BA2901YFV-CE2 - ROHM Co., Ltd. - Datasheet.Directory

TSZ22111･14･001 1/29 8.MAY.2013 Rev.004

Comparator series

Automotive

Ground Sense Comparators

BA2903Yxxx-C, BA2901Yxx-C

●General Description

BA2903Yxxx-C/BA2901Yxx-C, integrate two or four

independent high gain voltage comparator.

Some features are the wide operating voltage that is

2V to 36V and low supply current. BA2903Yxxx-C,

BA2901Yxx-C are manufactured for automotive

requirements of engine control unit, electric power

steering, antilock brake system, etc.

●Features

 AEC-Q100 Qualified

 Single or dual supply operation

 Wide operating supply voltage

 Standard comparator Pin-assignments

 Common-mode Input Voltage Range includes groun d

level, allowing direct ground sensing

 Internal ESD protection circuit

 Wide temperature range

●Key Specifications

 Wide operating supply voltage

single supply : +2.0V to +36V

split supply : ±1.0V to ±18V

 Very low supply current

BA2903Yxxx-C 0.6mA(Typ.)

BA2901Yxx-C 0.8mA(Typ.)

 Low input bias current : 50nA(Typ.)

 Low input offset current : 5nA(Typ.)

 Operating temperature range : -40℃ to +125℃

●Packages W(Typ.) x D(Typ.) x H(Max.)

SOP8 5.00mm x 6.20mm x 1.71mm

SOP14 8.70mm x 6.20mm x 1.71mm

SSOP-B8 3.00mm x 6.40mm x 1.35mm

SSOP-B14 5.00mm x 6.40mm x 1.35mm

MSOP8 2.90mm x 4.00mm x 0.90mm

●Application

 Engine Control Unit

 Electric Power Steering (EPS)

 Anti-Lock Braking System (ABS)

 Automotive electronics

●Selection Guide

●Simplified schematic

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

Figure 1. Simplified schematic (one channel only)

+IN

-IN

OUT

VCC

VEE

Automotive

Quad

Dual

0.8mA

0.6mA

Supply Current BA2903YF-C

BA2903YFV-C

BA2903YFVM-C

BA2901YF-C

BA2

1YFV-

+125℃

Maximum Operating Temperature

TSZ22111･15･001 2/29 8.MAY.2013 Rev.004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Pin Configuration

BA2903YF-C : SOP8

BA2903YFV-C : SSOP-B8

BA2903YFVM-C : MSOP8

Pin No. Pin name

1 OUT1

2 -IN1

3 +IN1

4 VEE

5 +IN2

6 -IN2

7 OUT2

8 VCC

BA2901YF-C : SOP14

BA2901YFV-C : SSOP-B14

Pin No. Pin name

1 OUT2

2 OUT1

3 VCC

4 -IN1

5 +IN1

6 -IN2

7 +IN2

8 -IN3

9 +IN3

10 -IN4

11 +IN4

12 VEE

13 OUT4

14 OUT3

Package

SOP8 SSOP-B8 MSOP8 SOP14 SSOP-B14

BA2903YF-C BA2903YFV-C BA2903YFVM-C BA2901YF-C BA2901YFV-C

+ -

CH1

CH2

OUT1

OUT2

-IN2

+IN2

+IN1

-IN1

VEE

VCC

-+-+

OUT1

OUT2 OUT3

OUT4

7 8

CH1

CH2 CH3

CH4

VCC

-IN1

+IN1

+IN2

-IN2 +IN3

-IN3

VEE

+IN4

-IN4

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Ordering Information

B A 2 9 0 x Y x x x - C x x

Part Number

BA2903Yxxx

BA2901Yxx

Package

F : SOP8

SOP14

FV : SSOP-B8

: SSOP-B14

FVM : MSOP8

Packaging and forming specific ation

C: Automotive (engine control unit,

electric power steering, antilock

braking system, etc.)

