[ /Title (CD74H C40103, CD74H CT4010 3) /Subject (High Speed CMOS Logic 8- CD54HC40103, CD74HC40103, CD74HCT40103 Data sheet acquired from Harris Semiconductor SCHS221D High-Speed CMOS Logic 8-Stage Synchronous Down Counters November 1997 - Revised October 2003 Features Description * Synchronous or Asynchronous Preset The 'HC40103 and CD74HCT40103 are manufactured with high speed silicon gate technology and consist of an 8-stage synchronous down counter with a single output which is active when the internal count is zero. The 40103 contains a single 8-bit binary counter. Each has control inputs for enabling or disabling the clock, for clearing the counter to its maximum count, and for presetting the counter either synchronously or asynchronously. All control inputs and the TC output are active-low logic. * Cascadable in Synchronous or Ripple Mode * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times In normal operation, the counter is decremented by one count on each positive transition of the CLOCK (CP). Counting is inhibited when the TE input is high. The TC output goes low when the count reaches zero if the TE input is low, and remains low for one full clock period. * Significant Power Reduction Compared to LSTTL Logic ICs * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V When the PE input is low, data at the P0-P7 inputs are clocked into the counter on the next positive clock transition regardless of the state of the TE input. When the PL input is low, data at the P0-P7 inputs are asynchronously forced into the counter regardless of the state of the PE, TE, or CLOCK inputs. Input P0-P7 represent a single 8-bit binary word for the 40103. When the MR input is low, the counter is asynchronously cleared to its maximum count of 25510, regardless of the state of any other input. The precedence relationship between control inputs is indicated in the truth table. * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH Ordering Information TEMP. RANGE (oC) PACKAGE CD54HC40103F3A -55 to 125 16 Ld CERDIP CD74HC40103E -55 to 125 16 Ld PDIP CD74HC40103M -55 to 125 16 Ld SOIC CD74HC40103MT -55 to 125 16 Ld SOIC CD74HC40103M96 -55 to 125 16 Ld SOIC CD74HCT40103E -55 to 125 16 Ld PDIP CD74HCT40103M -55 to 125 16 Ld SOIC CD74HCT40103MT -55 to 125 16 Ld SOIC CD74HCT40103M96 -55 to 125 16 Ld SOIC PART NUMBER If all control inputs except TE are high at the time of zero count, the counters will jump to the maximum count, giving a counting sequence of 10016 or 25610 clock pulses long. The 40103 may be cascaded using the TE input and the TC output, in either a synchronous or ripple mode. These circuits possess the low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits and can drive up to 10 LSTTL loads. NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) 2003, Texas Instruments Incorporated 1 CD54HC40103, CD74HC40103, CD74HCT40103 Pinout CD54HC40103 (CERDIP) CD74HC40103, CD74HCT40103 (PDIP, SOIC) TOP VIEW CP 1 16 VCC MR 2 15 PE (SYNC) TE 3 14 TC P0 4 13 P7 P1 5 12 P6 P2 6 11 P5 P3 7 10 P4 9 PL (ASYNC) GND 8 Functional Diagram TC 14 13 12 11 10 7 6 5 P7 P6 P5 P4 P3 P2 P1 P0 15 9 3 1 2 VCC GND MR TE CP PL PE 4 16 8 TRUTH TABLE CONTROL INPUTS MR PL PE TE PRESET MODE 1 1 1 1 Synchronous 1 1 1 0 Count Down 1 1 0 X Preset On Next Positive Clock Transition 1 0 X X 0 X X X Asynchronously ACTION Inhibit Counter Preset Asychronously Clear to Maximum Count 1 = High Level. 0 = Low Level. X = Don't Care. Clock connected to clock input. Synchronous Operation: changes occur on negative-to-positive clock transitions. Load Inputs: MSB = P7, LSB = P0. 