Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Overview KEMET's Ceramic Open Mode capacitor in X7R dielectric is designed to significantly minimize the probability of a low IR or short circuit condition when forced to failure in a board stress flex situation, thus reducing the potential for catastrophic failure. The Open Mode capacitor may experience a drop in capacitance; however, a short is unlikely because a crack will not typically propagate across counter electrodes within the device's "active area." Since there will not be any current leakage associated with a typical Open Mode flex crack, there is no localized heating and therefore little chance for a catastrophic and potentially costly failure event. a concern. These capacitors are manufactured in state of the art ISO/TS 16949:2002 certified facilities and are widely used in automotive circuits as well as power supplies (input and output filters) and general electronic applications. When combined with flexible termination technology these devices offer the ultimate level of protection against a low IR or short circuit condition. Open Mode devices compliment KEMET's Floating Electrode (FE-CAP) and Floating Electrode with Flexible Termination (FF-CAP) product lines by providing a fail-safe design optimized for mid to high range capacitance values. These devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to 15% from -55C to +125C. Driven by the demand for a more robust and reliable component, the Open Mode capacitor was designed for critical applications where higher operating temperatures and mechanical stress are Benefits * * * * * * * * * * * * * * -55C to +125C operating temperature range Open Mode/fail open design Mid to high capacitance flex mitigation Pb-Free and RoHS compliant EIA 0805, 1206, 1210 and 1812 case sizes DC voltage ratings of 16V, 25V, 50V, 100V and 200V Capacitance offerings ranging from 1000pF to 6.8F Available capacitance tolerances of 5%, 10% and 20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated termination finish allowing for excellent solderability SnPb termination finish option available upon request (5% min) Commercial and Automotive (AEC-Q200) grades available SnPb termination finish option available upon request (5% min) Flexible termination option available upon request Ordering Information C 1210 J 685 K 3 R Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance Voltage Dielectric 0805 1206 1210 1812 F = Open Mode J = Open Mode w/ Flexible Termination 2 Sig. Digits + Number of Zeros K = 10% M = 20% 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V R = X7R A C Failure Rate/ Termination Finish1 Design A = N/A C = 100% Matte Sn L = SnPb (5% min) TU Packaging/Grade (C-Spec)2 Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade Additional termination finish options may be available. Contact KEMET for details. SnPb termination finish option is not available on automotive grade product. 2 Additional reeling or packaging options may be available. Contact KEMET for details. 1 1, 2 One WORLD One Brand One Strategy One Focus One Team (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com One KEMET C1012_X7R_OPENMODE_SMD * 8/10/2011 1 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Dimensions - Standard Termination - Millimeters (Inches) 100% Tin or SnPb Plate L W B T Nickel Plate S Metric Size Code L Length W Width 0805 1206 1210 1812 2012 3216 3225 4532 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.20 (.008) 3.20 (.126) 0.20 (.008) 4.50 (.177) 0.30 (.012) 1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 3.20 (.126) 0.30 (.012) B Bandwidth 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.35 (.014) W 0805 2012 1206 1210 1812 3216 3225 4532 L Length W Width 2.10 (.083) +0.30 (.012) / -0.20 (.008) 3.30 (.130) 0.40 (.016) 3.30 (.130) 0.40 (.016) 4.50 (.178) 0.40 (.016) 1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 3.20 (.126) 0.30 (.012) Mounting Technique 0.75 (.030) N/A Solder Wave or Solder Reflow Solder Reflow Only L B T S T Thickness B Bandwidth See Table 2 for Thickness Dimensions - Flexible Termination - Millimeters (Inches) EIA Metric Size Size Code Code S Separation Min. T Thickness See Table 2 for Thickness EIA Size Code Conductive Metalization Electrodes 0.50 (0.02) +0.10 (.004)/ -0.25 (.010) 0.60 (.024) 0.25 (.010) 0.60 (.024) 0.25 (.010) 0.70 (.028) 0.35 (.014) S Separation Min. Mounting Technique 0.70 (.028) Solder Wave or Solder Reflow N/A Solder Reflow Only Applications Typical applications include input side filtering (power plane/bus), high current (battery line) and circuits that cannot be fused to open when short circuits occur due to flex cracks. Markets include automotive applications that are directly connected to the battery and/or involve conversion to a 42V system and raw power input side filtering in power conversion. Qualification/Certification Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website at www.aecouncil.com. Environmental Compliance Pb-Free and RoHS compliant (excluding SnPb termination finish option). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 2 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range -55C to +125C Capacitance Change with Reference to +25C and 0 Vdc Applied (TCC) 15% Aging Rate (Max % Cap Loss/Decade Hour) 3.0% 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50mA) Dielectric Withstanding Voltage Dissipation Factor (DF) Maximum Limits @ 25C 5% (10V), 3.5% (16V & 25V) and 2.5% (50V to 250V) See Insulation Resistance Limit Table (Rated voltage applied for 120 5 secs @ 25C) Insulation Resistance (IR) Limit @ 25C Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1000 hours. To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz 50Hz and 1.0 0.2 Vrms if capacitance 10F 120Hz 10Hz and 0.5 0.1 Vrms if capacitance >10F Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric Rated DC Voltage Capacitance Value >25 X7R DF (%) Cap Shift IR 20% 10% of Initial Limit 3.0 16 / 25 All < 16 5.0 7.5 Insulation Resistance Limit Table EIA Case Size 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225 1000 megohm microfarads or 100G N/A < .012F < .047F < .047F < 0.22F < 0.39F ALL < 2.2F ALL < 10F ALL 500 megohm microfarads or 10G ALL .012F .047F .047F 0.22F 0.39F N/A 2.2F N/A 10F N/A (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 3 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Table 1 - (0805 - 1812 Case Sizes) Cap Cap Code Series C0805F/J Voltage Code 4 Voltage DC 16 Cap Tolerance 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 F 0.12 F 0.15 F 0.18 F 0.22 F 0.27 F 0.33 F 0.39 F 0.47 F 0.56 F 0.68 F 0.82 F 1.0 F 1.2 F 1.5 F 1.8 F 2.2 F 2.7 F 3.3 F 3.9 F 4.7 F 6.8 F 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 685 Cap Cap Code K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M C1206F/J C1210F/J C1812F/J 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DG DD DD DD DE DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DD DD DG DG DG DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DE DD DD DD DD DD DD DD DD DD DD DD DD DD DG DG DG DG DG M M M EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EG EG EG EG EG EG EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EG EG EC EC EC EC EC EC EC EC EC EC EC EC EC EC EC EG EC EH EC EH EC EC EC EC EC EC EC EC EC EC EC EG EG ED EC EC EC EC EC EG EG EG EG EG EG EC EH FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FG FH FH FJ FD FD FD FD FD FD FD FD FD FD FD FD FG FG FH FD FD FD FD FD FD FD FD FD FG FG FG FH FH FJ FM FM FG FS FM FS FD FD FD FD FD FD FG FG FH FH FJ FR FR FD FD FG FG FH FH FJ FS GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GN GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GD GN GB GB GB GB GB GB GB GB GB GB GB GB GC GD GF GK GM GB GB GB GB GB GB GB GB GC GF GK GL Voltage DC 16 25 50 100 200 16 25 50 100 200 16 25 50 100 200 25 50 100 200 Voltage Code 4 3 5 1 2 4 3 5 1 2 4 3 5 1 2 3 5 1 2 Series C0805F C1206F (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. C1210F C1812F C1012_X7R_OPENMODE_SMD * 8/10/2011 4 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Table 2 - Chip Thickness/Packaging Quantities Thickness Code AA AB BB BC PA CB CC CD MA DB DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS FV FW PA MA NA NB NC LD LE LF LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO GP GR HB HC HD HE HF Thickness Code Chip Size 1005 0201 0402 0402 0508 0603 0603 0603 0612 0805 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1706 1808 1808 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 Chip Size Thickness Range (mm) 0.20 0.02 0.30 0.03 0.50 0.05 0.50 0.10 0.80 0.10 0.80 0.07 0.80 0.10 0.80 0.15 0.80 0.10 0.60 0.10 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.25 0.20 0.78 0.10 0.80 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.25 0.15 1.60 0.15 1.60 0.20 1.70 0.20 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.40 0.15 1.50 0.20 1.55 0.15 1.60 0.20 1.70 0.20 1.85 0.20 1.85 0.20 1.90 0.20 2.10 0.20 2.25 0.20 2.50 0.20 3.35 0.10 6.15 0.15 0.80 0.10 0.80 0.10 0.90 0.10 1.00 0.10 1.00 0.15 0.90 0.10 1.00 0.10 1.00 0.15 1.40 0.15 1.60 0.15 2.00 0.15 1.00 0.10 1.10 0.10 1.25 0.15 1.30 0.10 1.40 0.15 1.50 0.10 1.55 0.10 1.60 0.20 1.70 0.15 1.70 0.20 1.90 0.20 2.00 0.20 2.50 0.20 2.65 0.35 5.00 0.50 1.10 0.15 1.15 0.15 1.30 0.15 1.40 0.15 1.50 0.15 Thickness Range (mm) QTY per Reel QTY per Reel QTY per Reel QTY per Reel 7" Plastic 13" Plastic 7" Paper 13" Paper 4000 10000 4000 10000 4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 500 200 4000 4000 4000 4000 4000 2500 2500 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 500 350 1000 1000 1000 1000 1000 10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 1800 1000 10000 10000 10000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 1400 1000 4000 4000 4000 4000 4000 QTY per Reel 7" Plastic QTY per Reel 13" Plastic QTY per Bulk Cassette 15000 15000 10000 10000 50000 50000 50000 50000 4000 4000 4000 10000 10000 10000 15000 15000 15000 4000 4000 4000 10000 10000 10000 15000 15000 15000 4000 10000 Package Quantity Based on Finished Chip Thickness Specifications QTY per Reel 7" Paper (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com QTY per Reel 13" Paper QTY per Bulk Cassette C1012_X7R_OPENMODE_SMD * 8/10/2011 5 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Table 2 - Chip Thickness/Packaging Quantities con't Thickness Code Chip