E2: Embossed tape and reel

(SOP8/SOP14/SSOP-B8/

SSOP-B14)

TR: Embossed tape and reel

(MSOP8)

●Line-up

Topr Operating

Supply Voltage Dual/Quad Package Orderable

Part Number

-40℃ to +125℃ +2.0V to +36V

Dual

SOP8 Reel of 2500 BA2903YF-CE2

SSOP-B8 Reel of 2500 BA2903YFV-CE2

MSOP8 Reel of 3000 BA2903YFVM-CTR

Quad SOP14 Reel of 2500 BA2901YF-CE2

SSOP-B14 Reel of 2500 BA2901YFV-CE2

●Absolute Maximum Ratings (Ta=25℃)

Parameter Symbol Ratings Unit

Supply Voltage VCC-VEE +36 V

Power Dissipation

SOP8 770*1*6

SSOP-B8 620*2*6

MSOP8 580*3*6

SOP14 560*4*6

SSOP-B14 870*5*6

Differential Input Voltage *7 Vid +36 V

Input Common-mode Voltage Range Vicm (VEE-0.3) to (VEE+36) V

Input Current

Ii -10 mA

Operating Supply Voltage Vopr +2.0 to +36

(±1.0 to ±18) V

Operating Temperature Range Topr -40 to +125 ℃

S torage Temperature Range Tstg -55 to +150 ℃

Maximum junction Temperature Tjmax +150 ℃

Note : Absolute maximum rating item indicates the condition which must not be exceeded.

Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause

deterioration of characteristics.

*1 To use at temperature above Ta＝25℃ reduce 6.2mW/℃.

*2 To use at temperature above Ta＝25℃ reduce 5.5mW/℃.

*3 To use at temperature above Ta＝25℃ reduce 4.7mW/℃.

*4 To use at temperature above Ta＝25℃ reduce 4.9mW/℃.

*5 To use at temperature above Ta＝25℃ reduce 7.0mW/℃.

*6 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).

*7 The voltage difference between inverting input and non-inverting input is the differential input voltage.

Then input pin voltage is set to more than VEE.

*8 An excessive input current will flow when input voltages of lesser than VEE-0.6V are applied.

The input current can be set to less than the rated current by adding a limiting resistor.

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Electrical Characteristics

○BA2903Yxxx-C (Unless otherwise specified VCC=+5V, VEE=0V)

Parameter Symbol

Temperature

range Limits Unit Conditions

Min. Typ. Max.

Input Offset Voltage *9 Vio

25℃ - 2 4

mV OUT=1.4V

Full range - - 5 VCC=5 to 36V, OUT=1.4V

Input Offset Current *9 Iio

25℃ - 5 40

nA OUT=1.4V

Full range - - 50

Input Bias Current *9 Ib

25℃ - 50 250

nA OUT=1.4V

Full range - - 275

Input Common-mode

Voltage Range Vicm 25℃ 0 - VCC-1.5 V-

Full range 0 - VCC-2.0

Large Signal Voltage Gain Av 25℃ 88 100 -

dB VCC=15V, OUT=1.4 to 11.4V

RL=15kΩ, VRL=15V

Full range 74 - -

Supply Current ICC 25℃ - 0.6 1

mA OUT=open

Full range - - 2.5 OUT=open, VCC=36V

Output Sink Current *10 Isink 25℃ 6 16 - mA +IN=0V, -IN=1V, VOL=1.5V

Output Saturation Voltage

(Low level output voltage) VOL 25℃ - 150 400

mV +IN=0V, -IN=1V,

Isink=4mA

Full range - - 700

Output Leakage Current

(High level output current) Ileak 25℃ - 0.1 -

μA+IN=1V, -IN=0V, VOH=5V

Full range - - 1 +IN=1V, -IN=0V, VOH=36V

Response T ime Tre 25℃ - 1.3 -

μs

RL=5.1kΩ, VRL=5V

IN=100mVP-P, overdrive=5mV

- 0.4 - RL=5.1kΩ, VRL=5V, IN=TT L

Logic Swing, VREF=1.4V

Operable Frequency Fopr 25℃ 100 - - kHz VCC=5V, RL=2kΩ, +I N=1.5V, -IN=5Vp-p

(Duty 50% Rectangular Pulse)

*9 Absolute value

*10 Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

○BA2901Yxx-C (Unless otherwise specified VCC=+5V, VEE=0V)

Parameter Symbol

Temperature

range Limits Unit Conditions

Min. Typ. Max.

