1Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
I/O0–I/O7
I/O BUFFERS
CE, OE LOGIC SENSE
AMP
DATA
LATCH
ERASE V OL TA GE
SWITCH
PROGRAM V OLTA GE
SWITCH
COMMAND
REGISTER
CE
OE
WE
V OL TA GE VERIFY
SWITCH
ADDRESS LATCH
Y-DECODER
X-DECODER
Y-GATING
524,288 BIT
MEMORY
ARRAY
A0–A15
BLOCK DIAGRAM
DESCRIPTION
The CAT28F512 is a high speed 64K x 8-bit electrically
erasable and reprogrammable Flash memory ideally
suited for applications requiring in-system or after-sale
code updates. Electrical erasure of the full memory
contents is achieved typically within 0.5 second.
It is pin and Read timing compatible with standard
EPROM and EEPROM devices. Programming and Erase
are performed through an operation and verify algo-
rithm. The instructions are input via the I/O bus, using a
two write cycle scheme. Address and Data are latched
to free the I/O bus and address bus during the write
operation.
The CAT28F512 is manufactured using Catalyst’s ad-
vanced CMOS floating gate technology. It is designed
to endure 100,000 program/erase cycles and has a data
retention of 10 years. The device is available in JEDEC
approved 32-pin plastic DIP, 32-pin PLCC or 32-pin
TSOP packages.
FEATURES
Fast Read Access Time: 90/120/150 ns
Low Power CMOS Dissipation:
–Active: 30 mA max (CMOS/TTL levels)
–Standby: 1 mA max (TTL levels)
–Standby: 100 µA max (CMOS levels)
High Speed Programming:
–10 µs per byte
–1 Sec Typ Chip Program
12.0V ± 5% Programming and Erase Voltage
Electronic Signature
Commercial, Industrial and Automotive
Temperature Ranges
Stop Timer for Program/Erase
On-Chip Address and Data Latches
JEDEC Standard Pinouts:
–32-pin DIP
–32-pin PLCC
–32-pin TSOP ( 8 x 20)
100,000 Program/Erase Cycles
10 Year Data Retention
"Green" Package Options Available
512K-Bit CMOS Flash Memory Licensed Intel
second source
CAT28F512
CAT28F512
2
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
A3
A4
A5
A6
A7
A12
A15
NC
VPP
VCC
WE
NC
A14
A13
A8
A9
A11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
A3A4
A5
A6
A7
A12
A15
NC
VPP
VCC
WE
NC
A14
A13
A8
A9
A11
I/O0
I/O1
I/O2
VSS
I/O6
I/O5
I/O4
I/O3
13
14
15
16
20
19
18
17
9
10
11
12
24
23
22
21
A3
A2
A1
A0
OE
A10
CE
I/O7
A7
A6
A5
A4
5
6
7
8
1
2
3
4
VPP
NC
A15
A12 A13
A8
A9
A11
28
27
26
25
32
31
30
29
VCC
WE
N/C
A14
A7
A6
A5
A4
5
6
7
8
A3
A2
A1
A0
9
10
11
12
I/O013
A14
A13
A8
A9
29
28
27
26 A11
OE
A10
CE
25
24
23
22 I/O7
21
I/O1
I/O2
VSS
I/O3
I/O4
I/O5
I/O6
14 15 16 17 18 19 20
4321323130
A12
A15
NC
VPP
VCC
WE
N/C
PIN CONFIGURATION
28F512 F03
TSOP Package (Reverse Pinout) (TR, HR)
PIN FUNCTIONS
Pin Name Type Function
A0–A15 Input Address Inputs for
memory addressing
I/O0–I/O7I/O Data Input/Output
CE Input Chip Enable
OE Input Output Enable
WE Input Write Enable
VCC Voltage Supply
VSS Ground
VPP Program/Erase
Voltage Supply
28F512 F01
DIP Package (L) PLCC Package (N, G)
TSOP Package (Standard Pinout 8mm x 20mm) (T, H)
CAT28F512
3Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –45°C to +130°C
Storage Temperature....................... –65°C to +150°C
Voltage on Any Pin with
Respect to Ground(1) ........... –2.0V to +VCC + 2.0V
Voltage on Pin A9 with
Respect to Ground(1) ................... –2.0V to +13.5V
VPP with Respect to Ground
during Program/Erase(1) .............. –2.0V to +14.0V
