05/0.8mm 2 yt Ir4 MN (ipo | R= B SMT AY) 411-5808 Heike ha 0.5/0.8mm PITCH Fine Mate Connector Released | FJOO-1019-00 Handling and Operation Instruction Sheet Rev. Cc 1. SRIF RAM BBY 1, 1.1 = Rae AER BICIE. ROA OSE, 1-1. FavAOSa-SS, BMeSlAEeR WIRE RLET, ARIF ~ RS BLIALL, AVEO HIER OF BOR ARCROET, 12 fl-Bthtes27 2 ORE 1-2. ite Fav, WARS 37 ROY Sano AC POET, 2. Hik~ ORO it 2, ARIPO FTV AEEBEE SP icp LC, BRM LACEITHOP ITS LAR SROPBL REV RLET. RGAE eR BIEL CBOE B SAE ASROFRLSICLUARAS ATW AICHSBOICI, Pf - Mica EM MALE ESITHERLT PSU. (SISA DBE: SSO5C, SELAA) LARA ST YRORBERAERFB RU PERE HB 72 MICRO ET, (1) ANDLING OF CONNECTOR BODY Tools such as a screw driver or probing pin etc. should not be inserted in to the contact area of connector. INSERTION OF THE FOREIGN MATTERS INTO CONNECTORS WILL CAUSE SERIOUS PLATE-PEELING AND/OR TERMINAL DEFORMATION. Only one (1) connector should be used per one (1) PCB. It MAY CAUSE CRACKING OF SOLDER IGINTS AND BREAKAGE OF HOUSING. MOUNTING OPERATION ONTO PCB Adjust meunting device of automatic placement machine accordingly, so as to get the connectors held horizontally with the surface of PCB care should be taken such that the soldering tines are not deformed during this operation. This connector is designed for flow soldering, However, when the use of soldering iron is required for rework, care must be taken not to let the tip end of the iron touch on the tines of connector as this will deform the tines, The solder iron tip should touch on the PCB solder411-5808 pads only. (Manual soldering conditions:350+ 5C, 3 Seconds Maximum) DEFORMATION OF SOLDERING TINES IS OFTEN THE CAUSE OF BAD SOLDER JOINTS AND SUBSEQUENTLY,AFFECTS THE PERFORMANCE OF CONNECTORS. 21 Ey PF GAICRBT SL, 2RYFORR RY 2-1. The soldering tine deformed in the pitch AiR CARIVE ME REP bah, direction will fail to be aligned with the TER ARILA TEA SOS CRRA ET , corresponding PCB solder pad This condition is not good for soldering RBG Circuit plane of PC board ata tr a We a ep a dabaae PEEP TR Se ro: eo ene 4 hee E vFAT Pitch direction Sidedag me cy Bb@iee e |Nedstoaton | 1 2.2 ARIF RSD ACRE PSL, ARLSHH 2-2. Deformation of the soldering tine in the AR AR OAD TR tc AAR EL EB TT LOZ) Abt direction of connector height lead to no MERA DRY BERODET, adhesion of paste solder between the PCB solder pad and solder tines, and also cause the Manhattan phenomenon at reflow soldering. Jt 97 FEUB Receptacle Tab (TYP) y-dek BBO & older cream Solder a ef AE pa " ER ATES {VER Soldering tine PC board (2) Rev. C411-5808 3. TRE PER 3, MATING OPERATION ARIS tte SHER L, URN Ye LAT Ay The mating operation should be carried PREC Bt, MEAL EE Ae ae out without excessive misalignment tilt. cetemo LREALT TAY, Tt is advisable to align the housings lightly before exerting the full mating force. fiXti10 LIAIZLT FAV, TILT MUST BE WITHIN 10 DEGREES Zeik EAT RT Parallel mount type to PC board ARGHOR LASER, Hald the top of connector, RLIAAMR ATS, Push strongly and mate it. ) | | Ry SAPP ER OICR PE CMRALIORIE TC, E In the mating process, NEVER