SN54122, SN54123, SN54130, SN54LS122, SN54LS123, SN74122, SN74123, SN74130, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54122, SN54123, SN54130, SN54LS122, SN54LS123, SN74122, SN74123, SN74130, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54122, SN54123, SN54130, SN54LS122, SN54LS123, SN74122, SN74123, SN74130, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54122, SN54123, SN54130, SN54LS122, SN54LS123, SN74122, SN74123, SN74130, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54122, SN54123, SN54130, SN74122, SN74123, SN74130 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 SN54LS122, SN54LS123, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54122, SN54123, SN54130, SN74122, SN74123, SN74130 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 SN54LS122, SN54LS123, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54LS122, SN54LS123, SN74LS122, SN74LS123 RETRIGGERABLE MONOSTABLE MULTIVIBRATORS SDLS043 - DECEMBER 1983 - REVISED MARCH 1988 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 5962-7603901VFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type 7603901EA ACTIVE CDIP J 16 1 TBD Call TI Call TI 7603901FA ACTIVE CFP W 16 1 TBD Call TI Call TI JM38510/01203BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/31401B2A ACTIVE LCCC FK 20 1 TBD JM38510/31401BEA ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type JM38510/31401BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type M38510/01203BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type M38510/31401B2A ACTIVE LCCC FK 20 1 TBD M38510/31401BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type M38510/31401BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54122J OBSOLETE CDIP J 14 TBD Call TI POST-PLATE N / A for Pkg Type Call TI SN54123J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54LS123J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74122N OBSOLETE PDIP N 14 SN74123N NRND PDIP N 16 25 Pb-Free (RoHS) SN74123N3 OBSOLETE PDIP N 16 TBD Call TI Call TI CU NIPDAU N / A for Pkg Type Call TI Call TI SN74123NE4 NRND PDIP N 16 25 Pb-Free (RoHS) SN74LS122D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples (Requires Login) 5962-7603901VEA TBD (3) CU NIPDAU N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins SN74LS122N ACTIVE PDIP N 14 Package Qty Eco Plan (2) 25 Pb-Free (RoHS) MSL Peak Temp CU NIPDAU N / A for Pkg Type SN74LS122N3 OBSOLETE PDIP N 14 ACTIVE PDIP N 14 25 Pb-Free (RoHS) SN74LS122NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS122NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123J OBSOLETE CDIP J 16 SN74LS123N ACTIVE PDIP N 16 OBSOLETE PDIP N 16 TBD 25 Pb-Free (RoHS) TBD Call TI Call TI CU NIPDAU N / A for Pkg Type Call TI Call TI CU NIPDAU N / A for Pkg Type Call TI Call TI SN74LS123NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) SN74LS123NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS123NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54122J OBSOLETE CDIP J 14 TBD Call TI SNJ54123J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54123W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54LS123FK ACTIVE LCCC FK 20 1 TBD SNJ54LS123J ACTIVE CDIP J 16 1 TBD Addendum-Page 2 CU NIPDAU N / A for Pkg Type Call TI POST-PLATE N / A for Pkg Type A42 (3) Samples (Requires Login) SN74LS122NE4 SN74LS123N3 TBD Lead/ Ball Finish N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device SNJ54LS123W 28-Aug-2012 Status (1) ACTIVE Package Type Package Drawing CFP W Pins 16 Package Qty Eco Plan 1 (2) Lead/ Ball Finish TBD A42 MSL Peak Temp (3) Samples (Requires Login) N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54122, SN54123, SN54LS123, SN54LS123-SP, SN74122, SN74123, SN74LS123 : * Catalog: SN74122, SN74123, SN74LS123, SN54LS123 * Military: SN54122, SN54123, SN54LS123 * Space: SN54LS123-SP NOTE: Qualified Version Definitions: Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2012 * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications * Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS122DR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74LS122NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74LS123DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74LS123NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS122DR SOIC D 14 2500 367.0 367.0 38.0 SN74LS122NSR SO NS 14 2000 367.0 367.0 38.0 SN74LS123DR SOIC D 16 2500 333.2 345.9 28.6 SN74LS123NSR SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated