CYBLE-022001-00 EZ-BLETM PRoCTM Module General Description The Cypress CYBLE-022001-00 is a fully certified and qualified module supporting Bluetooth Low Energy (BLE) wireless communication. The CYBLE-022001-00 is a turnkey solution and includes onboard crystal oscillators, chip antenna, passive components, and Cypress PRoCTM BLE. The CYBLE-022001-00 supports a number of peripheral functions (ADC, timers, counters, PWM) and serial communication protocols (I2C, UART, SPI) through its programmable architecture. The CYBLE-022001-00 includes a royalty-free BLE stack compatible with Bluetooth 4.1 and provides up to 16 GPIOs in a small 10 x 10 x 1.80 mm package. The CYBLE-022001-00 is a complete solution and an ideal fit for applications requiring BLE wireless connectivity. Module Description Module size: 10.0 mm x10.0 mm x 1.80 mm (with shield) Bluetooth 4.1 single-mode module Industrial temperature range: -40 C to +85 C 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit multiply, operating at up to 48 MHz 128-KB flash memory 16-KB SRAM memory Watchdog timer with dedicated internal low-speed oscillator (ILO) Two-pin SWD for programming Up to 16 GPIOs configurable as open drain high/low, pull-up/pull-down, HI-Z analog, HI-Z digital, or strong output Functional Capabilities Up to 15 capacitive sensors for buttons or sliders with best-in-class signal-to-noise ration (SNR) and liquid tolerance 12-bit, 1-Msps SAR ADC with internal reference, sample-and-hold (S/H), and channel sequencer Four dedicated 16-bit timer, counter, or PWM blocks (TCPWMs) Programmable low voltage detect (LVD) from 1.8 V to 4.5 V I2S master interface Bluetooth Low Energy protocol stack supporting generic access profile (GAP) Central, Peripheral, Observer, or Broadcaster roles Switches between Central and Peripheral roles on-the-go Standard Bluetooth Low Energy profiles and services for interoperability Custom profile and service for specific use cases Benefits Certified to FCC, CE MIC, KC, and IC regulations FCC ID: WAP2001 IC ID: 7922A-2001 MIC ID: 005-101007 KC ID: MSIP-CRM-Cyp-2001 Bluetooth SIG 4.1 qualified QDID: 67366 Declaration ID: D026297 The CYBLE-022001-00 module is provided as a turnkey solution, including all necessary hardware required to use BLE communication standards. Proven, qualified, and certified hardware design ready to use Small footprint (10 x 10 mm x 1.80 mm), perfect for space constrained applications Reprogrammable architecture Fully certified module eliminates the time needed for design, development and certification processes Bluetooth SIG qualified with QDID and Declaration ID Flexible communication protocol support PSoC CreatorTM provides an easy-to-use integrated design environment (IDE) to configure, develop, program, and test a BLE application Power Consumption TX output power: -18 dbm to +3 dbm Received signal strength indicator (RSSI) with 1-dB resolution TX current consumption of 15.6 mA (radio only, 0 dbm) RX current consumption of 16.4 mA (radio only) Low power mode support Deep Sleep: 1.3 A with watch crystal oscillator (WCO) on Hibernate: 150 nA with SRAM retention Stop: 60 nA with XRES wakeup Cypress Semiconductor Corporation Document Number: 001-95662 Rev. *C Two serial communication blocks (SCBs) supporting I2C (master/slave), SPI (master/slave), or UART 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Revised June 26, 2015 CYBLE-022001-00 Contents Overview ............................................................................ 3 Module Description ...................................................... 3 Pad Connection Interface ................................................ 5 Recommended Host PCB Layout ................................... 6 Power Supply Connections and Recommended External Components ...................................................... 9 Connection Options ..................................................... 9 External Component Recommendation ...................... 9 Critical Components List ........................................... 11 Antenna Design ......................................................... 11 Electrical Specification .................................................. 12 GPIO ......................................................................... 14 XRES ........................................................................ 15 Serial Communication ............................................... 16 Memory ..................................................................... 17 System Resources .................................................... 17 Environmental Specifications ....................................... 20 Environmental Compliance ....................................... 20 RF Certification .......................................................... 20 Environmental Conditions ......................................... 20 ESD and EMI Protection ........................................... 