BD733L2FP3-CE2 - ROHM Semiconductor

Datashee

t

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

. 1/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・14・001

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14.Jul.2014 Rev.006

Single-Output LDO Regulators

Ultra Low Quiescent Current LDO

Regulator

BD7xxL2EFJ/FP/FP3-C

●General Description

The BD7xxL2EF J /F P/FP3-C are low quiescent

regulators featuring 50V a bsolute maximum voltage,

and output voltage accuracy of ±2%, 200mA output

current and 6μA (Typ.) current consumption. There

regulators are therefore ideal for applications

requiring a direct connection to the battery and a

low current consumption. Ceramic capacitors can

be used for compensation of the output capacitor

phase. Furthermore, these ICs also feature

overcurrent protection to protect the device from

damage caused by short-circuiting and an

integrated thermal shutdown to protect the device

from overheating at overload conditions.

●Features

 Ultra low quiescent current: 6μA (Typ.)

 Output current capability: 200mA

 Output voltage: 3.3 V or 5.0 V(Typ.)

 High output voltage accuracy: ±2%

 Low saturation voltage by using PMOS output

transistor.

 Integrated overcurrent protection to protect the

IC from damage caused by output

short-circuiting.

 Integrated thermal shutdown to protect the IC

from overheating at overload conditions.

 Low ESR ceramic capacitor can be used as

output capacitor.

 HTSOP-J8, TO252-3, SOT223-4F 3type

package

●Key specification

 Ultra low quiescent current: 6μA (Typ.)

 Output voltage: 3.3 V or 5.0 V (Typ.)

 Output current capability: 200mA

 High output voltage accuracy: ±2%

 Low ESR ceramic capacitor

can be used as output capacitor

 AEC-Q100 Qualified

●Packages W (Typ.) x D (Typ.) x H (Max.)

 EFJ: HTSOP-J8 4.90mm x 6.00mm x 1.00mm

 FP: TO252-3 6.50mm x 9.50mm x 2.50mm

 FP3: SOT223-4F 6.53mm x 7.00mm x 1.80mm

●Applications

 Automotive (body, audio system, navigation system, etc.)

●Typical Application Circuit s

 Components externally connected: 0.1 µF ≤ CIN, 4.7 µF ≤ COUT (Typ.)

*Electrolytic, tantalum and ceramic capacitors can be used.

Figure 2. Typical Application Circuits

Figure 1. Package Outlook

HTSOP-J8 TO252-3 SOT223-4F

1:VCC 2:N.C. 3:VOUT

FIN

BD7xxL2FP-C

Datasheet

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TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Ordering Information

B D 7 x x L 2 E F J - C E 2

●Lineup

Output current

ability Output voltage

(Typ.) Package type Orderable Part Number

200 mA

3.3 V

HTSOP-J8 BD733L2EFJ-CE2

TO252-3 BD733L2FP-CE2

SOT223-4F BD733L2FP3-CE2

5.0 V

HTSOP-J8 BD750L2EFJ-CE2

TO252-3 BD750L2FP-CE2

SOT223-4F BD750L2FP3-CE2

Package

EFJ: HTSOP-J8

FP: TO252-3

FP3: SOT223-4F

Taping

E2: reel-wound

embossed tamping

Output Voltage

33: 3.3V

50: 5.0V

Datasheet

. 3/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Pin Configuration

Figure 3. Pin Configuration

●Pin Description

Pin No. Pin Name Function

1 VOUT Output pin

2 N.C. Not connected

3 N.C. Not connected

4 N.C. Not connected

5 GND GND

6 N.C. Not connected

7 N.C. Not connected

8 VCC Supply voltage input pin

Pin No. Pin Name Function

1 VCC Supply voltage input pin

2 N.C./GND TO252-3: N.C.

SOT223-4F: GND

3 VOUT Output pin

FIN GND GND

■HTSOP-J8

(※N.C. terminals are not need to connect to GND.

(※Exposed die pad is need to be connected to GND.)

(※N.C. terminals are not need to connect to GND.)

