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UMFT231XA Datasheet
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Future Technology
Devices International
Datasheet
UMFT231XA USB to Full-
Handshake UART
Development Module
UMFT231XA is a USB to serial Full-Handshake UART DIP module with a 0.3” row pitch.
1 Introduction
The UMFT231XA is a development module for FTDI’s
FT231XQ, one of the devices from FTDI’s range of
USB interface bridging integrated circuit devices.
FT231X is a USB to UART interface with a battery
charger detection feature, which can allow batteries
to be charged with a higher current from a
dedicated charger port (without the FT231X being
enumerated). In addition, asynchronous and
synchronous bit bang interface modes are available.
The internally generated clock (6MHz, 12MHz and
24MHz) can be brought out of the on one of the
CBUS pin to be used to drive a microprocessor or
external logic.
The UMFT231XA is a module which is designed to
plug into a standard 0.3wide 20 pin DIP socket. All
components used, including the FT231XQ are Pb-
free (RoHS compliant).
1.1 Features
The UMFT231XA is fitted with a FT231XQ, all the
features of the FT231X can be utilized with the
UMFT231XA. For a full list of the FT231X’s features
please see the FT231X datasheet which can be found
at the FTDI website.
In addition to the features listed in the FT231X
datasheet, the UMFT231XA has the following features:
Small PCB assembly module designed to fit a
standard 7.62mm (0.3”) wide 20 pin DIP socket.
Pins are on a 2.54mm (0.1”) pitch.
On board USB ‘mini-Bsocket allows module to be
connected to a PC via a standard A to mini-B USB
cable.
Functionally configurable using solder links. The
default solder links setup enables the module to
function without peripheral wires or application
board. Other configurations enable external power
supply options and variation of logic reference
levels.
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Table of Contents
1 Introduction ................................................................. 1
1.1 Features ................................................................................ 1
2 Driver Support .............................................................. 3
3 Ordering Information & TID .......................................... 4
4 UMFT231XA Signals and Configurations ......................... 5
4.1 UMFT231XA Pin Out ............................................................... 5
4.2 Signal Descriptions ................................................................ 6
4.3 CBUS Signal Options............................................................... 7
5 Module Configurations .................................................. 8
5.1 Solder Link Configuration Options........................................... 8
5.2 Solder Link Modifications........................................................ 8
5.3 Bus Powered Configuration .................................................... 9
5.4 Self Powered Configuration ...................................................10
5.5 USB Bus Powered with Power Switching Configuration ...........11
5.6 Variable IO Voltage Supply ....................................................12
5.7 3.3V Voltage Supply ..............................................................13
5.8 Configuring the MTP ROM ......................................................14
5.9 Module Dimensions ...............................................................14
5.10 IC Package Markings .............................................................15
6 UMFT231XA Module Circuit Schematic ......................... 16
7 Internal MTP ROM Configuration.................................. 17
8 Contact Information .................................................... 18
Appendix A References ................................................. 19
Document References ...................................................................19
Acronyms and Abbreviations .........................................................19
Appendix B - List of Figures and Tables ............................ 20
List of Figures ...............................................................................20
List of Tables ................................................................................20
Appendix C Revision History.......................................... 21
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2 Driver Support
Royalty-Free D2XX Direct Drivers (USB Drivers
+ DLL S/W Interface):
Windows 10 32, 64 bit
Windows and 8.1 8 32,64-bit
Windows 7 32,64-bit
Windows Vista
Windows XP 32,64-bit
Windows XP Embedded
Windows CE.NET 4.2, 5.0 and 6.0
MAC OS OS-X
Linux 3.0 and greater
Android
The drivers listed above are all available to download for free from www.ftdichip.com. Various 3rd Party
Drivers are also available for various other operating systems - visit ww w.ftdichip.com for details.
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3 Ordering Information & TID
Module Code
Utilised
IC Code
TID
Description
UMFT201XA-01
FT201XQ
40001460
USB to I2C evaluation module , Pin length: 5.6mm.
