Product Brief
April 2002
CSP1037—AC-Link Soft Modem Chip Set
Features
Two-chip AC-link modem solution
CSP1037
CSP1037B
Data mode capabilities:
ITU-T V.92*: 56000 bits/s—28000 bits/s
ITU-T V.90*: 56000 bits/s—28000 bits/s
ITU-T V.34: 33600 bits/s—2400 bits/s
V.44, V.42, V.42bis, and
MNP
®Class 5 data
compression
V.32terbo, V.32bis, and fallbacks
High compression throughput due to parallel
access directly to the host PC
FAX mode capabilities:
ITI-T T.31 class 1 FAX
ITU-T V.34: 33600 bits/s—2400 bits/s (TCM)
ITU-T V.17: 14400 bits/s, 12000 bits/s,
7200 bits/s (TCM)
ITU-T V.29: 9600 bits/s, 7200 bits/s (QAM)
ITU-T V.27ter: 4800 bits/s, 2400 bits/s (DPSK)
ITU-T V.21 Channel 2: 300 bits/s (FSK)
Complete DAA includes the following:
AC‘97/MC‘97 2.2 compliant
International line interface
Compliant with FCC, CTR21, JATE, and other
PTTs
3.3 V to 5 V power supply
2400 V isolation
Integrated ring detector
Integrated analog front end (AFE)
2-wire to 4-wire hybrid
Low-power standby mode
Low-profile SOIC packages
Operating system support:
Windows
®98, 98SE, 2000,
NT
®4.0, ME,
XP
ÿ
PC 2001compliant
ACPI compliant
Applications:
Modem riser cards (MR)
Modem daughter cards (MDC)
Packaging options:
SOIC: for standard MR and MDC applications
TSSOP: for small foot print applications
Introduction
The CSP1037 chip set is an integrated direct access
arrangement (DAA) that provides a programmable
line interface to meet international telephone line
requirements. The CSP1037 chip set is available in
two 16-pin small outline packages (AC‘97 interface
on SCP and telephone line interface on
CSP1037B). The chip set eliminates the need for an
AFE, an isolation transformer, relays, optoisolators,
and a 2-wire to 4-wire hybrid. The CSP1037 chip set
dramatically reduces the number of discrete compo-
nents and cost required to achieve compliance with
international regulatory requirements. SCP complies
with AC‘97/MC‘97 Interface Specification Rev. 2.2.
The CSP1037 set is an ITU-T recommendation
V.92/V.44 solution. V.92 and V.44 have four innova-
tive features designed to improve modem perfor-
mance in the internet environment. The features are
as follows:
Modem fast connect: faster start-up times.
Modem on hold: switch between modem and an
incoming phone call without losing the data con-
nections.
PCM upstream: send data to central site at rates
approaching 48 kbits/s.
Data compression enhancement focused on
today’s internet traffic.
* Actual speeds over U.S. telephone lines vary and are less than
56K, due to current FCC regulations and line conditions.
Modem on hold functionality requires call waiting services.
2Agere Systems Inc.
Product Brief
April 2002
CSP1037—AC-Link Soft Modem Chip Set
Functional Description
Figure 1. Functional Block Diagram
The CSP1037 chip set is an integrated direct access arrangement (DAA) that provides a programmable line inter-
face to meet international telephone line requirements. The CSP1037 chip set is available in two 16-pin small out-
line packages (AC‘97 interface on CSP1037 and telephone line interface on CSP1037B). The chip set eliminates
the need for an AFE, an isolation transformer, relays, optoisolators, and a 2-wire to 4-wire hybrid. The CSP1037
chip set dramatically reduces the number of discrete components and cost required to achieve compliance with
international regulatory requirements. The CSP1037 complies with AC‘97/MC‘97 Interface Specification Rev. 2.1.
The chip set is fully programmable to meet worldwide telephone line interface requirements, including those
described by CTR21, JATE, FCC, and various country-specific PTT specifications. The programmable parameters
of the CSP1037 chip set include ac termination, dc termination, ringer impedance, and ringer threshold. The
CSP1037 chip set has been designed to meet stringent worldwide requirements for out-of-band energy, billing-tone
immunity, lightning surges, and safety requirements.
The CSP1037 chip set achieves an isolation barrier through low-cost, high-voltage capacitors in conjunction with
Agere’s proprietary signal processing techniques. These techniques eliminate any signal degradation due to
capacitor mismatches, common-mode interference, or noise coupling. All transmit, receive, control, and ring detect
data are communicated through this barrier.
