PLZ Series
www.vishay.com Vishay Semiconductors
Rev. 1.3. 19-Nov-2018 1Document Number: 84830
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Zener Diodes Permitting 500 mW Power Dissipation
DESIGN SUPPORT TOOLS
FEATURES
• Sillicon planar Zener diodes, ultra small
• Low profile MicroSMF (DO-219AC) package
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C / 10 s at
terminals
• Wave and reflow solderable (reflow as per
JPC / JEDEC® J-STD 020) (double wave as per
IEC 61760-1)
• AEC-Q101 qualified available
• Base P/N-G3 - RoHS-compliant, green,
industrial grade
•
Base P/N-HG3 - RoHS-compliant, green, AEC-Q101 qualified
• ESD immunity acc. IEC 61000-4-2 acc. to part table
• Surge performance acc. to part table
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
PARAMETER VALUE UNIT
VZ range nom. 2.0 to 39 V
Test current IZT 5 to 20 mA
VZ specification Pulse current
Circuit configuration Single
eSMP® Series
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Available
ORDERING INFORMATION
DEVICE NAME ORDERING CODE TAPED UNITS PER REEL MINIMUM ORDER QUANTITY
PLZ-Series Part number-G3/H 4500 per 7" reel (8 mm tape) 22 500 / box
PLZ-Series Part number-HG3/H
PACKAGE
PACKAGE NAME WEIGHT MOLDING COMPOUND
FLAMMABILITY RATING MOISTURE SENSITIVITY LEVEL SOLDERING CONDITIONS
MicroSMF (DO-219AC) 4.8 mg UL 94 V-0 MSL level 1 (according J-STD-020) 260 °C / 10 s at terminals
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Power dissipation Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land
10 mm x 10 mm, Tamb = 85 °C Ptot 500
mW
Power dissipation Mounted on FR4 board 50 mm x 50 mm x 1.6 mm, solder land
10 mm x 10 mm, Tamb = 25 °C Ptot 960
Power dissipation Mounted on FR4 board with recommended soldering footpads
(reflow) Ptot 340
Non-repetitive peak surge power
dissipation
tp = 8/20 μs acc. IEC 61000-4-5 (PLZ5V1A to PLZ39D) PZSM 100 W
tp = 8/20 μs acc. IEC 61000-4-5 (PLZ2V0A to PLZ4V7C) PZSM 70 W
Z-current IZPtot/VZ mA
Junction temperature Tj150 °C
Storage temperature range Tstg -55 to +150
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Typ. thermal resistance junction to ambient air Mounted on FR4 board 50 mm x 50 mm x 1.6 mm,
solder land 10 mm x 10 mm RthJA 130 K/W
Typ. thermal resistance junction to lead RthJL 40 K/W
ELECTRICAL SPECIFICATIONS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward Voltage IF = 10 mA VF0.8 0.9 V