■TO252-3, SOT223-4F

HTSOP-J8

(TOP VIEW) TO252-3

(TOP VIEW) SOT223-4F

(TOP VIEW)

1 2 3 4

8 7 6 5

123

FIN

1 2 3

Datasheet

. 4/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Block Diagram

■HTSOP-J8

■TO252-3, SOT223-4F

Figure 4. Block Diagram

Datasheet

. 5/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

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BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Absolute Maximum Ratings（Ta=25°C）

Parameter Symbol Ratings Unit

Supply Voltage *1 VCC -0.3 to +50.0 V

Power Dissipation

HTSOP-J8 *2 Pd 0.75 W

TO252-3 *2 Pd 1.3 W

SOT223-4F *2 Pd 0.6 W

Operating Temperature Range Topr -40 to +125 °C

Storage Temperature Range Tstg -55 to +150 °C

Maximum Junction Temperature Tjmax 150 °C

*1 Pd should not be ex ceeded.

*2 HTSOP-J8 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 6.0 mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

TO252-3 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 10.4 mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

SOT223-4F mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC. If Ta ≧25 °C, reduce by 4.8 mW/°C.

(1-layer PCB: Copper foil area on the reverse side of PCB: 0 mm x 0 mm)

●Operating Conditions（-40 < Ta < +125°C）

■BD733L2EFJ/FP/FP3-C

Parameter Symbol Min. Max. Unit

Supply Voltage *3 VCC 4.37 45.0 V

Startup Voltage *4 VCC 3.0 - V

Output Current IOUT 0 200 mA

■BD750L2EFJ/FP/FP3-C

Parameter Symbol Min. Max. Unit

Supply Voltage *3 VCC 5.8 45.0 V

Startup Voltage *4 VCC 3.0 - V

Output Current IOUT 0 200 mA

*3 For output voltage, refer to the dropout voltage corresponding to the output current.

*4 When IOUT=0mA.

Datasheet

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TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Thermal Resistance

*5 HTSOP-J8 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC.

(4-layer PCB: Copper foil on the reverse side of PCB: 74.2 mm x 74.2 mm)

*6 TO252-3 mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC.

(4-layer PCB: Copper foil on the reverse side of PCB: 74.2 mm x 74.2 mm)

*7 SOT223-4F mounted on 114.3 mm x 76.2 mm x 1.6 mmt Glass-Epoxy PCB based on JEDEC.

(4-layer PCB: Copper foil on the reverse side of PCB: 74.2 mm x 74.2 mm)

Parameter Symbol Min. Max. Unit

HTSOP-J8 Package

Junction to Ambient *5 θja 43.1 － °C/W

Junction to Case (bottom) *5 θjc 10 － °C/W

TO252-3 Package

Junction to Ambient *6 θja 24.5 － °C/W

Junction to Case (bottom) *6 θjc 3 － °C/W

SOT223-4F Package

Junction to Ambient *7 θja 83.3 － °C/W

Junction to Case (bottom) *7 θjc 17 － °C/W

Datasheet

. 7/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Electrical Characteristics (BD733L2EFJ/FP/FP3-C)

(Unless otherwise specified, -40 < Ta < +125°C, VCC= 13.5V, IOUT=0mA, Reference value: Ta=25°C)

Parameter Symbol

Limit Unit Conditions

Min. Typ. Max.

Bias current Ib - 6 15

μA

Output voltage VOUT 3.23 3.30 3.37 V 8V < VCC < 16V

0mA < IOUT < 100mA

Dropout voltage ΔVd - 0.6 1.0 V VCC=VOUT×0.95, IOUT=200mA

Ripple rejection R.R. 50 63 - dB f=120Hz, ein=1Vrms,

IOUT=100mA

Line regulation Reg I - 5 20

mV 8V < VCC < 16V

Load regulation Reg L - 5 20

mV 10mA < IOUT < 200mA

●Electrical Characteristics (BD750L2EFJ/FP/FP3-C)

(Unless otherwise specified, -40 < Ta < +125°C, VCC= 13.5V, IOUT=0mA, Reference value: Ta=25°C)

Parameter Symbol

Limit Unit Conditions

Min. Typ. Max.