UMFT201XA-02
FT201XQ
40001460
USB to I2C evaluation module , Pin length: 4.6mm.
UMFT220XA-01
FT220XQ
40001461
USB to 4-bit SPI/FT1248 evaluation module, Pin length:
5.6mm.
UMFT220XA-02
FT220XQ
40001461
USB to 4-bit SPI/FT1248 evaluation module, Pin length:
4.6mm.
UMFT221XA-01
FT221XQ
40001462
USB to 8-bit SPI/FT1248 evaluation module, Pin length:
5.6mm.
UMFT221XA-02
FT221XQ
40001462
USB to 8-bit SPI/FT1248 evaluation module, Pin length:
4.6mm.
UMFT230XA-01
FT230XQ
40001463
USB to Basic UART evaluation module, Pin length: 5.6mm.
UMFT230XA-02
FT230XQ
40001463
USB to Basic UART evaluation module, Pin length: 4.6mm.
UMFT231XA-01
FT231XQ
40001464
USB to Full-Handshake UART evaluation module, Pin length:
5.6mm.
UMFT231XA-02
FT231XQ
40001464
USB to Full-Handshake UART evaluation module, Pin length:
4.6mm.
UMFT240XA-01
FT240XQ
40001466
USB to 8-bit 245 FIFO evaluation module, Pin length: 5.6mm.
UMFT240XA-02
FT240XQ
40001466
USB to 8-bit 245 FIFO evaluation module, Pin length: 4.6mm.
TID is the test identification code for the IC. Note that this TID is for revision D silicon.
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4 UMFT231XA Signals and Configurations
4.1 UMFT231XA Pin Out
J2-1 SLD
VBUS
VCC
RI#
GND
RESET#
CBUS3
CBUS2
CBUS1
J2-10 CBUS0
GND J1-1
3V3OUT
VCCIO
DCD#
DSR#
DTR#
CTS#
RTS#
RXD
TXD J1-10
Figure 4.1 Module Pin Out
Figure 4.1 illustrates the signals available on the DIL pins. The LHS shows the pinout when the module is
viewed from the bottom. The RHS shows what signals are available (on the pins below) when viewed
from the top. The pins do not go completely through the PCB.
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4.2 Signal Descriptions
Pin
No.
Name
Type
Description
J1-1,
J2-5
GND
PWR
Module Ground Supply Pins
J1-2
3V3OUT
Power
Input/
Output
3.3V output from integrated L.D.O. regulator. This pin is decoupled with a 100nF
capacitor to ground on the PCB module. The prime purpose of this pin is to provide
the 3.3V supply that can be used internally. For power supply configuration details
see section 5.
J1-3
VCCIO
Power
Input
+1.8V to +3.3V supply to the UART Interface and CBUS I/O pins. For power supply
configuration details see section 5.
J1-4
DCD#
Input
Data C arrier Detect C ontrol Input.
J1-5
DSR#
Input
Data Set Ready Control Input / Handshake Signal.
J1-6
DTR#
Output
Data Terminal Ready Control Output / Handshake Signal.
J1-7
CTS#
Input
Clear To Send Control Input / Handshake Signal.
J1-8
RTS#
Output
Request to Send Control Output / Handshake Signal.
J1-9
RXD
Input
Receiving Asynchronous Data Input.
J1-10
TXD
Output
Transmit Asynchronous Data Output.
J2-1
SLD
GND
USB C able Shield. Connected to GND via a 0ohm resistor.
J2-2
VBUS
Power
Output
5V Power output from the USB bus. For a low power USB bus powered design, up to
100mA can be sourced from the 5V supply and applied to the USB bus. A maximum
of 500mA can be sourced from the USB bus in a high power USB bus powered design.
Currents up to 1A can be sourced from a dedicated charger and applied to the USB
bus.
J2-3
VCC
Power
Input
5V power input for FT231X. For power supply configuration details see section 5.
