67-21S/NR3C-D1530L6M41829Z15/2T - EVERLIGHT ELECTRONICS

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SMD  Middle Power LED

67-21S/NR3C-D1530L6M41829Z15/2T

Preliminary

Features

‧PLCC-2 package

Top view‧ Red LED

‧Wide viewing angle

‧Pb-free

‧RoHS compliant

Description

The Everlight 67-21S package has high efficacy, Middle Power consumption, wide viewing angle and a compact form

factor. These features make this package an ideal LED for all lighting applications.

Applications

‧Decorative and Entertainment Lighting

‧Agriculture Lighting

‧General use

DATASHEET

SMD  Middle Power LED

67-21S/NR3C-D1530L6M41829Z15/2T

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Device Selection Guide

Chip

Materials Emitted Color Resin Color

AlGaInP Red

Water Clear

Absolute Maximum Ratings (T

Soldering

=25℃)

Parameter Symbol Rating Unit

Forward Current IF 150 mA

Peak Forward Current (Duty 1/10 @10ms) IFP 300 mA

Power Dissipation Pd 435 mW

Electrostatic Discharge(HBM) (2) ESD 2000 V

Operating Temperature Topr -40 ~ +85

℃

Storage Temperature Tstg -40 ~ +100

℃

Thermal Resistance (Junction / Soldering point) Rth J-S 50 ℃/W

Junction Temperature T j 115

℃

Soldering Temperature Tsol Reflow Soldering : 260 ℃ for 10 sec.

Hand Soldering : 350 ℃ for 3 sec.

Note:

1.The products are sensitive to static electricity and must be carefully taken when handling products

2.Test result of Electrostatic Discharge is only for reference.

Electro-Optical Characteristics (TSoldering=25 )℃

Parameter Symbol Min. Typ. Max. Unit Condition

Luminous

flux(1) Ø 15.0 ----- 24.0

lm IF=150mA

Forward Voltage VF 1.9 ----- 2.9

V IF=150mA

Viewing Angle 2θ1/2 ----- 120 -----

deg IF=150mA

Reverse Current IR ----- ----- 50

μΑ VR =5V

Notes:

1. Tolerance of Radiometric Luminous

flux

: ±11%.

2. Tolerance of Forward Voltage: ±0.1V.

DATASHEET

SMD  Middle Power LED

67-21S/NR3C-D1530L6M41829Z15/2T

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Bin Range of Radiometric Power

Bin Code Min. Max. Unit Condition

L6 15 16

lm IF=150mA

L7 16 17

L8 17 18

L9 18 19

M3 19 21

M4 21 24

Notes:

Tolerance of Luminous flux: ±11%

Bin Range of Forward Voltage

Bin Code Min. Max. Unit Condition

25 1.8 2.8

V IF=150mA

26 1.9 2.0

27 2.0 2.1

28 2.1 2.2

29 2.2 2.3

30 2.3 2.4

31 2.4 2.5

32 2.5 2.6

33 2.6 2.7

34 2.7 2.8

35 2.8 2.9

Note:

Tolerance of Forward Voltage: ±0.1V.

Dominant Wavelength Bins

Bin Code Min. Max. Unit Condition

O54 615 620

nm IF=150mA

R51 620 625

R52 625 630

Notes:

Dominant / Peak wavelength measurement tolerance: ±1nm.

DATASHEET

SMD  Middle Power LED

67-21S/NR3C-D1530L6M41829Z15/2T

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Spectrum Distribution

560 580 600 620 640 660 680 700

0.0

0.2

0.4

0.6

0.8

1.0

Relative Luminous Intenstiy

Wavelength(nm)

Typical Electro-Optical Characteristics Curves

25 40 55 70 85 100 115

-0.30

-0.25

-0.20

-0.15

-0.10

-0.05

0.00

0.05

0.10

Forward Voltage Shift

(

V

)

T j - Ju n ctio n Temperature

(

o

C

)

0 15 30 45 60 75 90 105 120 135 150

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

Relative Radiometric Power

Forward Current(mA)

Fig.1 – Forward Voltage Shift vs.