Input Offset Voltage *11 Vio

25℃ - 2 4

mV OUT=1.4V

Full range - - 5 VCC=5 to 36V, OUT=1.4V

Input Offset Current *11 Iio

25℃ - 5 40

nA OUT=1.4V

Full range - - 50

Input Bias Current *11 Ib

25℃ - 50 250

nA OUT=1.4V

Full range - - 275

Input Common-mode

Voltage Range Vicm 25℃ 0 - VCC-1.5 V-

Full range 0 - VCC-2.0

Large Signal Voltage Gain Av 25℃ 88 100 -

dB VCC=15V, OUT=1.4 to 11.4V

RL=15kΩ, VRL=15V

Full range 74 - -

Supply Current ICC 25℃ - 0.8 2

mA OUT=open

Full range - - 2.5 OUT=open, VCC=36V

Output Sink Current *12 Isink 25℃ 6 16 - mA +IN=0V, -IN=1V, VOL=1.5V

Output Saturation Voltage

(Low level output voltage) VOL 25℃ - 150 400

mV +IN=0V, -IN=1V,

Isink=4mA

Full range - - 700

Output Leakage Current

(High level output current) Ileak 25℃ - 0.1 -

μA+IN=1V, -IN=0V, VOH=5V

Full range - - 1 +IN=1V, -IN=0V, VOH=36V

Response T ime Tre 25℃ - 1.3 -

μs

RL=5.1kΩ, VRL=5V

IN=100mVP-P, overdrive=5mV

- 0.4 - RL=5.1kΩ, VRL=5V, IN=TT L

Logic Swing, VREF=1.4V

Operable Frequency Fopr 25℃ 100 - - kHz VCC=5V, RL=2kΩ, +I N=1.5V, -IN=5Vp-p

(Duty 50% Rectangular Pulse)

*1 1 Absolute value

*12 Under high temperatures, please consider the power dissipation when selecting the output current.

When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

Description of Electrical Characteristics

Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also

shown. Note that item name and symbol and their meaning may differ from those on another manufacturer ’s document or

general document.

1. Absolute maximum ratings

Absolute maximum rating ite ms indicate the condition which mu st not be exceeded. Application of voltage in excess of absolut e

maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.

1.1 Supply Voltage (VCC-VEE)

Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power

supply terminal without deterioration or destruction of characteristics of internal circuit.

1.2 Differential Input Voltage (Vid)

Indicates the maximum voltage that can be applied bet ween non-inverting and inverting terminals without damaging

the IC.

1.3 Input Common-mode Voltage Range (Vicm)

Indicates the maximum voltage that can be appl ied to the non-inverting and i nverting terminals without deterioration

or destruction of electrical char acteristics. In put common-mode v oltage range of the ma ximum ratings does n ot assure

normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.

1.4 Operating and Storage Temperature Ranges (Topr,Tstg)

The operating temperature range indicates the temperature range within which the IC can operate. The higher the

ambient temperature, the lower the po wer consumption of the IC. T he storage temperature range denot es the range

of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.

1.5 Power Dissipation (Pd)

Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃

(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in

the package (maximum junction temperature) and the ther mal resistance of the package.

2.Electrical characteristics

2.1 Input Offset Voltage (Vio)

Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the

input voltage difference required for setting the output voltage at 0 V.

2.2 Input Offset Current (Iio)

Indicates the difference of input bias current between the non-invertin g and inverting terminals.

2.3 Input Bias Current (Ib)

Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at

the non-inverting and inverting terminals.

2.4 Input Common-mode Voltage Range (Vicm)

Indicates the input voltage range where IC normally operates.

2.5 Large Signal Voltage Gain (Av)

Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal

and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.

Av = (Output voltage) / (Differential input voltage)

2.6 Supply current (ICC)

Indicates the current that flows within the IC under specified no-load conditi ons.

2.7 Output Sink Current (Isink)

Indicates the current flowing into the IC under specific output conditions.

2.8 Output Saturation Voltage ( Low level output voltage) (VOL)

Indicates the lower limit of output voltage under specific input and output conditions.

2.9 Output Leakage Current( High level output current) (Ileak)

Indicates the current that flows into the IC under specific input and output conditions.

2.11 Response Time (Tre)

Indicates the time interval between the ap plication of input and output conditions.

2.10 Operable Frequency (Fopr)

Indicates minimum frequency that IC moves under specific conditions..

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves

○BA2903Yxxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

Figure 3.

Supply Current – Supply Voltage

Figure 4.

Supply Current – Ambient

Temperature

Figure 5.

Maximum Output Voltage – Supply Voltage

(Isink=4mA)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 10203040

SUPPLY CURRENT [mA] .

SU PPLY VOLTAGE [ V]

100

150

200

0 10203040

MAXIMUM OUT PUT VOLT AGE [mV]

SUPPLY VOLT AGE [V]

25℃

125℃

-40℃

36V

5V 2V 25℃

125℃

-40℃

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

-50 -25 0 25 50 75 100 125 150

SUPPLY CURRENT [mA]

AM BI EN T TEM PER ATU R E [ ℃]

Figure 2.