J2-4
RI#
Input
Ring Indicator Control Input. When remote wake up is enabled in the internal MTP
ROM taking RI# low >20ms can be used to resume the PC USB host controller from
suspend.
J2-6
RESET#
Input
FT231X active low reset line. Configured with an on board pull-up and recommended
filter capacitor. When no power is applied to the USB bus reset, will be held low, this
prevents current from flowing to the host or hub when in self-powered mode.
J2-7
CBUS3
I/O
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal
MTP ROM. Factory Default pin Function is SLEEP#. See CBUS Signal Options, Table
4.2.
J2-8
CBUS2
I/O
Configurable CBUS I/O Pin. Function of this pin is configured in the de vice internal
MTP ROM. Factory Default pin function is TXLED. See CBUS Signal Options,Table 4.2.
J2-9
CBUS1
I/O
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal
MTP ROM. Factory Default pin Function is RXLED#. See CBUS Signal Options, Table
4.2.
J2-10
CBUS0
I/O
Configurable CBUS I/O Pin. Function of this pin is configured in the device internal
MTP ROM. Factory Default pin Function is TXDED . See C BUS Signal Options,Table 4.2.
Table 4.1 Module Pin Out Description
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4.3 CBUS Signal Options
The following options can be configured on the CBUS I/O pins. These options are all configured in the
internal MTP ROM using the utility software FT_PROG, which can be downloaded from the
www.ftdichip.com. The default configuration is described in DS_UMFT231XA.
CBUS
Signal
Option
Available On
CBUS Pin
Description
Tristate
CBUS0-CBUS3
IO Pad is tristated
DRIVE_1
CBUS0-CBUS3
Output a constant 1
DRIVE_0
CBUS0-CBUS3
Output a constant 0
TXDEN
CBUS0-CBUS3
Enable transmit data for RS485
PWREN#
CBUS0-CBUS3
Output is low after the device has been configured by USB, then high during
USB suspend mode. This output can be used to control power to external logic
P-Channel logic level MOSFET switch.
NOTE: This function is driven by an open-drain to ground with no internal pull-
up; this is specially designed to aid battery charging applications. UMFT231XA
connects an external 47K pull-up.
TXLED#
CBUS0-CBUS3
Transmit data LED drive open drain pulses low when transmitting data via
USB.
RXLED#
CBUS0-CBUS3
Receive data LED drive open drain pulses low when receiving data via USB.
TX&RXLED#
CBUS0-CBUS3
LED drive open drain pulses low when transmitting or receiving data via USB.
SLEEP#
CBUS0-CBUS3
Goes low during USB suspend mode. Typically used to power down an external
logic to RS232 level converter IC in USB to RS232 converter designs. Cancel
SLEEP# option for when connected to a dedicated charger port, this can be
selected when configuring the MTP ROM. When this option is enabled SLEEP# is
driven high when FT231X is connected to a Dedicated Charger Port.
CLK24MHz
CBUS0-CBUS3
24 MHz C lock output.**
CLK12MHz
CBUS0-CBUS3
12 MHz C lock output.**
CLK6MHz
CBUS0-CBUS3
6 MHz C lock output.**
GPIO
CBUS0-CBUS3
CBUS bit bang mode option. Allows up to 4 of the C BUS pins to be used as
general purpose I/O. Configured individually for CBUS0, CBUS1, CBUS2 and
CBUS3 in the internal MTP ROM. A separate application note, AN232R-01,
available from FTDI website (www.ftdichip.com) describes in more detail how
to use C BUS bit bang mode.
BCD_Charger
CBUS0-CBUS3
Battery C harge Detect indicates when the device is connected to a dedicated
battery charger host. Active high output. NOTE: Requires a 10K pull-down to
remove power up toggling.
BCD_Charger#
CBUS0-CBUS3
Active low BCD Charger, driven by an open drain to ground with no internal
pull-up (4.7K on board pull-up present).