Bias current Ib - 6 15 μA

Output voltage VOUT 4.9 5.0 5.1 V 8V < VCC < 16V

0mA < IOUT < 100mA

Dropout voltage ΔVd - 0.4 0.7 V

VCC=VOUT×0.95, IOUT=200mA

Ripple rejection R.R. 50 60 - dB f=120Hz, ein=1Vrms,

IOUT=100mA

Line regulation Reg I - 5 20 mV 8V < VCC < 16V

Load regulation Reg L - 5 20 mV 10mA < IOUT < 200mA

Datasheet

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TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Typical Performance Curves

■BD733L2EFJ/FP/FP3-C Reference data

Unless otherwise specified: -4 0 < Ta < +125°C, VCC=13.5V, IOUT=0mA

Figure 5. Bias current

Figure 8. Output voltage vs. Load

Figure 6. Output voltage vs. Supply voltage

IOUT=10mA

Figure 7. Output voltage vs. Supply voltage

IOUT=100mA

0

1

2

3

4

5

6

01020304050

SUPPLY VOLTAGE : VCC[V]

O UT PUT VOLTAG E : VO UT[ V

]

0

1

2

3

4

5

6

01020304050

SUPPLY VOLTAG E : VCC[V]

OUTPUT VO LTAG E : VOUT[ V

]

0

1

2

3

4

5

6

0 200 400 600 800 1000

OUTPUT CURRENT : IOUT[mA ]

O UT PUT VOLT AGE : VO UT[ V

]

-40°C

25°C

125°C

-40°C

25°C

125°C

-40°C

25°C

125°C

0

10

20

30

40

50

60

70

80

90

100

0 1020304050

SUPPLY VOLTAGE : VCC[V]

BI AS CURRENT : lb[μA]

-40℃

25℃

125℃

Datasheet

. 9/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

■BD733L2EFJ/FP/FP3-C Reference data

Unless otherwise specified: -4 0 < Ta < +125°C, VCC=13.5V, IOUT=0mA

0

1

2

3

4

5

6

100 120 140 160 180 200

AMBIENT TEMPERATURE : T a[℃]

OUTPUT VO LTAG E : VOUT[ V

]

Figure 9. Dropout voltage

Figure 11. Total supply current vs. Load Figure 12. Thermal shutdown

(Output voltage vs. Temperature)

Figure 10. Ripple rejection

(ein=1Vrms,IOUT=100mA)

0.0

0.4

0.8

1.2

0 40 80 120 160 200

OUTPUT CURRENT : IOUT[mA ]

DRO P OUT : △Vd[V]

0

10

20

30

40

50

60

70

80

90

10 100 1000 10000 100000

FREQUENCY : f[Hz]

RI PPLE RE J E CTI ON : R. R.[ dB ]

-40°C

25°C

125°C

-40°C

25°C

125°C

0

2

4

6

8

10

12

14

16

18

20

0 40 80 120 160 200

O UTPUT CURRENT : IO UT[ mA]

BIAS CURRE NT : lb[μA]

-40℃

25℃

125℃

Datasheet

. 10/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

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BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

■BD733L2EFJ/FP/FP3-C Reference data

Unless otherwise specified: -4 0 < Ta < +125°C, VCC=13.5V, IOUT=0mA

Figure 13. Output voltage vs. Temperature Figure 14. Quiescent current vs. Temperature

3.280

3.285

3.290

3.295

3.300

3.305

3.310

3.315

-40 0 40 80 120

AMBIENT TEMPERATURE : T a[℃]

OUTPUT VO LTAGE : VOUT[ V

]

4

5

6

7

8

9

10

-40 0 40 80 120

AMBIENT T EMPERAT URE : T a[℃]

BIAS CURRENT : lb[ μA]

Datasheet

. 11/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

■BD750L2EFJ/FP/FP3-C Reference data

Unless otherwise specified: -4 0 < Ta < +125°C, VCC=13.5V, IOUT=0mA

Figure 15. Bias current Figure 16. Output voltage vs. Supply voltage

Figure 17. Output voltage vs. Supply voltage

IOUT=100mA Figure 18. Output voltage vs. Load

0

1

2

3

4

5

6

7

8

0 1020304050

SUPPLY V O LTAG E : VCC[V]

OUTPUT VO LTAG E : VOUT[ V

]

0

1

2

3

4

5

6

7

8

0 200 400 600 800 1000

OUTPUT CURRENT : IOUT[mA ]

OUTPUT VOLTAG E : VO UT[ V

]

-40°C

25°C

125°C

-40°C

25°C

125°C

0

1

2

3

4

5

6

7

8

0 1020304050

SUPPLY VOLTAGE : VCC[V]

OUTPUT VOLTAGE : VOUT[V]

-40°C

25°C

125°C

0

10

20

30

40

50

60

70

80

90

100

01020304050

SUPPLY VOLTAGE : VCC[V]

BIAS CURRE NT : lb[ μA] .

