– 241 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
X
2
C
3
C
4
L
5
3
6
2
7
1
8
6
9
U
10
1
11 12
Noise Filter Chip type Bead core Dimensions (mm)
4.5x3.2x1.8
3.2x2.5x1.6
3.2x1.6x1.6
Code
4532
3225
3216
Product Code Type Size Form Suffix
Packing
Embossed Carrier Taping
Code
U
Part kind
■Features
● Effective noise suppression for power lines and high
speed signal lines
● Easy pattern layout on PC Board
● RoHS compliant
Type: EXCCL, EXCML
●Low DC Resistance 3 to 8 m액 typical: Rated
current (3 and 4 Amperes) (type: EXCML)
● Low impedance
Type: EXC3B
● High impedance for high speed signal line noise
● Increased attenuation
● 60 액-1 A, 120 액-0.5 A are achieved by using 1608
size (type: EXC3BP)
Chip Bead Cores
Type:EXCCL
EXCML
EXC3B
■Ty pe: EXCCL
● Explanation of Part Numbers
■ Recommended Applications
● Digital equipment such as PCs, word processors,
print ers, HDD, PCC, CD-ROMs, DVD-ROMs.
● Digital audio and video equipment such as VCRs,
DVC, CD Players, DVD Players.
● AC adapters, and switching power supplies.
● Electronic musical instruments, and other digital
equipment.
Feb. 201101
– 242 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Ferrite core Electrode
AA
H
W
L
Product Code Type MaterialSize Nominal Impedance
E
1
Form
X
2
C
3
M
4
L
5
2
6
0
7
A
8
3
9
9
10
0
11
U
12
Noise Filter Molded
Chip type Bead core Dimensions (mm)
4.5x1.6 x1.1
3.2x1.6 x0.9
2.0x1.25x0.9
1.6x0.8 x0.8
Code
45
32
20
16
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Packing
Embossed Carrier Taping
(EXCML16 to 32)
Code
U
H
Part kind
Embossed Carrier Taping
(EXCML45)
Conductor Electrode
Ferrite core
eT
W
L
■ Dimensions in mm (not to scale)
■Construction
■Ty pe: EXCML
● Explanation of Part Numbers
■ Dimensions in mm (not to scale)■Construction
Type
(inch size)
Dimensions (mm) Mass
(Weight)
[mg/pc.]
LWHA
EXCCL4532
(1812)
4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2
125.8
EXCCL3225
(1210)
3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3
60.5
EXCCL3216
(1206)
3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3
37
Type
(inch size)
Dimensions (mm) Mass
(Weight)
[mg/pc.]
LWT e
EXCML16
(0603)
1.6±0.2 0.8±0.2 0.8±0.2
(0.4)
4.5
EXCML20
(0805)
2.0±0.2 1.25±0.20 0.9±0.2
(0.5)
10.5
EXCML32
(1206)
3.2±0.3 1.6±0.3 0.9±0.2
(0.6)
21.5
EXCML45
(1806)
4.5±0.3 1.6±0.3 1.1±0.2
(0.6)
36.0
Sep. 201000
– 243 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
X
2
C
3
3
4
B
5
B
6
2
7
2
8
1
9
H
10 11 12
Noise Filter High frequency
High attenuation
for signal Lines
B
High frequency
High attenuation
for Power Lines
P
Dimensions (mm)
1.6x0.8x0.8
Code
3
Multilayer
Chip type
Bead Core
The first two digits are
significant figure of
impedance value and the
third one denotes the
number of zeros following
Product Code Type
Characteristics
Size Nominal Impedance Form Suffix
Packing
Embossed Carrier Taping
Code
H
Inner Conductor Electrode
Ferrite core
eT
W
L
■Ty pe : EXC3B
● Explanation of Part Numbers
■ Dimensions in mm (not to scale)■Construction
Type
(inch size)
Dimensions (mm) Mass
(Weight)
[mg/pc.]
LWT e
EXC3BB
(0603) 1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2
4.5
EXC3BP
(0603) 1.6±0.2 0.8±0.2 0.8±0.2 0.3±0.2
4.5
Type Part Number Impedance Rated Current
(mA DC)
DC Resistance
(액) max.