BitBang_WR#
CBUS0-CBUS3
Synchronous and asynchronous bit bang mode WR# strobe output.
BitBang_RD#
CBUS0-CBUS3
Synchronous and asynchronous bit bang mode RD# strobe output.
VBUS_Sense
CBUS0-CBUS3
Input to detect when VBUS is present.
Time_Stamp
CBUS0-CBUS3
Toggle signal which changes state each time a USB SOF is received
Keep_Awake#
CBUS0-CBUS3
Active Low input, prevents the chip from going into suspend.
Table 4.2 CBUS Signal Options
**When in USB suspend mode the outputs clocks are also suspended.
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5 Module Configurations
5.1 Solder Link Configuration Options
Solder
Link No.
Setting
Status
Description
JP1
Shorted
Default
Connects internal 3.3V regulator to VCCIO. This restricts signal drive to only 3.3V
level signals.
JP1
Opened
Non-
Default
Disconnects internal 3.3V regulator connection to VCCIO. This mode allows for the
supply of 1.8V-3.3V power from an external power supply, thus allows the
processing of signals with logic levels between 1.8V and 3.3V. VCCIO can be
adjusted to match the interface requirements of external circuitry.
Table 5.1 Solder Links JP1 Pin Description
Solder
Link No.
Setting
Status
Description
JP2
Shorted
Default
Connects VBUS to VCC. This mode is known as “USB-Poweredmode.
JP2
Opened
Non-
Default
Disconnects VBUS to VCC. This allows the supply of power form an external power
supply. This mode is known as “Self-Poweredmode.
Table 5.2 Solder Links JP2 Pin Description
Note: There should never be more than one power output supplied to the same net. Failure to properly
remove solder from JP1 and JP2 can cause a direct short between two different power supplies (when a
self-powered set-up is applied and the USB bus is connected) resulting in damage to the UMFT231XA
module and the target circuit.
5.2 Solder Link Modifications
The UMFT231XA has two solder links fixed to the top side of the PCB. These solder link can be adjusted
by removing the solder linking the two PADs to produce an open or by placing a solder b ridge to produce
a short.
By default the UMFT231XA has both solder links shorting their pads. To allow for enhanced flexibility of
this module remove both solder links and wire the header pins according to the power setup required.
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5.3 Bus Powered Configuration
GND
Solder Link JP1 - Closed
GND
Solder Link JP2- Closed
Alternative
connection
Alternative
connection
Current Flow
Bus Powered
Mode
Self-Sourced
3V3 TTL Mode
VCCIO
3V3OUT VBUS
VCC
Viewing pins thourgh the board
from the top.
Figure 5.1 Bus Powered Configuration
A bus powered configuration draws its power from the USB host/hub. The UMFT231XA is configured by
default to be in bus powered mode.
Figure 5.1illustrates the UMFT231XA module in a typical USB bus powered design configuration. By
default solder bridge connections link VCCIO to 3V3OUT, and VCC to VBUS. (Note that Figure 5.1 is for
illustration only and that the pins do not actually go all the way through the PCB)
For a bus power configuration power is supplied from the USB VBUS:
+5V VBUS power is sourced from the USB bus and is connected to the FT231X power input (VCC)
+3.3V power is sourced from the FT231X’s voltage regulator output and is connected to the FT231X IO
port’s power input (VCCIO).
Interfacing the UMFT231XA module to a microcontroller (MCU), or other logic devices for bus powered
configuration is done the same way as a self-powered configuration (see Section 3), except that it is
possible for the MCU or external device to take its power supply from the USB bus (either the 5V from
the USB pin, or 3.3V from the 3V3OUT pin).
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5.4 Self Powered Configuration
MCU
Vcc = 1.8V 3.3V
TXD
RXD
RTS#
CTS# GND
Vcc = 5V
TXD
RXD
RTS#
CTS#
Solder Link JP2- Open
Solder Link JP1 - Open
GND
Self Power
Mode
Variable TTL
Mode
VIO
VCCIO
3V3OUT VBUS
VCC
Viewing pins thourgh the board
from the top.
