HD74AC174 Hex D-Type Flip-Flop with Master Reset ADE-205-376 (Z) 1st. Edition Sep. 2000 Description The HD74AC174 is a high-speed hex D flip-flop. The device is used primarily as a 6-bit edge-triggered storage register. The information on the D inputs is transferred to storage during the Low-to-High clock transition. The device has a Master Reset to simultaneously clear all flip-flops. Feature * Outputs Source/Sink 24 mA Pin Arrangement MR 1 16 VCC Q0 2 15 Q5 D0 3 14 D5 D1 4 13 D4 Q1 5 12 Q4 D2 6 11 D3 Q2 7 10 Q3 GND 8 9 CP (Top view) HD74AC174 Logic Symbol D0 D1 D2 D3 D4 D5 CP MR Q0 Q1 Q2 Q3 Q4 Q5 Pin Names D0 to D5 CP MR Q0 to Q5 Data Inputs Clock Pulse Input Master Reset Input Outputs Functional Description The HD74AC174 consists of six edge-triggered D flip-flops with individual D inputs and Q outputs. The Clock (CP) and Master Reset (MR) are common to all flip-flops. Each D input's state is transferred to the corresponding flip-flops's output following the Low-to-High Clock (CP) transition. A Low input to the Master Reset (MR) will force all outputs Low independent of Clock or Data inputs. The HD74AC174 is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements. Truth Table Inputs Output MR CP D Q L X X L H H H H L L X Q H L H : L : X : : 2 High Voltage Level Low Voltage Level Immaterial Low-to-High Transition of Clock HD74AC174 Logic Diagram MR CP D5 D4 D Q D3 D CP CD Q D CP CD Q5 D2 Q D CP CD Q4 D1 Q D CP CD Q3 D0 Q D CP CD Q2 Q CP CD Q1 Q0 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. DC Characteristics (unless otherwise specified) Item Symbol Max Unit Condition Maximum quiescent supply current I CC 80 A VIN = VCC or ground, VCC = 5.5 V, Ta = Worst case Maximum quiescent supply current I CC 8.0 A VIN = VCC or ground, VCC = 5.5 V, Ta = 25C AC Characteristics: HD74AC174 Ta = +25C CL = 50 pF Ta = -40C to +85C CL = 50 pF Item Symbol VCC (V)*1 Min Typ Max Min Max Unit Maximum clock f max 3.3 90 100 -- 70 -- MHz 5.0 100 125 -- 100 -- 3.3 1.0 9.0 11.5 1.0 12.5 5.0 1.0 6.0 8.5 1.0 9.5 3.3 1.0 8.5 11.0 1.0 12.0 5.0 1.0 6.0 8.0 1.0 9.0 3.3 1.0 9.0 11.5 1.0 12.5 5.0 1.0 7.0 9.0 1.0 10.5 frequency Propagation delay t PLH CP to Qn Propagation delay t PHL CP to Qn Propagation delay MR to Q n Note: t PHL ns ns ns 1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V 3 HD74AC174 AC Operating Requirements: HD74AC174 Ta = -40C to +85C CL = 50 pF Ta = +25C CL = 50 pF Item Symbol VCC (V)*1 Typ Guaranteed Minimum Unit Setup time, HIGH or LOW t su 3.3 2.5 6.5 7.0 ns 5.0 2.0 5.0 5.5 3.3 1.0 3.0 3.0 5.0 0.5 3.0 3.0 3.3 1.0 5.5 7.0 5.0 1.0 5.0 5.0 3.3 1.0 5.5 7.0 5.0 1.0 5.0 5.0 3.3 0 2.5 2.5 5.0 0 2.0 2.0 Dn to CP Hold time, HIGH or LOW th Dn to CP MR pulse width, LOW CP pulse width Recovery time tw tw t rec MR to CP Note: 1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V Capacitance Item Symbol Typ Unit Condition Input capacitance CIN 4.5 pF VCC = 5.5 V Power dissipation capacitance CPD 85.0 pF VCC = 5.0 V 4 ns ns ns ns HD74AC174 Package Dimensions Unit: mm 19.20 20.00 Max 6.30 9 1 7.40 Max 16 8 1.3 0.48 0.10 7.62 2.54 Min 5.06 Max 2.54 0.25 0.51 Min 1.11 Max + 0.13 0.25 - 0.05 0 - 15 Hitachi Code JEDEC EIAJ Mass (reference value) DP-16 Conforms Conforms 1.07 g Unit: mm 10.06 10.5 Max 9 1 8 1.27 *0.42 0.08 0.40 0.06 0.10 0.10 0.80 Max *0.22 0.05 0.20 0.04 2.20 Max 5.5 16 0.20 7.80 +- 0.30 1.15 0 - 8 0.70 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-16DA -- Conforms 0.24 g 5 HD74AC174 Unit: mm 9.9 10.3 Max 9 1 8 *0.42 0.08 0.40 0.06 *0.22 0.03 0.20 0.03 0.635 Max + 0.11 1.27 0.14 - 0.04 1.75 Max 3.95 16 + 0.10 6.10 - 0.30 1.08 0 - 8 0.67 0.60 +- 0.20 0.15 0.25 M Hitachi Code JEDEC EIAJ Mass (reference value) *Dimension including the plating thickness Base material dimension FP-16DN Conforms Conforms 0.15 g Unit: mm 4.40 5.00 5.30 Max 16 9 1 8 0.65 1.10 Max 0.65 Max 0.10 *Dimension including the plating thickness Base material dimension 6 6.40 0.20 0.07 +0.03 -0.04 0.20 0.06 1.0 0.13 M *0.17 0.05 0.15 0.04 0.08 *0.22 +- 0.07 0 - 8 0.50 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) TTP-16DA -- -- 0.05 g HD74AC174 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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