Derating Curve

200

400

600

800

1000

0 25 50 75 100 125 150

POWER DISSIPATION [m W]

AMBIEN T T EMPERAT U RE [ ℃]

BA2903YFVM-C

BA2903YFV-C

BA2903YF-C

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2903Yxxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

-8

-6

-4

-2

0 10203040

I N PU T OF F SET VOLTAGE [ m V]

SU PPLY VOLTAGE [ V]

Figure 7.

Output Voltage – Output Sink Current

(VCC=5V)

Figure 8.

Output Sink Current – Ambient Temperature

(OUT=1.5V)

Figure 9.

Input Offset Voltage – Supply Voltage

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

02468101214161820

OUTPUT VOLTAGE [V]

OUTPUT SINK CURRENT [mA]

-50 -25 0 25 50 75 100 125 150

OUTPUT SINK CURRENT [mA]

AM BI EN T TEM PER ATU R E [ ℃]

25℃

125℃

-40℃

36V

25℃

125℃

-40℃

Figure 6.

Maximum Output Voltage – Ambient Temperature

(Isink=4mA)

36V 5V

100

150

200

-50 -25 0 25 50 75 100 125 150

MAXIMUM OUT PUT VOLT AGE [ mV]

AMBIENT TEMPERAT URE [℃]

TSZ22111･15･001 8/29 8.MAY.2013 Rev.004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2903Yxxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

Figure 10.

Input Offset Voltage – Ambient

Temperature

Figure 11.

Input Bias Current – Supply Voltage

Figure 13.

Input Offset Current – Supply Voltage

Figure 12.

Input Bias Current – Ambient Temperature

-8

-6

-4

-2

-50 -25 0 25 50 75 100 125 150

I N PU T OF F SET VOLTAGE [ m V]

AM BI EN T TEM PER ATU R E [ ℃]

100

120

140

160

0 5 10 15 20 25 30 35

INPUT BIAS CURRENT [nA]

SU PPLY VOLTAGE [ V]

100

120

140

160

-50-250 255075100125150

INPUT BIAS CURRENT [nA]

AM BI EN T TEM PER ATU R E [ ℃]

-50

-40

-30

-20

-10

0 10203040

INPUT OFFSET CURRENT[nA]

SU PPLY VOLTAGE [ V]

36V

25℃

125℃

-40℃

36V

5V 2V

25℃ 125℃

-40℃

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2903Yxxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

Figure 14.

Input Offset Current

– Ambient Temperature

Figure 15.

Large Signal Voltage Gain

– Supply Voltage

Figure 17.

Common Mode Rejection Ratio

– Supply Voltage

Figure 16.

Large Signal Voltage Gain

– Ambient Temperature

100

110

120

130

140

0 10203040

LARGE SINGAL VOLT AGE GAI N [ dB]

SU PPLY VOLTAGE [ V]

-50

-40

-30

-20

-10

-50-250 255075100125150

INPUT OFFSET CURRENT [nA]

AM BI EN T TEM PER ATU R E [ ℃]

100

110

120

130

140

-50-250 255075100125150

LARGE SINGAL VOLT AGE GAI N [ dB]

AM BI EN T TEM PER ATU R E [ ℃]

100

120

140

160

0 10203040

COMMO N MODE REJ ECTION RATIO [dB]

SU PPLY VOLTAGE [V]

2V 5V

36V

125℃

-40℃

25℃

15V 5V

36V

-40℃ 25℃

125℃

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2903Yxxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

-100 -80 -60 -40 -20 0

RESPONSE TIME (L OW TO HIGH)[μs]

OVER DRIVE VOLT AGE [m V]

Figure 18.

Common Mode Rejection Ratio

– Ambient Temperature

Figure 19.

Input Offset Voltage – Input Voltage

(VCC=5V)

Figure 20.

Power Supply Rejection Ratio

– Ambient Temperature

Figure 21.

Response Time (Low to High) – Over Drive Voltage

(VCC=5V, VRL=5V, RL=5.1kΩ)

-6

-4

-2

-1012345

I N PU T OF F SET VOLTAGE [ m V]

I N PU T VOLTAGE [ V]

100

125

150

-50-250 255075100125150

COMMO N MODE RE J ECTIO N RATI O [ dB]

AM BI EN T TEM PER ATU R E [ ℃]

100

120

140

160

180

200

-50-250 255075100125150

POWER SUPPLY REJECTION RATIO [dB]

AM BI EN T TEM PER ATU R E [ ℃]

36V

-40℃

25℃

125℃

-40℃ 25℃ 125℃

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2903Yxxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

-50 -25 0 25 50 75 100 125 150

RRESPONSE TIM E ( LOW TO HIGH )[μs]

AMBIENT TEMPER AT U RE [℃]

-50 -25 0 25 50 75 100 125 150

RESPONSE TIME (HIGH TO LOW)[μs]

AMBIENT T EMPERAT URE [℃]

0 20406080100

RESPONSE TIME (HIGH TO LOW)[μs]

OVER D R I VE VOLTAGE [ m V]

Figure 22.