VCC with Respect to Ground(1) ............ –2.0V to +7.0V
Package Power Dissipation
Capability (TA = 25°C).................................. 1.0 W
Lead Soldering Temperature (10 secs)............ 300°C
Output Short Circuit Current(2) ........................ 100 mA
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Test Method
NEND(3) Endurance 100K Cycles/Byte MIL-STD-883, Test Method 1033
TDR(3) Data Retention 10 Years MIL-STD-883, Test Method 1008
VZAP(3) ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
ILTH(3)(4) Latch-Up 100 mA JEDEC Standard 17
CAPACITANCE TA = 25°C, f = 1.0 MHz
Limits
Symbol Test Min Max. Units Conditions
CIN(3) Input Pin Capacitance 6 pF VIN = 0V
COUT(3) Output Pin Capacitance 10 pF VOUT = 0V
CVPP(3) VPP Supply Capacitance 25 pF VPP = 0V
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC + 2.0V for periods of less than 20ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of
the device at these or any other conditions outside of those
listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for
extended periods may affect device performance and
reliability.
CAT28F512
4
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
D.C. OPERATING CHARACTERISTICS
VCC = +5V ±10%, unless otherwise specified.
Limits
Symbol Parameter Min. Max. Unit Test Conditions
ILI Input Leakage Current ±1µAV
IN = VCC or VSS
VCC = 5.5V, OE = VIH
ILO Output Leakage Current ±1µAV
OUT = VCC or VSS,
VCC = 5.5V, OE = VIH
ISB1 VCC Standby Current CMOS 100 µACE = VCC ±0.5V,
VCC = 5.5V
ISB2 VCC Standby Current TTL 1 mA CE = VIH, VCC = 5.5V
ICC1 VCC Active Read Current 30 mA VCC = 5.5V, CE = VIL,
IOUT = 0mA, f = 6 MHz
ICC2(1) VCC Programming Current 15 mA VCC = 5.5V,
Programming in Progress
ICC3(1) VCC Erase Current 15 mA VCC = 5.5V,
Erasure in Progress
ICC4(1) VCC Prog./Erase Verify Current 15 mA VCC = 5.5V, Program or
Erase Verify in Progress
IPPS VPP Standby Current ±10 µAV
PP = VPPL
IPP1 VPP Read Current 200 µAV
PP = VPPH
IPP2(1) VPP Programming Current 30 mA VPP = VPPH,
Programming in Progress
IPP3(1) VPP Erase Current 30 mA VPP = VPPH,
Erasure in Progress
IPP4(1) VPP Prog./Erase Verify Current 5 mA VPP = VPPH, Program or
Erase Verify in Progress
VIL Input Low Level TTL –0.5 0.8 V
VILC Input Low Level CMOS –0.5 0.8 V
VOL Output Low Level 0.45 V IOL = 5.8mA, VCC = 4.5V
VIH Input High Level TTL 2 VCC+0.5 V
VIHC Input High Level CMOS VCC*0.7 VCC+0.5 V
VOH1 Output High Level TTL 2.4 V IOH = –2.5mA, VCC = 4.5V
VOH2 Output High Level CMOS VCC–0.4 V IOH = –400µA, VCC = 4.5V
VID A9 Signature Voltage 11.4 13 V A9 = VID
IID(1) A9 Signature Current 200 µAA
9 = VID
VLO VCC Erase/Prog. Lockout Voltage 2.5 V
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
CAT28F512
5Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
SUPPLY CHARACTERISTICS
Limits
Symbol Parameter Min Max. Unit
VCC VCC Supply Voltage 4.5 5.5 V
VPPL VPP During Read Operations 0 6.5 V
VPPH VPP During Read/Erase/Program 11.4 12.6 V
Note:
(1) This parameter is tested initially and after a design or process change that affects the parameter.
(2) Output floating (High-Z) is defined as the state where the external data line is no longer driven by the output buffer.
(3) Input Rise and Fall Times (10% to 90%) < 10 ns.