2 CD54HC40103, CD74HC40103, CD74HCT40103 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .50mA Thermal Resistance (Typical, Note 1) JA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - 0.1 - 1 - 1 A ICC VCC or GND 0 6 - - 8 - 80 - 160 A 3 CD54HC40103, CD74HC40103, CD74HCT40103 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC and GND 0 5.5 - - 0.1 - 1 - 1 A ICC VCC or GND 0 5.5 - - 8 - 80 - 160 A ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 A NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS (NOTE) P0-P7 0.20 TE, MR 0.40 CP 0.60 PE 0.80 PL 1.35 NOTE: Unit Load is ICC limit specified in DC Electrical Table, e.g., 360A max at 25oC. Prerequisite for Switching Specifications 25oC PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tW 2 165 - - 205 - 250 - ns 4.5 33 - - 41 - 50 - ns 6 28 - - 35 - 43 - ns 2 125 - - 155 - 190 - ns 4.5 25 - - 31 - 38 - ns 6 21 - - 26 - 32 - ns HC TYPES CP Pulse Width PL Pulse Width tW 4 CD54HC40103, CD74HC40103, CD74HCT40103 Prerequisite for Switching Specifications (Continued) 25oC PARAMETER MR Pulse Width CP Max. Frequency (Note 3) P to CP Set-up Time PE to CP Set-up Time TE to CP Set-up Time P to CP Hold Time TE to CP Hold Time MR to CP Removal Time PE to CP Hold Time -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tW 2 125 - - 135 - 190 - ns 4.5 25 - - 31 - 38 - ns 6 21 - - 26 - 32 - ns 2 3 - - 2 - 2 - MHz 4.5 15 - - 12 - 10 - MHz 6 18 - - 14 - 12 - MHz 2 100 - - 125 - 150 - ns 4.5 20 - - 25 - 30 - ns 6 17 - - 21 - 26 - ns 2 75 - - 95 - 110 - ns 4.5 15 - - 19 - 22 - ns 6 13 - - 16 - 19 - ns 2 150 - - 190 - 225 - ns 4.5 30 - - 38 - 45 - ns 6 26 - - 33 - 38 - ns 2 5 - - 5 - 5 - ns 4.5 5 - - 5 - 5 - ns 6 5 - - 5 - 5 - ns fCP(MAX) tSU tSU tSU tH tH tREM tH 2 0 - - 0 - 0 - ns 4.5 0 - - 0 - 0 - ns 6 0 - - 0 - 0 - ns 2 50 - - 65 - 75 - ns 4.5 10 - - 13 - 15 - ns 6 9 - - 11 - 13 - ns 2 2 - - 2 - 2 - ns 4.5 2 - - 2 - 2 - ns 6 2 - - 2 - 2 - ns tW 4.5 35 - - 44 - 53 - ns PL Pulse Width tW 4.5 43 - - 54 - 65 - ns MR Pulse Width tW 4.5 35 - - 44 - 53 - ns CP Max. Frequency (Note 3) fCP(MAX) 4.5 14 - - 11 - 9 - MHz P to CP Set-up Time tSU 4.5 24 - - 30 - 36 - ns PE to CP Set-up Time tSU 4.5 20 - - 25 - 30 - ns TE to CP Set-up Time tSU 4.5 40 - - 50 - 60 - ns P to CP Hold Time tH 4.5 5 - - 5 - 5 - ns TE to CP Hold Time tH 4.5 0 - - 0 - 0 - ns tREM 4.5 10 - - 13 - 15 - ns tH 4.5 2 - - 2 - 2 - ns HCT TYPES CP Pulse Width MR to CP Removal Time PE to CP Hold Time 5 CD54HC40103, CD74HC40103, CD74HCT40103 Switching Specifications Input tr, tf = 6ns -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS CL = 50pF 2 - - 300 - 375 - 450 ns CL = 50pF 4.5 - - 60 - 75 - 90 ns CL = 15pF 5 - 25 - - CL = 50pF 6 - - 51 - 64 - 77 ns CL = 50pF 2 - - 300 - 375 - 450 ns CL = 50pF 4.5 - - 60 - 75 - 90 ns CL = 15pF 5 - 25 - - - - - ns CL = 50pF 6 - - 51 - 64 - 77 ns CL = 50pF 2 - - 200 - 250 - 300 ns CL = 50pF 4.5 - - 40 - 50 - 60 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 6 - - 34 - 43 - 51 ns CL = 50pF 2 - - 275 - 345 - 415 ns CL = 50pF 4.5 - - 55 - 69 - 83 ns CL = 15pF 5 - 23 - - - - - ns CL = 50pF 6 - - 47 - 59 - 71 ns CL = 50pF 2 - - 275 - 345 - 415 ns CL = 50pF 4.5 - - 55 - 69 - 83 ns CL = 15pF 5 - 23 - - - - - ns CL = 50pF 6 - - 47 - 59 - 71 ns CL = 50pF 2 - - 75 - 95 - 110 ns CL = 50pF 4.5 - - 15 - 19 - 22 ns CL = 50pF 6 - - 13 - 16 - 19 ns CI CL = 50pF - - - 10 - 10 - 10 pF CP Maximum Frequency fMAX CL = 15pF 5 - 25 - - - - - MHz Power Dissipation Capacitance (Notes 4, 5) CPD - 5 - 25 - - - - - pF tPLH, tPHL CL = 50pF 4.5 - - 60 - 75 - 90 ns CL = 15pF 5 - 25 - - - - - ns CL = 50pF 4.5 - - 63 - 79 - 95 ns CL = 15pF 5 - 26 - - - - - ns CL = 50pF 4.5 - - 50 - 63 - 75 ns CL = 15pF 5 - 21 - - - - - ns CL = 50pF 4.5 - - 68 - 85 - 102 ns CL = 15pF 5 - 28 - - - - - ns PARAMETER TEST SYMBOL CONDITIONS -40oC TO 85oC 25oC HC TYPES Propagation Delay CP to any TC (Async Preset) CP to TC (Sync Preset) TE to TC PL to TC MR to TC Output Transition Time