V23818-K305-L57 - Infineon Technologies

LC™ is a trademark of Lucent

Fiber Optics MARCH 2002

V23818-K305-L17/L57(*)

Small Form Factor

Multimode 850 nm 1.0625 GBd Fibre Channel

1.25 Gigabit Ethernet 2x5 Transceiver

with LC™ Connector

FEATURES

• Small Form Factor transceiver

• Full compliant with Fibre Channel Standard

• Excellent EMI performance

• RJ-45 style LC™ c onnector system

• Half the size of SC Duplex 1x9 transceiver

• Single power supply (3.3 V)

• Extremely low power consumption of 445 mW typical

• PECL and LVPECL differential inputs and outputs

• System optimized fo r 62.5/50 µm graded index fiber

• Multisource 2x5 footprint

• Small size for high port density

• UL-94 V-0 certified

• ESD Class 1 per MIL-STD 883D Method 3015.7

• Compliant with FCC (Class B) and EN 55022

• For distances of up to 700 m

• Class 1 FDA and IEC laser safety compliant

• AC/AC coupling in accordance to SFF MSA

*) Ordering Information

a) recommended bezel position

shown design with collar

Dimensions in mm [inches]

V23818-K305-L57

Input Output Signal de tect Voltag e Part Numb e r

DC DC TTL 3.3 V V23818-K305-L17

AC AC V23818-K305-L57

Fiber Optics V23818-K305-L17/L57, SFF, MM 850nm 1.0625GBd Fibre Channel, 1.25GBE 2x5 Trx (LC™)

Absolute Maximum Ratings

Exceeding any one of these values may des troy the device

immediately.

Package Power Dissipation................................................0.5 W

Data Input Levels (PECL)............................................VCC+0.5 V

Differential Data Input Voltage............................................2.5 V

Storage Ambient Temperature.............................–40°C to 85°C

Solde rin g C on di tio ns , Temp/Time

(MIL-STD 883C, Method 2003) ......... ...... ............ 250°C/ 5.5 s

VCC max ........ ...... ..... ...... ................. ..... ................. ...... ..... ..5.5 V

ECL-Output current data...................................................50 mA

DESCRIPTION

The Infineon Gigabit Ethernet multimode transceiver – part of

Infineon Small Form Factor transceiver family – is based on the

Physical Medium Depend (PMD) sublayer and baseband

medium , type 1000BA S E-SX (s ho rt wa velen gt h), Fibr e Ch anne l

FC-PI 100-M5-SN-I, 100-M6-SN-I

FC-PH2 100-M5-SN-I, FC-PH2 100-M6 -SN-I.

The appropriate fiber optic cable is 62.5 µm or 50 µm multi-

mode fiber with LC™ connector.

Operating range for over ea ch opt ical fiber type

T h e I nfi ne on Gi ga bit Eth er n et mul t im od e tr a ns c ei ver i s a sin gl e

unit comprised of a transmitter, a receiver, and an LC™ recepta-

cle. This de sign free s the customer from many alignmen t and

PC board layout concerns.

This transceiver supports the LC™ connectorization concept.

It is compatible with RJ-45 style backpanels for high end

Data Com and Telecom applications while providing the advan-

tages of fiber optic technology.

The module is designed for low cost SAN, LAN, WAN, Fibre

Channel and Gigabit Ethernet applications. It can be used as the

network end device interface in mainframes, workstations,

servers, and storage devices, and in a broad range of network

devices such as bridges, routers, hubs, and local and wide area

switches.

This transceiver operates at 1 and 1.25 Gbit/s from a single

power supply (+3.3 V). The full differential data inputs and out-

puts are PECL and LVPECL compatible.

Functional Descript ion of 2x5 Pin Row Transceiver

This transceiver is designed to transmit serial data via

multimode cable.

Functional Diagram

The receiver component conver ts the optical serial data into

PECL compatible electrical data (RD+ and RD–). The Signal

Detect (SD, active high) shows whether an optical signal is

present.

The transmitter converts PECL compatible electrical serial data

(TD+ and TD–) into optical serial data. Data lines are differen-

tially 100 Ω terminated.

The transmitter contains a laser driver circuit that drives the

modulation and bias current of the laser diode. The currents are

controlled by a power control circuit to guarantee constant out-

put power of the laser over temperature and aging.