-40℃

25℃

125℃

Datasheet

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TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

■BD750L2EFJ/FP/FP3-C Reference data

Unless otherwise specified: -4 0 < Ta < +125°C, VCC=13.5V, IOUT=0mA

0

10

20

30

40

50

60

70

80

90

10 100 1000 10000 100000

F RE QUENCY : f [Hz]

RI PPLE RE J E CTI ON : R. R.[ dB ]

0

1

2

3

4

5

6

100 120 140 160 180 200

AMBIENT T EMPERA T URE : T a[℃]

O UTPUT VO LTAG E : VO UT[ V

]

Figure 20. Ripple rejection

(ein=1Vrms,IOUT=100mA)

Figure 21. Total supply c urrent vs. Load Figure 22. Thermal shutdown

(Output voltage vs. Temperature)

Figure 19. Dropout voltage

-40°C

25°C

125°C

0.0

0.4

0.8

1.2

0 40 80 120 160 200

OUT P UT CURRENT : I OUT [mA]

DRO POUT VO LTAG E : △Vd[V]

-40°C

25°C

125°C

0

2

4

6

8

10

12

14

16

18

20

0 40 80 120 160 200

OUTPUT CURRENT : IOUT[mA ]

BIAS CURRENT : lb[μA] .

-40℃

25℃

125℃

Datasheet

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TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

■BD750L2EFJ/FP/FP3-C Reference data

Unless otherwise specified: -4 0 < Ta < +125°C, VCC=13.5V, IOUT=0mA

Figure 23. Output voltage vs. Temperature

Figure 24. Bias current vs. Temperature

4.970

4.975

4.980

4.985

4.990

4.995

5.000

5.005

5.010

5.015

5.020

-40 0 40 80 120

AMBIENT T E MPERATURE : T a[℃]

OUTPUT VOLTAG E : VO UT[V

]

4

5

6

7

8

9

10

-4004080120

AMBIENT TEMPERATURE : Ta[℃]

BI AS CURRENT : lb[μA]

Datasheet

. 14/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Reference data (BD7xxL2EFJ-C Series) HTSOP-J8

●Reference data (BD7xxL2FP-C Series) TO252-3

Measurement setup for Figure 5, 14, 15, 24 Measurement setup for

Figure 6, 7, 12, 13, 16, 17, 22, 23 Measurem ent setup for Figure 8, 18

Measurement setup for Figure 9, 19 Measurement setup for Figure 10, 20 Measurement setup for Figure 11, 21

Measurement setup for Figure 5, 14, 15, 24 Measurement setup for

Figure 6, 7, 12, 13, 16, 17, 22, 23 Measurement setup for Figure 8, 18

Measurement setup for Figure 9, 19 Measurement setup for Figure 10, 20 Measurement setup for Figure 11, 21

BD7xxL2EFJ-C

8:VCC 7:N.C. 6:N.C. 5:GND

1:VOUT 2:N.C. 3:N.C. 4:N.C.

1µF

4.7µF

1Vrms

IOUT

BD7xxL2EFJ-C

8:VCC 7:N.C. 6:N.C. 5:GND

1:VOUT 2:N.C. 3:N.C. 4:N.C.

1µF

4.7µF

BD7xxL2EFJ-C

8:VCC 7:N.C. 6:N.C. 5:GND

1:VOUT 2:N.C. 3:N.C. 4:N.C.

1µF

4.7µF IOUT

Datasheet

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TSZ22111・15・001

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BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Reference data (BD7xxL2FP3-C Series) SOT223-4F

Measurement setup for Figure 5, 14, 15, 24 Measurement setup for

Figure 6, 7, 12, 13, 16, 17, 22, 23 Measurem ent setup for Figure 8, 18

Measurement setup for Figure 9, 19 Measurement setup for Figure 10, 20 Measurement setup for Figure 11, 21

Datasheet

. 16/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Selection of Components Externally Connected

・VCC pin

Insert capacitors with a capacitance of 0.1μF or higher between the VCC and GND pin. Choose the capacitance

according to the line between the power smoothing circuit and the VCC pin. Selection of the capacitance also

depends on the application. Verify the application and allow for sufficient margins in the design. We recommend

using a capacitor with excellent voltage a nd temperature characteristics.