20 Document Number: 001-95662 Rev. *C Regulatory Information .................................................. 21 FCC ........................................................................... 21 Industry Canada (IC) Certification ............................. 22 European R&TTE Declaration of Conformity ............ 22 MIC Japan ................................................................. 23 KC Korea ................................................................... 23 Ordering Information ...................................................... 24 Ordering Code Definitions ......................................... 24 Packaging ........................................................................ 25 Document Conventions ................................................. 27 Units of Measure ....................................................... 27 Document History Page ................................................. 28 Sales, Solutions, and Legal Information ...................... 29 Worldwide Sales and Design Support ....................... 29 Products .................................................................... 29 PSoC(R) Solutions ...................................................... 29 Cypress Developer Community ................................. 29 Technical Support ..................................................... 29 Page 2 of 29 CYBLE-022001-00 Overview Module Description The CYBLE-022001-00 module is a complete module designed to be soldered to the applications main board. Module Dimensions and Drawing Cypress reserves the right to select components (including the appropriate BLE device) from various vendors to achieve the BLE module functionality. Such selections will still guarantee that all height restrictions of the component area are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm). Table 1. Module Design Dimensions Dimension Item Specification Length (X) 10.00 0.15 mm Width (Y) 10.00 0.15 mm Length (X) 7.00 0.15 mm Width (Y) 5.00 0.15 mm PCB thickness Height (H) 0.50 0.10 mm Shield height Height (H) 1.10 0.10 mm Module dimensions Antenna location dimensions Maximum component height Height (H) 1.30 mm typical (chip antenna) Total module thickness (bottom of module to highest component) Height (H) 1.80 mm typical See Figure 1 on page 4 for the mechanical reference drawing for CYBLE-022001-00. Document Number: 001-95662 Rev. *C Page 3 of 29 CYBLE-022001-00 Figure 1. Module Mechanical Drawing Side View Top View Bottom View Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see Figure 3 and Figure 4 on page 6. Document Number: 001-95662 Rev. *C Page 4 of 29 CYBLE-022001-00 Pad Connection Interface As shown in the bottom view of Figure 1 on page 4, the CYBLE-022001-00 connects to the host board via solder pads on the back of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the CYBLE-022001-00 module. Table 2. Solder Pad Connection Description Name SP Connections Connection Type 21 Solder Pads Pad Length Dimension Pad Width Dimension Pad Pitch 0.71 mm 0.41 mm 0.76 mm Figure 2. Solder Pad Dimensions Document Number: 001-95662 Rev. *C Page 5 of 29 CYBLE-022001-00 Recommended Host PCB Layout Figure 3 details the recommended PCB layout pattern for the host PCB. Dimensions are in mils. Figure 3. Recommended PCB Layout Pattern for CYBLE-022001-00 Top View (On Host PCB) To maximize RF performance, the host layout should follow these recommendations: 1. The ideal placement of the Cypress BLE module is in a corner of the host board with the chip antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. 2. It is recommended that the area around the Cypress BLE module chip antenna should contain an additional keep out area, where no grounding or signal trace are contained. The keep out area applies to all layers of the host board. The recommended dimensions of the host PCB keep out area are shown in Figure 4 (dimensions are in mm). Figure 4. Recommended Host PCB Keep Out Area Around the CYBLE-022001-00 Chip Antenna Host PCB Keep Out Area Around Chip Antenna Document Number: 001-95662 Rev. *C Page 6 of 29 CYBLE-022001-00 Table 3 details the solder pad pitch (center-to-center) for each of the neighboring connections. Table 3. Module Solder Pad Connection Dimensions Pad X Pad Y Pad Pitch (Pad X - Pad Y) Comments Bottom Right Corner 1 1.64 mm Distance from bottom right corner to Pad 1 center 1 2 0.76 mm Distance from Pad 1 center to Pad 2 center 2 3 0.76 mm Distance from Pad 2 center to Pad 3 center 3 4 0.76 mm Distance from Pad 3 center to Pad 4 center 4 5 0.76 mm Distance from Pad 4 center to Pad 5 center Top Right Corner 6 0.81 mm Distance from top right corner to Pad 6 center 6 7 0.76 mm Distance from Pad 6 center to Pad 7 center 7 8 0.76 mm Distance from Pad 7 center to Pad 8 center 8 9 0.76 mm Distance from Pad 8 center to Pad 9 center 9 10 0.76 mm Distance from Pad 9 center to Pad 10 center 10 11 0.76 mm Distance from Pad 10 center to Pad 11 center 11 12 0.76 mm Distance from Pad 11 center to Pad 