LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH SCOPE 0.8 mm This specification covers the 0.8 mm PITCH BOARD TO BOARD CONNECTOR series. PRODUCT NAME AND PART NUMBER Material Number Product Name Assembly Embossed Tape Package Without Boss LEAD FREE 52465-**29 52465-**71 With Boss LEAD FREE 52465-**19 52465-**70 Plug Without Boss LEAD FREE 53309-**29 53309-**70 () (Right angle type) With Boss LEAD FREE 53309-**19 53309-**71 Receptacle * *: Refer to the drawing RATINGS Item Standard Rated Voltage (MAX.) 50 V Rated Current (MAX.) 0.5 A [ AC ( rms) / DC ] 1 * Ambient Temperature Range -40C ~ + 105C *1 *1 This includes the terminal temperature rise generated by conducting electricity. REV. A B C SHEET 1-8 1-8 1-15 REVISE ON PC ONLY REVISED J2016-0624 C 2015/12/14 S.TERUKI REV. DESCRIPTION STATUS DESIGN CONTROL J DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION WRITTEN BY: E.SUZUKI CHECKED BY: APPROVED BY: K.TOJO N.UKITA DATE: YR/MO/DAY 2004/11/11 FILE NAME SHEET PS-52465-014_Rev _C.docx 1 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH PERFORMANCE Electrical Performance Item Contact Resistance 4-1-1 Insulation Resistance 4-1-2 Dielectric Strength 4-1-3 . 20mV 10mA (JIS C5402 5.4) 20 milliohm MAX. DC 200V (JIS C5402 5.2/MIL-STD-202 302) 100 Megohm MIN. Mate connectors and apply 200V DC between adjacent terminal or ground. (JIS C5402 5.2/MIL-STD-202 Method 302) AC(rms) 500V () 1 (JIS C5402 5.1/MIL-STD-202 301) No Breakdown Mate connectors and apply 500V AC(rms) for 1 minute between adjacent terminal or ground. (JIS C5402 5.1/MIL-STD-202 Method 301) Mechanical Performance Test Condition Insertion and Withdrawal Force Terminal / Housing Retention Force 4-2-2 Requirement Mate connectors and measured by dry circuit, 20mV MAX., 10mA. (JIS C5402 5.4) Item 4-2-1 Test Condition 253mm Insert and withdraw connectors at the speed rate of 253mm/minute. 6 Refer to paragraph 6 253mm Apply axial pull out force at the speed rate of 253mm/minute on the terminal assembled in the housing. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 Requirement 3.0N {0.3 kgf} MIN. TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 2 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Apply axial push force at the speed rate of 253mm/minute. Vibration Shock 4-3-4 Test Condition Temperature Rise 4-3-3 3.0N {0.3 kgf} MIN. Environmental Performance and Others Repeated Insertion / Withdrawal 4-3-2 Requirement 253mm Item 4-3-1 Test Condition Pin Retention Force 4-2-3 JAPANESE ENGLISH 1 10 30 When mated up to 30 cycles repeatedly by the rate of 10 cycles per minute. 40 milliohm MAX. Contact Resistance Temperature (UL 498) Rise Carrying rated current load. (UL 498) DC 1mA 3 105510 Hz/ 1.5mm 2 (MIL-STD-202 201) Amplitude : 1.5mm P-P Frequency : 10~55~10 Hz in 1 minute Duration : 2 hours in each X.Y.Z. axes (MIL-STD-202 Method 201) DC 1mA 2 6 490m/s {50G} 3 (JIS C60068-2-27/MIL-STD-202 213) 2 490m/s {50G}, 3 strokes in each X.Y.Z. axes. (JIS C60068-2-27/MIL-STD-202 Method 213) REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 Requirement Appearance 30 C MAX. No Damage 40 milliohm MAX. Contact Resistance Discontinuity 1 microsecond MAX. Appearance No Damage 40 milliohm MAX. Contact Resistance Discontinuity 1 microsecond MAX. TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 3 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Heat Resistance 4-3-5 Test Condition 1052C 96 1~2 (JIS C60068-2-2/MIL-STD-202 108) 1052C, 96 hours (JIS C60068-2-2/MIL-STD-202 Method 108) Cold Resistance 4-3-6 -403C 96 1~2 (JIS C60068-2-1) Humidity Temperature Cycling 4-3-8 602C 90~95 96 1 ~2 (JIS C60068-2-3/MIL-STD-202 103) Temperature : 602C Relative Humidity : 90~95% Duration : 96 hours (JIS C60068-2-3/MIL-STD-202 Method 103) Appearance 5 cycles of : a) - 55C b) + 105C (JIS C0025) C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER No Damage 40 milliohm MAX. Contact Resistance Appearance Appearance No Damage 30 minutes 30 minutes No Damage 40 milliohm MAX. Contact Resistance Dielectric Strength 4-1-3 Must meet 4-1-3 Insulation Resistance 50 Megohm MIN. -55C 30+105C 30 1 5 5 Appearance 1~2 (JIS C0025) REVISE ON PC ONLY PS-52465-014 Requirement 40 milliohm MAX. Contact Resistance -403C, 96 hours (JIS C60068-2-1) 