・Output pin capacitor

In order to prevent oscillation, a capacitor needs to be placed bet ween the output pin and GND p in. We recommend

using a capacitor with a capacitance of 4.7μF or higher. Electrolytic, tantalum and ceramic capacitors can be us ed.

When selecting the capacitor ensure that the capacitance of 4.7μF or higher is maintained at the intended applied

voltage and temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate possibly

resulting in oscillation. For selection of the capacitor refer to the IOUT vs. ESR data. The stable operation range

given in the reference data is based on the standalone IC and resistive load. For actual applications the stable

operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore

verification of the final operating environment is needed.

When selecting a ceramic type capac itor, we recommend using X5 R, X7R or better with excellent temperature and

DC-biasing characteristics and hig h voltag e tolerance.

Also, in case of rapidly changing input voltag e and load current, select the capacitance in accordance with verifying

that the actual application meets with the required specification.

●Measurement setup

○Condition

VCC=13.5V

CIN=0.1μF

4.7µF < COUT < 100µF

Ta=-40 < Ta < +125℃

○Condition

VCC=13.5V

CIN=0.1µF

4.7µF < COUT < 100µF

Ta=-40 < Ta < +125℃

TO252-3 SOT223-4F

HTSOP-J8

BD7xxL2EFJ-C

8:VCC 7:N.C. 6:N.C. 5:GND

1:VOUT 2:N.C. 3:N.C. 4:N.C.

CIN

IOUT

COUT

ESR

Datasheet

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BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

②5.1 W

①1.3 W

0

1

2

3

4

5

6

0 255075100125150

Power Dissipation: Pd[W]

Ambient Temperature: Ta[°C]

●Power Dissipation

■HTSOP-J8

IC mounted on ROHM standard board based on JEDEC.

Board material: FR4

Board size: 11 4.3 mm × 76.2 mm × 1.6 mmt

(with thermal via on the board)

Mount condition: PCB and exposed pad are soldered.

Top copper foil: The footprint ROHM recommend.

+ wiring to measure.

①: 1-layer PCB

(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

②: 4-layer PCB

(2 inner layers and copper foil area on the reverse side of PCB:

74.2 mm × 74.2 mm)

Condition①: θja = 166.7 °C/W, θjc(top) = 45 °C/W

Condition②: θja = 43.1 °C/W, θjc(top) = 16 °C/W,

θjc(bottom) = 10 °C/W

■TO252-3

IC mounted on ROHM standard board based on JEDEC.

Board material: FR4

Board size: 11 4.3 mm × 76.2 mm × 1.6 mmt

(with thermal via on the board)

Mount condition: PCB and exposed pad are soldered.

Top copper foil: The footprint ROHM recommend.

+ wiring to measure.

①: 1-layer PCB

(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

②: 4-layer PCB

(2 inner layers and copper foil area on the reverse side of PCB:

74.2mm × 74.2 mm)

Condition①: θja = 96.2 °C/W, θjc(top) = 22 °C/W

Condition②: θja = 24.5 °C/W, θjc(top) = 5 °C/W,

θjc(bottom) = 3 °C/W

0

1

2

3

4

5

0 255075100125150

Power Dissipation: Pd[W]

Ambient Temperature: Ta[˚С]

①0.75 W

②2.9 W

Figure 25. Package Data

(HTSOP-J8)

Figure 26. Package Data

(TO252-3)

Datasheet

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TSZ22111・15・001

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BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

■SOT223-4F

IC mounted on ROHM standard board based on JEDEC.

Board material: FR4

Board size: 11 4.3 mm × 76.2 mm × 1.6 mmt

(with thermal via on the board)

Mount condition: PCB and exposed pad are soldered.

Top copper foil: The footprint ROHM recommend.

+ wiring to measure.

①: 1-layer PCB

(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)

②: 4-layer PCB

(2 inner layers and copper foil area on the reverse side of PCB:

74.2mm × 74.2 mm)

Condition①: θja = 208.3 °C/W, θjc(top) = 52 °C/W

Condition②: θja = 83.3 °C/W, θjc(top) = 36 °C/W,

θjc(bottom) = 17 °C/W

②1. 5 W

①0. 6 W

0

1

2

3

4

5

0 255075100125150

Power Dissipation: Pd[W]

Ambient Temperature: Ta[°C]

Figure 27. Package Data

(SOT223-4F)

Datasheet

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TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

Refer to the heat mitigation characteristics illustrated in Fig ure 25 to Figur e 27 when using the IC in an environm ent of Ta≧25°C.