Input Capacitance tPLH, tPHL tPLH, tPHL tPLH, tPHL tPLH, tPHL tPLH, tPHL tTLH, tTHL - ns HCT TYPES Propagation Delay CP to TC (Async Preset) CE to TC (Sync Preset) TE to TC PL to TC tPLH, tPHL tPLH, tPHL tPLH, tPHL 6 CD54HC40103, CD74HC40103, CD74HCT40103 Switching Specifications Input tr, tf = 6ns (Continued) TEST SYMBOL CONDITIONS -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS CL = 50pF 4.5 - - 55 - 69 - 83 ns CL = 15pF 5 - 23 - - - - - ns tTHL, tTLH CL = 50pF 4.5 - - 15 - 19 - 22 ns CIN CL = 50pF - - - 10 - 10 - 10 pF CP Maximum Frequency fMAX CL = 15pF 5 - 25 - - - - - MHz Power Dissipation Capacitance (Notes 4, 5) CPD - 5 - 27 - - - - - pF PARAMETER MR to TC tPLH, tPHL Output Transition Time Input Capacitance NOTES: 3. Noncascaded operation only. With cascaded counters clock-to-terminal count propagation delays, count enables (PE or TE)-to-clock SET UP TIMES, and count enables (PE or TE)-to-clock HOLD TIMES determine maximum clock frequency. For example, with these HC devices: 1 1 C P f MAX = ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------ = ----------------------------- 11MHz CP-to-TC prop delay + TE-to-CP Setup Time + TE-to-CP Hold Time 60 + 30 + 0 4. CPD is used to determine the dynamic power consumption, per package. 5. PD = VCC2 fi + CL VCC2 fo where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage, fo = Output Frequency. Timing Diagrams CP MR TE PE PL P0 P1 P2 P3 P4 P5 P6 P7 TC HC/HCT40103 COUNT 255 254 3 2 1 0 255 254 254 253 FIGURE 1. 7 8 7 6 5 4 255 254 253 252 CD54HC40103, CD74HC40103, CD74HCT40103 Test Circuits and Waveforms tr tf tPHL tW INPUT LEVEL 90% 10% tW 1/fMAX CP VS INPUT LEVEL VS MR GND GND tPLH TC 10% 90% tREM VS CP tTHL VS tTLH GND FIGURE 2. FIGURE 3. tf tf INPUT LEVEL 10% 90% TE INPUT LEVEL GND tPHL tSU tPLH 10% 90% TC INPUT LEVEL VS MR VS VS th INPUT LEVEL VS CP GND tTHL tTLH FIGURE 4. FIGURE 5. VALID INPUT LEVEL INPUTS VS GND P0 - P7 tSU PE INPUT LEVEL VS tSU CP TE OR PE th th GND tREC tSU CP 10% GND GND tfCL 90% GND INPUT LEVEL VS FIGURE 6. CLOCK th INPUT LEVEL VS trCL INPUT LEVEL VS FIGURE 7. tWL + tWH = I fCL tWL 50% tfCL = 6ns I fCL 3V VCC 50% 10% tWL + tWH = trCL = 6ns CLOCK 50% 2.7V 0.3V GND 1.3V 0.3V tWL tWH 1.3V 1.3V GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 9. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH FIGURE 8. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH 8 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty 1 5962-9055301EA ACTIVE CDIP J 16 5HC40103F3AS228 OBSOLETE CDIP J 16 Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) TBD Call TI Call TI TBD Call TI Call TI CD54HC40103F ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD54HC40103F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74HC40103E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC40103EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC40103M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC40103MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT40103EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT40103M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp CD74HCT40103M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT40103MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 OTHER QUALIFIED VERSIONS OF CD54HC40103, CD74HC40103 : * Catalog: CD74HC40103 * Automotive: CD74HC40103-Q1, CD74HC40103-Q1 * Enhanced Product: CD74HC40103-EP, CD74HC40103-EP * Military: CD54HC40103 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC40103M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT40103M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC40103M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT40103M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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