INCH-POUND MIL-M-38510/319C 14 July 2003 _ SUPERSEDING MIL-M-38510/319B 4 March 1985 MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, 4 BY 4 REGISTER FILE, CASCADABLE, MONOLITHIC SILICON Inactive for new design after 18 April 1997. This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for monolithic silicon, Schottky TTL, low-power, 4 by 4 register file microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M38510 have been superseded by MIL-PRF-38535, (see 6.3). 1.2 Part number. The part number should be in accordance with MIL-PRF-38535, and as specified herein. 1.2.1 Device types. The device types should be as follows: Circuit Device type 01 02 4 by 4 register file with 3-state outputs, cascadable 4 by 4 register file with open collector outputs, cascadable 1.2.2 Device class. The device class should be the product assurance level as defined in MIL-PRF-38535. 1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows: Outline letter E F 2 Descriptive designator Terminals GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 16 16 20 Package style Dual-in-line Flat pack Square leadless chip carrier Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43216-5000, by using the self addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. FSC 5962 MIL-M-38510/319C 1.3 Absolute maximum ratings. Supply voltage range ............................................................................. Input voltage range ................................................................................ Storage temperature range .................................................................... Maximum power dissipation (PD) 1/ Device type 01 ................................................................................. Device type 02 ................................................................................. Lead temperature (soldering, 10 seconds) ............................................. Thermal resistance, junction to case (JC): Cases E, F, and 2 ................................................................................ Junction temperature (TJ) 2/................................................................... -0.5 V dc to 7.0 V dc -1.5 V at -18 mA to 5.5 V -65 to +150C 275 mW 220 mW 300C (See MIL-STD-1835) +175C 1.4 Recommended operating conditions. Supply voltage (VCC) .............................................................................. Minimum high level input voltage (VIH) ................................................... Maximum low level input voltage (VIL) .................................................... Case operating temperature range (TC) ................................................. Minimum width of write enable or read enable pulse ............................. Minimum setup time (data) ..................................................................... Minimum setup time (write select) .......................................................... Minimum hold time (data) ....................................................................... Minimum hold time (write select) ............................................................ Minimum latch time for new data ............................................................ 4.5 V minimum to 5.5 V maximum 2.0 V 0.7 V -55C to +125C 25 ns 10 ns 15 ns 15 ns (with respect to GW) 5 ns 25 ns 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard for Microelectronics. Interface Standard Electronic Component Case Outlines (Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _______ 1/ Must withstand the added PD due to short-circuit test (e.g., IOS). 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with MIL-PRF-38535. 2 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C 3. REQUIREMENTS 3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4). 3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. 