4-3-7 JAPANESE ENGLISH No Damage 40 milliohm MAX. Contact Resistance TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 4 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Item Salt Spray 4-3-9 Test Condition SO2 Gas NH3 Gas 4-3-11 Solderability 4-3-12 24 hours exposure to 505ppm SO2 gas at 402. No Damage 40 milliohm MAX. Contact Resistance 402 505ppm Appearance 24 No Damage 40 milliohm MAX. Contact Resistance 28% Appearance No Damage 40 (1L25ml) 40 minutes exposure to NH3 gas evaporating 40 milliohm MAX. Contact from 28% Ammonia solution. Resistance 2453C 30.5 Soldering Time : 30.5 sec. Solder Temperature : 2453 C REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 Requirement 352C 51% 484 Appearance (JIS C60068-2-11/MIL-STD-202 101) 484 hours exposure to a salt spray from the 51% solution at 352C. (JIS C60068-2-11/MIL-STD-202 Method 101) 4-3-10 JAPANESE ENGLISH Solder Wetting 95% 95% of immersed area must show no voids, pin holes. TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 5 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION Test Condition (Reflow soldering method) 2 Using the reflow profile condition below Paragraph 7, the product was reflowed two times. Item Resistance to Soldering- Heat 4-3-13 JAPANESE ENGLISH (Reflow by Manual Soldering iron) 35010 5 Requirement Appearance No Damage Soldering iron method Soldering Iron Temperature : 35010 Soldering Time : 5 seconds MAX. ( { ) : } : Reference Reference Standard Unit PRODUCT SHAPE, DIMENSIONS AND MATERIALS Refer to the drawing. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 6 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH INSERTION/WITHDRAWAL FORCE N {kgf} Insertion (MAX.) 1st 6th 30th 34.3 35.2 35.2 {3.50} {3.60} {3.60} N {kgf} 37.2 {3.80} 38.2 {3.90} 38.2 {3.90} 4.5 {0.45} 4.3 {0.43} 4.3 {0.43} N {kgf} 40.1 {4.10} 41.1 {4.20} 41.1 {4.20} 5.4 {0.55} 5.2 {0.53} 5.2 {0.53} N {kgf} 43.1 {4.40} 44.1 {4.50} 44.1 {4.50} 6.4 {0.65} 6.2 {0.63} 6.2 {0.63} N {kgf} 46.0 {4.70} 47.0 {4.80} 47.0 {4.80} 7.4 {0.75} 7.2 {0.73} 7.2 {0.73} N {kgf} 49.0 {5.00} 49.9 {5.10} 49.9 {5.10} 8.4 {0.85} 8.2 {0.83} 8.2 {0.83} N {kgf} 51.9 {5.30} 52.9 {5.40} 52.9 {5.40} 9.4 {0.95} 9.2 {0.93} 9.2 {0.93} N {kgf} 54.8 {5.60} 55.8 {5.70} 55.8 {5.70} 10.3 {1.05} 10.1 {1.03} 10.1 {1.03} N {kgf} 57.8 {5.90} 58.8 {6.00} 58.8 {6.00} 11.3 {1.15} 11.1 {1.13} 11.1 {1.13} N {kgf} 60.7 {6.20} 61.7 {6.30} 61.7 {6.30} 12.3 {1.25} 12.1 {1.23} 12.1 {1.23} N {kgf} 63.7 {6.50} 64.6 {6.60} 64.6 {6.60} 13.3 {1.35} 13.1 {1.33} 13.1 {1.33} N {kgf} 66.6 {6.80} 67.6 {6.90} 67.6 {6.90} 14.3 {1.45} 14.1 {1.43} 14.1 {1.43} N {kgf} 69.5 {7.10} 70.5 {7.20} 70.5 {7.20} 15.2 {1.55} 15.0 {1.53} 15.0 {1.53} N {kgf} 72.5 {7.40} 73.5 {7.50} 73.5 {7.50} 16.2 {1.65} 16.0 {1.63} 16.0 {1.63} N {kgf} 75.4 {7.70} 76.4 {7.80} 76.4 {7.80} 17.2 {1.75} 17.0 {1.73} 17.0 {1.73} N {kgf} 78.4 {8.00} 79.3 {8.10} 79.3 {8.10} 18.2 {1.85} 18.0 {1.83} 18.0 {1.83} No. of CKT UNIT { REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 Withdrawal (MIN.) 1st 6th 30th 3.5 3.3 3.3 {0.35} {0.33} {0.33} } : Reference Unit TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 7 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH Recommended Reflow Profile 2455 Peak Temp. 2455 degree C 230 230 degree C MAXIMUM 200 200 degree C 150 3060 150 degree C 90120 30~60 seconds Pre-heat: 90~120 seconds TEMPERATURE CONDITION GRAPH (Temperature is measured at the soldering area on the surface of the print circuit board) N2 () Please make sure to do test run under the mounting condition (reflow soldering condition) on your own devices before use because reflow condition may change due to the local condition (Air / N2 reflow / temperature profile / solder paste, metal mask thickness / aperture rate / pattern layout of PWB / types of PWB / and other factors ). Depending on the mounting condition, product's performance might be influenced by occurrence of solder-wicking or flux wicking at contact area. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 8 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH [] 10 [Mating] Mate connectors parallel to the mating axis as much as possible. (Figure-1) In doing so, priory determine the position with temporary fitting each inner wall of the Receptacle and Plug housing, then mate those fully. If angled mating is inevitable, determine the position priory with temporary fitting each inner wall of the Receptacle and Plug housing softly within an angle less than 10 degree, and mate the connector parallel. (Figure-2) [] 3 4 [Withdrawal] Withdraw the connector parallel to mating axis as much as possible (Figure-1). Or do it with slightly swinging them right to left. (Figure-3) (Please take care NOT to do excess twist extraction. It could cause the housing or pin breakage.) (Figure-4) REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 9 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH Plug <pitch direction> <Span direction> Rec Housing - Figure 1 Horizontal Mating/Unmating (Best) Inner wall of Plug 10 Under 10 degrees Inner wall of Rec housing - Figure 2 Mating aligning to inner wall of housing - Figure 3 Wthdrawal - Figure 4 Wthdrawal with twisting the connector at an angle REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 10 Under 10 degrees (Acceptable) (Best) (Not Good) TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 10 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH OTHERS 1. Although this product may have a small black dot, a weld line or a scratch on the housing, it doesn't impact the product's performance. 2. Although there may be slight differences in the housing color tone, it doesn't impact the product's performance. 3. Although the housing color tone could be changed by ultraviolet light, it doesn't impact the product's performance. 4. Although the surface of the product could have scratch marks by frictions because of the Tin plating, it doesn't impact the product's performance. 5. N2 () Please make sure to do test run under the mounting condition (reflow soldering condition) on your own devices before use because reflow condition may change due to the local condition (Air / N2 reflow / temperature profile / solder paste, metal mask thickness / aperture rate / pattern layout of PWB / types of PWB / and other factors ). Depending on the mounting condition, product's performance might be influenced by occurrence of solder-wicking or flux wicking at contact area. 6. The product performance was tested using rigid PWB. In case the product needs to be mounted onto FPC, please conduct a reflow test on the FPC before use. 7. In case of mounting the connector onto FPC, add a stiffener on the FPC in order to prevent the deformation. 8. In case of designing with changing our recommended board pattern size, please consult the contact person in advance because it may cause a fatal defect. 9. Max0.02mm The mounting specification for coplanarity does not include the influence of warpage of the PWB. Warpage of the PWB should be 0.02mm at maximum at center of the connector based on the both sides of connector. 10. N2 N2 This product is designed to be mounted by air reflow. So, if this product is mounted by N2 reflow, solder wicking may caused after reflow. Therefore if it is plan to adopt N2 reflow for this connector, an evaluation is needed separately. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 11 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 11. Our evaluation is conducted based on Molex-recommended condition specified in this product specification. 12. Only coplanarity before reflow is guaranteed. Coplanarity in and after reflow is not guaranteed. 13. The housing material of this product is made from a highly-heat-resistant Nylon, therefore blisters could be occurred on the housing surface depending on the soldering condition and the water absorption properties of the housing material. However, it does not damage the product's function since the blister is not caused by change of the material property. 14. If you leave any soldering area on this product open, it could occur terminal disengagement, short circuit between pins, terminal buckling or connector disengagement from the PWB. Therefore, please solder all of the soldering tails and fitting nails on the PWB. 15. Since this product is low profile product, flux wicking could be occurred on the areas except for the terminal contacts. However it does not impact on the product's performance. 