ASMT-UWB1-NX3G2 - Avago Technologies

ASMT-UWB1-Nxxxx

OneWhite Surface Mount PLCC-2 LED Indicator

Data Sheet

CAUTION: LEDs are ESD sensitive. Please observe appropriate precautions during handling and processing.

Description

This family of SMT LEDs is packaged in the industry

standard PLCC-2 package. These SMT LEDs have high

reliability performance and are designed to work under

a wide range of environmental conditions. This high

reliability feature makes them ideally suited to be used as

interior signs application conditions.

To facilitate easy pick & place assembly, the LEDs are

packed in EIA-compliant tape and reel. Every reel will be

shipped in single intensity and color bin.

These LEDs are compatible with reow soldering process.

The wide viewing angle at 120° makes these LEDs ideally

suited for panel, push button, oce equipment, industrial

equipment, and home appliances. The at top emitting

surface makes it easy for these LEDs to mate with light

pipes. With the built-in reector pushing up the intensity

of the light output, these LEDs are also suitable to be used

as LED pixels in interior electronic signs.

Features

• High reliability package with silicone encapsulation

• Compatible with reow soldering process

• High optical eciency with 100 lm/W

• Available in 8 mm carrier tape with reel diameter

180mm

• JEDEC MSL 3 product

• ESD threshold of 1000 V (HBM model) per Jedec

Applications

• Non-automotive use

• General Signage backlighting

• Amusement machine backlighting

• Industrial lighting

• Light strips

Package Drawing

Notes:

1. All dimensions in millimeters.

2. Terminal nish = Ag plating.

0.8 ± 0.3

3.5 ± 0.2

2.8 ± 0.2

0.5 ± 0.1

3.2 ± 0.2

2.2 ± 0.2

1.9 ± 0.2

0.1 TYP. 0.8 ± 0.1

CATHODE MARKING

Device Selection Guide

Color Part Number

CCT

(K)

Luminous Intensity (mcd) [1,2] Test Current

(mA) ChipMin Typ Max

White ASMT-UWB1-NX302 4500 ~ 8000 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX312 2700 ~ 4000 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3A2 8000 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3B2 6500 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3C2 5700 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3D2 5000 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3E2 4500 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3F2 4000 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3G2 3500 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3H2 3000 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX3J2 2700 1800 2300 3550 20 InGaN

White ASMT-UWB1-NX7B2 6500 2240 - 4500 20 InGaN

White ASMT-UWB1-NX7D2 5000 2240 - 4500 20 InGaN

White ASMT-UWB1-NX7C2 5700 2240 - 4500 20 InGaN

Notes:

1. The luminous intensity is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned

with this axis.

2. Tolerance ±12%

Absolute Maximum Ratings (TA = 25° C)

Parameters Rating

DC Forward Current (1) 30 mA

Peak Forward Current (2) 100 mA

Power Dissipation 108 mW

Junction Temperature 110° C

Operating Temperature -40° C to +100° C

Storage Temperature -40° C to +100° C

Notes:

1. Derate linearly as shown in derating curve.

2. Duty Factor = 10%, Frequency = 1 kHz

Optical Characteristics (TA = 25° C)

Color Part Number

Dice

Technology

Typ. Chromaticity

Coordinates (1)

Viewing

Angle 2θ½ (2)

(Degrees)

Luminous

Eciency

ηe (lm/W)

Total Flux /

Luminous Intensity

θV (lm) / IV (cd) CRI

x y Typ. Typ. Typ. Min.

White ASMT-UWB1 InGaN 0.33 0.34 120 100 2.8 70

Notes:

1. The chromaticity coordinates are derived from the CIE 1931Chromaticity diagram and represents the perceived color of the device.

2. θ½ is the o-axis angle where the luminous intensity is ½ the peak intensity.

Electrical Characteristics (TA = 25° C)

Color Part Number

Forward Voltage

VF (Volts) @ IF = 20 mA

Reverse Voltage

VR (1) @ 10 mAThermal Resistance

RθJ-P (°C/W)Min. Max. Min.