12 center 12 13 0.76 mm Distance from Pad 12 center to Pad 13 center 13 14 0.76 mm Distance from Pad 13 center to Pad 14 center 14 15 0.76 mm Distance from Pad 14 center to Pad 15 center 15 16 0.76 mm Distance from Pad 15 center to Pad 16 center 16 17 0.76 mm Distance from Pad 16 center to Pad 17 center Top Left Corner 18 1.50 mm Distance from top left corner to Pad 18 center 18 19 0.76 mm Distance from Pad 18 center to Pad 19 center 19 20 0.76 mm Distance from Pad 19 center to Pad 20 center 20 21 0.76 mm Distance from Pad 20 center to Pad 21 center Document Number: 001-95662 Rev. *C Page 7 of 29 CYBLE-022001-00 Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4 lists the solder pads on CYBLE-022001-00, the BLE device port-pin, and denotes whether the function shown is available for each solder pad. Each connection is configurable for a single option shown with a . Table 4. Solder Pad Connection Definitions Solder Pad Number Device Port Pin UART SPI I2 C TCPWM[2] [3] 1 GND 2 P4.1[4] 3 P5.1 4 P5.0 5 VDDR 6 P1.6 7 P0.7 8 P0.4 9 P0.5 10 GND 11 P0.6 12 P1.7 CapSense WCOOut ECO_OUT LCD SWD GPIO Ground Connection (CTS) (MISO) (Sensor / (TX) (RX) (SCLK) (SCL) (SS) (SDA) (Sensor) (Sensor) CTANK) - - - - - - - - - Radio Power Supply (1.9V to 5.5V) (RTS) (CTS) (RX) (TX) (SS) - (SCLK) - (MOSI) (SDA) (MISO) (SCL) (Sensor) (Sensor) (Sensor) (Sensor) - - - - - - - - - - - (SWDCLK) - - Ground Connection (RTS) (CTS) (SS) (SCLK) - - (Sensor) (Sensor) 13 VDD Digital Power Supply Input (1.71 to 5.5V) 14 XRES External Reset Hardware Connection Input 15 P3.5 16 P3.4 17 P3.7 18 P1.4 19 P1.5 20 P3.6 21 P4.0[5] (TX) (RX) (CTS) (RX) (TX) (RTS) (RTS) (SCL) (SDA) (MISO) - (MOSI) (SDA) (MISO) (SCL) - - - - - - - (Sensor) (Sensor) (Sensor) (Sensor) (Sensor) (Sensor) (CMOD) - - - - - - - - - - - - - (SWDIO) - - - - - - - - Notes 2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions. 3. The main board needs to connect both GND connections (Pad 1 and Pad 10) on the module to the common ground of the system. 4. When using the capacitive sensing functionality, Pad 2 (P4.1) can be connected to a CTANK capacitor (located off of Cypress BLE Module). CTank should be used if implementing a shield layer on the capacitive sensor. If used, this capacitor should be placed as close to the module as possible. 5. When using the capacitive sensing functionality, Pad 21 (P4.0) must be connected to a CMOD capacitor (located off of Cypress BLE Module). The value of this capacitor is 2.2 nF and should be placed as close to the module as possible. 6. If the I2S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC Creator. Document Number: 001-95662 Rev. *C Page 8 of 29 CYBLE-022001-00 Power Supply Connections and Recommended External Components Power Connections External Component Recommendation The CYBLE-022001-00 contains two power supply connections, VDD and VDDR. The VDD connection supplies power for both digital and analog device operation. The VDDR connection supplies power for the device radio. In either connection scenario, it is recommended to place an external ferrite bead between the supply and the module connection. The ferrite bead should be positioned as close as possible to the module pin connection. VDD accepts a supply range of 1.8 V to 5.5 V. VDDR accepts a supply range of 1.9 V to 5.5 V. These specifications can be found in Table 9. The maximum power supply ripple for both power connections on the module is 100 mV, as shown in Table 7. Figure 5 details the recommended host schematic options for a single supply scenario. The use of one or two ferrite beads will depend on the specific application and configuration of the CYBLE-022001-00. The power supply ramp rate of VDD must be equal to or greater than that of VDDR. Figure 6 details the recommended host schematic for an independent supply scenario. Connection Options The recommended ferrite bead value is 330 , 100 MHz. (Murata BLM21PG331SN1D). Two connection options are available for any application: 1. Single supply: Connect VDD and VDDR to the same supply. 2. Independent supply: Power VDD and VDDR separately. Figure 5. Recommended Host Schematic Options for a Single Supply Option Single Ferrite Bead Option Two Ferrite Bead Option Figure 6. Recommended Host Schematic for Independent Supply Option Document Number: 001-95662 Rev. *C Page 9 of 29 CYBLE-022001-00 Figure 7 shows the CYBLE-022001-00 schematic. Figure 7. CYBLE-022001-00 Schematic Diagram Document Number: 001-95662 Rev. *C Page 10 of 29 CYBLE-022001-00 Critical Components List Table 5 details the critical components used in the CYBLE-022001-00 module. Table 5. Critical Component List Component Reference Designator Silicon U1 Description 68-pin WLCSP Programmable Radio-on-Chip (PRoC) with BLE Crystal Y1 24.000 MHz, 10PF Crystal Y2 32.768 kHz, 12.5PF Antenna E1 2.4 - 2.5 GHz chip antenna Antenna Design Table 6 details the chip antenna used in the CYBLE-022001-00 module. The specifications listed are according to