5-8164 (F)
CLOCK
AC‘97
DIGITAL
INTERFACE
CONTROL
INTERFACE
ISOLATION
INTERFACE
HYBRID
AND
dc
RING DETECT
OFF-HOOK
ISOLATION
INTERFACE
TERMINATION
XOUT
MCLK/XIN
RESET
BIT_CLK
SYNC
SDATA_IN
SDATA_OUT
ID0
ID1
GPIO_A
GPIO_B
RX
FILT
FILT2
REF
DCT
VREG
VREG2
REXT
REXT2
RNG1
RNG2
QB
QE
QE2
CSP1037 CSP1037B
Agere Systems Inc. 3
Product Brief
April 2002 CSP1037—AC-Link Soft Modem Chip Set
V.92 and V.90 Technology
ITU-T recommendations V.92 and V.44 are the new
international standards for analog modems. They
improve the features of the former standards V.90 and
V.42bis with simple yet powerful changes designed to
enhance the internet experience. The new features of
V.92 are as follows:
Fast connect, which decreases start-up times on rec-
ognized connections.
Modem on hold*, which allows the user to place the
modem on hold when an incoming call is identified,
when call waiting services are available.
PCM upstream, which increases the upstream trans-
mission rate up to 48 kbits/s under the best line con-
ditions.
V.44 updates the older compression standardf V.42bis.
V.42bis was created ten years ago and predates the
World Wide Web. V.44 addresses the content changes
from the last ten years and can provide significantly
increased throughput.
Although the central-site architecture is beginning to
move towards V.92, most of the existing infrastructure
only supports V.90 equipment. The CSP1037 chip set
supports both V.92 and V.90 with a fallback to V.34 for
connections where a V.92 or V.90 connectionis not
negotiated.
* This feature is dependant on the country specific call waiting ser-
vice. Not all countries are supported.
AC-Link
The AC-Link is a bidirectional, fixed rate, serial PCM
digital stream. It handles multiple input and output
audio streams and control register access employing a
time-division multiplexed (TDM) scheme. The AC-link
architecture divides each audio frame into twelve out-
going and twelve incoming data streams, each with 20-
bit sample resolution.
The AC-link serial interconnect defines a digital data
and control pipe between the controller and the codec.
The AC-link supports twelve 20-bit slots at 48 kHz on
SDATA_IN and SDATA_OUT. The TDM slot-based
architecture supports a per-slot valid tag infrastructure
that is the source of each slot’s data sets or clears to
idicate the validity of the slot data within the current
frame. For modern AFE, data streams at a variety of
required sample rates can be supported.
Isolation Barrier
The CSP1037 chip set achieves an isolation barrier
through low-cost, high-voltage capacitors in conjunc-
tion with proprietary signal processing techniques.
These techniques eliminate any signal degradation
due to capacitor mismatches, common-mode interfer-
ence, or noise coupling. All transmit, receive, control,
and ring detect data are communicated through this
barrier.
The communications link is disabled by default. The
PR bits in register 3Eh must be cleared, and the sam-
ple rate must be set in register 40h/42h. No communi-
cation between SCP and the CSP1037B can occur
until these conditions are set.
Agere Systems Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use orapplication. Agere,
Agere Systems, and the Agere logo are trademarks of Agere Systems Inc.
Copyright © 2002 Agere Systems Inc.
All Rights Reserved
April 2002
PB01-125DMOD (Replaces PN99-096DMOD)
For additional information, contact your Agere Systems Account Manager or the following:
INTERNET: http://www.agere.com
E-MAIL: docmaster@agere.com
N. AMERICA: Agere Systems Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18109-3286
1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)
ASIA: Agere Systems Hong Kong Ltd., Suites 3201 & 3210-12, 32/F, Tower 2, The Gateway, Harbour City, Kowloon
Tel. (852) 3129-2000, FAX (852) 3129-2020
CHINA: (86) 21-5047-1212 (Shanghai), (86) 10-6522-5566 (Beijing), (86) 755-695-7224 (Shenzhen)
JAPAN: (81) 3-5421-1600 (Tokyo), KOREA: (82) 2-767-1850 (Seoul), SINGAPORE: (65) 6778-8833, TAIWAN: (886) 2-2725-5858 (Taipei)
EUROPE: Tel. (44) 7000 624624, FAX (44) 1344 488 045
Product Brief
April 2002
CSP1037—AC-Link Soft Modem Chip Set
Ordering Information
Table 1. CSP1037 Ordering Information
* All specifications for commercial grade and extended temperature parts are the same as the specifications for the SOIC package except for
the pin configuration of the CSP1037. The SOIC and TSSOP pin configurations for the CSP1037B are the same for both packages.
MNP
is a registered trademark of Microcom, Inc.
Windows
and
Windows NT
areregisteredtrademarksand
XP
is a trademark of Microsoft Corporation.
Device Package Comcode Remarks
CSP1037 SOIC, 16-pin, small-outline 108500117
CSP1037B SOIC, 16-pin, small-outline 108500109 For international use
CSP1037-16T TSSOP, 16-pin, thin shrink small-outline 109061416 Extended temperature: 0—90 °C
CSP1037B-16T TSSOP, 16-pin, thin shrink small-outline 109061390 Extended temperature: 0—90 °C
CSP1037-16T70* TSSOP, 16-pin, thin shrink small-outline 700023261 Commercial grade: 0—70 °C
CSP1037B-16T70* TSSOP, 16-pin, thin shrink small-outline 700023262 Commercial grade: 0—70 °C