White ASMT-UWB1 2.8 3.6 5 150

Note:

1. Reverse Voltage indicates product nal test condition. Long term reverse bias is not recommended.

Part Numbering System

Packaging Option

Color Bin Selection

Intensity Bin Selection

LED Chip Color

ASMT – U X1 B1 – N X2 X3 X4 X5

0.2

0.4

0.6

0.8

1.2

1.4

1.6

0 5 10 15 20 25 30 35

DC FORWARD CURRENT (mA)

RELATIVE LUMINOUS INTENSITY

(NORMALIZED AT 20 mA)

0.25

0.5

0.75

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT (°)

NORMALIZED INTENSITY

217° C

200° C

60 - 120 SEC.

6°C/SEC. MAX.

3°C/SEC. MAX.

150° C

255 - 260° C

100 SEC. MAX.

10 - 30 SEC.

TIME

TEMPERATURE

(Acc. to J-STD-020C)

0 20 40 60 80 100 120

MAXIMUM FORWARD CURRENT (mA)

AMBIENT TEMPERATURE (°C)

01234

FORWARD CURRENT (mA)

FORWARD VOLTAGE (V)

-0.006

-0.005

-0.004

-0.003

-0.002

-0.001

0.001

0.002

0.003

-0.0014 -0.001 -0.0006 -0.0002 0 0.0002 0.0006

5mA

10mA

20mA

30mA

Figure 1. Forward current vs. forward voltage Figure 2. Relative intensity vs. forward current

Figure 3. Chromaticity shift vs. current Figure 4. Radiation pattern

Figure 5. Maximum forward current vs. ambient temperature.

Derated based on Tjmax 110° C, Rthja 600°C/W

Figure 6. Recommended Pb-free reow soldering prole

Figure 8. Recommended Soldering Pad Pattern

END

THERE SHALL BE A

MINIMUM OF 160 mm

OF EMPTY COMPONENT

POCKETS SEALED WITH

COVER TAPE.

MOUNTED

WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 400 mm

OF EMPTY COMPONENT

POCKETS SEALED WITH

COVER TAPE.

START

USER FEED

DIRECTION

Figure 9. Tape Leader and Trailer Dimensions

Figure 10. Tape Dimensions (Unit: mm)

3.85 ±0.1

2.15 ±0.1 3.10 ±0.1

4.00 ±0.1

2.00 ±0.05

3.5 ±0.1 8.00 ±0.1

1.55 ±0.05

1.75 ±0.1

Cathode Marking

2.60

4.50

1.50

SOLDER RESIST

14.4 (MAX. MEASURED AT HUB)

7.9 (MIN.)

10.9 (MAX.)

62.5

2+0.5

–0

Ø 20.5 ± 0.3

Ø 13 ± 0.2

–2.5

8.4 (MEASURED AT OUTER EDGE)

+1.50

–0.00

180

LABEL AREA (111 mm x 57 mm)

WITH DEPRESSION (0.25 mm)

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

Figure 10. Reel Dimensions (Unit: mm)

Figure 11. Reel Orientation

Intensity Bin Select (X2 X3)

Individual reel will contain parts from one half bin only.

X2Min IV Bin

0 Full Distribution

3 3 half bins starting from x21

4 4 half bins starting from x21

5 5 half bins starting from x21

7 3 half bins starting from x22

8 4 half bins starting from x22

9 5 half bins starting from x22

Intensity Bin Limits

Bin ID Min. (mcd) Max. (mcd)

X1 1800 2240

X2 2240 2850

Y1 2850 3550

Y2 3550 4500

Z1 4500 5600

Z2 5600 7150

AA 2000 2500

Tolerance of each bin limit = ±12%

Color Bin Selection (X4)

Individual reel will contain parts from one full bin only.

Bin Color Bin ID

A 1A, 1B, 1C, 1D

B 2A, 2B, 2C, 2D

C 3A, 3B, 3C, 3D

D 4A, 4B, 4C, 4D

E 5A, 5B, 5C, 5D

F 6A, 6B, 6C, 6D

G 7A, 7B, 7C, 7D

H 8A, 8B, 8C, 8D

J 9A, 9B, 9C, 9D

K 1A, 1B, 1C, 1D, 2A, 2B, 2C, 2D,

L 2A, 2B, 2C, 2D, 3A, 3B, 3C, 3D

M 3A, 3B, 3C, 3D, 4A, 4B, 4C, 4D

N 4A, 4B, 4C, 4D, 5A, 5B, 5C, 5D

Q 6A, 6B, 6C, 6D, 7A, 7B, 7C, 7D

R 7A, 7B, 7C, 7D, 8A, 8B, 8C, 8D

S 8A, 8B, 8C, 8D, 9A, 9B, 9C, 9D

0 1A, 1B, 1C, 1D, 2A, 2B, 2C, 2D, 3A, 3B, 3C, 3D, 4A, 4B, 4C,

4D, 5A, 5B, 5C, 5D

16A, 6B, 6C, 6D, 7A, 7B, 7C, 7D, 8A, 8B, 8C, 8D, 9A, 9B, 9C, 9D

Color Bin ID Limits

Color

Bin ID Chromaticity Coordinates Limits

1A x 0.2950 0.2920 0.2984 0.3009

y 0.2970 0.3060 0.3133 0.3042

1B x 0.2920 0.2895 0.2962 0.2984

y 0.3060 0.3135 0.3220 0.3133

1C x 0.2984 0.2962 0.3028 0.3048

y 0.3133 0.3220 0.3304 0.3207

1D x 0.2984 0.3048 0.3068 0.3009

y 0.3133 0.3207 0.3113 0.3042

2A x 0.3048 0.3130 0.3144 0.3068

y 0.3207 0.3290 0.3186 0.3113

2B x 0.3028 0.3115 0.3130 0.3048

y 0.3304 0.3391 0.3290 0.3207

2C x 0.3115 0.3205 0.3213 0.3130

y 0.3391 0.3481 0.3373 0.3290

2D x 0.3130 0.3213 0.3221 0.3144

y 0.3290 0.3373 0.3261 0.3186

3A x 0.3215 0.3290 0.3290 0.3222

y 0.3350 0.3417 0.3300 0.3243

3B x 0.3207 0.3290 0.3290 0.3215

y 0.3462 0.3538 0.3417 0.3350

3C x 0.3290 0.3376 0.3371 0.3290

y 0.3538 0.3616 0.3490 0.3417

3D x 0.3290 0.3371 0.3366 0.3290

y 0.3417 0.3490 0.3369 0.3300

4A x 0.3371 0.3451 0.3440 0.3366

y 0.3490 0.3554 0.3427 0.3369

4B x 0.3376 0.3463 0.3451 0.3371

y 0.3616 0.3687 0.3554 0.3490

4C x 0.3463 0.3551 0.3533 0.3451

y 0.3687 0.3760 0.3620 0.3554

4D x 0.3451 0.3533 0.3515 0.3440

y 0.3554 0.3620 0.3487 0.3427

5A x 0.3530 0.3615 0.3590 0.3512

y 0.3597 0.3659 0.3521 0.3465

5B x 0.3548 0.3641 0.3615 0.3530

y 0.3736 0.3804 0.3659 0.3597

5C x 0.3641 0.3736 0.3702 0.3615

y 0.3804 0.3874 0.3722 0.3659

5D x 0.3615 0.3702 0.3670 0.3590

y 0.3659 0.3722 0.3578 0.3521

Tolerance of each bin limit = ±0.01

Color

Bin ID Chromaticity Coordinates Limits

6A x 0.3670 0.3702 0.3825 0.3783

y 0.3578 0.3722 0.3798 0.3646

6B x 0.3702 0.3736 0.3869 0.3825

y 0.3722 0.3874 0.3958 0.3798

6C x 0.3825 0.3869 0.4006 0.3950

y 0.3798 0.3958 0.4044 0.3875

6D x 0.3783 0.3825 0.3950 0.3898

y 0.3646 0.3798 0.3875 0.3716

7A x 0.3889 0.3941 0.4080 0.4017

y 0.3690 0.3848 0.3916 0.3751

7B x 0.3941 0.3996 0.4146 0.4080

y 0.3848 0.4015 0.4089 0.3916

7C x 0.4080 0.4146 0.4299 0.4221

y 0.3916 0.4089 0.4165 0.3984

7D x 0.4017 0.4080 0.4221 0.4147

y 0.3751 0.3916 0.3984 0.3814

8A x 0.4147 0.4221 0.4342 0.4259

y 0.3814 0.3984 0.4028 0.3853

8B x 0.4221 0.4299 0.4430 0.4342

y 0.3984 0.4165 0.4212 0.4028

8C x 0.4342 0.4430 0.4562 0.4465

y 0.4028 0.4212 0.4260 0.4071

8D x 0.4259 0.4342 0.4465 0.4373

y 0.3853 0.4028 0.4071 0.3893

9A x 0.4373 0.4465 0.4582 0.4483

y 0.3893 0.4071 0.4099 0.3919

9B x 0.4465 0.4562 0.4687 0.4582

y 0.4071 0.4260 0.4289 0.4099

9C x 0.4582 0.4687 0.4813 0.4700

y 0.4099 0.4289 0.4319 0.4126

9D x 0.4483 0.4582 0.4700 0.4593

y 0.3919 0.4099 0.4126 0.3944

Tolerance of each bin limit = ±0.01

Figure 11. Color Bins

Forward Voltage Bin

Bin ID Min. Max

F03 2.4 2.6

F04 2.6 2.8

F05 2.8 3.0

F06 3.0 3.2

Tolerance of each bin limit = ±0.1 V

Packaging Option (X5)

Option Test Current Package Type Reel Size

2 20 mA Top Mount 7 Inch

0.2800

0.3000

0.3200

0.3400

0.3600

0.3800

0.4000