the vendor's datasheet. The Cypress module performance improves many of these characteristics. For more information, see Table 8. Table 6. Chip Antenna Specifications Item Description Chip Antenna Manufacturer Johanson Technology Inc. Chip Antenna Part Number 2450AT18B100 Frequency Range 2400 - 2500 MHz Peak Gain 0.5 dBi typical Average Gain -0.5 dBi typical Return Loss 9.5 dB minimum Document Number: 001-95662 Rev. *C Page 11 of 29 CYBLE-022001-00 Electrical Specification Table 7 details the absolute maximum electrical characteristics for the Cypress BLE module. Table 7. CYBLE-022001-00 Absolute Maximum Ratings Parameter Description Min Typ Max Units Details/Conditions VDDD_ABS Analog, digital, or radio supply relative to VSS (VSSD = VSSA) -0.5 - 6 V Absolute maximum VCCD_ABS Direct digital core voltage input relative to VSSD -0.5 - 1.95 V Absolute maximum VDDD_RIPPLE Maximum power supply ripple for VDD and VDDR input voltage - - 100 mV VGPIO_ABS GPIO voltage -0.5 - VDD +0.5 V Absolute maximum IGPIO_ABS Maximum current per GPIO -25 - 25 mA Absolute maximum IGPIO_injection GPIO injection current: Maximum for VIH > VDD and minimum for VIL < VSS -0.5 - 0.5 mA Absolute maximum current injected per pin LU Pin current for latch up -200 200 mA - 3.0V supply Ripple frequency of 100 kHz to 750 kHz Table 8 details the RF characteristics for the Cypress BLE module. Table 8. CYBLE-022001-00 RF Performance Characteristics Parameter Description RFO RF output power on ANT RXS RF receive sensitivity on ANT Min Typ Max Units Details/Conditions -18 0 3 dBm Configurable via register settings - -91 - dBm Guaranteed by design simulation; High Gain Mode FR Module frequency range 2400 - 2480 MHz - GP Peak gain - 0.5 - dBi - GAvg Average gain - -0.5 - dBi - RL Return loss - -10.5 - dB - Table 9 through Table 37 list the module level electrical characteristics for the CYBLE-022001-00. All specifications are valid for -40 C TA 85 C and TJ 100 C, except where noted. Specifications are valid for 1.71 V to 5.5 V, except where noted. Table 9. CYBLE-022001-00 DC Specifications Parameter Description Min Typ Max Units Details/Conditions VDD1 Power supply input voltage 1.8 - 5.5 V With regulator enabled VDD2 Power supply input voltage unregulated 1.71 1.8 1.89 V Internally unregulated supply VDDR1 Radio supply voltage (radio on) 1.9 - 5.5 V - VDDR2 Radio supply voltage (radio off) 1.71 - 5.5 V - Active Mode, VDD = 1.71 V to 5.5 V IDD3 Execute from flash; CPU at 3 MHz - 1.7 - mA T = 25 C, VDD = 3.3 V IDD4 Execute from flash; CPU at 3 MHz - - - mA T = -40 C to 85 C IDD5 Execute from flash; CPU at 6 MHz - 2.5 - mA T = 25 C, VDD = 3.3 V IDD6 Execute from flash; CPU at 6 MHz - - - mA T = -40 C to 85 C IDD7 Execute from flash; CPU at 12 MHz - 4 - mA T = 25 C, VDD = 3.3 V Document Number: 001-95662 Rev. *C Page 12 of 29 CYBLE-022001-00 Table 9. CYBLE-022001-00 DC Specifications (continued) Parameter Description Min Typ Max Units Details/Conditions IDD8 Execute from flash; CPU at 12 MHz - - - mA T = -40 C to 85 C IDD9 Execute from flash; CPU at 24 MHz - 7.1 - mA T = 25 C, VDD = 3.3 V IDD10 Execute from flash; CPU at 24 MHz - - - mA T = -40 C to 85 C IDD11 Execute from flash; CPU at 48 MHz - 13.4 - mA T = 25 C, VDD = 3.3 V IDD12 Execute from flash; CPU at 48 MHz - - - mA T = -40 C to 85 C - - - mA T = 25 C, VDD = 3.3 V, SYSCLK = 3 MHz - - - mA T = 25 C, VDD = 3.3 V, SYSCLK = 3 MHz T = 25 C, VDD = 3.3 V Sleep Mode, VDD = 1.8 to 5.5 V IDD13 IMO on Sleep Mode, VDD and VDDR = 1.9 to 5.5 V IDD14 ECO on Deep-Sleep Mode, VDD = 1.8 to 3.6 V IDD15 WDT with WCO on - 1.5 - A IDD16 WDT with WCO on - - - A T = -40 C to 85 C IDD17 WDT with WCO on - - - A T = 25 C, VDD = 5 V IDD18 WDT with WCO on - - - A T = -40 C to 85 C Deep-Sleep Mode, VDD = 1.71 to 1.89 V (Regulator Bypassed) IDD19 WDT with WCO on - - - A T = 25 C IDD20 WDT with WCO on - - - A T = -40 C to 85 C Hibernate Mode, VDD = 1.8 to 3.6 V IDD27 GPIO and reset active - 150 - nA T = 25 C, VDD = 3.3 V IDD28 GPIO and reset active - - - nA T = -40 C to 85 C Hibernate Mode, VDD = 3.6 to 5.5 V IDD29 GPIO and reset active - - - nA T = 25 C, VDD = 5 V IDD30 GPIO and reset active - - - nA T = -40 C to 85 C Stop Mode, VDD = 1.8 to 3.6 V IDD33 Stop-mode current (VDD) - 20 - nA T = 25 C, VDD = 3.3 V IDD34 Stop-mode current (VDDR) - 40 -- nA T = 25 C, VDDR = 3.3 V IDD35 Stop-mode current (VDD) - - - nA T = -40 C to 85 C IDD36 Stop-mode current (VDDR) - - - nA T = -40 C to 85 C, VDDR = 1.9 V to 3.6 V Stop Mode, VDD = 3.6 to 5.5 V IDD37 Stop-mode current (VDD) - - - nA T = 25 C, VDD = 5 V IDD38 Stop-mode current (VDDR) - - - nA T = 25 C, VDDR = 5 V IDD39 Stop-mode current (VDD) - - - nA T = -40 C to 85 C IDD40 Stop-mode current (VDDR) - - - nA T = -40 C to 85 C Document Number: 001-95662 Rev. *C Page 13 of 29 CYBLE-022001-00 Table 10. AC Specifications Parameter Description Min Typ Max Units DC - 48 MHz Wakeup from Sleep mode - 0 - s Guaranteed by characterization TDEEPSLEEP Wakeup from Deep-Sleep mode - - 