Response T ime (Low to High)

– Ambient Temperature

(VCC=5V, VRL=5V, RL=5.1kΩ)

Figure 23.

Response Time (High to Low)

– Over Drive Voltage

(VCC=5V, VRL= 5V, RL=5.1kΩ)

Figure 24.

Response Time (High to Low)

– Ambient Temperature

(VCC=5V, VRL=5V, RL=5.1kΩ)

5mV overdrive

20mV overdrive

100mV overdrive

-40℃

25℃

125℃

5mV overdrive

20mV overdrive

100mV overdrive

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves

○BA2901Yxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

200

400

600

800

1000

0 25 50 75 100 125 150

POWER DISSIP ATION [mW]

AMBIENT TEMPERATURE [℃]

Figure 27.

Supply Current – Ambient Temperature

Figure 25.

Derating Curve Figure 26.

Supply Current – Supply Voltage

BA2901YF-C

BA2901YFV-C

Figure 28.

Maximum Output Voltage – Supply Voltage

(Isink=4mA)

100

150

200

0 10203040

MAXIMUM OUT PUT VOLT AGE [mV]

SUPPLY VOLT AGE [V]

25℃

125℃

-40℃

25℃

125℃

-40℃

0.0

0.5

1.0

1.5

2.0

0 10203040

SUPPLY CURRENT [mA]

SUPPLY VOLTAGE [V]

36V

0.0

0.5

1.0

1.5

2.0

-50 -25 0 25 50 75 100 125 150

SUPPLY CURRENT [mA ]

AMBIENT TEMPERATURE [℃]

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BA2903Yxxx-C, BA2901Yxx-C Datasheet

100

150

200

-50 -25 0 25 50 75 100 125 150

MAXIMUM OUT PUT VOLT AGE [ mV]

AMBIENT TEMPERAT URE [℃]

●Typical Performance Curves -Continued

○BA2901Yxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

-8

-6

-4

-2

0 10203040

I N PU T OF F SET VOLTAGE [ m V]

SU PPLY VOLTAGE [ V]

Figure 29.

Maximum Output Voltage – Ambient Temperature

(Isink=4mA)

Figure 30.

Output Voltage – Output Sink Current

(VCC=5V)

Figure 31.

Output Sink Current – Ambient Temperature

(OUT=1.5V)

Figure 32.

Input Offset Voltage – Supply Voltage

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

02468101214161820

OUTPUT VOLTAGE [V]

OUTPUT SINK CURRENT [mA]

-50 -25 0 25 50 75 100 125 150

OUTPUT SINK CURRENT [mA]

AM BI EN T TEM PER ATU R E [ ℃]

25℃

125℃

-40℃

36V

25℃

125℃

-40℃

36V 5V

TSZ22111･15･001 14/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2901Yxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

Figure 33.

Input Offset Voltage – Ambient

Temperature

Figure 34.

Input Bias Current – Supply Voltage

Figure 36.

Input Offset Current – Supply Voltage

Figure 35.

Input Bias Current – Ambient Temperature

-8

-6

-4

-2

-50 -25 0 25 50 75 100 125 150

I N PU T OF F SET VOLTAGE [ m V]

AM BI EN T TEM PER ATU R E [ ℃]

100

120

140

160

0 5 10 15 20 25 30 35

INPUT BIAS CURRENT [nA]

SU PPLY VOLTAGE [ V]

100

120

140

160

-50-250 255075100125150

INPUT BIAS CURRENT [nA]

AM BI EN T TEM PER ATU R E [

℃

]

-50

-40

-30

-20

-10

0 10203040

INPUT OFFSET CURRENT[nA]

SU PPLY VOLTAGE [ V]

36V

25℃

125℃

-40℃

36V

5V 2V

25℃ 125℃

-40℃

TSZ22111･15･001 15/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2901Yxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

Figure 37.

Input Offset Current

– Ambient Temperature

Figure 38.

Large Signal Voltage Gain

– Supply Voltage

Figure 40.

Common Mode Rejection Ratio

– Supply Voltage

Figure 39.