Figure 5.2 Self-Powered Configuration
A self-powered configuration operates on the principle of drawing power from an external power supply,
as oppose to drawing power from the USB host. In this configuration no current is drawn from the USB
bus.
Figure 5.2 illustrates the UMFT231XA in a typical USB self-powered configuration. In this case the solder
links connection of JP1 is removed, which allows 5V power to be supplied to the module VCC pins from an
external source. VCCIO can to be powered from 3V3OUT or the VCC of an external source. (Note that
Figure 5.2 is for illustration only and that the pins do not actually go all the way through the PCB)
For a self-powered configuration it is necessary to prevent current from flowing back to the USB data
lines when the connected USB host or hub has powered down. To carry out this function the UMFT231XA
uses an on-board voltage divider network connected to the USB power bus and RESET# pin. This
operates on the principle that when no power is supplied to the VBUS line , the FT231X will automatically
be held in reset by a w eak pull-down, when power is applied the voltage divider will apply a weak 3.3V
pull-up. Driving a level to the RESET# pin of the UMFT231XA will override the effect of this voltage
divider. When the FT231X is in reset the USB DP signal pull-up resistor connected to the data lines is
disconnected and no current can flow down the USB lines.
An example of interfacing the FT231X with a Microcontroller’s UART interface is also illustrated in Figure
5.2. This example shows the wire configuration of the transfer and handshake lines. This example also
illustrates that a voltage other than 3.3V can be supplied to the FT231X’s IO port, this feature is
described further and for bus powered mode in Section 5.6.
Alternatively both the FT231X’s IO port and MCU can be powered from the 3V3OUT pin; this approach is
described in Section 5.5.
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5.5 USB Bus Powered with Power Switching Configuration
MCU
TXD
RXD
RTS#
CTS# GND
TXD
RXD
RTS#
CTS#
Solder Link JP2 - Closed
Solder Link JP1 - Closed
GND
s d
g
1K
0.1uF 0.1uF
Soft
Start
Circuit
PWREN#
CBUSx
P-Channel Power
MOSFET
Bus Powered
Mode
Self-Sorced
3.3V TTL Mode
VCC
10K
VCCIO
3V3OUT VBUS
VCC
5V
Viewing pins thourgh the board
from the top.
Figure 5.3 Bus Powered with Power Switching Configuration
USB bus powered mode is introduced in Section 5.3. This section describes how to use bus-powered
mode with a pow er switch.
USB bus powered circuits are required by USB compliance standards to consume less than 2.5mA (and
less than 100mA when not enumerated and not suspended) when connected to a host or hub when in
USB suspend mode. The PWREN# CBUS function can be used to remove power from external circuitry
whenever the FT231X is not enumerated. (Note: It is impossible to be in suspended mode when
enumerated.) (Note that Figure 5.3 is for illustration only and that the pins do not actually go all the way
through the PCB)
To implement a power switch using PWREN#, configure a P -Channel Power MOSFET to have a soft start
by fitting a 10K pull-up, a 1K series resistor and a 100nF cap as shown in Figure 5.3.
Connecting the source of the P-Channel MOSFET to 3V3OUT instead of VBUS can allow external logic to
source 3.3V power from the FT231X without breaking USB compliancy. In this setup it is important that
the VCCIO is not sourced from the drain of this MOSFET, this is because the power used to drive the gate
of this transistor is sourced from VCCIO. VCCIO should be connected directly to 3V3OUT for this setup to
function effectively. It is also important that the external logic must and IO core of the FT231X must not
draw more that 50mA, this is because the current limit of the internal 3.3V regulator is 50mA.
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5.6 Variable IO Voltage Supply
MCU
Vcc = 1.8V 3.3V
TXD
RXD
RTS#
CTS# GND
TXD
RXD
RTS#
CTS#
Solder Link JP2 - Closed
Solder Link JP1 - Open
GND
VCCIO
3V3OUT VBUS
VCC
Viewing pins thourgh the board
from the top.
