SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365J - AUGUST 2001 - REVISED FEBRUARY 2007 FEATURES * * * * * * * * Available in the Texas Instruments NanoFreeTM Package Supports 5-V VCC Operation Max tpd of 3.7 ns at 3.3 V Low Power Consumption, 10-A Max ICC 24-mA Output Drive at 3.3 V Input and Open-Drain Output Accepts Voltages up to 5.5 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25C Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) * * * DCT PACKAGE (TOP VIEW) DCU PACKAGE (TOP VIEW) 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 1A 3Y 2A GND 1 2 3 8 7 6 4 5 YZP PACKAGE (BOTTOM VIEW) VCC 1Y 3A 2Y GND 2A 3Y 1A 4 5 3 6 2 7 1 8 2Y 3A 1Y VCC See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION This triple buffer/driver is designed for 1.65-V to 5.5-V VCC operation. NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package. The output of the SN74LVC3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (2) TOP-SIDE MARKING (2) NanoFreeTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74LVC3G07YZPR _ _ _CV SSOP - DCT Reel of 3000 SN74LVC3G07DCTR C07_ _ _ Reel of 3000 SN74LVC3G07DCUR Reel of 250 SN74LVC3G07DCUT VSSOP - DCU (1) ORDERABLE PART NUMBER C07_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2001-2007, Texas Instruments Incorporated SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365J - AUGUST 2001 - REVISED FEBRUARY 2007 FUNCTION TABLE (EACH BUFFER/DRIVER) INPUT A OUTPUT Y H H L L LOGIC DIAGRAM (POSITIVE LOGIC) 1A 2A 3A 1 7 3 5 6 2 1Y 2Y 3Y Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range -0.5 6.5 V VI Input voltage range (2) -0.5 6.5 V VO Voltage range applied to any output in the high-impedance or power-off state (2) -0.5 6.5 V state (2) (3) -0.5 VO Voltage range applied to any output in the high or low 6.5 V IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current 50 mA 100 mA Continuous current through VCC or GND JA Tstg (1) (2) (3) (4) 2 UNIT Package thermal impedance (4) DCT package 220 DCU package 227 YZP package 102 Storage temperature range -65 150 C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365J - AUGUST 2001 - REVISED FEBRUARY 2007 Recommended Operating Conditions VCC (1) Operating Supply voltage MAX 1.65 5.5 Data retention only 1.7 VCC = 3 V to 3.6 V 0.7 x VCC VCC = 1.65 V to 1.95 V Low-level input voltage V 2 VCC = 4.5 V to 5.5 V VIL V 0.65 x VCC VCC = 2.3 V to 2.7 V High-level input voltage UNIT 1.5 VCC = 1.65 V to 1.95 V VIH MIN 0.35 x VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V V 0.3 x VCC VI Input voltage 0 5.5 V VO Output voltage 0 5.5 V VCC = 1.65 V 4 VCC = 2.3 V IOL Low-level output current t/v 8 16 VCC = 3 V Input transition rise or fall rate VCC = 4.5 V 32 VCC = 1.8 V 0.15 V, 2.5 V 0.2 V 20 VCC = 3.3 V 0.3 V 10 VCC = 5 V 0.5 V TA (1) mA 24 ns/V 5 Operating free-air temperature -40 85 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOL = 100 A VOL MAX 1.65 V 0.45 IOL = 8 mA 2.3 V 0.3 0.4 3V IOL = 32 mA VI = 5.5 V or GND VI or VO = 5.5 V ICC VI = 5.5 V or GND, IO = 0 ICC One input at VCC - 0.6 V, Other inputs at VCC or GND CI VI = VCC or GND UNIT V 0.55 4.5 V Ioff (1) TYP (1) IOL = 4 mA IOL = 24 mA A inputs MIN 0.1 IOL = 16 mA II VCC 1.65 V to 5.5 V 0.55 0 to 5.5 V 5 A 0 10 A 1.65 V to 5.5 V 10 A 3 V to 5.5 V 500 A 3.3 V 3.5 pF All typical values are at VCC = 3.3 V, TA = 25C. Submit Documentation Feedback 3 SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365J - AUGUST 2001 - REVISED FEBRUARY 2007 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) TO (OUTPUT) A Y VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5 V 0.5 V MIN MAX MIN MAX MIN MAX MIN MAX 1.5 7.8 1 4.3 1.1 3.7 1 2.9 UNIT ns Operating Characteristics TA = 25C PARAMETER Cpd 4 Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V TYP TYP TYP TYP 3 3 4 5 Submit Documentation Feedback UNIT pF SN74LVC3G07 TRIPLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS www.ti.com SCES365J - AUGUST 2001 - REVISED FEBRUARY 2007 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) VLOAD RL From Output Under Test S1 Open TEST GND CL (see Note A) RL S1 tPZL (see Notes E and F) VLOAD tPLZ (see Notes E and G) VLOAD tPHZ/tPZH VLOAD LOAD CIRCUIT INPUT VCC 1.8 V 0.15 V 2.5 V 0.2 V 3.3 V 0.3 V 5 V 0.5 V VM tr/tf VI 2 ns 2 ns 2.5 ns 2.5 ns VCC VCC 3V VCC VCC/2 VCC/2 1.5 V VCC/2 VLOAD CL 2 x VCC 2 x VCC 6V 2 x VCC 30 pF 30 pF 50 pF 50 pF RL V 1 k 500 500 500 0.15 V 0.15 V 0.3 V 0.3 V VI Timing Input VM 0V tw tsu th VI VM Input VM VM VM Data Input 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VI VM Input VM 0V tPHL tPLH VOH VM Output VM VOL tPHL tPLH VOH Output VM VI VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VI Output Control VM 0V tPZL Output Waveform 1 S1 at VLOAD (see Note B) Output Waveform 2 S1 at VLOAD (see Note B) VM tPLZ VLOAD/2 VM tPZH VOL + V VOL tPHZ VM VLOAD/2 VLOAD/2 - V 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time, with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 5 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LVC3G07DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUR ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCURE4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUT ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUTE4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC3G07YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2008 OTHER QUALIFIED VERSIONS OF SN74LVC3G07 : SN74LVC3G07-Q1 * Automotive: * Enhanced Product: SN74LVC3G07-EP NOTE: Qualified Version Definitions: - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Automotive * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74LVC3G07DCUR US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 SN74LVC3G07YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LVC3G07DCUR US8 DCU 8 3000 202.0 201.0 28.0 SN74LVC3G07YZPR DSBGA YZP 8 3000 220.0 220.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MPDS049B - MAY 1999 - REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM CCCCC CCCCC CCCCC CCCCC 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0 - 8 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. 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