3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3.2 Truth table. The truth table shall be as specified on figure 2. 3.3.3 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3.4 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity upon request. 3.3.5 Case outlines. The case outlines shall be as specified in 1.2.3. 3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6). 3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply over the full recommended case operating temperature range, unless otherwise specified. 3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III. 3.7 Marking. Marking shall be in accordance with MIL-PRF-38535. 3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 12 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with, MIL-PRF-38535 and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply: a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer. c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B. 3 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C TABLE I. Electrical performance characteristics. Test Symbol Conditions Device -55C TC +125C type High level output voltage VOH VCC = 4.5 V, VIN = 2.0 V IOH = -1 mA 01 Collector cutoff current ICEX VCC = 4.5 V, VOH = 5.5 V 02 Low level output voltage VOL VCC = 4.5 V, VIN = 0.7 V IOL = 4 mA Input clamp voltage VI C VCC = 4.5 V, IIN = -18 mA, Limits Min Unit Max 2.4 V 20 A 01, 02 0.4 V 01, 02 -1.5 V TC = +25C High level input current IIH1 VCC = 5.5 V, VIN = 2.7 V 01, 02 20 A IIH2 VCC = 5.5 V, VIN = 2.7 V 01 60 A 02 40 IIH3 VCC = 5.5 V, VIN = 2.7 V 01, 02 40 A IIH4 VCC = 5.5 V, VIN = 5.5 V 01, 02 100 A IIH5 VCC = 5.5 V, VIN = 5.5 V 01 300 A 02 200 all inputs except GR and GW High level input current at GR High level input current at GW High level input current all inputs except GR and GW High level input current at GR High level input current IIH6 VCC = 5.5 V, VIN = 5.5 V 01, 02 200 A IOZH VCC = 5.5 V, VO = 2.7 V 01 20 A IOZL VCC = 5.5 V, VO = 0.4 V 01 -20 A IIL1 VCC = 5.5 V, VIN = 0.4 V 01, 02 -0.5 -460 A IIL2 VCC = 5.5 V, VIN = 0.4 V A at GW Off state output current, high level voltage applied Off state output current: low level voltage applied Low level input current at data, read select, and write select Low level input current at read enable Low level input current at IIL3 VCC = 5.5 V, VIN = 0.4 V Short circuit output current IOS VCC = 5.5 V 1/ Supply current ICC VCC = 5.5 V 01 -90 -1300 02 -90 -900 01, 02 -60 -840 A 01 -15 -130 mA 01 50 mA 02 40 write enable See footnote at end of table. 4 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C TABLE I. Electrical performance characteristics - Continued. Test Symbol Propagation delay time, tPLH1 low to high level from data Propagation delay time, tPLH2 Conditions Device -55C TC +125C type Min Max 01 2 65 RL = 316 5% for device type 01, 02 2 65 RL = 2 k 5% for device type 02 01 2 58 02 2 58 VCC = 5.0 V, CL = 50 pF 10%, low to high level from read select Propagation delay time, tPHL1 high to low level from data Propagation delay time, tPHL2 low to high level from read select Propagation delay time, tPLH3 low to high level from write enable Limits Unit 01 2 58 02 2 52 01 2 65 02 2 58 01 2 65 02 2 65 ns ns ns ns ns Propagation delay time, low to high level from read enable tPLH4 02 2 46 ns Propagation delay time, tPHL3 01 2 72 ns 02 2 58 high to low level from write enable Propagation delay time, high to low level from read enable tPHL4 02 2 46 ns Output enable time to low level tPZL 01 2 58 ns Output enable time to high level tPZH 01 2 52 ns Output disable time to low level tPLZ 01 2 52 ns Output disable time to high level tPHZ 01 2 72 ns 1/ Not more than one output should be shorted at one time. 5 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C TABLE II. Electrical test requirements. Subgroups (see table III) Class S Class B devices devices 1 1 MIL-PRF-38535 test requirements Interim electrical parameters Final electrical test parameters Group A test requirements Group B electrical test parameters when using method 5005 QCI option Group C end-point electrical parameters Group D end-point electrical parameters 1*, 2, 3, 7, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 1, 2, 3, 7, 8 9, 10, 11 1, 2, 3, 7, 8 9, 10, 11 1, 2, 3 1*, 2, 3, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 N/A 1, 2, 3 1, 2, 3 *PDA applies to subgroup 1. 4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. 4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with MILPRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 shall be omitted. 4.4.2 Group B inspection. Group B inspection shall be in accordance with table II MIL-PRF-38535. 4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point electrical parameters shall be as specified in table II herein. 4.5 Methods of inspection. Methods of inspection shall be specified and as follows: 4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given are conventional and positive when flowing into the referenced terminal. 6 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C Pin identification Device types 01 and 02 Pin number Case 2 Case E, F 1 NC Data D2 2 Data D2 Data D3 3 Data D3 Data D4 4 Data D4 Read Select RB 5 Read Select RB Read Select RA 6 NC Output Q4 7 Read Select RA Output Q3 8 Output Q4 GND 9 Output Q3 Output Q2 10 GND Output Q1 11 NC Read Enable GR 12 Output Q2 Write Enable GW 13 Output Q1 Write Select WB 14 Read Enable GR Write Select WA 15 Write Enable GW Data D1 16 NC VCC 17 Write Select WB 18 Write Select WA 19 Data D1 20 VCC FIGURE 1. Terminal connections. 7 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C Device type 01 WB Write function table (see notes A, B, and C) Read function table (see notes A and D) Write inputs Read inputs Word WA GW Q L L L Q=D L H L Q0 H L L Q0 H H L X X H 1 2 3 RB Q0 Q0 Q0 Q=D Q0 Q0 Q0 Q=D Q0 Q0 Q0 Q0 Outputs RA GR Q1 Q2 Q3 Q4 L L L W0B1 W0B2 W0B3 W0B4 L H L W1B1 W1B2 W1B3 W1B4 Q0 H L L W2B1 W2B2 W2B3 W2B4 Q0 Q=D H H L W3B1 W3B2 W3B3 W3B4 Q0 Q0 X X H Z Z Z Z NOTES: A. H = high level, L = low level, X = irrelevant, Z = high impedance (off) B. (Q = D) - The four selected internal flip-flop outputs will assume the states applied to the four external data inputs. C. Q0 = the level of Q before the indicated input conditions were established. D. W0B1 = The first bit of word 0, etc. Device type 02 Write function table (see notes A, B, and C) Read function table (see notes A and D) Write inputs Read inputs Word Outputs WB WA GW Q 1 2 3 RB RA GR Q1 Q2 Q3 Q4 L L L Q=D Q0 Q0 Q0 L L L W0B1 W0B2 W0B3 W0B4 L H L Q0 Q=D Q0 Q0 L H L W1B1 W1B2 W1B3 W1B4 H L L Q0 Q0 Q=D Q0 H L L W2B1 W2B2 W2B3 W2B4 H H L Q0 Q0 Q0 Q=D H H L W3B1 W3B2 W3B3 W3B4 X X H Q0 Q0 Q0 Q0 X X H H H H H NOTES: A. H = high level, L = low level, X = irrelevant B. (Q = D) - The four selected internal flip-flop outputs will assume the states applied to the four external data inputs. C. Q0 = the level of Q before the indicated input conditions were established. D. W0B1 = The first bit of word 0, etc. FIGURE 2. Truth tables. 8 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C FIGURE 3 Logic diagram. 9 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C FIGURE 3 Logic diagram - Continued. 10 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C NOTES: 1. Input pulse characteristics: PRR 1.0 MHz, tr 15 ns, tf 6 ns, duty cycle = 50% 15%. 2. CL = 50 pF 10%. CL includes probe and jig capacitance. 3. All diodes are 1N3064 and 1N916. 4. Load circuits on a given output are required only where the specific test given in table III indicates "OUT" on that output. Load circuits may otherwise be omitted. FIGURE 4. Switching test circuit and waveforms for device types 01 and 02. 11 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C FIGURE 4. Switching test circuit and waveforms for device types 01 and 02 - Continued. 12 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated may be high 2.0 V; low 0.7 V; or open). 