16. If accidental contact is added onto connectors in the reflow machine, connectors could be deformed or damaged. Therefore review the reflow machine before use of the connectors. 17. Although color tone of housing or surface of terminal plating could be varied depending on reflow conditions, it does not impact on the product's performance. 18. PIN When using this product, ensure that the specification for rated current per a circuit is followed. Do not allow the sum of the current used on several circuits to exceed the maximum allowable current. 19. Do not use the connector in a condition where the mating area (contact area) are constantly moved due to sympathetic vibration of wires and PWB or constant movement of devices. It may cause contact failure due to the worn out. Therefore fix wires and PWB on the chassis to reduces sympathetic vibration. 20. Keep enough clearance between connector and chassis of your application in order to avoid pressure on the connector. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 12 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 21. When using this product in an environment where dew condensation and water wetting occur, apply an appropriate drip-proof treatment. Dew condensation and water wetting could cause insulation failure between the circuits. 22. Avoid using a connector alone to mechanically support the PWB. Adopt separate fixture to support PWB besides the connector in the chassis. 23. Do not mate and un-mate connectors while those are energized since this connector is not designed to allow it. It may cause danger due to sparks and functional failure of the product. 24. When mounting several board to board connectors on a same PWB, ensure to mount the each mating connector on a separate PWB. 25. At packaging, transportation and storing, avoid applying loads to connectors by handling, interference of connectors or piling-up packages. It could cause functional defect such as connector deformation or breakage. 26. Do not stack PWB directly after mounting the connector on it. 27. Do not wash connector because it may impact the product's function. 28. Do not touch the terminals and fitting nails of connectors before or after mounting onto the PWB. 29. Avoid move or assembly of connector which could apply loads to the direction of the connector pitch, span or rotation. It may damage the connector and crack the soldering. 30. Ensure to mate connectors fully. Also mount and assemble the connector in your application unit with disengagement proof to avoid connector disengagement due to vibration or shocks. 31. Because the receptacle housing of this product use Nylon, insertion/withdrawal force or insertion feeling might change by its water absorption state. Its excess water absorption might cause interference with the mating part a little bit or weaken the click feeling of the lock when mating. However it does not impact the product's features and functions. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 13 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION JAPANESE ENGLISH 32. When conducting manual repairs using a soldering iron, follow the soldering conditions shown in the product specification. If the conditions in the product specification are not followed, it may cause the terminal disengagement, contact gap change, housing deformation, housing melting, and connector damage. 33. When conducting manual repairs using a soldering iron, do not use excess solder and flux than needed. It may cause solder wicking and flux wicking issues, and also eventually cause a contact defect and functional issues. COMPLIANCE WITH ENVIRONMENTAL DIRECTIVE ELVRoHS ELV and RoHS Compliant. REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 14 OF 15 EN-037(2015-11 rev.1) LANGUAGE PRODUCT SPECIFICATION REV. REV. RECORD A RELEASED JAPANESE ENGLISH DATE ECN NO. WRITTEN BY : CHECKED BY : `04/11/11 J2005-1415 E.SUZUKI K.TOJO B REVISED `14/08/04 J2015-0176 N.NAITO T.ASAKAWA C REVISED `15/12/14 J2016-0624 S.TERUKI K.TANAKA REVISE ON PC ONLY C SEE SHEET 1 OF 15 REV. DESCRIPTION DOCUMENT NUMBER PS-52465-014 TITLE: 0.8mm PITCH BOARD TO BOARD CONNECTOR -LEAD FREE THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION FILE NAME SHEET PS-52465-014_Re v_C.docx 15 OF 15 EN-037(2015-11 rev.1)