QJD1210006
Silicon Carbide MOSFET Module
100 Amperes/1200 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
2
Preliminary
04/10 Rev. 5
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specied
Ratings Symbol QJD1210006 Units
Drain-Source Voltage (G-S Short) VDDS 1200 Volts
Gate-Source Voltage VGSS -5 / +20 Volts
Drain Current (Continuous) at TC = 150°C ID 100 Amperes
Drain Current (Pulsed)* ID(pulse) 250 Amperes
Maximum Power Dissipation (TC = 25°C, Tj < 175°C) PD 880 Watts
Junction Temperature Tj -40 to 200 °C
Storage Temperature Tstg -40 to 150 °C
Mounting Torque, M6 Main Terminal Screws — 40 in-lb
Mounting Torque, M6 Mounting Screws — 40 in-lb
Module Weight (Typical) — 400 Grams
V Isolation Voltage VRMS 3000 Volts
MOSFET Characteristics, Tj = 25 °C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Drain-Source Breakdown Voltage V(BR)DSS I
D = 50μA, VGS = 0 1200 — — Volts
Zero Gate Voltage Drain Current** IDSS V
GS = 0, VDS = 1200V — 0.5 50 μA
Zero Gate Voltage Drain Current** IDSS V
GS = 0, VDS = 1200V, Tj = 175°C — 50 — μA
Gate Leakage Current IGSS V
DS = 0, VGS = 20V — — 500 nA
Gate Threshold Voltage VGS(th) V
DS = VGS, ID = 5mA 1.5 2.0 2.5 Volts
V
DS = VGS, ID = 5mA, Tj = 175°C — 1.1 — Volts
Drain-Source On Resistance RDS(on) I
D = 100A, VGS = 20V — 15 25 mΩ
I
D = 100A, VGS = 20V, Tj = 175°C — 20 32 mΩ
Gate to Source Charge Qgs V
DD = 800V, ID = 100A — 140 — nC
Gate to Drain Charge Qgd V
DD = 800V, ID = 100A — 220 — nC
Total Gate Charge QG V
CC = 800V, IC = 100A, VGS = -5/20V — 500 — nC
Body Diode Forward Voltage VSD I
F = 100A, VGS = -5V — 4.3 — Volts
Input Capacitance Ciss — 10.2 — nF
Output Capacitance Coss V
GS = 0, VDS = 800V, f = 1MHz — 1.0 — nF
Reverse Transfer Capacitance Crss — 0.1 — nF
Turn-on Delay Time td(on) V
DD = 800V, ID = 100A, — — TBD ns
Rise Time tr V
GS = 0/20V, — — TBD ns
Turn-off Delay Time td(off) R
G = 10Ω, — — TBD µs
Fall Time tf R
L = 856µH — — TBD ns
* Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed Tj(max) rating.
**Total module leakage includes MOSFET leakage plus reverse Schottky diode leakage.