ISL21009BFB850Z-TK - Intersil - Datasheet.Directory

FN6327.6

ISL21009

High Voltage Input Precision, Low Noise

FGA™ Voltage References

The ISL21009 FGA™ voltage references are extrem ely low

power, high precision, and low no ise voltage references

fabricated on Intersil’s proprietary Floating Gate Analog

technology . The ISL21009 features very low noise (4.5µVP-P

for 0.1Hz to 10Hz), low operating current (180µA, Max), and

3ppm/°C of temperature drift. In addition, the ISL 21009

family features guaranteed initial accuracy as low as

±0.5mV.

This combination of high initi al accuracy, low power and low

output noise performance of the ISL21009 enables versatile

high performance control and data acquisition applications

with low power consumption.

Available Options

Features

• Output Voltages . . . . . . . .1.250V, 2.500V, 4.096V, 5.000V

• Initial Accuracy. . . . . . . . . . . . . .±0.5mV, ±1.0mV, ±2 .0mV

• Input Voltage Range. . . . . . . . . . . . . . . . . . . 3.5V to 16.5V

• Output Voltage Noise . . . . . . . . .4.5µVP-P (0.1Hz to 10Hz)

• Supply Current. . . . . . . . . . . . . . . . . . . . . . . .180µA (Max)

• Temperature Coefficient. . .3ppm/°C, 5ppm/°C, 10ppm/°C

• Output Current Capability. . . . . . . . . . . . . . . Up to ±7.0mA

• Operating Temperature Range. . . . . . . . .-40°C to +125°C

• Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ld SOIC

• Pb-free available (RoHS compliant)

Applications

• High Resolution A/Ds an d D/As

• Digital Meters

• Bar Code Scanners

• Basestations

• Battery Management/Monitoring

• Industrial/Instrumentation Equipment

Pinout ISL21009

(8 LD SOIC)

TOP VIEW

PART NUMBER

VOUT

OPTION

(V)

INITIAL

ACCURACY

(mV) TEMPCO.

(ppm/°C)

ISL21009BFB812Z 1.250 ±0.5 3

ISL21009CFB812Z 1.250 ±1.0 5

ISL21009DFB812Z 1.250 ±2.0 10

ISL21009BFB825Z 2.500 ±0.5 3

ISL21009CFB825Z 2.500 ±1.0 5

ISL21009DFB825Z 2.500 ±2.0 10

ISL21009BFB841Z 4.096 ±0.5 3

ISL21009CFB841Z 4.096 ±1.0 5

ISL21009DFB841Z 4.096 ±2.0 10

ISL21009BFB850Z 5.000 ±0.5 3

ISL21009CFB850Z 5.000 ±1.0 5

ISL21009DFB850Z 5.000 ±2.0 10

GND or NC

VIN

DNC

GND

DNC

VOUT

TRIM or NC

Data Sheet September 12, 2007

2FN6327.6

Pin Descriptions

PIN NUMBER PIN NAME DESCRIPTION

1 GND or NC Can be either Ground or No Connect

2 VIN Power Supply Input Connection

4 GND Ground Connection

5 TRIM Allows user trim typically ±2.5%. Leave Unconnected when unused.

6 VOUT Voltage Reference Output Connection

3, 7, 8 DNC Do Not Connect; Internal Connection – Must Be Left Floating

Ordering Information

PART NUMBER

(Notes 1, 2) PART

MARKING VOUT OPTION

(V) GRADE TEMP.

RANGE (°C) PACKAGE

(Pb-Free) PKG. DWG. #

ISL21009BFB812Z 21009BF Z12 1.250 ±0.5mV, 3ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009CFB812Z 21009CF Z12 1.250 ±1.0mV, 5ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009DFB812Z 21009DF Z12 1.250 ±2.0mV, 10ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009BFB825Z 21009BF Z25 2.500 ±0.5mV, 3ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009CFB825Z 21009CF Z25 2.500 ±1.0mV, 5ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009DFB825Z 21009DF Z25 2.500 ±2.0mV, 10ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009BFB841Z 21009BF Z41 4.096 ±0.5mV, 3ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009CFB841Z 21009CF Z41 4.096 ±1.0mV, 5ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009DFB841Z 21009DF Z41 4.096 ±2.0mV, 10ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009BFB850Z 21009BF Z50 5.000 ±0.5mV, 3ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009CFB850Z 21009CF Z50 5.000 ±1.0mV, 5ppm/°C -40 to +125 8 Ld SOIC M8.15

ISL21009DFB850Z 21009DF Z50 5.000 ±2.0mV, 10ppm/°C -40 to +125 8 Ld SOIC M8.15

NOTES:

1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte

tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC

J STD-020.

2. Add “-TK” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

ISL21009

4FN6327.6

Absolute Voltage Ratings Recommended Operating Conditions

Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C

Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . .-0.5V to +18V

Max Voltage VOUT to GND (10s) . . . . . . . . . . . . . -0.5V to VOUT +1V

Voltage on “DNC” pins. . . . No connections permitted to these pins.

ESD Ratings

Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6kV

Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV

Temperature Range (Industrial) . . . . . . . . . . . . . . . -40°C to +125°C

Thermal Information

Continuous Power Dissipation (Note 3) . . . . . . . . . . . . . TA = +70°C

8 Ld SOIC derate 5.88mW/°C above +70°C. . . . . . . . . . . . . 471mW

Pb-free reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . see link below

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and

result in failures not covered by warranty.