Figure 5.4 USB Bus Powered 3.3V Logic Drive
The FT231X can process signals at CMOS/TTL logic levels in the range of 1.8V to 3.3V. This section
describes how to utilise this feature.
Figure 5.4 shows a configuration where the FT231X is interfaced to a device with IOs operating in the
range of 1.8V - 3.3V. The IO ports of this module need to be powered with a voltage level that is equal to
the level of the signals it is processing. Since the FT231X’s embedded voltage regulator only outputs 3V3
the IO ports will need to be powered from another power source when operating at voltage levels other
than 3.3V. (Note that Figure 5.4 is for illustration only and that the pins do not actually go all the way
through the PCB)
By default, a short is present between 3V3OUT (embedded voltage regulator) and VCCIO (IO ports
power input) by solder links JP1. If an external power supply is used to power the IO ports this solder
links needs to be open. This can be done by removing the solder linking the two pads of the solder links.
The configuration described in this section can be implemented in either bus -powered mode or self-
powered mode.
Note 1: The CBUS and DBUS pins are 5V tolerant; however these signals cannot drive signals at 5V
TTL/CMOS. VCCIO is not 5V tolerant; applying 5V to VCCIO w ill damage the chip.
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Note 2: If power is applied to VCCIO and no power is applied to VCC all IOs will be at an unknown state,
this however will not damage the chip. The FT231X also has protective circuitry to prevent the chip being
damaged by a voltage discrepancy between VCCIO and the level of the signal being processed .
Note 3: When using VCCIO less than 3V3 on a chip from FTDI’s X-chip range, it is recommended to uses
pull up resistors (47K) to VCCIO on the data lines, all of the UMFT2xxXA devices include an on-board
pull-up for these lines.
5.7 3.3V Voltage Supply
MCU
Vcc = 3.3V
TXD
RXD
RTS#
CTS# GND
TXD
RXD
RTS#
CTS#
Solder Links JP2 - Open
Solder Links JP1 - Closed
GND
Vcc = 3.3V
VCCIO
3V3OUT VBUS
VCC
Viewing pins thourgh the board
from the top.
Figure 5.5 USB Self Powered 3.3V Logic Drive
The FT231X can be powered from a single 3.3V supply. This feature is an alternative to having the
FT231X powered at 5V in standard self-powered configuration.
The 3.3V Self Powered configuration is illustrated in Figure 5.5. Note that the 3.3V input is connected to
VCC, VCCIO and 3V3OUT. (Note that Figure 5.5 is for illustration only and that the pins do not actually go
all the way through the PCB)
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5.8 Configuring the MTP ROM
The FT231X contains an embedded MTP ROM. This can be used to configure the functions of each CBUS
pin, the current drive on each signal pin, current limit for the USB bus and the other descriptors of the
device. For details on using the MTP ROM/EEPROM programming utility FT_PROG, please see the
FT_PROG User Guide and FT231X datasheet.
When programming the MTP ROM please note:
i) One of the CBUS Pins can be configured as PWREN# in the internal MTP ROM. This can be used to
switch the power supply to the external circuitry.
ii) The Max Bus Power setting of the MTP ROM should specify the maximum current to be drawn from
the USB host/hub when enumerated. For high-powered USB devices the current limit when
enumerated is between 100mA and 500mA, for low -powered USB devices the current limit is
100mA.
5.9 Module Dimensions
Figure 5.6 UMFT231XA Module Dimensions
All dimensions are given in millimetres.
The UMFT231XA module exclusively uses lead free components, and is fully compliant with European
Union directive 2002/95/EC.
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5.10 IC Package Markings
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number. This is
followed by the revision letter.
The code XXXXXXX is the manufacturing LOT code.
