ECXO-2158-32.000M TR RoHS Pb PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters are intentionally excluded from this specification sheet. ECXO-2158 -32.000M TR Series Ecliptek Custom Oscillator Packaging Options Tape & Reel Nominal Frequency 32.000MHz ELECTRICAL SPECIFICATIONS Nominal Frequency 32.000MHz ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 5.00 0.15 MARKING ORIENTATION 2.60 0.15 2 1 1.2 0.2 1.4 01 3.68 0.15 PIN CONNECTION 1 Tri-State 2 Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECXO2158 2 32.000M 3 XXYZZ XX=Ecliptek Manufacturing Designator Y=Last Digit Of Year ZZ=Week of Year 1.60 0.20 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 1 of 5 ECXO-2158-32.000M TR Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 2 of 5 ECXO-2158-32.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 0.1 2.0 0.1 DIA 1.5 +0.1/-0.0 0.3 0.05 7.5 0.1 16.0 +0.3/-0.1 A0* 6.75 0.1 8.0 0.1 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2.0/-0.0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 3 of 5 ECXO-2158-32.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 4 of 5 ECXO-2158-32.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 5 of 5