Large Signal Voltage Gain

– Ambient Temperature

100

110

120

130

140

0 10203040

LARGE SINGAL VOLT AGE GAI N [ dB]

SU PPLY VOLTAGE [ V]

-50

-40

-30

-20

-10

-50-250 255075100125150

INPUT OFFSET CURRENT [nA]

AM BI EN T TEM PER ATU R E [

℃

]

100

110

120

130

140

-50-250 255075100125150

LARGE SINGAL VOLT AGE GAI N [ dB]

AM BI EN T TEM PER ATU R E [ ℃]

100

120

140

160

0 10203040

COMMO N MODE REJ ECTION RATIO [dB]

SU PPLY VOLTAGE [V]

2V 5V

36V

125℃

-40℃

25℃

15V 5V

36V

-40℃ 25℃

125℃

TSZ22111･15･001 16/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2901Yxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

-100 -80 -60 -40 -20 0

RESPONSE TIME (L OW TO HIGH)[μs]

OVER DRIVE VOLT AGE [m V]

-40℃ 25℃ 125℃

Figure 41.

Common Mode Rejection Ratio

– Ambient Temperature

Figure 42.

Input Offset Voltage – Input Voltage

(VCC=5V)

Figure 43.

Power Supply Rejection Ratio

– Ambient Temperature

Figure 44.

Response Time (Low to High) – Over Drive Voltage

(VCC=5V, VRL=5V, RL=5.1kΩ)

-6

-4

-2

-1012345

I N PU T OF F SET VOLTAGE [ m V]

I N PU T VOLTAGE [ V]

100

125

150

-50-250 255075100125150

COMMO N MODE RE J ECTIO N RATI O [ dB]

AM BI EN T TEM PER ATU R E [ ℃]

100

120

140

160

180

200

-50-250 255075100125150

POWER SUPPLY REJECTION RATIO [dB]

AM BI EN T TEM PER ATU R E [

℃

]

36V

-40℃

25℃

125℃

TSZ22111･15･001 17/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Typical Performance Curves -Continued

○BA2901Yxx-C

(*)The data above is measurement value of typical sample, it is not guaranteed.

-50 -25 0 25 50 75 100 125 150

RRESPONSE TIM E ( LOW TO HIGH )[μs]

AMBIENT TEMPER AT U RE [℃]

-50 -25 0 25 50 75 100 125 150

RESPONSE TIME (HIGH TO LOW)[μs]

AMBIENT T EMPERAT URE [℃]

0 20406080100

RESPONSE TIME (HIGH TO LOW)[μs]

OVER D R I VE VOLTAGE [ m V]

Figure 45.

Response T ime (Low to High)

– Ambient Temperature

(VCC=5V, VRL=5V, RL=5.1kΩ)

Figure 46.

Response Time (High to Low)

– Over Drive Voltage

(VCC=5V, VRL= 5V, RL=5.1kΩ)

Figure 47.

Response Time (High to Low)

– Ambient Temperature

(VCC=5V, VRL=5V, RL=5.1kΩ)

5mV overdrive

20mV overdrive

100mV overdrive

-40℃

25℃

125℃

5mV overdrive

20mV overdrive

100mV overdrive

TSZ22111･15･001 18/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Power Dissipation

Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC

consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable

temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and

consumable power.

Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the

thermal resistance of the package used (heat dissipation capability). Ma ximum junction t emperature is typical ly equal to the

maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold

resin or lead frame of the package. Thermal resistance, represente d by the symbol θja°C/W, indicates this heat dissipation

capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.

Figure 50. (a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the

Thermal resistance (θja), given the ambient temperature (Ta), junction temperature (Tj), and po wer dissipation (Pd).

θja = (Tjmax-Ta) / Pd ℃/W ・・・・・ (Ⅰ)

The Derating curve in Figure 48. (b) indicates the power that the IC can consume with reference to ambient temperature.

Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal

resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,

wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a

reference value measured at a specified condition. Figure 49. (c),(d) shows an example of the derating curve for

BA2903Yxxx-C, BA2901Yxx-C.

(*13) (*14) (*15) (*16) (*17) UNIT

6.2 5.0 4.7 7.0 4.5 mW/℃

When using the unit above Ta=25℃, subtract the value above per degree℃.

Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%) is mounted.