25 s 24-MHz IMO. Guaranteed by characterization THIBERNATE Wakeup from Hibernate mode - - 2 ms Guaranteed by characterization TSTOP Wakeup from Stop mode - - 2 ms XRES wakeup FCPU CPU frequency TSLEEP Details/Conditions 1.71 V VDD 5.5 V GPIO Table 11. GPIO DC Specifications Parameter VIH[7] VIL VOH VOL Min Typ Max Units Input voltage HIGH threshold Description 0.7 x VDD - - V Details/Conditions LVTTL input, VDD < 2.7 V 0.7 x VDD - - V - LVTTL input, VDD >= 2.7 V 2.0 - - V - Input voltage LOW threshold - - 0.3 x VDD V LVTTL input, VDD < 2.7 V - - 0.3x VDD V LVTTL input, VDD >= 2.7 V - - 0.8 V Output voltage HIGH level VDD -0.6 - - V IOH = 4 mA at 3.3-V VDD Output voltage HIGH level VDD -0.5 - - V IOH = 1 mA at 1.8-V VDD Output voltage LOW level - - 0.6 V IOL = 8 mA at 3.3-V VDD Output voltage LOW level - - 0.6 V IOL = 4 mA at 1.8-V VDD Output voltage LOW level - - 0.4 V IOL = 3 mA at 3.3-V VDD CMOS input CMOS input - - RPULLUP Pull-up resistor 3.5 5.6 8.5 k - RPULLDOWN Pull-down resistor 3.5 5.6 8.5 k - IIL Input leakage current (absolute value) - - 2 nA IIL_CTBM Input leakage on CTBm input pins - - 4 nA CIN Input capacitance - - 7 pF VHYSTTL Input hysteresis LVTTL 25 40 - mV VHYSCMOS Input hysteresis CMOS 0.05 x VDD - - 1 - IDIODE Current through protection diode to VDD/VSS - - 100 A - ITOT_GPIO Maximum total source or sink chip current - - 200 mA - 25 C, VDD = 3.3 V - - VDD > 2.7 V Note 7. VIH must not exceed VDD + 0.2 V. Document Number: 001-95662 Rev. *C Page 14 of 29 CYBLE-022001-00 Table 12. GPIO AC Specifications Parameter Description Min Typ Max Units Details/Conditions TRISEF Rise time in Fast-Strong mode 2 - 12 ns 3.3-V VDDD, CLOAD = 25 pF TFALLF Fall time in Fast-Strong mode 2 - 12 ns 3.3-V VDDD, CLOAD = 25 pF TRISES Rise time in Slow-Strong mode 10 - 60 ns 3.3-V VDDD, CLOAD = 25 pF TFALLS Fall time in Slow-Strong mode 10 - 60 ns 3.3-V VDDD, CLOAD = 25 pF FGPIOUT1 GPIO Fout; 3.3 V VDD 5.5 V Fast-Strong mode - - 33 MHz 90/10%, 25 pF load, 60/40 duty cycle FGPIOUT2 GPIO Fout; 1.7 VVDD 3.3 V Fast-Strong mode - - 16.7 MHz 90/10%, 25 pF load, 60/40 duty cycle FGPIOUT3 GPIO Fout; 3.3 V VDD 5.5 V Slow-Strong mode - - 7 MHz 90/10%, 25 pF load, 60/40 duty cycle FGPIOUT4 GPIO Fout; 1.7 V VDD 3.3 V Slow-Strong mode - - 3.5 MHz 90/10%, 25 pF load, 60/40 duty cycle FGPIOIN GPIO input operating frequency 1.71 V VDD 5.5 V - - 48 MHz 90/10% VIO Min Typ Max Units Table 13. OVT GPIO DC Specifications (P5_0 and P5_1 Only) Parameter Description Details/Conditions IIL Input leakage (absolute value). VIH > VDD - - 10 A 25C, VDD = 0 V, VIH = 3.0 V VOL Output voltage LOW level - - 0.4 V IOL = 20 mA, VDD > 2.9 V Table 14. OVT GPIO AC Specifications (P5_0 and P5_1 Only) Parameter Description Min Typ Max Units Details/Conditions TRISE_OVFS Output rise time in Fast-Strong mode 1.5 - 12 ns 25-pF load, 10%-90%, VDD=3.3 V TFALL_OVFS Output fall time in Fast-Strong mode 1.5 - 12 ns 25-pF load, 10%-90%, VDD=3.3 V TRISESS Output rise time in Slow-Strong mode 10 - 60 ns 25 pF load, 10%-90%, VDD = 3.3 V TFALLSS Output fall time in Slow-Strong mode 10 - 60 ns 25 pF load, 10%-90%, VDD = 3.3 V FGPIOUT1 GPIO FOUT; 3.3 V VDD 5.5 V Fast-Strong mode - - 24 MHz 90/10%, 25 pF load, 60/40 duty cycle FGPIOUT2 GPIO FOUT; 1.71 V VDD 3.3 V Fast-Strong mode - - 16 MHz 90/10%, 25 pF load, 60/40 duty cycle XRES Table 15. XRES DC Specifications Parameter Description Min Typ Max Units Details/Conditions VIH Input voltage HIGH threshold 0.7 x VDDD - - V CMOS input VIL Input voltage LOW threshold - - 0.3 x VDDD V CMOS input RPULLUP Pull-up resistor 3.5 5.6 8.5 k - CIN Input capacitance - 3 - pF - VHYSXRES Input voltage hysteresis - 100 - mV - IDIODE Current through protection diode to VDD/VSS - - 100 A - Document Number: 001-95662 Rev. *C Page 15 of 29 CYBLE-022001-00 Table 16. XRES AC Specifications Parameter TRESETWIDTH Description Reset pulse width Min Typ Max Units Details/Conditions 1 - - s - Serial Communication Table 17. I2C DC Specifications Min Typ Max Units Details/Conditions II2C1 Parameter Block current consumption at 100 kHz Description - - 10.5 A - II2C2 Block current consumption at 400 kHz - - 135 A - II2C3 Block current consumption at 1 Mbps - - 310 A - II2C4 I2C enabled in Deep-Sleep mode - - 1.4 A - Min Typ Max Units Details/Conditions - - 1 Mbps Maximum is applicable to Port 5[0] and Port 5[1] only Table 18. Fixed I2C AC Specifications Parameter FI2C1 Description Bit rate Table 19. Fixed UART DC Specifications Description Min Typ Max Units Details/Conditions IUART1 Parameter Block current consumption at 100 kbps - - 9 A - IUART2 Block current consumption at 1000 kbps - - 312 A - Min Typ Max Units Details/Conditions - - 1 Mbps - Table 20. Fixed UART AC Specifications Parameter FUART Description Bit rate Table 21. Fixed SPI DC Specifications Min Typ Max Units Details/Conditions ISPI1 Parameter Block current consumption at 1 Mbps Description - - 360 A - ISPI2 Block current consumption at 4 Mbps - - 560 A - ISPI3 Block current