The power control uses the output of the monitor PIN diode

(mechanically built into the laser coupling unit) as a controlling

signal, to prev ent the laser power from e xceeding the operating

limits.

Single fault condition is ensured by means of an integrated

automatic shutdown circuit that disables the laser when it

detects laser fault to guarantee the laser Eye Safety.

The transceiver contains a supervisory circuit to control the

power supply. This circuit makes an internal reset signal when-

ever the supply volt age drops below the reset threshold. It

keeps the re set signal active for at least 140 milliseconds after

the voltage has risen above the reset threshold. During this

time the laser is inactive.

A low signal on TxDis enables transmitter. If TxDis is high the

transmitter is d isabled.

Fiber type Min.

(meters) Typ.

(meters) Max.

(meters)

62.5 micron MMF 0.5 2 to 300 400

50.0 micron MMF 0.5 2 to 550 700

Laser

Driver

Power

Control

Receiver

o/e

Laser

e/o

Rx Coupling Unit

TD−

TD+

TxDis

RD−

RD+

Laser

Coupling Unit

Multimode Fiber

LEN

Monitor

Automatic

Shut-Down

Fiber Optics V23818-K305-L17/L57, SFF, MM 850nm 1.0625GBd Fibre Channel, 1.25GBE 2x5 Trx (LC™)

TECHNICAL DATA

The electro-optical character istics describe d in the following

tables are valid only for use under the recommended operatin g

conditions.

Recommended Operating Conditions

Transmitter Electro-Optical Characteristics

Notes

1. Into multimode fiber, 62.5 µm or 50 µm diameter.

2. Laser power is shut down if power supply is below VTH and

switched on if power supply is above VTH after tRES.

3. Fibre Channel PI Standard.

Recei ver El ect ro-Op ti c al Characteri st ic s

Notes

1. A ver age optical power at which t he BER is 1x1 0–12. Measured with a

27–1 NRZ PRBS and ER=9 dB.

2. An increase in optical power above the specified level wi ll cause the

SIGNAL DETECT output to switch from a Low state to a High state.

3. A decrease in opt ic a l power belo w the spe ci f ied level will cause the

SIGNAL DETECT to change from a High state to a Low state.

4. AC/AC f or data. Load 50 Ω to GND or 100 Ω dif f er ential. F or dynamic

measurement a tolerance of 50 mV should be added.

5. Supply current excluding Rx output load.

6. Fibre Channel PI Standard.

7. Measured at the given Stressed Receiver Eyeclosure Penalty and

DCD component giv en in Fibre Channel PI Standa r d (2.03/2.18 d B &

40/80 ps).

8. Measured according to IEEE 802.3

Parameter Symbol Min. Typ. Max. Units

Ambient Temp erat ure TAMB 070°C

Power Supply Voltage VCC–

VEE 3.13.33.5V

Transmitter

Data Input

High Voltage DC/DC VIH–VCC –1165 –880 mV

Data Input

Low Voltage DC/DC VIL–VCC –1810 –1475

Data Input

Differential Voltage

AC/AC

VDIFF 250 2400

Receiver

Inpu t C enter

Wavelength λC770 860 nm

Transmitter Symbol Min. Typ. Max. Units

Launched Power

(Average)(1) PO–9.5 –6–4dBm

Optical Modulation

Amplitude(3) OMA 156 450 µW

Center Wave le ngt h λC830 850 860 nm

Spectral Width (RMS) σl0.85

Relative Intensity Noise RIN –116 dB/Hz

Extinction Ratio (Dynamic) ER 9 13 dB

Total Tx Jitter TJ 53 130 ps

Reset Thr eshold(2) VTH 2.2 2.7 2.99 V

Reset Time Out(2) tRES 140 240 560 ms

Rise Time, 20%–80% tR260 ps

Power Supply Current 65 75 mA

Receiver Symbol Min. Typ. Max. Units

Sensitivity

(Averag e P o wer) (1) PIN –20 –17 dBm

Saturation

(Averag e P o wer) PSAT 0

Min. Optical Modulation

Amplitude(6) OMA 19 31 µW

Stressed Rece iv er Sen-

siti vity 50 µm Fiber SPIN 24 55 µW(7)

–17 –13.5 dBm(8)

Stressed Rece iv er Sen-

sitivity 62.5 µm Fiber SPIN 32 67 µW(7)

–16 –12.5 dBm(8)