(a) Thermal resistance (b) Derating curve

Figure 48. Thermal resistance and derating

Figure 49. Derating curve

周囲温度 Ta [℃]

チップ表面温度 Tj [℃]

消費電力 P [ W]

Ambient temperature

Chip sur face temperature

Power dissipation Pd [W]

0 50 75 100 125 15025

Pd (m ax)

LSIの消費電力 [W]

θ' ja2

θ' ja1 Tj ' ( m a x)

θja2 < θja1

周囲温度 Ta [℃]

θ ja2

θ ja1 Tj ( max)

Ambient temperature

Power dissipation of LSI

θja=(Tjmax-Ta)/Pd ℃/W

200

400

600

800

1000

0 25 50 75 100 125 150

POWER DISSIPATION [mW]

AMBIENT TEMPERAT URE [℃]

BA2901YFV-C(*16)

BA2901YF-C(*17)

200

400

600

800

1000

0 25 50 75 100 125 150

POWER DISSIPATION [mW]

AMBIENT T EMPERAT UR E [℃]

BA2903YFVM-C(*15)

BA2903YFV-C(*14)

BA2903YF-C(*13)

TSZ22111･15･001 19/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Applic at ion Informa tion

NULL method condition for Test circuit 1 VCC,VEE,EK,Vicm Unit：V

Parameter VF S1 S2 S3 Vcc VEE EK Vicm Calculation

Input Offset Voltage VF1 ON ON ON 5～36 0 -1.4 0 1

Input Offset Current VF2 OF F OFF ON 5 0 -1.4 0 2

Input Bias Current VF3 OFF ON ON 5 0 -1.4 0 3

VF4 ON OFF 5 0 -1.4 0

Large Signal Voltage Gain VF5 ON ON ON 15 0 -1.4 0 4

VF6 15 0 -11.4 0

- Calculation -

1. Input Offset Voltage (Vio)

2. Input Offset Current (Iio)

3. Input Bias Current (Ib)

4. Large Signal Voltage Gain (Av)

Figure 50. Test circuit 1 (one channel only)

[V]

RS / RF + 1 VF1

Vio

[A]

RS) / RF + (1× Ri VF1-VF2

Iio 

[A]

RS) / RF + (1 ×Ri×2 VF3-VF4

Ib 

[dB]

VF6-VF5 RF/RS)+(1×ΔEK

Log×20 Av 

Vicm VF

0.1μF

500kΩ

Rf=50kΩ

Rs=50Ω

Ri=10kΩ

NULL

DUT

SW1

SW2

1000pF

SW3

VCC

VEE -15V

+15V

Ri=10kΩ

Rs=50Ω

50kΩVRL

TSZ22111･15･001 20/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

Switch Condition for Test Circuit 2

SW No. SW

1 SW

2 SW

3 SW

4 SW

5 SW

6 SW

Supply Current OFF OFF OFF OFF OFF OFF OFF

Output Sink Current VOL=1.5V OFF ON ON OFF OFF OFF ON

Output Saturation Voltage Isink=4mA OFF ON ON OFF ON ON OFF

Output Leakage Current VOH=36V OFF ON ON OFF OFF OFF ON

Response T ime RL=5.1kΩ, VRL=5V ON OFF ON ON OFF OFF OFF

Figure 51. Test Circuit 2 (one channel only)

Figure 52. Response Time

+100mV

Tre (LO W to HIGH)

VCC/2

出力電圧波形

VOU

入力電圧波形

overdrive voltage

-100mV

出力電圧波形

Tre (HIGH to LO W)

VCC/2

VOU

入力電圧波形

Input wave

Out put wave

SW1 SW2 SW3

－

＋

SW5 SW6 SW7

VIN- VIN+ VRL

VOL/VOH

VCC

VEE

SW4

TSZ22111･15･001 21/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Application example

○Reference voltage is -IN

While the input voltage(Vin) is higher that the

reference voltage, the output voltage remains high.

In case the input voltage becomes lower than the

reference voltage, the output voltage will turn low.

○Reference voltage is +IN

While the input voltage(Vin) is smaller that the

reference voltage, the output voltage remains high.

In case the input voltage becomes higher than the

reference voltage, the output voltage will turn low.

Reference Voltage

Vref

Vin

VCC

VEE

VRL

OUT

Vin

Vref

VEE

VCC VRL

OUT

電圧

入力電圧波形

High OUT

Reference voltage

Time

Input voltage wave

Vin

Low

Time

Output voltage wave

電圧

入力電圧波形

電圧

High

出力電圧波形

OUT

Vin

Reference voltage

Time

Input voltage wave

Output voltage wave

Time

Low

TSZ22111･15･001 22/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Operational Notes

1) Unused circuits

When there are unused comparators, it is recommended that they are

connected as in Figure 53. ,setting the non-inverting input terminal to a

potential within the in-phase input voltage range (Vicm).