(액) at 100 MHz tol.(%)
4532 EXCCL4532U1 115
±25
2000 0.1
3225 EXCCL3225U1 45 2000 0.05
3216 EXCCL3216U1 25 2000 0.05
4516 EXCML45A910H 91 3000 0.016
3216 EXCML32A680U 68 3000 0.012
2012 EXCML20A390U 39 4000 0.008
1608 EXCML16A270U 27 4000 0.006
1608
EXC3BP600H 60 1000 0.07
EXC3BP121H 120 500 0.1
EXC3BB221H 220 200 0.3
EXC3BB601H 600 100 0.8
EXC3BB102H 1000 50 1
■Ratings
● Category Temperature Range –25 °C to +85 °C
Feb. 201101
– 244 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Frequency(MHz)
Frequency(MHz)
●EXCML16A270U (1608)
●EXCML20A390U (2012)
●EXCML32A680U (3216)
●EXCML45A910H (4516)
140
120
100
80
60
40
20
0
140
120
100
80
60
40
20
0
Frequency(MHz)
Frequency(MHz)
140
120
100
80
60
40
20
0
140
160
180
120
100
80
60
40
20
0
140
120
100
80
60
40
20
0
110100
Frequency(MHz)
●EXCCL4532U1 (4532)
1000 10000
X
R
140
120
100
80
60
40
20
0
110100
Frequency(MHz)
●EXCCL3225U1 (3225)
1000 10000
X
R
140
120
100
80
60
40
20
0
110100
Frequency(MHz)
●EXCCL3216U1 (3216)
1000 10000
X
R
훺Z훺,R,X(액)훺Z훺,R,X(액)훺Z훺,R,X(액)
훺Z훺,R,X(액)훺Z훺,R,X(액)훺Z훺,R,X(액)훺Z훺,R,X(액)
110100 1000 10000
110 100 1000 10000
110100 10000
110100 1000 10000
X
R
X
R
X
R
X
R
1000
Z
Z
Z
Z
Z
Z
Z
■ Impedance Characteristics (Reference Data) Measured by HP4291A
앚Z앚 : Impedance R : Resistance X : Reactance
Sep. 201000
– 245 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
1400
1200
1000
800
600
400
200
0
110100
Frequency(MHz)
●EXC3BB221H (1608)
1000 10000
XR
1400
1200
1000
800
600
400
200
0
110100
Frequency(MHz)
●EXC3BB601H (1608)
1000 10000
X
R
1400
1200
1000
800
600
400
200
0
110100
Frequency(MHz)
●EXC3BB102H (1608)
1000 10000
X
R
200
150
100
50
0
200
150
100
50
0
110100
Frequency(MHz)
●EXC3BP121H (1608)
1000 10000
X
R
110100
Frequency(MHz)
●EXC3BP600H (1608)
1000 10000
X
R
훺Z훺,R,X(액)훺Z훺,R,X(액)
훺Z훺,R,X(액)훺Z훺,R,X(액)
훺Z훺,R,X(액)
Z
Z
Z
Z
Z
■ Impedance Characteristics (Reference Data) Measured by HP4291A
앚Z앚 : Impedance R : Resistance X : Reactance
Sep. 201000
– 246 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Sprocket hole Compartment
Chip component Tape running direction
t2P1P2P0
φD0
F
W
A
B
T
φ C
φ D
E
φ AW
φ B
■Packaging Methods (Taping)
● Standard Quantity
Standard Reel Dimensions (mm)
Embossed Carrier Dimensions (mm)
● Taping Reel● Embossed Carrier Taping
Part Number Kind of Taping Pitch (P1) Quantity
EXCCL4532U1
Embossed Carrier Taping
8 mm 1000 pcs./reel
EXCCL3225U1
4 mm
2000 pcs./reel
EXCCL3216U1
EXCML45A910H 3000 pcs./reel
EXCML32A680U
EXCML20A390U
4000 pcs./reel
EXCML16A270U
EXC3B첸첸첸첸H
Part Number A B W F P1P2P0φD0t2
EXCCL4532U1 3.6±0.2 4.9±0.2
12.0
±
0.2
5.5±0.1 8.0±0.1
2.0±0.1 4.0±0.1 1.5±0.1
2.4 max.
EXCCL3225U1 2.9±0.2 3.6±0.2 8.0±0.2 3.5±0.1
4.0±0.1
2.1 max.
EXCCL3216U1 2.0±0.2 3.6±0.2
EXCML45A910H 1.9±0.2 4.8±0.2
12.0
±
0.2
5.5±0.1
1.8 max.
EXCML32A680U 1.9±0.2 3.5±0.2
8.0±0.2 3.5±0.1
1.6 max.
EXCML20A390U 1.5±0.2 2.3±0.2
EXCML16A270U 1.0±0.2 1.8±0.2
EXC3B첸첸첸첸H1.0±0.1 1.8±0.1
Part Number φAφBφCφDE W T
EXCCL4532U1
180.0 0 60.0±1.0 13.0±0.5 21.0±0.8 2.0±0.5
13.0±0.3 16.5 max.
EXCCL3225U1 09.0±0.3 13 max.
EXCCL3216U1
EXCML45A910H 13.0±0.3 16.5 max.
EXCML32A680U
09.0±0.3 13 max.
EXCML20A390U
EXCML16A270U
EXC3B첸첸첸첸H
–3.0
Sep. 201000
– 247 –
Chip Bead Cores
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
C
AB
Preheating
Peak
Heating
Temperature
Time
■Recommended Soldering Conditions
Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
■ Recommended Land Pattern Dimensions in mm (not to scale)
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales per son
in advance.
3. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.
pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance.
Excessive mechanical stress may damage the bead cores. Handle with care.
4. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a rel a tive humidity of
40 % to 60 %, where there are no rapid changes in temperature or humidity.
5. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the out go ing in spec tion
indicated on the packages.
Part Number A B C
EXCCL4532U1
3 5.4 2.8
EXCCL3225U1
1.7 4.1 2.1
EXCCL3216U1
1.7 4.1 1.2
EXCML45A910H
2.6 to 3 5.5 to 6.5 1.2 to 1.6
EXCML32A680U
1.6 to 2 4 to 5 1.2 to 1.6
EXCML20A390U
0.8 to 1.2 3 to 4 1 to 1.2
EXCML16A270U
0.6 to 1 2 to 3 0.8 to 1
EXC3B첸첸첸첸H0.8 to 1 2 to 2.6 0.8 to 1
(mm)
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 10 °C max. 10 s
Temperature Time
Preheating 150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
●Recommended soldering conditions for refl ow
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
●Flow soldering
· Flow soldering may cause this product to come off because the adhesiveness of the product element is low.
Please consult our sales representative in advance about fl ow soldering.
Sep. 201000