consumption at 8 Mbps - - 600 A - Table 22. Fixed SPI AC Specifications Parameter FSPI Description SPI operating frequency (master; 6x over sampling) Min Typ Max Units Details/Conditions - - 8 MHz - Table 23. Fixed SPI Master Mode AC Specifications Min Typ Max Units Details/Conditions TDMO Parameter MOSI valid after SCLK driving edge Description - - 18 ns - TDSI MISO valid before SCLK capturing edge Full clock, late MISO sampling used 20 - - ns Full clock, late MISO sampling THMO Previous MOSI data hold time 0 - - ns Referred to Slave capturing edge Document Number: 001-95662 Rev. *C Page 16 of 29 CYBLE-022001-00 Table 24. Fixed SPI Slave Mode AC Specifications Parameter Description Min Typ Max Units TDMI MOSI valid before SCLK capturing edge 40 - - ns TDSO MISO valid after SCLK driving edge - - 42 + 3 x TCPU ns TDSO_ext MISO Valid after SCLK driving edge in external clock mode. VDD < 3.0 V - - 50 ns THSO Previous MISO data hold time 0 - - ns TSSELSCK SSEL valid to first SCK valid edge 100 - - ns Refer to the CYBL10X6X datasheet at www.cypress.com/?rID=99422 for details on Analog (ADC, CapSense) and Digital (TCPWM) Peripherals DC and AC specifications. Memory Table 25. Flash DC Specifications Parameter Description Min Typ Max Units Details/Conditions 1.71 - 5.5 V - VPE Erase and program voltage TWS48 Number of Wait states at 32-48 MHz 2 - - CPU execution from flash TWS32 Number of Wait states at 16-32 MHz 1 - - CPU execution from flash TWS16 Number of Wait states for 0-16 MHz 0 - - CPU execution from flash Min Typ Max Units Table 26. Flash AC Specifications Parameter Description Details/Conditions TROWWRITE[8] TROWERASE[8] Row (block) write time (erase and program) - - 20 ms Row erase time - - 13 ms - TROWPROGRAM[8] TBULKERASE[8] TDEVPROG[8] Row program time after erase - - 7 ms - Bulk erase time (128 KB) - - 35 ms - - - 25 seconds - FEND Flash endurance 100 K - - cycles - FRET Flash retention. TA 55 C, 100 K P/E cycles 20 - - years - FRET2 Flash retention. TA 85 C, 10 K P/E cycles 10 - - years - Total device program time Row (block) = 128 bytes System Resources Power-on-Reset (POR) Table 27. POR DC Specifications Min Typ Max Units Details/Conditions VRISEIPOR Parameter Rising trip voltage Description 0.80 - 1.45 V - VFALLIPOR Falling trip voltage 0.75 - 1.40 V - VIPORHYST Hysteresis 15 - 200 mV - Min Typ Max Units Details/Conditions - - 1 s - Table 28. POR AC Specifications Parameter TPPOR_TR Description Precision power-on reset (PPOR) response time in Active and Sleep modes Note 8. It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash operations will be interrupted and cannot be relied on to have completed. Reset sources include the XRES pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watchdogs. Make certain that these are not inadvertently activated. Document Number: 001-95662 Rev. *C Page 17 of 29 CYBLE-022001-00 Table 29. Brown-Out Detect Parameter Description Min Typ Max Units Details/Conditions VFALLPPOR BOD trip voltage in Active and Sleep modes 1.64 - - V - VFALLDPSLP BOD trip voltage in Deep Sleep 1.4 - - V - Table 30. Hibernate Reset Parameter VHBRTRIP Description BOD trip voltage in Hibernate Min Typ Max Units Details/Conditions 1.1 - - V - Voltage Monitors (LVD) Table 31. Voltage Monitor DC Specifications Parameter VLVI1 Description LVI_A/D_SEL[3:0] = 0000b Min 1.71 Typ 1.75 Max 1.79 Units V Details/Conditions - VLVI2 LVI_A/D_SEL[3:0] = 0001b 1.76 1.80 1.85 V - VLVI3 LVI_A/D_SEL[3:0] = 0010b 1.85 1.90 1.95 V - VLVI4 LVI_A/D_SEL[3:0] = 0011b 1.95 2.00 2.05 V - VLVI5 LVI_A/D_SEL[3:0] = 0100b 2.05 2.10 2.15 V - VLVI6 LVI_A/D_SEL[3:0] = 0101b 2.15 2.20 2.26 V - VLVI7 LVI_A/D_SEL[3:0] = 0110b 2.24 2.30 2.36 V - VLVI8 LVI_A/D_SEL[3:0] = 0111b 2.34 2.40 2.46 V - VLVI9 LVI_A/D_SEL[3:0] = 1000b 2.44 2.50 2.56 V - VLVI10 LVI_A/D_SEL[3:0] = 1001b 2.54 2.60 2.67 V - VLVI11 LVI_A/D_SEL[3:0] = 1010b 2.63 2.70 2.77 V - VLVI12 LVI_A/D_SEL[3:0] = 1011b 2.73 2.80 2.87 V - VLVI13 LVI_A/D_SEL[3:0] = 1100b 2.83 2.90 2.97 V - VLVI14 LVI_A/D_SEL[3:0] = 1101b 2.93 3.00 3.08 V - VLVI15 LVI_A/D_SEL[3:0] = 1110b 3.12 3.20 3.28 V - VLVI16 LVI_A/D_SEL[3:0] = 1111b 4.39 4.50 4.61 V - LVI_IDD Block current - - 100 A - Min Typ Max Units Details/Conditions - - 1 s - Min Typ Max Units Details/Conditions - - 14 MHz SWDCLK 1/3 CPU clock frequency Table 32. Voltage Monitor AC Specifications Parameter TMONTRIP Description Voltage monitor trip time SWD Interface Table 33. SWD Interface Specifications Parameter Description F_SWDCLK1 3.3 V VDD 5.5 V F_SWDCLK2 1.71 V VDD 3.3 V - - 7 MHz SWDCLK 1/3 CPU clock frequency T_SWDI_SETUP T = 1/f SWDCLK 0.25 x T - - ns - T_SWDI_HOLD 0.25 x T - - ns - T_SWDO_VALID T = 1/f SWDCLK T = 1/f SWDCLK - - 0.5 x T ns - T_SWDO_HOLD 1 - - ns - T = 1/f SWDCLK Document Number: 001-95662 Rev. *C Page 18 of 29 CYBLE-022001-00 Internal Main Oscillator Table 34. IMO DC Specifications Parameter Description Min Typ Max Units Details/Conditions IIMO1 IMO operating current at 48 MHz - - 1000 A - IIMO2 IMO operating current at 24 MHz - - 325 A - IIMO3 IMO operating current at 12 MHz - - 225 A - IIMO4 IMO operating current at 6 MHz - - 180 A - IIMO5 IMO operating current at 3 MHz - - 150 A - Table 35. IMO AC Specifications Description Min Typ Max Units FIMOTOL3 Parameter Frequency variation from 3 to 48 MHz - - 2 % Details/Conditions FIMOTOL3 IMO startup time - 12 - s - Min Typ Max Units Details/Conditions - 0.3 1.05 A - With API-called calibration Internal Low-Speed Oscillator Table 36. ILO DC Specifications Parameter IILO2 Description ILO operating current at 32 kHz Table 37. ILO AC Specifications Min Typ Max Units Details/Conditions TSTARTILO1 Parameter ILO startup time Description - - 2 ms - FILOTRIM1 32-kHz trimmed frequency 15 32 50 kHz - Table 38. ECO Trim Value Specification Parameter ECOTRIM Description 24-MHz trim value (firmware configuration) Document Number: 001-95662 Rev. *C Value Details/Conditions 0x00003FFA Optimum trim value that needs to be loaded to register CY_SYS_XTAL_BLERD_BB_XO_CAPTRIM_REG Page 19 of 29 CYBLE-022001-00 Environmental Specifications Environmental Compliance This Cypress BLE module is built in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBLE-022001-00 module is certified under the following RF certification standards: FCC: WAP2001 CE IC: 7922A-2001 MIC: 005-101007 KC: MSIP-CRM-Cyp-2001 Environmental Conditions Table 39 describes the operating and storage conditions for the Cypress BLE module. Table 39. Environmental Conditions for CYBLE-022001-00 Description Operating temperature Operating humidity (relative, non-condensation) Thermal ramp rate Minimum Specification Maximum Specification -40 C 85 C 5% 85% - 3 C/minute -40 C 85 C Storage temperature and humidity - 85 C at 85% ESD: Module integrated into system Components[9] - 15 kV Air 2.2 kV Contact Storage temperature ESD and EMI Protection Exposed components require special attention to ESD and electromagnetic interference (EMI). A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground. Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability. Note 9. This does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for 500-V HBM. Document Number: 001-95662 Rev. *C Page 20 of 29 CYBLE-022001-00 Regulatory Information FCC FCC NOTICE: The device CYBLE-022001-00, including the antenna 2450AT18B100 from Johanson Technology, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. CAUTION: The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Cypress Semiconductor may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,e may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help LABELING REQUIREMENTS: The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP2001. In any case the end product must be labeled exterior with "Contains FCC ID: WAP2001" ANTENNA WARNING: This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennas in Table 6 on page 11, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of CYBLE-022001-00 with the chip antenna mounted (FCC ID: WAP2001) is far below the FCC radio frequency exposure limits. Nevertheless, use CYBLE-022001-00 in such a manner that minimizes the potential for human contact during normal operation. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Document Number: 001-95662 Rev. *C Page 21 of 29 CYBLE-022001-00 Industry Canada (IC) Certification CYBLE-022001-00 is licensed to meet the regulatory requirements of Industry Canada (IC), License: IC: 7922A-2001 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in Table 6 on page 11, having a maximum gain of 0.5 dBi. Antennas not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. IC NOTICE: The device CYBLE-022001-00 including the antenna 2450AT18B100 from Johanson technology, complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. LABELING REQUIREMENTS: The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the IC Notice above. The IC identifier is 7922A-2001. In any case, the end product must be labeled in its exterior with "Contains IC: 7922A-2001" European R&TTE Declaration of Conformity Hereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-022001-00 complies with the essential requirements and other relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the end-customer equipment should be labeled as follows: All versions of the CYBLE-022001-00 in the specified reference design can be used in the following countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway. Document Number: 001-95662 Rev. *C Page 22 of 29 CYBLE-022001-00 MIC Japan CYBLE-022001-00 is certified as a module with type certification number 005-101007. End products that integrate CYBLE-022001-00 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Model Name: EZBLE PRoC Module Part Number: CYBLE02200100 Manufactured by Cypress Semiconductor. 