The characteristics of the IC are greatly influenced by the operating temperature, and it is necessary to operate under the

maximum junction temperature Timax.

Even if the ambient temperature Ta is at 25°C it is possible that the junction temperature Tj reaches high temperatures.

Therefore, the IC should be operated within the power dissipation range.

The following method is used to calculate th e power consumption Pc (W)

Pc=(VCC－VOUT)×IOUT＋VCC×Ib

Power dissipation Pd≧Pc

The load current Lo is obtained by operating the IC within the power dissipation range.

(Refer to Figure 11 and Figure 21 for the Ib)

Thus, the maximum load current IOUT m ax for the applied voltage VCC can be calculated during the thermal design process.

●HTSOP-J8

■Calculation example 1) with Ta=125°C, VCC=13.5V, VOUT=3.3V

At Ta=125°C with Figure 25 ② condition, the calculation shows that ca 56.4mA of output current is possibl e at 10.2V potential

difference across input and output.

■Calculation example 2) with Ta=125°C, VCC=13.5V, VOUT=5.0V

At Ta=125°C with Figure 25 ② condition, the calculation shows that ca 67.7mA of output current is possible at 8.5V potential

difference across input and output.

The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole

operating temperature range within the power dissipation range.

In the event of shorting (i.e. VOUT and GND pins are shorted) the power consumption Pc of the IC can be calculated as follo ws:

Pc=VCC×(Ib+Ishort) (Refer to Figure 8 and F ig ure 18 for the Ishort)

VCC : Input voltage

VOUT : Output voltage

IOUT : Load current

Ib : Bias current

Ishort : Shorted current

IOUT≦56.4mA (Ib: 6µA)

0.576－13.5×Ib

10.2

IOUT≦

IOUT≦67.7mA (Ib: 6µA)

0.576－13.5×Ib

8.5

IOUT≦

θja=43.1°C/W → -23.2mW/°C

25°C=2.90W → 125°C=0.576W

θja=43.1°C/W → -23.2mW/°C

25°C=2.90W → 125°C=0.576W

IOUT≦ Pd－VCC×Ib

VCC－VOUT

Datasheet

. 20/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●TO252-3

■Calculation example 3) with Ta=125°C, VCC=13.5V, VOUT=3.3V

At Ta=125°C with Figure 26 ② condition, the calculation shows that ca 100mA of output current is possible at 10.2V potential

difference across input and output.

■Calculation example 4) with Ta=125°C, VCC=13.5V, VOUT=5.0V

At Ta=125°C with Figure 26 ② condition, the calculation shows that ca 120mA of output current is possible at 8.5V potential

difference across input and output.

The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole

operating temperature range within the power dissipation range.

In the event of shorting (i.e. VOUT and GND pins are shorted) the power consumption Pc of the IC can be calculated as follo ws:

Pc=VCC×(Ib+Ishort) (Refer to Figure 8 and F ig ure 18 for the Ishort)

IOUT≦100mA (Ib: 6µA)

IOUT≦1.02－13.5×Ib

10.2 θja=24.5°C/W → -40.8mW/°C

25°C=5.10W → 125°C=1.02W

IOUT≦120mA (Ib: 6µA)

IOUT≦1.02－13.5×Ib

8.5 θja=24.5°C/W → -40.8mW/°C

25°C=5.10W → 125°C=1.02W

Datasheet

. 21/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●SOT223-4F

■Calculation example 7) with Ta=125°C, VCC=13.5V, VOUT=3.3V

At Ta=125°C with Figure 27 ② condition, the calculation shows that ca 29.4mA of output current is possibl e at 10.2V potential

difference across input and output.

■Calculation example 8) with Ta=125°C, VCC=13.5V, VOUT=5.0V

At Ta=125°C with Figure 27 ② condition, the calculation shows that ca 35.2mA of output current is possible at 8.5V potential

difference across input and output.

The thermal calculation shown above should be taken into consideration during the thermal design in order to keep the whole

operating temperature range within the power dissipation range.