move the vPARMICP OSV ICH RLET, connector in the longitudinal direction. AYFA+ORERUAGY YS ORIUCLOR AR MOVING THE CONNECTORS IN PERE ATA A AICROET, LONGITUDINAL DIRECTION DURING A HALF-MATED CONDITION, WILL OFTEN CAUSE DEFECTIVE EFFECTS TO THE FUNCTION OF THE CONNECTOR. (3) Rev. C411-5808 4, Hee (TEE) Os 4, TREATMENT OF MATED ft EL RAR ILA (SY) SPUR LIT BRVRLET, HiicAnApraLbbon AL, AM dh Ss ICKSBRO RPE LET, RX. TOR -BRMEAVSICIORETSAR, RAR ez AS BRC RELAY YC FP ab, RAEBOI CVA S37 OWA ROET, dea AE Lay RET A BY (Af y FP SO ARBEIT LEDS) Kojiri (PC board may sometimes be depressed by a switch etc.) poe ata Gonn, > CONNECTORS (IN PROCESS) No load (Kojiri} should be applied to PC board after completion of the connector mating, Support the PC board using supplementary parts, when it is considered some load may be applied to the PC board . Fixing holes should be properly aligned before the PC board is fixed to the chasais. KOJIRI (LOAD) EXERTED AFTER THE CONNECTOR MATING WILL CAUSE SOLDER CRACK. Parallel mount type to PC board. Ha75 Gann qf f Hea ME Bc k SAR OIF Support of PG board with supplementary parts (4) Rev. C411-5808 aR FR AE ORT ARAL Att, When mounting mated PCBs onto a case / RABOARZ FI ALR ALOR ORI chassis fix the PCBs in a condition such that FELT FA, i, RE ORS, ERYIC the Mated PCBs are Should have minimal LARA BE SORA MDSAV IIH relative movement. Bee RLET, Care should be taken to eliminate undue , SRE CARLY MGI, BeSAIICE twisting and distorting stress resulting from ABEL RBORLET. mounting and securing printed circuit board. In the case that above mentioned method is not available, using a proper adhesive may be recommendable to secure the PCB as an alternative. flee HH Fixing position < Ble CTA) Fixing position (Fixing hole) a ae B- d ! , 1 1 1 i Hl Hl BE CHT 7X) Fixing position (Fixing hole) TRA4 Conn. TA Case LULL LLL (5) Rev. C5. Hae PERE FRO O RAO BEML, SRORITULY Te Fr (Ba IZIU SLICE T (10 SAS) | ete WRAY, RY), PLATS SATS LILA Reo 7 ORALRVET, 10 EL FLOR ECSU Ye FAL, {ey FA A), FR FTA) 16 EOE CICS YO FEY, (oF 271A), FRAT) (4E): P/N: 8-1376459-0(80Pos.TAB), 1376456-1(100Pos. TAB), 8-316592-0(80Pos.REC.), 917734-1(100Pos, REC. iC IRE WAS st ae = = ie 5. = 411-5808 REMOVAL OPERATION When removing the PCB board from connector, it is necessary to hold the portion of the PCB close to connector and extract the PC board straightly. When the extraction force is high, it may be easier to unmate the PCB by tilting it, in one direction and then the other while extracting. However, this tilt must not be more than 10 . (in the longitudinal direction,and in the row direction) However, this tilt must not be more than 15 . {in the longitudinal direction,in the row direction} NOTE: Restricted to P/N: 8-1376459-0(80Pos. TAB), 1376456-1(100Pos. TAB), 8-316592-0(80Pos.REC.), 917734-1(100Pos, REC.) Parallel mount type to PC board (6) Rev. C411-5808 i Le he POR ae ~ TAB ASSEMELY o. a5 * at Oe te ow a ee oe RECEPTACLE aSSEMBLY \ \ \ . + Re SS Sd 0.55 sy 2.55 ar et Ot MATING SECTION FIGURE (H-TYPE? (7) Rev. C