IMPORTANT NOTE: All parameters having Min/Max specificati ons are gua ranteed. Typ values are for information purposes only. Unless otherwise noted, all test s are at

the specified temperature and are pulsed tests, therefore: TJ = TC = TA

NOTE:

3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

Common Electrical Specifications (ISL21009-12, -25, -41, -50) TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

VOA VOUT Accuracy @ TA = +25°C ISL21009B -0.5 +0.5 mV

ISL21009C -1.0 +1.0 mV

ISL21009D -2.0 +2.0 mV

TC VOUT Output Voltage Temperature

Coefficient (Note 4) ISL21009B 3 ppm/°C

ISL21009C 5 ppm/°C

ISL21009D 10 ppm/°C

IIN Supply Current 95 180 µA

ΔVOUT / VOUT Trim Range ±2.0 ±2.5 %

ISC Short Circuit Current TA = +25°C, VOUT tied to GND 10 mA

tRTurn-on Settling Time VOUT = ±0.1% 100 µs

Ripple Rejection f = 10kHz 60 dB

eNOutput Voltage Noise 0.1Hz ≤ f ≤ 10Hz 4.5 µVP-P

VNBroadband Voltage Noise 10Hz ≤ f ≤ 1kHz 2.2 µVRMS

Electrical Specifications (ISL21009-12, VOUT = 1.250V) V

IN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

VOUT Output Voltage 1.250 V

VIN Input Voltage Range 3.5 16.5 V

ΔVOUT/ΔVIN Line Regulation 3.5V < VIN < 5.5V 50 150 µV/V

5.5V < VIN < 16.5V 10 50 µV/V

ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 7mA 10 50 µV/mA

Sinking: -7mA ≤ IOUT ≤ 0mA 20 100 µV/mA

ΔVOUT/ΔTAThermal Hysteresis (Note 5) ΔTA = +165°C 50 ppm

ΔVOUT/Δt Long Term Stability (Note 6) TA = +25°C 50 ppm

ISL21009

5FN6327.6

Electrical Specifications (ISL21009-25, VOUT = 2.50V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified.

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

VOUT Output Voltage 2.500 V

VIN Input Voltage Range 3.5 16.5 V

ΔVOUT/ΔVIN Line Regulation 3.5V < VIN < 5.5V 50 150 µV/V

5.5V < VIN < 16.5V 10 50 µV/V

ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 7mA 10 50 µV/mA

Sinking: -7mA ≤ IOUT ≤ 0mA 20 100 µV/mA

ΔVOUT/ΔTAThermal Hysteresis (Note 5) ΔTA = +165°C 50 ppm

ΔVOUT/Δt Long Term Stability (Note 6) TA = +25°C 50 ppm

Electrical Specifications (ISL21009-41, VOUT = 4.096V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0 unless otherwise

specified.

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

VOUT Output Voltage 4.096 V

VIN Input Voltage Range 4.5 16.5 V

ΔVOUT/ΔVIN Line Regulation 4.5V < VIN < 16.5V 50 200 µV/V

ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 5mA 20 100 µV/mA

Sinking: -5mA ≤ IOUT ≤ 0mA 20 150 µV/mA

ΔVOUT/ΔTAThermal Hysteresis (Note 5) ΔTA = +165°C 50 ppm

ΔVOUT/Δt Long Term Stability (Note 6) TA = +25°C 50 ppm

Electrical Specifications (ISL21009-50, VOUT = 5.0V) V

IN = 10.0V, TA = -40°C to +125°C, IOUT = 0 unless other wise specified.

PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX UNIT

VOUT Output Voltage 5.000 V

VIN Input Voltage Range 5.5 16.5 V

ΔVOUT/ΔVIN Line Regulation 5.5V < VIN < 16.5V 20 90 µV/V

ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 7mA 10 100 µV/mA

Sinking: -7mA ≤ IOUT ≤ 0mA 20 150 µV/mA

ΔVOUT/ΔTAThermal Hysteresis (Note 5) ΔTA = +165°C 50 ppm

ΔVOUT/Δt Long Term Stability (Note 6) TA = +25°C 50 ppm

NOTES:

4. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the

temperature range; in this case, -40°C to +125°C = +165°C.

5. Thermal Hysteresis is the change of VOUT measured @ T A = +25°C af ter temperature cycling over a specified range, ΔTA. VOUT is read initially

at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference

between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For Δ TA = +165°C, the device under test is cycled

from +25°C to +125°C to -40°C to +25°C.

6. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/sqrt(1kHrs).

ISL21009

19 FN6327.6

ISL21009

Small Outline Plastic Packages (SOIC)

INDEX

AREA E

123

-B-

0.25(0.010) C AMBS

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45°

H0.25(0.010) BM M

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

M8.15 (JEDEC MS-012-AA ISSUE C)

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.0532 0.0688 1.35 1.75 -

A1 0.0040 0.0098 0.10 0.25 -

B 0.013 0.020 0.33 0.51 9

C 0.0075 0.0098 0.19 0.25 -

D 0.1890 0.1968 4.80 5.00 3

E 0.1497 0.1574 3.80 4.00 4

e 0.050 BSC 1.27 BSC -

H 0.2284 0.2440 5.80 6.20 -

h 0.0099 0.0196 0.25 0.50 5

L 0.016 0.050 0.40 1.27 6

N8 87

a0° 8° 0° 8° -