0.4200

0.4400

0.2800 0.3000 0.3200 0.3400 0.3600 0.3800 0.4000 0.4200 0.4400 0.4600 0.4800 0.5000

1D 2A

2D 3A

3B 3C

3D 4A

4B 4C

8OOOK

6500K

5700K

5000K

4500K

5B 5C

5D 6A

4000K

7B 7C

3500K

8B 8C

3000K

9B 9C

2700K

PRECAUTIONARY NOTES

1. Handling precautions

The encapsulation material of the LED is made of sili-

cone for better product reliability. Compared to epoxy

encapsulant that is hard and brittle, silicone is softer

and exible. Special handling precautions need to be

observed during assembly of silicone encapsulated

LED products. Failure to comply might lead to damage

and premature failure of the LED. Do refer to Applica-

tion Note AN5288, Silicone Encapsulation for LED: Ad-

vantages and Handling Precautions for more informa-

tion.

a. Do not poke sharp objects into the silicone

encapsulant. Sharp object like tweezers or syringes

might apply excessive force or even pierce through

the silicone and induce failures to the LED die or

wire bond.

b. Do not touch the silicone encapsulant. Uncontrolled

force acting on the silicone encapsulant might result

in excessive stress on the wire bond. The LED should

only be held by the body.

c. Do no stack assembled PCBs together. Use an

appropriate rack to hold the PCBs.

d. Surface of silicone material attracts dusk and dirt

easier than epoxy due to its surface tackiness. To

remove foreign particles on the surface of silicone, a

cotton bud can be used with isopropyl alcohol (IPA).

During cleaning, rub the surface gently without

putting much pressure on the silicone. Ultrasonic

cleaning is not recommended.

e. For automated pick and place, Avago has tested

nozzle size below to be working ne with this LED.

However, due to the possibility of variations in other

parameters such as pick and place machine maker/

model and other settings of the machine, customer

is recommended to verify the nozzle selected will

not cause damage to the LED.

2. Handling of moisture sensitive device

This product has a Moisture Sensitive Level 3 rating

per JEDEC J-STD-020. Refer to Avago Application Note

AN5305, Handling of Moisture Sensitive Surface Mount

Devices, for additional details and a review of proper

handling procedures.

a. Before use

- An unopened moisture barrier bag (MBB) can

be stored at <40°C/90%RH for 12 months. If the

actual shelf life has exceeded 12 months and

the humidity Indicator Card (HIC) indicates that

baking is not required, then it is safe to reow the

LEDs per the original MSL rating.

- It is recommended that the MBB not be opened

prior to assembly (e.g. for IQC).

b. Control after opening the MBB

- The humidity indicator card (HIC) shall be read

immediately upon opening of MBB.

- The LEDs must be kept at <30°C / 60%RH at all

times and all high temperature related processes

including soldering, curing or rework need to be

completed within 168 hours.

c. Control for unnished reel

- Unused LEDs must be stored in a sealed MBB

with desiccant or desiccator at <5%RH.

d. Control of assembled boards

- If the PCB soldered with the LEDs is to be

subjected to other high temperature processes,

the PCB need to be stored in sealed MBB with

desiccant or desiccator at <5%RH to ensure that

all LEDs have not exceeded their oor life of 168

hours.

e. Baking is required if:

- The HIC indicator is not BROWN at 10% and is

AZURE at 5%.

