SWP 11/1/00

Hi-Rel Standard

ENGINEERING

S. Carpenter 10/30/00

CODE IDENT NO SIZE DWG. NO. REV

00136

OS-68338 K

UNSPECIFIED TOLERANCES: N/A

SHEET 1 0F 20

SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET

A 00136

N/A OS-68338 K 2

1. SCOPE

1.1 General. This specification defines the design, assembly and functional evaluation of high

reliability, hybrid clock oscillators produced by Vectron International. Devices delivered to

this specification represent the standardized Parts, Materials and Processes (PMP) Program

developed, implemented and certified for advanced applications and extended environments.

1.2 Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within OS-68338 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military or Ruggedized COTS environments.

2. APPLICABLE DOCUMENTS

2.1 Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310 Oscillators, Crystal Controlled, General Specification For

MIL-PRF-38534 Hybrid Microcircuits, General Specification For

Standards

MIL-STD-202 Test Method Standard, Electronic and Electrical Component Parts

MIL-STD-883 Test Methods and Procedures for Microelectronics

MIL-STD-1686 Electrostatic Discharge Control Program for Protection of Electrical and

Electronic Parts, Assemblies and Equipment

Other

HT-67849 Test Specification, OS-68338 Hybrids, Hi-Rel Standard

QSP-90100 Quality Systems Manual, Vectron International

VL-65339 Identification Common Documents, Materials and Processes, Hi-Rel XO

3. GENERAL REQUIREMENTS

3.1 Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent

specification, options are imbedded within it to also produce Class B, Engineering Model and

Ruggedized COTS devices. Devices carry a Class 2 ESDS classification.

SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET

A 00136

N/A OS-68338 K 3

3.2 Item Identification. External packaging choices are of metal flatpacks, DIP’s and ceramic J-

lead 9x14mm and LCC’s with either TTL or ACMOS logic output. Unique Model Number

Series’ are utilized to identify device package configurations and output logic as listed in Table

3.3 Absolute Maximum Ratings.

a. Supply Voltage Range (V

): -0.5Vdc to +7.0Vdc

b. Storage Temperature Range (T

STG

): -65°C to +125°C

c. Junction Temperature (T

): +175°C

d. Lead Temperature (soldering, 10 seconds): +300°C

e. Output Source/Sink Current ±70 mA

3.4 Design, Parts, Materials and Processes, Assembly, Inspection and Test.

3.4.1 Design. The ruggedized designs implemented for these devices are proven in military and

space applications under extreme environments. Designs utilize 4-point crystal mounting in

compliment with Established Reliability (MIL-ER) componentry. When specified, radiation

hardening up to 100krad(Si) (RHA level R) can be included without altering the device’s

internal topography.

3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting

passive chip component values to offset component tolerances, there will not be fundamental

changes to the design or assembly or parts, materials and processes after first product delivery

of that item without written approval from the procuring activity.

3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-

PRF-55310. These designs have also passed extended dynamic levels of at least:

Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)

Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms)

Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)

3.4.2 Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high

reliability devices produced to this specification.

a. Gold metallization of package elements without a barrier metal.

b. Zinc chromate as a finish.

c. Cadmium, zinc, or pure tin external or internal to the device.

d. Plastic encapsulated semiconductor devices.

e. Ultrasonically cleaned electronic parts.

f. Heterojunction Bipolar Transistor (HBT) technology.

g. ‘getter’ materials

3.4.3 Assembly. Manufacturing utilizes standardized procedures, processes and verification

methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.

MIL-PRF-38534 Group B Option 1 in-line inspection is included on radiation hardened part

numbers to further verify lot pedigree. Traceability of all components and production lots are

SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET

A 00136

N/A OS-68338 K 4

in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part

of the deliverable data package. Devices are handled in accordance with MIL-STD-1686 for

Class 1 devices.

3.4.4 Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to

this document. Inspection conditions and standards are documented in accordance with the

Quality Assurance, ISO-9001 derived, System of QSP-90100.

3.4.5 Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to

eliminate costs associated with the development/maintenance of device-specific documentation

packages while maintaining performance integrity.

3.4.6 Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.

3.4.7 Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the

same robust designs found in the other device pedigrees. They do not include the provisions of

traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.

4. DETAIL REQUIREMENTS

4.1 Components

4.1.1 Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the

devices. The optional use of Premium Q swept quartz can, because of its processing to remove

impurities, be specified for better frequency aging characteristics. In accordance with MIL-

PRF-55310, the manufacturer has a documented crystal element evaluation program.

4.1.2 Passive Components. Established Reliability (ER) failure level R minimum passive

components are procured from QPL suppliers. Lot evaluations are in accordance with MIL-

PRF-55310 or Enhanced Element Evaluation as specified in Table 7.