2) Input voltage

Applying VEE +36V to the input terminal is possible without causing

deterioration of the electrical characteristics or destruction, regardless of

the supply voltage. However, this does not ensure normal circuit oper ation.

Please note that the circuit operates normall y only when the input voltage is

within the common mode input voltage range of the electric characteristics.

3) Power supply (single / dual)

The comparator operates when the voltage supplie d is between VCC and VEE. Therefore, the signal s upply comparator

can be used as a dual supply comparator as well.

4) Power dissipation Pd

Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including

reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power

dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal

derating curves for more information.

5) Short-circuit between pins and erroneous mounting

Be careful when mounting the IC on printed circuit boards. T he IC ma y be damaged if it is mounted in a wrong orientation

or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Terminal short-circuits

When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation

and, subsequently, destruction.

7) Operation in a strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8) Radioactive rays

This IC is not designed protection against ra dioactive rays.

9) IC handling

Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical

characteristics due to piezo resistance effects.

10) Board inspection

Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every

process is recommended. In addition, when attaching and detaching the jig during the inspec tion phase, ensure that the

power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly

process as well as during transportation and storage.

Figure 53. Example of application

circuit for unused comparator

Please keep this potential in Vicm

VCC-1.5V＞Vicm＞VEE

VCC

VEE

OPEN

Vicm

TSZ22111･15･001 23/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Physical Dimension, Tape and Reel Information

Package Name SOP8

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP8

Drawing No. : EX112-5001-1

(Max 5.35 (include.BURR))

TSZ22111･15･001 24/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Physical Dimension, Tape and Reel Information

Package Name SOP14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

(UNIT : mm)

PKG : SOP14

Drawing No. : EX113-5001

(Max 9.05 (include.BURR))

TSZ22111･15･001 25/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Physical Dimension, Tape and Reel Information

Package Name SSOP-B8

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

TSZ22111･15･001 26/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Physical Dimension, Tape and Reel Information

Package Name SSOP-B14

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

()

Direction of feed

Reel 1pin

TSZ22111･15･001 27/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Physical Dimension, Tape and Reel Information

Package Name MSOP8

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

TSZ22111･15･001 28/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Marking Diagrams

Product Name Package Type Marking

BA2903Y F-C SOP8 2903Y

FV-C SSOP-B8 03Y

FVM-C MSOP8 2903Y

BA2901Y F-C SOP14 BA2901YF

FV-C SSOP-B14 2901Y

SOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SSOP-B8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SOP14(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

SSOP-B14(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

MSOP8(TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

TSZ22111･15･001 29/29 8.MAY.2013 Rev. 004

BA2903Yxxx-C, BA2901Yxx-C Datasheet

●Land pattern data

●Revision History

Date Revision Changes

11.APR.2012 001 New Release

21.JAN.2013 002 Land pattern data inserted.

11.MAR.2013 003 Input offset voltage, Input offset current limit (Temp=25℃) changed.

Description of Physical Dimension, Tape and Reel Information changed.

8.MAY.2013 004

SOP8, SSOP-B8, MSOP8 Power dissipation corrected.

SSOP-B8, SSOP-B14 corrected.

Package Land pitch

e Land space

MIE Land length

≧ℓ 2 Land width

SOP8

SOP14 1.27 4.60 1.10 0.76

SSOP-B8

SSOP-B14 0.65 4.60 1.20 0.35

MSOP8 0.65 2.62 0.99 0.35

SOP8, SSOP-B8, MSOP8

SOP14, SSOP-B14

All dimensions in mm

b 2

MIE

Datasheet

Notice - Rev.004

Notice

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred b y yo u or third parties arising from the use of an y

ROHM’s Products for Specific Applications.

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expens es or losses arising from the

use of any ROHM’s Products under an y special or extraordinary envir onments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product perform ance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-pro of desig n.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (T a). When us ed in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way respo nsible or liable for failure induced under dev iant condition from what is defined in

this document.

Datasheet

Notice - Rev.004

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlori ne, bromin e, etc.) flux is used, the residue of flux may negativel y affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information

contained in this document. ROHM shall not be in any way respo nsib le or liable for any damages, expenses or loss es

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).

Precaution for Storage / Transportati on

1. Product performance and soldered connecti ons may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds thos e recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, sold erability of products out of recommende d storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products pl ease dispose them properly using a n authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.004

Other Precaution

1. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2. This document may not be reprinted or reproduced, in whole or in part, wit hout prior written consent of ROHM.

3. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limit ed to, the development of mass-destruction

weapons.

5. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.