- The LEDs are exposed to condition of >30°C /

60% RH at any time.

- The LED oor life exceeded 168hrs.

The recommended baking condition is: 60±5ºC

for 20hrs

Baking should only be done once.

f. Storage

- The soldering terminals of these Avago LEDs

are silver plated. If the LEDs are being exposed

in ambient environment for too long, the silver

plating might be oxidized and thus aecting its

solderability performance. As such, unused LEDs

must be kept in sealed MBB with desiccant or in

desiccator at <5%RH.

Note: Diameter "ID" should

be bigger than 2.3mm

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-2936EN - March 26, 2015

DISCLAIMER: Avago’s products and software are not specically designed, manufactured or authorized for sale

as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a

nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to

make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.

TS can be measured easily by mounting a thermo-

couple on the soldering joint as shown in illustration

above, while RqJ-S is provided in the datasheet. User is

advised to verify the TS of the LED in the nal product

to ensure that the LEDs are operated within all maxi-

mum ratings stated in the datasheet.

5. Eye safety precautions

LEDs may pose optical hazards when in operation. It is

not advisable to view directly at operating LEDs as it

may be harmful to the eyes. For safety reasons, use ap-

propriate shielding or personal protective equipments.

6. Disclaimer

Avago’s products are not specically designed, manu-

factured or authorized for sale as parts, components

or assemblies for the planning, construction, mainte-

nance or direct operation of a nuclear facility or for

use in medical devices or applications. Customer is

solely responsible, and waives all rights to make claims

against Avago or its suppliers, for all loss, damage, ex-

pense or liability in connection with such use.

The complication of using this formula lies in TA and

RqJ-A. Actual TA is sometimes subjective and hard to de-

termine. RqJ-A varies from system to system depending

on design and is usually not known.

Another way of calculating TJ is by using solder point

temperature TS as shown below:

TJ = TS + RqJ-S x IF x VFmax

where;

TS = LED solder point temperature as shown in illustra-

tion below [°C]

RqJ-S = thermal resistance from junction to solder point

[°C/W]

3. Application precautions

a. Drive current of the LED must not exceed the

maximum allowable limit across temperature as

stated in the datasheet. Constant current driving is

recommended to ensure consistent performance.

b. LED is not intended for reverse bias. Do use other

appropriate components for such purpose. When

driving the LED in matrix form, it is crucial to ensure

that the reverse bias voltage is not exceeding the

allowable limit of the LED.

c. Do not use the LED in the vicinity of material with

sulfur content, in environment of high gaseous

sulfur compound and corrosive elements. Examples

of material that may contain sulfur are rubber gasket,

RTV (room temperature vulcanizing) silicone rubber,

rubber gloves etc. Prolonged exposure to such

environment may aect the optical characteristics

and product life.

d. Avoid rapid change in ambient temperature

especially in high humidity environment as this will

cause condensation on the LED.

e. Although the LED is rated as IPx6 and IPx8

according to IEC60529: Degree of protection

provided by enclosure, the test condition may not

represent actual exposure during application. If

the LED is intended to be used in outdoor or harsh

environment, the LED must be protected against

damages caused by rain water, water,dust, oil,

corrosive gases, external mechanical stress etc.

4. Thermal management

Optical, electrical and reliability characteristics of LED

are aected by temperature. The junction temperature

(TJ) of the LED must be kept below allowable limit at all

times. TJ can be calculated as below:

TJ = TA + RqJ-A x IF x VFmax

where;

TA = ambient temperature [°C]

RqJ-A = thermal resistance from LED junction to ambi-

ent [°C/W]

IF = forward current [A]

VFmax = maximum forward voltage [V]

Ts point - pin 5

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Avago Technologies:

ASMT-UWB1-NX302 ASMT-UWB1-NX312 ASMT-UWB1-NX3A2 ASMT-UWB1-NX3B2 ASMT-UWB1-NX3C2

ASMT-UWB1-NX3D2 ASMT-UWB1-NX3E2 ASMT-UWB1-NX3F2 ASMT-UWB1-NX3G2 ASMT-UWB1-NX3H2

ASMT-UWB1-NX3J2