4.1.3 Class S Microcircuits. Microcircuits are procured from wafer lots that have passed MIL-PRF-

55310 Lot Acceptance Tests for Class S devices. The prescribed die carries a Class 2 ESDS

classification in accordance with MIL-PRF-38535. When optionally specified, further testing

in accordance with MIL-PRF-55310 and MIL-PRF-38534 is performed for radiation hardness

assurance and for Enhanced Element Evaluation as specified in Table 6. Those microcircuits,

identified by a unique part number, are certified for 100krad(Si) total ionizing dose (TID),

RHA level R (2X minimum margin). NSC, as the original 54ACT designer, rates the SEU

LET at >40 MeV and SEL at >120MeV for the FACT™ family (AN-932). Vectron has

conducted additional SEE testing in 2008 to verify this performance since our lot wafer testing

does not include these parameters and determinations.

SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET

A 00136

N/A OS-68338 K 5

4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into OS-68338 Design

Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed

MIL-PRF-55310 element evaluations for Class B devices.

4.1.4 Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. Package lots are upscreened in accordance with the

requirements of MIL-PRF-38534 as applicable.

4.1.5 Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s

individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing

details of the autoclave lot, as applicable. All other elements and materials are traceable to

their manufacturer and incoming inspection lots.

4.1.6 Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and

passive devices with Enhanced Element Evaluation as listed in Table 6 and 7 shall be

implemented for the highest reliability preference.

4.2 Mechanical.

4.2.1 Package Outline.

Table 1 links each Hi-Rel Standard Model Number of this specification to a

corresponding package style. Mechanical Outline information of each package style is found

in the referenced Figure.

4.2.2 Thermal Characteristics. The worst case thermal characteristics of each package style are

found in Table 4.

4.3 Electrical.

4.3.1 Input Power. Devices are designed for standard 5.0 volt dc operation, ±10%. Optional 3.3

Vdc (±10%) input performance for ACMOS output conditions. Current is measured, no load,

at maximum rated operating voltage.

4.3.2 Temperature Range. Operating range is -55°C to +125°C.

4.3.3 Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. Frequency-

Temperature Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage

Tolerance is ±4 ppm maximum.

4.3.4 Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B

inspection, shall not exceed ±1 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year

thereafter. When screening Option F is selected, aging is performed on 100% of the lot and

Vectron does not apply the PDA as specified in MIL-PRF-55310. Data will be presented for

each individual unit to show compliance to the aging limit.

SIZE CODE IDENT NO. UNSPECIFIED TOLERANCES DWG NO. REV. SHEET

A 00136

N/A OS-68338 K 6

4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated

after 15 days if the measured aging rate is less than half of the specified aging rate. This is a

common method of expediting 30-Day Aging without incurring risk to the hardware and used

quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations

of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally

conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time.

Vectron’s automated aging systems take about 6 data points per day, so a lot of data is

available to do very accurate projections, much more data than what is required by MIL-PRF-

55310. The delivered data would include the Aging plots projected to 30 days. If the units

would not perform within that limit then they would continue to full 30 Day term. Please

advise by purchase order text if this may be an acceptable option to exercise as it assists in

Production Test planning.

4.3.5 Operating Characteristics. Symmetrical square wave limits are dependent on the device

frequency and are in accordance with Tables 2 and 2A. Waveform measurement points and

logic limits are in accordance with MIL-PRF-55310. Start-up time is 10.0 msec. maximum.

4.3.6 Output Load. Standard TTL (6 or 10) and ACMOS (10kΩ, 15pF) test loads are in accordance

with MIL-PRF-55310.

5. QUALITY ASSURANCE PROVISIONS AND VERIFICATION

5.1 Verification and Test. Device lots shall be tested prior to delivery in accordance with the

applicable Screening Option letter as stated by the 15

character of the part number. Table 5

tests are conducted in the order shown and annotated on the appropriate process travelers and

data sheets of the governing test procedure. For devices that require Screening Options that

include MIL-PRF-55310 Group A testing, the Post-Burn-In Electrical Test and the Group A

Electrical Test are combined into one operation.

5.1.1 Screening Options. The Screening Options, by letter, are summarized as:

A Modified MIL-PRF-38534 Class K

B Modified MIL-PRF-55310 Class B Screening & Group A Quality Conformance

Inspection (QCI)

C Modified MIL-PRF-55310 Class S Screening & Group A QCI

D Modified MIL-PRF-38534 Class K with Burn-in Delta Aging

E Modified MIL-PRF-55310 Class B Screening, Groups A & B QCI

F Modified MIL-PRF-55310 Class S Screening, Groups A & B QCI

G Modified MIL-PRF-55310 Class B Screening & Post Burn-in Nominal

Electricals

X Engineering Model (EM)

5.2 Optional Design, Test and Data Parameters. The following is a list of design, assembly,

inspection and test options that can be selected or added by purchase order request.