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Case 2 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 D2 D3 D4 RB 0.7 V " " " " " " " RA 0.7 V " " " " " " " Q4 Q3 GND GND " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Q2 Q1 4 mA GR 0.7 V " " " " " " " GW 0.7 V " " " " " " " WB 0.7 V " " " " " " " WA 0.7 V " " " " " " " D1 0.7 V VCC 4.5 V " " " " " " " " " " " " " " " " " 5.5 V " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Subgroup Symbol 883 method 1 Tc = 25C VOL 3007 " " " 3006 " " " VOH VI C IIL1 13 IIL2 IIL3 IIH1 IIH2 IIH3 IIH4 IIH5 IIH6 3009 " " " " " " " " " 3010 " " " " " " " " " " " " " " " " " " " Test no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 0.7 V 0.7 V 0.7 V 2.0 V 2.0 V 2.0 V -18 mA -18 mA -18 mA -18 mA -18 mA 0.4 V 0.4 V 0.4 V 0.4 V 0.4 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 4 mA 4 mA -1 mA -1 mA 4 mA -1 mA -1 mA See footnotes at end of device type 01. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. 2.0 V -18 mA -18 mA -18 mA -18 mA -18 mA 0.4 V 0.4 V 0.4 V 0.4 V 0.4 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V Measured terminal Limits Min Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 D2 D3 D4 RB RA GR GW WB WA D1 D2 D3 D4 RB RA WB WA D1 GR GW D2 D3 D4 RB RA WB WA D1 GR GW D2 D3 D4 RB RA WB WA D1 GR GW Unit Max 0.4 " " " 2.4 " " " 1/ -1.5 " " " " " " " " " 1/ " " " " " " " " " 20 " " " " " " " 60 40 100 " " " " " " " 300 200 V " " " " " " " " " " " " " " " " " A " " " " " " " " " " " " " " " " " " " " " " " " " " " " " MIL-M-38510/319C Cases E, F 1 MIL-STD- TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated may be high 2.0 V; low 0.7 V; or open). Subgroup Symbol 3 4 5 6 7 8 9 10 11 12 13 14 15 16 883 method Case 2 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Q1 GR 4.5 V GND " " " 2.0 V " " " " " " " GW 4.5 V GND " " " 0.7 V " " " " " " " WB GND " " " " 0.7 V " " " " " " " WA GND " " " " 0.7 V " " " " " " " D1 4.5 V 5.5 V " " " 2.0 V VCC 5.5 V " " " " " " " " " " " " H " " " L H " " L " " " " H " " " " " " " " B " " " " " " " " " " " " " " " " " " " " " B " " " " " " " A B " " " " " " " A " " " " B " A " B " " " " " " A " B " A " " B " A " B A B A B " " " " " A B A B A B A " B A B " A " " " B " " " " " " " " A " " " " B " " " 5.0 V " " " " " " " " " " " " " " " " " " " " " OUT GND " " " " " " " " " " " " " " " GND " " " " " " " " " " " " " " " GND " " " " " " " " " " " 5.0 V " " " GND " " " " " " " " " " " " " " " IN 5.0 V " " " " " " " " " " " " " " " 3005 3011 " " " Q2 GND GND 2.7 V 2.7 V 0.4 V 0.4 V L " " " H L " " H " " " " " " " " " " " " " OUT OUT OUT OUT OUT OUT OUT See footnotes at end of device type 01. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. 2.0 V IN GND 5.0 V Measured terminal Limits Min VCC Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 -30 " " " Unit Max 50 -130 " " " 20 " " " -20 " " " mA " " " " A " " " " " " " 50 " " " 45 " " " " " " " 50 " " " ns " " " " " " " " " " " " " " " 5/ " " " " " " " " " " " " " " " " " " " " " D1 to Q1 D2 to Q2 D3 to Q3 D4 to Q4 D1 to Q1 D2 to Q2 D3 to Q3 D4 to Q4 RA to Q1 RA to Q2 RA to Q3 RA to Q4 RB to Q1 RB to Q2 RB to Q3 RB to Q4 2 " " " " " " " " " " " " " " " MIL-M-38510/319C 2 Test no. D2 D3 D4 RB RA Q4 Q3 GND 49 4.5 V 4.5 V 4.5 V GND GND GND 50 " " " 51 5.5 V " " " 52 5.5 V " " GND " 53 5.5 V " " GND " IOZH 54 0.7 V 0.7 V " 55 2.0 V " " " 56 2.0 V " " 2.7 V " 57 2.0 V " " 2.7 V " IOZL 58 " " " 59 2.0 V " " " 60 2.0 V " " 0.4 V " 61 2.0 V " " 0.4 V " 2 Same tests, terminal conditions, and limits as subgroup 1, except TC = +125C and VI C tests are omitted. 3 Same tests, terminal conditions, and limits as subgroup 1, except TC = -55C and VI C tests are omitted. 