In the event of shorting (i.e. VOUT and GND pins are shorted) the power consumption Pc of the IC can be calculated as follo ws:

Pc=VCC×(Ib+Ishort) (Refer to Figure 8 and F ig ure 18 for the Ishort)

IOUT≦29.4mA (Ib: 6µA)

IOUT≦0.30－13.5×Ib

10.2

IOUT≦35.2mA (Ib: 6µA)

IOUT≦0.30－13.5×Ib

8.5

θja=83.3°C/W → -12.0mW/°C

25°C=1.50W → 125°C=0.30W

θja=83.3°C/W → -12.0mW/°C

25°C=1.50W → 125°C=0.30W

Datasheet

. 22/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Application Examples

・Applying positive surg e to the VCC pin

If the possibility exists that surges higher than 50V will be applied to the VCC pin, a zenar diode should be placed

between the VCC pin and GN D pin as shown in the figure below.

・Applying negative surge to the VCC pin

If the possibility exists that negative surges lower than the GND are applied to the VCC pin, a Shottky diode should be

place between the VCC pi n and GND pin as shown in the figure below.

・Implementing a protection diode

If the possibility exists that a large inductiv e load is connected to the output pin resulting i n back-EMF at time of startup

and shutdown, a protection diode should be placed as shown in the figure below.

●I/O equivalence circuits

○Output terminal *inside of () shows 5V ○Input terminal

VOUT

SOT223-4FHTSOP-J8

SOT223-4FHTSOP-J8 TO252-3

TO252-3

Datasheet

. 23/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Operational Notes

1) Absolute maximum ratings

Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in

damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage

(e.g. short circuit, open circuit, etc.). Therefore, if any special mode is being considered with values expected to exceed

the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be consid ered.

2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply

voltage and external components. Transient characteristics should be sufficiently verified.

3) GND electric potential

Keep the GND pin potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that,

including the transient, none of the pin’s voltages are less than the GND pin voltage.

4) GND wiring pattern

When both a small-signa l GND and a high current GND are present, single-point grounding (at the set standard point) is

recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes

stemming from the wiring resistance and high current do not cause an y voltage change in the small-signal GND. Similarl y,

care must be taken to avoid wiring pattern fluctuations in any connected external component GND.

5) Inter-pin shorting and mounting errors

Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in

damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging

the IC.

6) Inspection using the set board

The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a

capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the

assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the

power supply when connecti ng and disconnecting the inspection equipment.

7) Power dissipation (Pd)

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. The absolute ma ximum rating of the Pd stated in this specific ation is when the

IC is mounted on a 70mm X 70mm X 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,

increase the board size and copper area to prevent exceeding the Pd ratin g.

8) Thermal design

The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin

should be allowed for in the thermal desi gn. On the revers e side of the p ackage this product has a n ex posed he at pad for

improving the heat dissipatio n. Use both the front and reverse side of the PCB to incre ase the heat dissipation patter n as

far as possible. The amount of heat generated depends on the voltage difference across the input and output, load

current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the

Pd rating.

Tjmax: maximum junction temperature=150°C, Ta: ambient temperature (°C), θja: junction-to-ambient thermal

resistance (°C/W), Pd: power dissipation rating (W), Pc: power consumption (W), VCC: input voltage,

VOUT: output voltage, IOUT: load current, Ib: bias current

Power dissipation rating Pd (W)=(Tjmax－Ta)/θja

Power consumption Pc (W)=(VCC-VOUT)×IOUT＋VCC×Ib

9) Rapid variation in VCC voltage and load current

In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as

output transistor. Althou gh the actual appl ication might be the caus e of the transients, the IC input voltage, output curr ent

and temperature are also possible causes. In case problems arise within the actual operating range, use

countermeasures such as adjusting the outp ut capacitance.

Datasheet

. 24/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

10) Minute variation in output voltage

In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and

load current, etc., use countermeasures such as implementing filters.

11) Overcurrent protection circuit

This IC incorporates an integr ated overcurre nt protection circuit that is activated when the load is shorted. T his protection

circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in

applications characterized by continuous operation or transitioning of the pr otection circuit.

12) Thermal shutdown (TSD)

This IC incorporates and integr ated thermal shutdown circuit to prevent heat damage to the IC. Normal operati on should

be within the power dissipation rating, if however the rating is exceeded for a continued period, the junct ion temperature

(Tj) will rise and the TSD circuit wi ll be activated and turn all output pins OFF. After the Tj falls below the TSD threshold

the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set des ign or for any purpose other than protecting the IC from heat

damage.