FTDI
I
XXXXXXXXXX
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UMFT231XA Datasheet
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6 UMFT231XA Module Circuit Schematic
Figure 6.1 Module Circuit Schematic
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UMFT231XA Datasheet
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7 Internal MTP ROM Configuration
Following a power-on reset or a USB reset the FT231X will scan its internal MTP ROM and read the USB
configuration descriptors stored there. The default values programmed into the internal MTP ROM in the
FT231XQ used on the UMFT231XA are shown in Table 8.1.
Parameter
Value
Notes
USB Vendor ID (VID)
0403h
FTDI default VID (hex)
USB Product UD (PID)
6015h
FTDI default PID (hex)
Serial Number Enabled?
Yes
Serial Number
See Note
A unique serial number is generated and programmed into
the MTP ROM during final test of the UM232R module.
Pull down I/O Pins in USB
Suspend
Disabled
Enabling this option will make the device pull down on the
UART interface lines when the power is shut off (PWREN#
is high).
Manufacturer Name
FTDI
Product Description
UMFT231XA
Max Bus Power C urrent
90mA
Power Source
Bus Powered
Device Type
FT231X
USB Version
0200
Returns USB 2.0 device description to the host. Note: The
device is a USB 2.0 Full Speed device (12Mb/s) as opposed
to a USB 2.0 High Speed device (480Mb/s).
Remote Wake Up
Enabled
Taking RI# low will wake up the USB host controller from
suspend.
High C urrent I/Os
Disabled
Enables the high drive level on the UART and CBUS I/O
pins.
Load VCP Driver
Enabled
Makes the device load the CVP driver interface for the
device.
CBUS0
GPIO
CBUS1
GPIO
CBUS2
GPIO
CBUS3
GPIO
Invert UART
Disabled
Signal on this pin becomes TXD# if enable.
Table 7.1 Default Internal MTP ROM Configuration
The internal MTP ROM in the FT231X can be programmed over USB using the utility program FT_PROG.
FT_PROG can be downloaded from the www.ftdichip.com. Users who do not have their own USB vendor
ID but w ho would like to use a unique Product ID in their design can apply to FTDI for a free block of
unique PIDs. Contact FTDI Support (support1@ftdichip.com) for this service , also see TN_100 and
TN_101.
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UMFT231XA Datasheet
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8 Contact Information
Head Office Glasgow, UK
Branch Office Tigard, Oregon, USA
Future Technology Devices International Limited
Unit 1, 2 Seaward Place, Centurion Business Park
Glasgow G41 1HH
United Kingdom
Tel: +44 (0) 141 429 2777
Fax: +44 (0) 141 429 2758
Future Technology Devices International Limited (USA)
7130 SW Fir Loop
Tigard, OR 97223-8160
USA
Tel: +1 (503) 547 0988
Fax: +1 (503) 547 0987
E-mail (Sales)
sales1@ftdichip.com
E-mail (Sales)
us.sales@ftdichip.com
E-mail (Support)
support1@ftdichip.com
E-mail (Support)
us.support@ftdichip.com
E-mail (General Enquiries)
admin1@ftdichip.com
E-mail (General Enquiries)
us.admin@ftdichip.com
Branch Office Taipei, Taiwan
Branch Office Shanghai, China
Future Technology Devices International Limited (Taiwan)
2F, No. 516, Sec. 1, NeiHu Road
Taipei 114
Taiwan , R.O.C.
Tel: +886 (0) 2 8791 3570
Fax: +886 (0) 2 8791 3576
Future Technology Devices International Limited (China)
Room 1103, No. 666 West Huaihai Road,
Shanghai, 200052
China
Tel: +86 21 62351596
Fax: +86 21 62351595
E-mail (Sales)
tw.sales1@ftdichip.com
E-mail (Sales)
cn.sales@ftdichip.com
E-mail (Support)
tw.support1@ftdichip.com
E-mail (Support)
cn.support@ftdichip.com
E-mail (General Enquiries)
tw.admin1@ftdichip.com
E-mail (General Enquiries)
cn.admin@ftdichip.com
Web Site
http://ftdichip.com
Distributor and Sales Representatives
Please visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales
representative(s) in your country.