Size Thickness Range (mm) QTY per Reel QTY per Reel QTY per Reel QTY per Reel 7" Plastic 13" Plastic 7" Paper 13" Paper HG JB JC JD JE JF JP JG JH JO JP JR KB KC KD KE KF 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225 1.60 0.20 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.70 0.15 1.80 0.15 2.40 0.15 3.50 0.30 5.00 0.50 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.60 0.20 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 250 150 1000 1000 1000 1000 1000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 850 600 4000 4000 4000 4000 4000 Thickness Code Chip Size Thickness Range (mm) QTY per Reel 7" Plastic QTY per Reel 13" Plastic QTY per Reel 7" Paper QTY per Bulk Cassette QTY per Reel 13" Paper QTY per Bulk Cassette Table 3A - Land Pattern Design Recommendations per IPC-7351 (Standard Termination) EIA Size Code Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) C Y X Density Level B: Median (Nominal) Land Protrusion (mm) V1 V2 C Y X V1 Density Level C: Minimum (Least) Land Protrusion (mm) V2 C Y X V1 V2 01005 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50 0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 6 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Table 3B - Land Pattern Design Recommendations per IPC-7351 (Flexible Termination) EIA Size Code Metric Size Code 0603 1608 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20 0805 2012 1.10 1.30 1.55 4.50 2.60 1.00 1.10 1.45 3.60 2.00 0.90 0.90 1.35 2.90 1.70 1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00 1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90 1808 4520 2.25 1.85 2.30 7.40 3.30 2.15 1.65 2.20 6.50 2.70 2.05 1.45 2.10 5.80 2.40 1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70 1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00 2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60 2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00 Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 7 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: * KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020 Table 4 - Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8kg for 60 seconds. Board Flex JIS-C-6429 Appendix 2, Note: 2mm (min) for all except 3mm for C0G. Magnification 50 X. Conditions: Solderability J-STD-002 a) Method B, 4 hours @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C Temperature Cycling JESD22 Method JA-104 1000 cycles (-55C to +125C). Measurement at 24 hours. +/- 2 hours after test conclusion. Biased Humidity MIL-STD-202 Method 103 Moisture Resistance MIL-STD-202 Method 106 Thermal Shock MIL-STD-202 Method 107 High Temperature Life MIL-STD-202 Method 108 / EIA -198 Storage Life MIL-STD-202 Method 108 150C, 0VDC, for 1000 hours. Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical - OKEM Clean or equivalent. Load Humidity: 1000 hours 85C/85%RH and Rated Voltage. Add 100K ohm resistor. Measurement at 24 hours. +/- 2 hours after test conclusion. Low Volt Humidity: 1000 hours 85C/85%RH and 1.5V. Add 100K ohm resistor. Measurement at 24 hours. +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hours. +/- 2 hours after test conclusion. -55C/+125C. Note: Number of cycles required-300, maximum transfer time-20 seconds, dwell time-15 minutes. Air-Air. 1000 hours at 125C (85C for X5R, Z5U and Y5V) with 2x rated voltage applied. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature - reels may soften or warp, and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C, and maximum storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts, and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably within 1.5 years of receipt. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 8 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Tape & Reel Packaging Information KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel (R) T Embossed Plastic* or Punched Paper Carrier. ME KE Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military) Sprocket Holes Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape 178mm (7.00") or 330mm (13.00") Anti-Static Cover Tape (.10mm (.004") Max Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration (mm) EIA Case Size Tape size (W)* Pitch (P1)* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 9 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo Po [10 pitches cumulative tolerance on tape 0.2 mm] E1 Ao F Ko W B1 E2 Bo S1 P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 5 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8mm 12mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16mm D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 T Max. T1 Max. 