(4) Input Pulse Levels = 0.45V and 2.4V.
(5) Input and Output Timing Reference = 0.8V and 2.0V.
(6) Low-Z is defined as the state where the external data may be driven by the output buffer but may not be valid.
1.3V
DEVICE
UNDER
TEST
1N914
3.3K
CL = 100 pF
OUT
CL INCLUDES JIG CAPACITANCE
A.C. CHARACTERISTICS, Read Operation
VCC = +5V ±10%, unless otherwise specified.
JEDEC Standard 28F512-90 28F512-12 28F512-15
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tAVAV tRC Read Cycle Time 90 120 150 ns
tELQV tCE CE Access Time 90 120 150 ns
tAVQV tACC Address Access Time 90 120 150 ns
tGLQV tOE OE Access Time 35 50 55 ns
tAXQX tOH Output Hold from Address OE/CE Change 0 0 0 ns
tGLQX tOLZ(1)(6) OE to Output in Low-Z 0 0 0 ns
tELQX tLZ(1)(6) CE to Output in Low-Z 0 0 0 ns
tGHQZ tDF(1)(2) OE High to Output High-Z 20 30 35 ns
tEHQZ tDF(1)(2) CE High to Output High-Z 30 40 45 ns
tWHGL(1) - Write Recovery Time Before Read 6 6 6 µs
INPUT PULSE LEVELS REFERENCE POINTS
2.0 V
0.8 V
2.4 V
0.45 V
Figure 1. A.C. Testing Input/Output Waveform(3)(4)(5)
Figure 2. A.C. Testing Load Circuit (example)
CAT28F512
6
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
A.C. CHARACTERISTICS, Program/Erase Operation
VCC = +5V ±10%, unless otherwise specified.
JEDEC
Standard
28F512-90 28F512-12 28F512-15
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tAVAV tWC Write Cycle Time 90 120 150 ns
tAVWL tAS Address Setup Time 0 0 0 ns
tWLAX tAH Address Hold Time 40 40 40 ns
tDVWH tDS Data Setup Time 40 40 40 ns
tWHDX tDH Data Hold Time 10 10 10 ns
tELWL tCS CE Setup Time 0 0 0 ns
tWHEH tCH CE Hold Time 0 0 0 ns
tWLWH tWP WE Pulse Width 40 40 40 ns
tWHWL tWPH WE High Pulse Width 20 20 20 ns
tWHWH1(2) - Program Pulse Width 10 10 10 µs
tWHWH2(2) - Erase Pulse Width 9.5 9.5 9.5 ms
tWHGL - Write Recovery Time Before Read 6 6 6 µs
tGHWL - Read Recovery Time Before Write 0 0 0 µs
tVPEL -V
PP Setup Time to CE 100 100 100 ns
ERASE AND PROGRAMMING PERFORMANCE(1)
28F512-90 28F512-12 28F512-15
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit
Chip Erase Time(3)(5) 0.5 10 0.5 10 0.5 10 sec
Chip Program Time(3)(4) 16 16 16sec
Note:
(1) Please refer to Supply characteristics for the value of VPPH and VPPL. The VPP supply can be either hardwired or switched. If VPP is switched,
VPPL can be ground, less than VCC + 2.0V or a no connect with a resistor tied to ground.
(2) Program and Erase operations are controlled by internal stop timers.
(3) ‘Typicals’ are not guaranteed, but based on characterization data. Data taken at 25°C, 12.0V VPP.
(4) Minimum byte programming time (excluding system overhead) is 16 µs (10 µs program + 6 µs write recovery), while maximum is 400 µs/
byte (16 µs x 25 loops). Max chip programming time is specified lower than the worst case allowed by the programming algorithm since
most bytes program significantly faster than the worst case byte.
(5) Excludes 00H Programming prior to Erasure.