Signal Detect

Assert Level(2) PSDA –24 –18 dBm

Signal Detect

Deassert Level(3) PSDD –30 –27

Signal Detect

Hysteresis PSDA–

PSDD 3dB

Signal Detect

Assert Time tASS 100 µs

Signal Detect

Deassert Time tDAS 350

Receiver 3 d B cut -off

Frequency(6) 1.25 1.5 GHz

Receiver 10 d B cut-off

Frequency(6) 1.5 3

Data Output Differential

Voltage AC/AC(4) VDIFF 0.5 0.7 1.23 V

Return Loss of Receiver ARL 12 dB

Output Data

Rise/Fall Ti me tR-RX,

tF-RX 260 ps

Supply current(5) ICCRX 75 90 mA

Fiber Optics V23818-K305-L17/L57, SFF, MM 850nm 1.0625GBd Fibre Channel, 1.25GBE 2x5 Trx (LC™)

Pin Description

Pin Inf ormati on

Regulatory Compliance

EYE SAFETY

This laser based mult imode transceiver is a Class 1 product.

It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and

1040.11.

To meet laser saf ety requ irements the tr ansceiver shall be oper-

ated within the maximum operating limits.

Caution

All adjustments have been made at the factory prior to ship-

ment o f the devices. No m aintenance or alteration to the

device is required.

Tampering with or modifying the performance of the device

will result in voided produ ct warrant y.

Note

Failure to adhere to the above restrictions could result in a modifica-

tion that is considered an act of “manufacturing”, and will require,

under la w, rece rtification of the modif ied pr oduct with th e U . S . F o od

and Drug Administra ti on (r ef. 21 CFR 1040.10 (i)).

Laser Data

Required Labels

Laser Emission

Pin Name Lev el/

Logic Pin# Description

VEEr Receiver

Signal Ground N/A 1

VCCr Receiver

Power Supply N/A 2

SD Signal Detect TTL 3 Normal Operation: Logic

“1” Output, represents

that light is present at re-

ceiver input

Fault Condition: Logic “0”

Output

RD–Received Data

Out Not PECL 4

RD+ Received Data

Out PECL 5

VCCt N/A 6 Transmitter Power Supply

VEEt N/A 7 Transmitter Signa l Ground

TxDis Transmitter

Disable/Enable TTL

Input 8 A low signal switch es t he

laser on.

A high signal swi t ches the

lase r o ff.

TD+ Transmit Data PECL 9 Transmitter Data In

TD–Transmit Data

Not PECL 10 Transmitter Data In

MS Mountin g

Studs N/A MS1

MS2 Mounting Studs are provid-

ed for transceiver mechan-

ical attachment to the

circuit board. They also pro-

vide an optional connection

of the transceiver to the

equipment chassis ground.

HL Housing Leads N/A HL1

HL2

HL3

HL4

The transcei ver Hous in g

Leads are p ro vi d ed for ad-

ditional signal grounding.

The holes in the circuit

board must be included

and be tied to signal

ground.

(See Application Notes).

Feature Standard Comments

ESD:

Electrostatic

Discharge to the

Electrical Pins

EIA/JESD22-A114-A

(MIL-S TD 883D

Met ho d 3015.7)

Class 1 (>10 00 V)

HL4

HL1 HL2

HL3

12345

10 9 8 7 6

10-PIN MODULE - TOP VIEW

MS2

MS1

Immunity:

Against Electro-

static Discharge

(ESD) to the

Duplex LC

Receptacle

EN 61000 -4 -2

IEC 61000-4-2 Discharges r anging

from ±2 kV to ±15 kV

on the receptacle

cause no dama ge to

transceiver (under rec-

ommended co ndi-

tions).

Immunity:

Against Radio Fre-

quency Electro-

magnetic Field

EN 61000 -4 -3

IEC 61000-4-3 With a field st rength of

3 V/m rms, noise

frequency ranges from

10 MH z to 2 GHz. No

effect on transceiver

performance betw een

the s p ecif icat io n limits.