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8mm Single (4mm) 12mm Single (4mm) & Double (8mm) 16mm Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. F P1 T2 Max W Max A0,B0 & K0 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 5.5 0.05 (0.217 0.002) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 8.0 0.10 (0.315 0.004) 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12mm tapes and 10 maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 10 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Figure 2 - Punched (Paper) Carrier Tape Dimensions P2 T Po ODo [10 pitches cumulative tolerance on tape 0.2 mm] E1 A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1Max G Min 8mm 1.5 +0.10-0.0 (0.059 +0.004, -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (.004) Max. 0.75 (.030) R Ref. Note 2 25 (.984) T Max W Max A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8mm Half (2mm) 8mm Single (4mm) E2 Min 6.25 (0.246) F 3.5 0.05 (0.138 0.002) P1 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) Note 5 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 11 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8mm 12mm & 16mm 0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 30010 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Maximum Width (mm) Rotation ( 8,12 20 16-200 10 Bo T) Typical Component Centerline Ao s Tape Width (mm) 8,12 16-56 72-200 Maximum Rotation ( 20 10 5 S) Figure 4 - Maximum Lateral Movement 8mm & 12mm Tape 16mm Tape 0.5 mm maximum 0.5 mm maximum 1.0 mm maximum 1.0 mm maximum Figure 5 - Bending Radius Embossed Carrier R Punched Carrier Bending Radius R (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 12 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm min.) flange distortion at outer edge) W2 (Measured at hub) D A N (See Note) C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Min C D Min 8mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12mm 16mm Variable Dimensions -- Millimeters (Inches) Tape Size N Min W1 W2 Max W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8mm 12mm 16mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 13 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum, Components 100 mm Min. Leader 400 mm Minimum, Top Cover Tape Figure 8 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 14 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Figure 9 - Bulk Cassette Packaging (Ceramic Chips Only) Meets Dimensional Requirements IEC-286 and EIAJ 7201 6 8 0.1 8 8 0.1 12.0 0.1 Unit mm *Reference 19.0* 36 00.2 31.5 0.2 0 53 3* 10* 1.5 2.0 3.0 0.1 0 0 0.1 0.2 0 5 0* 110 0.7 Table 9 - Capacitor Dimensions for Bulk Cassette Cassette Packaging - Millimeters EIA Size Metric Size L Length Code Code W Width B Bandwidth S Separation minimum T Thickness Number of Pcs/Cassette 0402 1005 1.0 0.05 0.5 0.05 0.2 to 0.4 0.3 0.5 .05 50,000 0603 1608 1.6 0.07 0.8 0.07 0.2 to 0.5 0.7 0.8 .07 15,000 Table 10 - Capacitor Marking Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional - Not Available for 0402 Size) Numeral Alpha Character A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y Capacitance (pF) For Various Numeral Identifiers 9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Example shown is 1,000 pF capacitor C1012_X7R_OPENMODE_SMD * 8/10/2011 15 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) KEMET Corporation World Headquarters Europe Asia 2835 KEMET Way Simpsonville, SC 29681 Southern Europe Geneva, Switzerland Tel: 41-22-715-0100 Northeast Asia Paris, France Tel: 33-1-4646-1009 Shenzhen, China Tel: 86-755-2518-1306 Sasso Marconi, Italy Tel: 39-051-939111 Beijing, China Tel: 86-10-5829-1711 Milan, Italy Tel: 39-02-57518176 Shanghai, China Tel: 86-21-6447-0707 Fort Lauderdale, FL Tel: 954-766-2800 Rome, Italy Tel: 39-06-23231718 Taipei, Taiwan Tel: 886-2-27528585 North America Madrid, Spain Tel: 34-91-804-4303 Southeast Asia Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Corporate Offices Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 West Chester, PA Tel: 610-692-4642 Central Europe Hong Kong Tel: 852-2305-1168 Singapore Tel: 65-6586-1900 Landsberg, Germany Tel: 49-8191-3350800 Penang, Malaysia Tel: 60-4-6430200 Dortmund, Germany Tel: 49-2307-3619672 Bangalore, India Tel: 91-806-53-76817 Kwidzyn, Poland Tel: 48-55-279-7025 Central Schaumburg, IL Tel: 847-882-3590 Carmel, IN Tel: 317-706-6742 West Milpitas, CA Tel: 408-433-9950 Mexico Zapopan, Jalisco Tel: 52-33-3123-2141 Northern Europe Bishop's Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Farjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 16 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Other KEMET Resources Tools Resource Location Configure A Part: CapEdge http://capacitoredge.kemet.com SPICE & FIT Software http://www.kemet.com/spice Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask Product Information Resource Location Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Product Request Resource Location Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Contact Resource Location Website Contact Us Investor Relations www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir Call Us 1-877-MyKEMET Twitter http://twitter.com/kemetcapacitors Disclaimer All product specifications, statements, information and data (collectively, the "Information") are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 17 SMD MLCCs - Open Mode Design (FO-CAP), X7R Dielectric, 16VDC-200VDC (Commercial & Automotive Grade) Digitally signed by Marcy Brand DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corporation, ou=Marketing Communications, cn=Marcy Brand, email=marcybrand@kemet.com Date: 2011.08.12 14:58:42 -04'00' (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1012_X7R_OPENMODE_SMD * 8/10/2011 18