Junction Temperature

Fig.2 - Relative Radiometric Power

vs. Forward Current

DATASHEET

SMD  Middle Power LED

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Typical Electro-Optical Characteristics Curves

25 35 45 55 65 75 85 95 105 115

0.0

0.2

0.4

0.6

0.8

1.0

1.2

Tj - Junction

Temperature(

o

C

)

Relative Luminous Flux

1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10 2.15 2.20 2.25 2.30

0

15

30

45

60

75

90

105

120

135

150

TS=25

o

C

IF-Forward Current(mA)

VF- Forward V oltage (V)

0 102030405060708090100

0

20

40

60

80

100

120

140

160

180

Forward Current (mA)

S olde r in g Temp e ra t u re

(

oC

)

0.7

0.8

0.9

1.0

0.10.30.5 0.2 0.4

80°

90°

0.6

50°

60°

70°

40°

20°0° 10°

30°

Fig.3 - Relative Luminous Intensity vs.

Junction Temperature

Fig.4 - Forward Current vs. Forward

Voltage

Fig.5 – Max. Driving Forward Current vs.

Sol

d

ering Temperatu r e

Rth

j

-s=50

。

C/W

Fig.6 – Radiation Diagram

DATASHEET

SMD  Middle Power LED

67-21S/NR3C-D1530L6M41829Z15/2T

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Package Dimension

Note:

Tolerance unless mentioned is ±0.1 mm; Unit = mm

DATASHEET

SMD  Middle Power LED

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Moisture Resistant Packing Materials

Label Explanation

‧CPN: Customer’s Product Number

‧P/N: Product Number

‧QTY: Packing Quantity

‧CAT: Luminous Intensity Rank

‧HUE: Dom. Wavelength Rank

‧REF: Forward Voltage Rank

‧LOT No: Lot Number

Reel Dimensions

Note:

Tolerances unless mentioned ±0.1mm. Unit = mm

DATASHEET

SMD  Middle Power LED

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Carrier Tape Dimensions: Loaded Quantity 4000 pcs. Per Reel

1.5+0.1

Progressive direction

Note:

Tolerance unless mentioned is ±0.1mm; Unit = mm

Moisture Resistant Packing Process

Label Aluminum moisture-proof bag Desiccant Label

DATASHEET

SMD  Middle Power LED

67-21S/NR3C-D1530L6M41829Z15/2T

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Reliability Test Items and Conditions

The reliability of products shall be satisfied with items listed below.

Confidence level：90%

LTPD：10%

No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re

1 Reflow Soldering

Temp. : 260℃/10sec. 6 Min. 22 PCS. 0/1

2 Thermal Shock

H : +100℃ 20min

∫ 10 sec

L : -10℃ 20min

200 Cycles 22 PCS. 0/1

3 Temperature Cycle

H : +100℃ 30min

∫ 5 min

L : -40℃ 30min

200 Cycles 22 PCS. 0/1

4 High Temperature/Humidity

Storage Ta=85℃,85%RH 1000 Hrs. 22 PCS. 0/1

5 High Temperature/Humidity

Operation

Ta= 85℃,85%RH,

IF = 90mA 1000 Hrs. 22 PCS. 0/1

6 Low Temperature Storage Ta= -4 0℃ 1000 Hrs. 22 PCS. 0/1

7 High Temperature Storage Ta= 85℃ 1000 Hrs. 22 PCS. 0/1

8 Low Temperature

Operation Life

Ta= -4 0℃,

IF = 180 mA 1000 Hrs. 22 PCS. 0/1

9 High Temperature

Operation/ Life#1

Ta= 25℃,

IF = 180 mA 1000 Hrs. 22 PCS. 0/1

10 High Temperature

Operation/ Life#2

Ta= 55℃,

IF =180mA 1000 Hrs. 22 PCS. 0/1

11 High Temperature

Operation/ Life#3

Ta= 85℃,

IF = 90 mA 1000 Hrs. 22 PCS. 0/1

DATASHEET

SMD  Middle Power LED

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Precautions for Use

1. Over-current-proof

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will

happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 After opening the package: The LED's floor life is 168 Hrs under 30℃ or less and 60% RH or less. If unused LEDs

remain, it should be stored in moisture proof packages.

2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking

treatment should be performed using the following conditions.

Baking treatment: 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile

260 Max.

10sec. Max.

6 C/sec.Max.

Above255 C

30sec.Max.

C

Above 217

60~150 sec.

3 C/sec.Max.

Pre-heating

150~200 C

60~120sec.

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the

soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful

because the damage of the product is often started at the time of the hand solder.

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering

iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or

will not be damaged by repairing.