7 3/ 4/ Truth 3014 62 B A B B B L H GND " 63 " " " " A " " " Tc = 25C table tests " 64 " " " A B " " " " 65 " " " " A " " " " 66 A B A B B H L " " 67 " " " " A L H " " 68 " " " A B " " " " 69 " " " " A " " " " 70 " " " B B H L " " 71 " " " " " " " " " 72 " " " " A " " " " 73 " " " A B " " " " 74 " " " " A " " " " 75 " A " B B " H " " 76 " " " " A " " " " 77 " " " A B " " " " 78 " " " " A " " " " 79 " " " " " " " " " 80 B B B B B " " " " 81 " " " " A " " " " 82 " " " A B " " " " 83 " " " " A " " " 8 Same tests and terminal conditions as for subgroup 7 except TC = +125C and TC = -55C. 9 tPLH1 3003 84 GND GND GND Fig. 4 85 IN " " " Tc = 25C " 86 IN " " OUT " " 87 IN " " OUT " tPHL1 " 88 " " " " 89 IN " " " " 90 IN " " OUT " " 91 IN " " OUT " tPLH2 " 92 " " " 7/ " 93 GND " " " " 94 GND " " OUT " " 95 GND " " OUT " tPHL2 " 96 IN GND " 6/ " 97 5.0 V " " " " 98 5.0 V " " OUT " " 99 5.0 V " " OUT " 1 ICC Tc = 25C IOS 2/ 14 Cases E, F 1 MIL-STD- TABLE III. Group A inspection for device type 01. Terminal conditions (pins not designated may be high 2.0 V; low 0.7 V; or open). Subgroup 3 4 5 6 7 8 9 10 11 12 13 14 15 16 883 method Case 2 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 GW IN " " " " " " " GND " " " " " " " " " " " " " " " WB GND " " " " " " " " " " " " " " " " " " " " " " " WA IN " " " " " " " GND " " " " " " " " " " " " " " " D1 5.0 V VCC 5.0 V " " " " " " " " " " " " " " " " " " " " " " " Symbol tPLH3 6/ 1/ Min/max limits (A) for circuits, unless otherwise specified. Test IIL1 A -120/-360 B -30/-300 IIL2 IIL3 -36 mA/-1.08 mA -240/-720 -90/-900 -60/-600 Min/max limits (mA) C E -160/-400 except -120/-360 except -120/-360 for test 24 -0.5/-360 for test 22 -305/-760 -305/-760 -.36 mA/-1.08 mA -240/-720 F -135/-370 except -150/-380 for test 23; -135/-380 for tests 24, 25, 26 -.48 mA/-1.20 mA -320/-800 2/ IOS limits for circuits B, C, and E are -15/-100 mA. 3/ Connect a 0.5 k to 2 k resistor from terminals, 6, 7, 9, and 10 to VCC for subgroup 7 tests. 4/ A = 3.0 V min., B = 0.0 V or GND, C = pulse 3.0 V 3.0 V 0.0 V 5/ Output voltages shall be: H > 1.5 V, L < 1.5 V 6/ Load ground into register under test prior to test. 7/ Load one state into register under test prior to test. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. GND 5.0 V 5.0 V GND GND Measured terminal GW to Q1 GW to Q2 GW to Q3 GW to Q4 GW to Q1 GW to Q2 GW to Q3 GW to Q4 GR to Q1 GR to Q2 GR to Q3 GR to Q4 GR to Q1 GR to Q2 GR to Q3 GR to Q4 GR to Q1 GR to Q2 GR to Q3 GR to Q4 GR to Q1 GR to Q2 GR to Q3 GR to Q4 Limits Min 2 " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Unit Max 50 " " " 55 " " " " " " " 40 " " " " " " " 45 " " " 65 58 58 65 65 72 72 52 52 58 ns " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " MIL-M-38510/319C 2 Test no. D2 D3 D4 RB RA Q4 Q3 GND Q2 Q1 GR 3003 100 GND 5.0 V GND OUT GND Fig. 4 101 5.0 V " " " OUT " " 102 5.0 V " " OUT " " " 103 5.0 V " " OUT " " tPHL3 " 104 " " " OUT " 7/ " 105 GND " " " OUT " " 106 GND " " OUT " " " 107 GND " " OUT " " tPHZ " 108 " GND " OUT IN " 109 5.0 V " " " OUT " " 110 5.0 V " " OUT " " " 111 5.0 V " " OUT " " tPZH " 112 " " " OUT " " 113 5.0 V " " " OUT " " 114 5.0 V " " OUT " " " 115 5.0 V " " OUT " " tPLZ " 116 " " " OUT " " 117 GND " " " OUT " " 118 GND " " OUT " " " 119 GND " " OUT " " tPZL " 120 " " " OUT " " 121 GND " " " OUT " " 122 GND " " OUT " " " 123 GND " " OUT " " 10 tPLH1 " 124 " 125 TC =125C tPHL1 Same tests and terminal conditions as for subgroup 9, except TC = +125C and test limits as shown tPLH2 " 126 tPHL2 " 127 tPLH3 " 128 tPHL3 " 129 tPHZ " 130 tPZH " 131 tPLZ " 132 tPZL " 133 11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55C. 9 Tc = 25C 15 Cases E, F 1 MIL-STD- TABLE III. Group A inspection for device type 02. Terminal conditions (pins not designated may be high 2.0 V; low 0.7 V; or open). 