13) In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or

damage to the elements. For example, while the external capacitor is charged, the VCC shorts to the GND. Use a

capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a

bypass between all pins and the VCC pin.

14) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a

variety of parasitic elements.

For example, in case a resistor and a transistor are connected to the pins as sho wn in the figure below then:

○ The P/N junction functions as a parasitic diode when GND > pin A for the resistor, or GND > pin B for the transistor.

○ Also, when GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of the

other adjacent elements to operate as a parasitic NPN transistor.

Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between

circuits and can cause malfunctions and, in turn, physical damage to or destructio n of the chip. Therefore do not employ

any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the

(P substrate) GND.

Figure 28. Example of the Parasitic Device Structures

Datasheet

. 25/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Physical Dimension, Tape and Reel Information

Package Name HTSOP-J8

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

2500pcs

E2

()

Direction of feed

Reel 1pin

Datasheet

. 26/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Physical Dimension, Tape and Reel Information

Package Name TO252-3

Direction of feed

1pin

Reel ∗ Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the lower left when you hold

reel on the left hand and you pull out the tape on the right hand

2000pcs

E2

( )

Datasheet

. 27/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Physical Dimension, Tape and Reel Information

Package Name SOT223-4F

Direction of Feed

Datasheet

. 28/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Marking Diagrams (TOP VIEW)

Part Number

Marking Output Voltage (V) Package

D733L2 3.3 HTSOP-J8

BD733L2 TO252-3 /

SOT223-4F

D750L2 5.0 HTSOP-J8

BD750L2 TO252-3 /

SOT223-4F

TO252-3

HTSOP-J8

HTSOP-J8 (TOP VIEW)

Part Number Marking

LOT Number

1PIN MARK

TO252-3

(TOP VIEW) Part Number Marking

LOT Number

SOT223-4F (TOP VIEW)

Part Number Marking

LOT Number

1PIN

SOT223-4F

Datasheet

. 29/29 TSZ02201-0G1G0AN00010-1-2

TSZ22111・15・001

www.rohm.com

BD7xxL2EFJ/FP/FP3-C

14.Jul.2014 Rev.006

●Revision History

Date Revision Changes

21.Aug.2012 001 New Release

24.Sep.2012 002 New Release TO252-3 package.

14.Mar.2013 003

Page 1.Series name is changed.

Page 6. Append Thermal Resistance θja, θjc.

Page 8. Figure 5, Page 9. Figure 11 All Quie scent current are integrated into Bias Current.

Page 10. Figure 14, Page 11. Figure 15 All Quiescent current are integrated into Bias Current.

Page 12. Figure 21, Page 13. Figure 24 All Quiescent current are integrated into Bias Current.

Page 17, 18. Figure 25, 26, 27, 28

Power Dissipation is changed to be compliant with JEDEC standard.

Page 19, 20. Calculation examples are changed.

Page 25. “Application exampl e” is deleted.

Figure 29 “ Example of the Parasitic Device Structures” is renewed.

30.Sep.2013 004 AEC-Q100 Qualified

Page 28. Physical Quantity is changed.

01.May.20 14 005 TO263-3F is changed to the individual registration.

14.Jul.2014 006

Page 16. Output capacitor range was corrected.

Page 28. HTSOP-J8 Marking Diagrams was corrected.

Datasheet

Notice – SS Rev.002

Notice

Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred b y you or thir d parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ

CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which

a failure or malfunction of our Products may cause. T he following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expens es or losses arising from the

use of any ROHM’s Products under an y special or extraordinary envir onments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product perform ance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Po wer Dissipation (P d) dependi ng on Ambient temp erature (T a). When used i n sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range d escribed in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condi tion from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlor ine, bromine, etc.) flux is used, the residue of flu x may negatively affect prod uct

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specificati on

Datasheet

Notice – SS Rev.002

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information

contained in this document. ROHM shall not be in an y way responsible or liable for any d amages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportati on

1. Product performance and soldere d conn ections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive g ases, i nclud ing Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommende d b y ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommen de d storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products wit hin the specified time after ope ning a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products pl ease dispose them properly using an authorized industr y waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including b ut not limited to, the developm ent of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or

concerning such information.

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