Metal Glaze™ Cylindrical
Official Size Power Resistor
CHP1X Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
01.12
· 0.1 ohm to 10K ohm
· Outstanding surge capacity
· 1W in a 1/2W package (2010 footprint)
· 150°C maximum operating temperature
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
s3OUTH3TAPLES3TREETs#Orpus Christi TeXAS53!
Wire and Film Technologies Division
Telephone:sFacsimile:s Website: www.irctt.com
Metal Glaze™ thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over
nickel barrier
High Purity ceramic
core for optimal
thermal
distribution
Metal Glaze™ Cylindrical
Official Size
Power Resistor
CHP1X Series
s 0.1 ohm to 10K ohm
sOutstanding surge capacity
s 1W in a 1/2W package (2010 footprint)
s 150°C maximum operating temperature
Environmental Data
Characteristics Maximum Change Test Method
Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±0.5% + 0.01 ohm
±1% for R>100K ohm
MIL-R-55342E Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at
260°C for 10 seconds)
Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±0.3% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength ±1% + 0.01 ohm
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending ±1% + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected
5mm so as to exert pull on chip contacts for 10 seconds
√
#(083ErIES)SSUE3EPTEMBER3HEETOF
2
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print. A subsidiary of
TT electronics plc
s3OUTH3TAPLES3TREETs#Orpus Christi TeXAS53!
Wire and Film Technologies Division
Telephone:sFacsimile:s Website: www.irctt.com
Metal Glaze™ thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
60/40 Solder over
nickel barrier
High Purity ceramic
core for optimal
thermal
distribution
Metal Glaze™ Cylindrical
Official Size
Power Resistor
CHP1X Series
s 0.1 ohm to 10K ohm
sOutstanding surge capacity
s 1W in a 1/2W package (2010 footprint)
s 150°C maximum operating temperature
Environmental Data
Characteristics Maximum Change Test Method
Temperature Coefficient As specified MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Thermal Shock ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Low Temperature Operation ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Short Time Overload ±0.5% + 0.01 ohm
±1% for R>100K ohm
MIL-R-55342E Par 4.7.5
2.5 x P x R for 5 seconds
High Temperature Exposure ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Resistance to Bonding Exposure ±0.25% + 0.01 ohm MIL-R-55342E Par 4.7.7 (Reflow soldered to board at
260°C for 10 seconds)
Solderability 95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Moisture Resistance ±0.5% + 0.01 ohm MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
Life Test ±0.3% + 0.01 ohm MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Terminal Adhesion Strength ±1% + 0.01 ohm
no mechanical damage
1200 gram push from underside of mounted chip for
60 seconds
Resistance to Board Bending ±1% + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected
5mm so as to exert pull on chip contacts for 10 seconds
√
#(083ErIES)SSUE3EPTEMBER3HEETOF
2
Metal Glaze™ Cylindrical
Official Size Power Resistor
CHP1X Series
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
© TT electronics plc
01.12
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