SS12L thru SS115L Taiwan Semiconductor CREAT BY ART FEATURES Surface Mount Schottky Barrier Rectifier - Low power loss, high efficiency - Ideal for automated placement - Guardring for overvoltage protection - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: Sub SMA Sub SMA Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.019 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25 unless otherwise noted) PARAMETER SYMBOL Marking code SS SS SS SS SS SS SS SS 12L 13L 14L 15L 16L 19L 12L 13L 14L 15L 16L 19L 10L A5L 110L 115L UNIT Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 90 100 150 V Maximum RMS voltage VRMS 14 21 28 35 42 63 70 105 V Maximum DC blocking voltage VDC 20 30 40 50 60 90 100 150 V Maximum average forward rectified current IF(AV) 1 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30 A Maximum instantaneous forward voltage (Note 1) @ 0.5A @ 1.0A Maximum reverse current @ rated VR TJ=25 TJ=100 TJ=125 VF 0.385 0.45 0.43 0.50 0.51 0.55 0.58 0.70 0.4 IR 6.0 8.0 - dV/dt 10000 Typical thermal resistance RJL RJA 45 100 Storage temperature range TSTG - 55 to +125 mA 0.5 - TJ V 0.75 0.90 0.05 Voltage rate of change (Rated VR) Operating junction temperature range 0.70 0.80 V/s O - 55 to +150 - 55 to +150 C/W O C O C Note 1: Pulse test with PW=300s, 1% duty cycle Document Number: DS_D1308028 Version: N13 SS12L thru SS115L Taiwan Semiconductor ORDERING INFORMATION AEC-Q101 PACKING GREEN COMPOUND QUALIFIED CODE RU RV RT MT RQ MQ R3 RF R2 M2 CODE PART NO. SS1XL (Note 1) Prefix "H" PACKAGE PACKING Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA Sub SMA 1,800 / 7" Plastic reel (8mm tape) 3,000 / 7" Plastic reel (8mm tape) 7,500 / 13" Paper reel (8mm tape) 7,500 / 13" Plastic reel (8mm tape) 10,000 / 13" Paper reel (8mm tape) 10,000 / 13" Plastic reel (8mm tape) 1,800 / 7" Plastic reel (12mm tape) 3,000 / 7" Plastic reel (12mm tape) 7,500 / 13" Paper reel (12mm tape) 7,500 / 13" Plastic reel (12mm tape) RH Sub SMA 10,000 / 13" Paper reel (12mm tape) MH Sub SMA 10,000 / 13" Plastic reel (12mm tape) Suffix "G" Note 1: "x" defines voltage from 20V (SS12L) to 150V (SS115L) EXAMPLE AEC-Q101 PREFERRED P/N PART NO. SS16L RU SS16L SS16L RUG SS16L SS16LHRU GREEN COMPOUND PACKING CODE QUALIFIED DESCRIPTION CODE RU G RU H SS16L Green compound AEC-Q101 qualified RU RATINGS AND CHARACTERISTICS CURVES (TA=25 unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT (A) 1.2 SS15L-SS115L 1 0.8 0.6 SS12L-SS14L 0.4 0.2 0 0 25 50 75 100 125 150 PEAK FORWARD SURGE CURRENT (A) FIG. 2 MAXUMUM FORWARD SURGE CURRENT 40 8.3ms Single Half Sine-Wave 30 20 10 0 1 10 SS15L-SS16L SS13L-SS14L 10 10000 INTANTANEOUS REVERSE CURRENT. (uA) INSTANTANEOUS FORWARD CURRENT (A) FIG. 4 TYPICAL REVERSE CHARACTERISTICS FIG. 3 TYPICAL FORWARD CHARACTERISTICS 100 SS12L SS115L 1 SS19L-SS110L 0.1 0.2 0.4 0.6 0.8 1 1.2 FORWARD VOLTAGE (V) Document Number: DS_D1308028 100 NUMBER OF CYCLES AT 60 Hz LEAD TEMPERATURE (oC) 1.4 1.6 1.8 TJ=100 1000 100 TJ=75 10 1 TJ=25 0.1 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE.(%) Version: N13 SS12L thru SS115L Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE 100 100 10 TRANSIENT THERMAL IMPEDANCE (/W) JUNCTION CAPACITANCE (pF) 1000 f=1.0MHz Vslg=50mVp-p 1 10 1 0.1 0.1 1 10 0.01 100 0.1 1 10 100 T-PULSE DURATION(s) REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS Unit (mm) DIM. Unit (inch) Min Max Min Max B 1.70 1.90 0.067 0.075 C 2.70 2.90 0.106 0.114 D 0.16 0.30 0.006 0.012 E 1.23 1.43 0.048 0.056 F 0.80 1.20 0.031 0.047 G 3.40 3.80 0.134 0.150 H 2.45 2.60 0.096 0.102 I 0.35 0.85 0.014 0.033 J 0.00 0.10 0.000 0.004 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 1.4 0.055 B 1.2 0.047 C 3.1 0.122 D 1.9 0.075 E 4.3 0.169 MARKING DIAGRAM P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Document Number: DS_D1308028 Version: N13 SS12L thru SS115L Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1308028 Version: N13