005101007 KC Korea CYBLE-022001-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2001. Document Number: 001-95662 Rev. *C Page 23 of 29 CYBLE-022001-00 Ordering Information Table 40 lists the CYBLE-022001-00 part number and features. Table 40. Ordering Information Part Number CPU Speed (MHz) Flash Size (KB) CapSense SCB TCPWM 12-Bit SAR ADC I2S LCD Package Packaging CYBLE-022001-00 48 128 Yes 2 4 1 Msps Yes Yes 21-SMT Tape and Reel Ordering Code Definitions The part numbers are of the form CYBLE-ABCDEF-GH where the fields are defined as follows. For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website. U.S. Cypress Headquarters Address U.S. Cypress Headquarter Contact Info Cypress website address Document Number: 001-95662 Rev. *C 198 Champion Court, San Jose, CA 95134 (408) 943-2600 http://www.cypress.com Page 24 of 29 CYBLE-022001-00 Packaging The CYBLE-022001-00 is offered in tape and reel packaging. Figure 8 details the tape dimensions used for the CYBLE-022001-00. Figure 8. CYBLE-022001-00 Tape Dimensions Figure 9 details the orientation of the CYBLE-022001-00 in the tape as well as the direction for unreeling. Figure 9. Component Orientation in Tape and Unreeling Direction Document Number: 001-95662 Rev. *C Page 25 of 29 CYBLE-022001-00 Figure 10 details reel dimensions used for the CYBLE-022001-00. Figure 10. Reel Dimensions The CYBLE-022001-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBLE-022001-00 is detailed in Figure 11. Figure 11. CYBLE-022001-00 Center of Mass Document Number: 001-95662 Rev. *C Page 26 of 29 CYBLE-022001-00 Acronyms Document Conventions Table 41. Acronyms Used in this Document Acronym Description Units of Measure Table 42. Units of Measure BLE Bluetooth Low Energy Bluetooth SIG Bluetooth Special Interest Group C degree Celsius CE European Conformity kV kilovolt CSA Canadian Standards Association mA milliamperes EMI electromagnetic interference mm millimeters ESD electrostatic discharge mV millivolt FCC Federal Communications Commission A microamperes GPIO general-purpose input/output m micrometers IC Industry Canada MHz megahertz IDE integrated design environment GHz gigahertz KC Korea Certification V volt MIC Ministry of Internal Affairs and Communications (Japan) PCB printed circuit board RX receive QDID qualification design ID SMT surface-mount technology; a method for producing electronic circuitry in which the components are placed directly onto the surface of PCBs TCPWM timer, counter, pulse width modulator (PWM) TUV Germany: Technischer Uberwachungs-Verein (Technical Inspection Association) TX transmit Document Number: 001-95662 Rev. *C Symbol Unit of Measure Page 27 of 29 CYBLE-022001-00 Document History Page Document Title: CYBLE-022001-00 EZ-BLETM PRoCTM Module Document Number: 001-95662 Revision ECN Orig. of Change ** 4662055 DSO 02/18/2015 Preliminary datasheet for CYBLE-022001-00 module. DSO Updated Pad 10 on module pinout from NC to GND. Updated Module Pad Assignment in Figure 1 on page 4. 03/09/2015 Updated title of Table 3 to "Module Solder Pad Connection Dimensions". Updated Table 4 to change Pad 10 from NC to GND. Updated Figure 5, Figure 6, and Figure 7 to update Pad 10 from NC to GND. DSO Updated Title Page heading to "EZ-BLETM PRoCTM Module". Updated Module Description to correct GPIO number from "12" to "16". Updated Module Description to add QDID and Declaration ID under Bluetooth SIG 4.1 qualified item. Updated Functional Capabilities to correct number of capacitive sensors. 04/01/2015 supported from nine to 13. Updated Power Consumption Stop mode as "60 nA with XRES wakeup". Updated terms "pre-certified" and "pre-qualified" to "certified" and "qualified" respectively. Updated Table 10 to change Details/Conditions to "XRES wakeup". Updated Acronyms to add "QDID". DSO Changed document status from "Preliminary" to "Final". Updated Functional Capabilities to correct number of capacitive sensors. supported from nine to 15. Updated Module Description to add identification numbers for FCC, IC, KC, and MIC regulatory agencies. Updated Power Supply Connections and Recommended External Components. 06/26/2015 section to specify power supply ramp timing for VDD and VDDR. Updated Figure 7 to final design schematic. Update IDD15 in Table 9 from 1.3 A to 1.5 A. Added Packaging section. Added Ordering Code Definitions. Updated Acronyms to add "SMT". *A *B *C 4679323 4710754 4812402 Submission Date Document Number: 001-95662 Rev. *C Description of Change Page 28 of 29 CYBLE-022001-00 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC(R) Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/memory cypress.com/go/psoc cypress.com/go/touch psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/go/support cypress.com/go/USB cypress.com/go/wireless (c) Cypress Semiconductor Corporation, 2015. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress' product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-95662 Rev. *C Revised June 26, 2015 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 29 of 29 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Cypress Semiconductor: CYBLE-022001-00ES CYBLE-022001-00