Emission:

Electromagnetic

Interference (EMI)

FCC 47 CFR Part 15,

Class B

EN 55022 Cla ss B

CISPR 22

Noise frequency rang e:

30 MH z to 18 GHz

Wavelength 850 nm

Total output power (as defined by IEC: 7 mm

apertur e at 1 .4 cm di st ance) <675 µW

Total output power (as defined by FDA: 7 mm

apertur e at 2 0 cm dist ance) <70 µW

Beam dive rg ence 12°

Feature Standard Comments

Class 1 Laser Product

IEC

Complies with 21 CFR

1040.10 and 1040.11

FDA

10 9 8 7 6

1 2 3 4 5

Indication of

laser aperture

and beam

Fiber Optics V23818-K305-L17/L57, SFF, MM 850nm 1.0625GBd Fibre Channel, 1.25GBE 2x5 Trx (LC™)

APPLICATION NOTES

Small Form Factor Pinning Comparison

The drawing below gives you a comparison between the differ-

ent pinnings 2x5, 2x6, 2x10. Dimension for diameter and dis-

tance of additional pins is similar to the existing dimensions of

the other pins.

Pin Description

RS pin

The RS Rate Select: is not connected.

LF pi n

The LF pin (Laser Fault) is a TTL out p ut of the Laser Driver

Supervisor Circuit. A Logic “1” level can be measured in case

of a laser fault. It will not show a fault if the laser is being dis-

able d us in g th e Tx D is inp ut, si nc e this is not a fault co nd i tion.

EMI-Recommendation

To av oid elec trom agn etic r adi ation ex ce eding the requ ire d lim its

please take note of the following recommendations.

When Gigabit switching components are found on a PCB (multi-

plexers, clock recoveries etc.) a ny op ening of t he chassis may

produce radiation also at chassis slots other than that of the

device itself . T hus ev ery mechanical opening or aperture should

be as small as pos sible.

On the board itself every data connection should be an imped-

ance matched line (e.g. strip line, coplanar strip line). Data,

Datanot should be routed symmetrically, vias should be

avoided. A terminating resistor of 100 Ω sh ould be pla ced at the

end of each matched line. An alternative termination can be

provided with a 50 Ω resistor at each (D, Dn). In DC coupled

systems a t he v en in equi v a lent 5 0 Ω resistance can be achiev ed

as follows: Fo r 3.3 V: 125 Ω to VCC and 82 Ω to VEE, for 5 V:

82 Ω to VCC and 125 Ω to VEE at Data and Datanot. Please con-

sider whether there is an internal termination inside an IC or a

transceiver.

In certain cases signal GND is the most harmful source of radia-

tion. Connecting chassis GND and signal GND at the plate/

bezel/ chassis rear e.g. by means of a fiber optic transceiver

may result in a large amount of radiation. Even a capacitive cou-

pling between signal GND and chassis may be harmful if it is

too close to an opening or an aperture.

If a separation of signal GND and chassis GND is not possible,

it is strongly recommended to provide a proper contact

between signal GND and chassis GND at every location where

possible. This concept is de signed to avoid hotspots. Hotspots

are places of highest radiation which could be generated if only

a few connections b etween signal and chassis GND exist.

Compe nsation currents would concentrate at these connec-

tions, causing radiation.

By us e of Gi ga b it swit chin g compo ne nts in a d es ig n, the r e turn

path of the RF curren t must also be considered. Thus a split

GND plane of Tx and Rx portion may result in severe EMI prob-

lems.

A recommendatio n is to connect the housing leads to signal

GND. However, in cer tain app lications it may improve EMI per-

formance by connecting them to chassis GND.

The cutout should be sized so that all contact springs make

good contact with the face plate.

Please consider that the PCB may behave like a waveguide.

With an εr of 4, the wavelength of the harmonics inside the

PCB will be half of that in free space. In this scenario even the

smallest PCBs may have unexpected resonanc es.

Transceiver Pitch

TOP VIEW

RX TX

VCC PIN 1

RX VEE 2

RX VEE 3

RX CLK - 4

RX CLK + 5

RX VEE 6

RX VCC 7

SD 8

RXD - 9

RXD + 10

RS 1

RX VEE 2

RX VCC 3

SD 4

RXD - 5

RXD + 6

RX VEE 1

RX VCC 2

SD 3

RXD - 4

RXD + 5

20 P MON +

19 P MON -

18 BIAS MON +

17 BIAS MON -

16 TX VEE

15 TXD -

14 TXD +

13 TX DIS

12 TX VEE

11 TX VCC

12 LASER FAULT

11 TXD -

10 TXD +

9 TX DIS

8 TX VEE

7 TX VCC

10 TXD -

9 TXD +

8 TX DIS

7 TX VEE

6 TX VCC

2 x 5

2 x 6

2 x 10

(13.97)

.550 *)

*) min. pitc h between SFF transceiv er according to MS A.