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Case 2 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 D2 D3 D4 RB 0.7 V " " " " " " " RA 0.7 V " " " " " " " Q4 Q3 GND GND " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Q2 Q1 4 mA GR 0.7 V " " " " " " " GW 0.7 V " " " " " " " WB 0.7 V " " " " " " " WA 0.7 V " " " " " " " D1 0.7 V VCC 4.5 V " " " " " " " " " " " " " " " " " 5.5 V " " " " " " " " " " " " " " " " " " " " " " " " " " " " " Subgroup Symbol 883 method 1 Tc = 25C VOL 3007 " " " ICEX VI C IIL1 16 IIL2 IIL3 IIH1 IIH2 IIH3 IIH4 IIH5 IIH6 3009 " " " " " " " " " 3010 " " " " " " " " " " " " " " " " " " " Test no. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 0.7 V 0.7 V 0.7 V 2.0 V 2.0 V 2.0 V -18 mA -18 mA -18 mA -18 mA -18 mA 0.4 V 0.4 V 0.4 V 0.4 V 0.4 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 4 mA 4 mA 5.5 V 5.5 V 4 mA 5.5 V 5.5 V See footnotes at end of device type 02. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. 2.0 V -18 mA -18 mA -18 mA -18 mA -18 mA 0.4 V 0.4 V 0.4 V 0.4 V 0.4 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V Measured terminal Limits Min Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 D2 D3 D4 RB RA GR GW WB WA D1 D2 D3 D4 RB RA WB WA D1 GR GW D2 D3 D4 RB RA WB WA D1 GR GW D2 D3 D4 RB RA WB WA D1 GR GW 1/ Unit Max 0.4 " " " 20 " " " -1.5 " " " " " " " " " 1/ " " " " " " " " " 20 " " " " " " " 40 40 100 " " " " " " " 200 200 V " " " A " " " V " " " " " " " " " A " " " " " " " " " " " " " " " " " " " " " " " " " " " " " MIL-M-38510/319C Cases E, F 1 MIL-STD- TABLE III. Group A inspection for device type 02. Terminal conditions (pins not designated may be high 2.0 V; low 0.7 V; or open). Subgroup Symbol 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 883 method Case 2 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 Q2 Q1 GR 4.5 V GW 4.5 V WB GND WA GND D1 4.5 V VCC 5.5 V H " " " L H " " L H L " " H " " " " " " " B " " " " " " " " A B " " A " " " B " " " B " " " " " " A " B " " " " " " " A " " " B " A " B " " " A B " A " B " A " B " A " B A B A B " " " " " A B A B A B A B A B " A " " " B " " " " " " " " A " " " B " " " 5.0 V " " " " " " " " " " " " " " " " " " " " OUT GND " " " " " " " " " " " " " " " GND " " " " " " " " " " " " " " " GND " " " " " " " " " " " 5.0 V " " " GND " " " " " " " " " " " GND " " " IN 5.0 V " " " " " " " " " " " " " " " Test no. D2 D3 D4 RB RA Q4 Q3 GND 1 ICC 3005 49 4.5 V 4.5 V 4.5 V GND GND GND Tc = 25C 2 Same tests, terminal conditions, and limits as subgroup 1, except TC = +125C and VI C tests are omitted. 3 Same tests, terminal conditions, and limits as subgroup 1, except TC = -55C and VI C tests are omitted. 7 2/ 3/ Truth 3014 50 B A B B B L H GND " 51 " " " " A " " " Tc = 25C table tests " 52 " " " A B " " " " 53 " " " " A " " " " 54 A B A B B H L " " 55 " " " " A L H " " 56 " " " A B " " " " 57 " " B " A " " " " 58 " " " B B H L " " 59 " " " " " " H " " 60 " " A " A " L " " 61 " " " A B " " " " 62 " " " " A " " " " 63 " A " B B " H " " 64 " " " " A " " " " 65 " " " A B " " " " 66 " " " " A " " " " 67 B B B B B " " " " 68 " " " " A " " " " 69 " " " A B " " " " 70 " " " " A " " " 8 Same tests and terminal conditions as for subgroup 7 except TC = +125C and TC = -55C. 9 tPLH1 3003 71 GND GND GND Fig. 4 72 IN " " " Tc = 25C " 73 IN " " OUT " " 74 IN " " OUT " tPHL1 " 75 " " " " 76 IN " " " " 77 IN " " OUT " " 78 IN " " OUT " tPLH2 " 79 " IN " 5/ " 80 5.0 V " " " " 81 5.0 V " " OUT " " 82 5.0 V " " OUT " tPHL2 " 83 IN GND " 5/ " 84 5.0 V " " " " 85 5.0 V " " OUT " " 86 5.0 V " " OUT " L " " " H L " " H " " " " " " " " " " " " OUT OUT OUT OUT OUT OUT OUT See footnotes at end of device type 02. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. IN 5.0 V 5.0 V Measured terminal Limits Min VCC Unit Max 40 mA 50 " " " 40 " " " 45 " " " " " " " ns " " " " " " " " " " " " " " " 4/ " " " " " " " " " " " " " " " " " " " " D1 to Q1 D2 to Q2 D3 to Q3 D4 to Q4 D1 to Q1 D2 to Q2 D3 to Q3 D4 to Q4 RA to Q1 RA to Q2 RA to Q3 RA to Q4 RB to Q1 RB to Q2 RB to Q3 RB to Q4 2 " " " " " " " " " " " " " " " MIL-M-38510/319C 17 Cases E, F 1 MIL-STD- TABLE III. Group A inspection for device type 02. Terminal conditions (pins not designated may be high 2.0 V; low 0.7 V; or open). Subgroup 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 883 method Case 2 2 3 4 5 7 8 9 10 12 13 14 15 17 18 19 20 GW IN " " " " " " " GND " " " " " " " WB GND " " " " " " " " " " " " " " " WA IN " " " " " " " GND " " " " " " " D1 5.0 V VCC 5.0 V " " " " " " " " " " " " " " " Symbol Test no. D2 D3 D4 RB RA Q4 Q3 GND Q2 Q1 GR 3003 87 GND 5.0 V GND OUT GND Fig. 4 88 5.0 V " " " OUT " " 89 5.0 V " " OUT " " " 90 5.0 V " " OUT " " tPHL3 " 91 " " " OUT " 6/ " 92 GND " " " OUT " " 93 GND " " OUT " " " 94 GND " " OUT " " tPLH4 " 95 " GND " OUT IN " 96 GND " " " OUT " " 97 GND " " OUT " " " 98 GND " " OUT " " tPHL4 " 99 " " " OUT " " 100 GND " " " OUT " " 101 GND " " OUT " " " 102 GND " " OUT " " 10 tPLH1 " 103 " 104 Same tests and terminal conditions as for subgroup 9, except TC = +125C and test limits as shown TC =125C tPHL1 tPLH2 " 105 tPHL2 " 106 tPLH3 " 107 tPHL3 " 108 tPLH4 " 109 tPHL4 " 110 11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55C. 9 Tc = 25C tPLH3 5/ 18 1/ Min/max limits (A) for circuits, unless otherwise specified. Test IIL1 A -120/-360 B -30/-300 IIL2 IIL3 -240/-720 -240/-720 -90/-900 -60/-600 Min/max limits (mA) C E -160/-400 except -120/-360 except -120/-360 for test 24 -0.5/-360 for tests 22 and 24 -305/-760 -240/-720 -305/-760 -240/-720 F -135/-370 except -150/-380 for test 23 -320/-800 -320/-800 2/ Connect a 0.5 k to 2 k resistor from terminals, 6, 7, 9, and 10 to VCC for subgroup 7 tests. C = pulse 3.0 V 0.0 V 4/ Output voltages shall be: H > 1.5 V, L < 1.5 V 3/ A = 3.0 V min., B = 0.0 V or GND, 3.0 V 5/ Load ground into register under test prior to test. 6/ Load one state into register under test prior to test. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. GND GND GND Measured terminal GW to Q1 GW to Q2 GW to Q3 GW to Q4 GW to Q1 GW to Q2 GW to Q3 GW to Q4 GR to Q1 GR to Q2 GR to Q3 GR to Q4 GR to Q1 GR to Q2 GR to Q3 GR to Q4 Limits Min 2 " " " " " " " " " " " " " " " " " " " " " " " Unit Max 50 " " " 45 " " " 40 " " " " " " " 65 52 58 58 65 58 46 46 ns " " " " " " " " " " " " " " " " " " " " " " " MIL-M-38510/319C Cases E, F 1 MIL-STD- MIL-M-38510/319C 5. PACKAGING 5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature which may be helpful, but is not mandatory.) 6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment. 6.2 Acquisition requirements. Acquisition documents should specify the following: a. Title, number, and date of the specification. b. Complete part number (see 1.2). c. Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable. d. Requirements for certificate of compliance, if applicable. e. Requirements for notification of change of product or process to contracting activity in addition to notification to the qualifying activity, if applicable. f. Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883), corrective action, and reporting of results, if applicable. g. Requirements for product assurance options. h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government. j. Requirements for "JAN" marking. 6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists. 6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199. 19 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-HDBK-1331, and as follows: GND ........................................... IIN ................................................ VIC ............................................... VIN ............................................... IOZL .............................................. IOZH ............................................. tPHZ .............................................. tPLZ tPZH tPZL Ground zero voltage potential. Current flowing into an input terminal. Input clamp voltage. Voltage level at an input terminal. Output current in the high impedance mode with the output voltage low. Output current in the high impedance mode with the output voltage high. Output disable time from high level - The time between the specified reference points on the input and output voltage waveforms with the three state output changing from the defined high level to a high impedance (off) state. .............................................. Output disable time from low level - The time between the specified reference points on the input and output voltage waveforms with the three state output changing from the defined low level to a high impedance (off) state. .............................................. Output enable time to high level - The time between the specified reference points on the input and output voltage waveforms with the three state output changing from a high impedance (off) state to the defined high level. .............................................. Output enable time to low level - The time between the specified reference points on the input and output voltage waveforms with the three state output changing from a high impedance (off) state to the defined low level. 6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number. 6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M-38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535. Military device type Generic-industry type 01 02 54LS670 54LS170 6.8 Manufacturers' designation. Manufacturers' circuits, which form a part of this specification, are designated with an "X" as shown in table IV herein. TABLE IV. Manufacturer's designator. Device type 01 02 Circuit A Texas Instruments Circuit B Signetics Corp. X X X X Manufacturer Circuit C Circuit E National Fairchild Semiconductor Semiconductor X X X X Circuit F Motorola Inc. X X 6.9 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. 20 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. MIL-M-38510/319C Custodians: Army - CR Navy - EC Air Force - 11 DLA - CC Preparing activity: DLA - CC (Project 5962-1966) Review activities: Army - MI, SM Navy - AS, CG, MC, SH, TD Air Force - 03, 19, 99 21 Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. STANDARDIZATION DOCUMENT IMPROVEMENT PROPOSAL INSTRUCTIONS 1. The preparing activity must complete blocks 1, 2, 3, and 8. In block 1, both the document number and revision letter should be given. 2. The submitter of this form must complete blocks 4, 5, 6, and 7, and send to preparing activity. 3. The preparing activity must provide a reply within 30 days from receipt of the form. NOTE: This form may not be used to request copies of documents, nor to request waivers, or clarification of requirements on current contracts. Comments submitted on this form do not constitute or imply authorization to waive any portion of the referenced document(s) or to amend contractual requirements. I RECOMMEND A CHANGE: 1. DOCUMENT NUMBER MIL-M-38510/319C 2. DOCUMENT DATE (YYYYMMDD) 2003-07-14 3. DOCUMENT TITLE MICROCIRCUITS, DIGITAL, LOW-POWER SCHOTTKY TTL, 4 BY 4 REGISTER FILE, CASCADABLE, MONOLITHIC SILICON 4. NATURE OF CHANGE (Identify paragraph number and include proposed rewrite, if possible. Attach extra sheets as needed.) 5. REASON FOR RECOMMENDATION 6. SUBMITTER a. NAME (Last, First Middle Initial) b. ORGANIZATION c. ADDRESS (Include Zip Code) d. TELEPHONE (Include Area Code) (1) Commercial (2) DSN (If applicable) 8. PREPARING ACTIVITY a. NAME Defense Supply Center, Columbus c. ADDRESS (Include Zip Code) DSCC-VA P. O. Box 3990 Columbus, Ohio 43216-5000 DD Form 1426, FEB 1999 (EG) b. TELEPHONE (Include Area Code (1) Commercial 614-692-0536 7. DATE SUBMITTED (YYYYMMDD) (2) DSN 850-0536 IF YOU DO NOT RECEIVE A REPLY WITHIN 45 DAYS, CONTACT: Defense Standardization Program Office (DLSC-LM) 8725 John J. Kingman Road, Suite 2533 Fort Belvoir, Virginia 22060-6221 Telephone (703)767-6888 DSN 427-6888 PREVIOUS EDITIONS ARE OBSOLETE. Source: https://assist.dla.mil -- Downloaded: 2018-10-13T10:00Z Check the source to verify that this is the current version before use. WHS/DIOR, Feb 99