System and equipment manufac turers and des igners are res pons ible to ens ure that their sys tems , and any Future T ec hnology Devices
I nternational Ltd (FTDI ) devic es incorporated in their s ystems , meet all applicable safety, regulatory and sys tem-level performanc e
requirements . All application-related information in this doc ument (including applic ation desc riptions , s uggested FTDI devic es and other
materials ) is provided for reference only. While FTDI has taken c are to ass ure it is acc urate, this information is s ubjec t to c us tomer
c onfirmation, and FTDI disclaims all liability for system designs and for any applic ations assis tanc e provided by FTDI . Us e o f FTDI
devic es in life s upport and/or safety applications is entirely at the us er’s risk, and the us er agrees to de fend, indemnify and hold
harmless FTDI from any and all damages , claims , s uits or expens e resulting from s uch use. T his doc ument is s ubject to change without
notice. No freedom to use patents or other intellec tual property rights is implied by the publication of this document. Neither the whole
nor any part of the information c ontained in, or the product desc ribed in this document, may be adapted or reproduced in any material
or elec tronic form without the prior written c onsent of the c opyright holder. Futu re Tec hnology Devices I nternational L td, U nit 1 , 2
Seaward P lac e, C enturion B usiness P ark, G lasgow G 4 1 1HH, U nited Kingdom. Sc otland Registered Company N umber: S C136640
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UMFT231XA Datasheet
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Appendix A References
Document References
DS_FT201x
DS_FT220X
DS_FT221X
DS_FT230X
DS_FT231X
DS_FT240X
DS_UMFT230XA
AN232R-01
AN_124 User Guide for FT Prog
TN_100 USB VID-PID Guidelines
TN_101 Guide to Debugging Customers Failed Driver Installation
Acronyms and Abbreviations
Terms
Description
DIP
Dual In-line Package
DLL
Dynamic Link Library
IC
Integrated Circuit
C
Inter Integrated Circuit
OS
Operating System
PCB
Printed Circuit Board
ROM
Read Only Memory
USB
Universal Serial Bus
VCP
Virtual COM Ports
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Appendix B - List of Figures and Tables
List of Figures
Figure 4.1 Module Pin Out ................................................................................................................... 5
Figure 5.1 Bus Powered Configuration.................................................................................................. 9
Figure 5.2 Self-Powered Configuration ............................................................................................... 10
Figure 5.3 Bus Powered w ith Power Switching Configuration .............................................................. 11
Figure 5.4 USB Bus Powered 3.3V Logic Drive.................................................................................... 12
Figure 5.5 USB Self Powered 3.3V Logic Drive ................................................................................... 13
Figure 6.1 UMFT231XA Module Dimensions ........................................................................................ 14
Figure 8.1 Module Circuit Schematic .................................................................................................. 16
List of Tables
Table 4.1 Module Pin Out Description................................................................................................... 6
Table 4.2 CBUS Signal Options ............................................................................................................ 7
Table 5.1 Solder Links JP1 Pin Description ........................................................................................... 8
Table 5.2 Solder Links JP2 Pin Description ........................................................................................... 8
Table 9.1 Default Internal MTP ROM Configuration ............................................................................. 17
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UMFT231XA Datasheet
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Appendix C Revision History
Document Title: UMFT231XA USB to Full-Handshake UART Development Module
Document Reference No.: FT_000512
Clearance No.: FTDI# 270
Product Page: http://www.ftdichip.com/FT-X.htm
Document Feedback: Send Feedback
Revision
Changes
Date
1.0
Initial Release
2012-02-09
1.0
Added links, references to silicon revision, TID and
logos
2012-06-13
1.2
Added a section for package marking and changed
TIDs
2013-01-29
1.3
Added ordering information and support for Win 10
2016-04-13
Mouser Electronics
Authorized Distributor
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