Dimensions in (mm) inches

Fiber Optics V23818-K305-L17/L57, SFF, MM 850nm 1.0625GBd Fibre Channel, 1.25GBE 2x5 Trx (LC™)

Multimode 850 nm Giga bit Ethernet/Fibre Channel 2x5 Transceiver, AC/AC

Values of R1/2/3 /4 may vary as lo ng as pr op e r 50 Ω termination

to VEE or 100 Ω differe ntial is provided. The power supply filter- ing is required for good EMI performance. Use short tracks

from the inductor L1/L2 to the module VCCRx/VCCTx.

VCSEL

Driver

Signal

Detect

Limiting

Amplifier

Pre-

Amp RD-

RD+

Tx+

Tx-

Serializer/

Deserializer

Gigabit

Transceiver

Chip

ECL/PECL

Driver

Receiver

PLL etc.

Infineon Transceiver

V23818-K305-L57

SD to upper level

VEEt

TD+

TD-

VCCt

VCCr

RD-

RD+

VEEr

VCC

VCC SerDes

3.3 V

VCC

3.3 V

100 Ω

TTL level

TxDis

C1/2/3 = 4.7 µF

L1/2 = 1 µH

R1/2 = Depends on SerDes chi p use d

R3/4 = Depends on SerDes chi p use d

R7/8 = Biasing (depends on SerDes chip)

Place R1/2/3/4/7/8 close to SerDes chip

Place R5/6 close to Infineon transceiver

Published by Infineon Techno logies AG

Attention please!

The information herein is given to describe certain components and shall not be

considered as warranted characteristics.

Terms of delivery and rights to technical change reserved.

W e hereby disclaim any and all warranties, including but not limited to warranties

of non-infrin gem ent , regarding circuits, descri ptions and charts stated herein.

Infineon Technologies is an approved CECC manufacturer.

Information

For further information on technology, delivery terms and conditions and prices

please contact the Infineon Technologies offices or our Infineon Technologies

Representatives worldwide - see our webpage at

www.infineon.com/fiberoptics

Warnings

Due to technical requirements components may contain dangerous substances.

F or information on the types in question please contact your Infineon Technologies

offices.

Infineon Technologies Components may only be used in life-support devices or

systems with the express written approval of Infineon Technologies, if a failure of

such components can reasonably be expected to cause the failure of that

life-support device or sy stem, or to aff ect the safety or ef f ectiveness of that device

or system. Lif e support devices or systems are intended to be implanted in the

human body, or to support and/or maintain and sustain and/or protect human life.

If they fail, it is reasonable to assume that the health of the user or other persons

may be endangered.

Infineon Technologies AG • Fiber Optics • Wernerwerkdamm 16 • Berlin D-13623, Germany

Infineon Technologies, Inc. • Fiber Opti cs • 1730 North First Street • San Jose, CA 95112, USA

Infineon Technologies K.K. • Fiber Optics • Takanawa Park Tower • 20-14, Higashi-Gotanda, 3-chome, Shinagawa-ku • Tokyo 141, Japan

Multimode 850 nm Gigabit Ethernet 2x5 Transceiver DC/DC Version

Laser

Driver

Signal

Detect

Limiting

Amplifier

Pre-

Amp RD

RD+

Tx+

Serializer/

Deserializer

Gigabit

Transceiver

Chip

ECL/PECL

Driver

Receiver

PLL etc.

Infineon Transceiver

V23818-K305-L17

SD to upper level

VEEt

TD+

TD-

TxDis

VCCt

VCCr

RD-

RD+

VEEr

VCC

VCC SerDes

3.3 V

VCC

3.3 V

RD+

R10

R7 R11

100 Ω

C1/2/3 = 4.7 µF

C4/5/6 /7 = 10 nF

L1/2 = 1 µH

R10/11 = 1 27 Ω

(depends on SerDes chip used)

R7/8 = 82 Ω

(depends on SerDes chip used)

R5/6 = 150 Ω

Place R1/2/3/4/7/8/10/11 close to SerDes chip,

depends on SerDes chip used,

see application note of SerDes supplier.