CAT28F512
7Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
FUNCTION TABLE(1)
Pins
Mode CE OE WE VPP I/O Notes
Read VIL VIL VIH VPPL DOUT
Output Disable VIL VIH VIH X High-Z
Standby VIH XXV
PPL High-Z
Signature (MFG) VIL VIL VIH X 31H A0 = VIL, A9 = 12V
Signature (Device) VIL VIL VIH X B8H A0 = VIH, A9 = 12V
Program/Erase VIL VIH VIL VPPH DIN See Command Table
Write Cycle VIL VIH VIL VPPH DIN During Write Cycle
Read Cycle VIL VIL VIH VPPH DOUT During Write Cycle
WRITE COMMAND TABLE
Commands are written into the command register in one or two write cycles. The command register can be altered
only when VPP is high and the instruction byte is latched on the rising edge of WE. Write cycles also internally latch
addresses and data required for programming and erase operations.
Pins
First Bus Cycle Second Bus Cycle
Mode Operation Address DIN Operation Address DIN DOUT
Set Read Write X 00H Read AIN DOUT
Read Sig. (MFG) Write X 90H Read 00 31H
Read Sig. (Device) Write X 90H Read 01 B8H
Erase Write X 20H Write X 20H
Erase Verify Write AIN A0H Read X DOUT
Program Write X 40H Write AIN DIN
Program Verify Write X C0H Read X DOUT
Reset Write X FFH Write X FFH
Note:
(1) Logic Levels: X = Logic ‘Do not care’ (VIH, VIL, VPPL, VPPH)
CAT28F512
8
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
ADDRESSES
CE (E)
OE (G)
WE (W)
DATA (I/O) HIGH-Z
POWER UP ST ANDBY DEVICE AND
ADDRESS SELECTION OUPUTS
ENABLED D A TA VALID ST ANDBY
ADDRESS STABLE
OUTPUT VALID
tAVQV (tACC)
tELQX (tLZ)
tGLQX (tOLZ)
tGLQV (tOE)
tELQV (tCE)tAXQX (tOH)
tGHQZ (tDF)
tEHQZ (tDF)
tAVAV (tRC)
POWER DOWN
HIGH-Z
tWHGL
READ OPERATIONS
Read Mode
A Read operation is performed with both CE and OE low
and with WE high. VPP can be either high or low,
however, if VPP is high, the Set READ command has to
be sent before reading data (see Write Operations). The
data retrieved from the I/O pins reflects the contents of
the memory location corresponding to the state of the 16
address pins. The respective timing waveforms for the
read operation are shown in Figure 3. Refer to the AC
Read characteristics for specific timing parameters.
Signature Mode
The signature mode allows the user to identify the IC
manufacturer and the type of device while the device
resides in the target system. This mode can be activated
in either of two ways; through the conventional method
of applying a high voltage (12V) to address pin A9 or by
sending an instruction to the command register (see
Write Operations).
The conventional mode is entered as a regular READ
mode by driving the CE and OE pins low (with WE high),
and applying the required high voltage on address pin A9
while all other address lines are held at VIL.
A Read cycle from address 0000H retrieves the binary
code for the IC manufacturer on outputs I/O0 to I/O7:
CATALYST Code = 00110001 (31H)
A Read cycle from address 0001H retrieves the binary
code for the device on outputs I/O0 to I/O7.
28F512 Code = 1011 1000 (B8H)
Standby Mode
With CE at a logic-high level, the CAT28F512 is placed
in a standby mode where most of the device circuitry is
disabled, thereby substantially reducing power con-
sumption. The outputs are placed in a high-impedance
state.
Figure 3. A.C. Timing for Read Operation
CAT28F512
9Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
ADDRESSES
CE (E)
OE (G)
WE (W)
DATA (I/O)
VCC
VPP
tWC tWC tRC
tCS
tCH tCS
tCH tCH tEHQZ
tDF
tGHWL
tWPH tWHWH2 tWHGL
tWP
tDS
HIGH-Z DATA IN
= 20H DATA IN
= A0H VALID
DATA OUT
tDH tWP tDH
tDS tDS
tWP tDH tOLZ
tOE tOH
tLZ
tCE
tVPEL
VPPH
VPPL
0V
5.0V
VCC POWER-UP
& STANDBY SETUP ERASE
COMMAND ERASE
COMMAND ERASING ERASE VERIFY
COMMAND ERASE
VERIFICATION VCC POWER-DOWN/
STANDBY
tAS tAH
DATA IN
= 20H
tWC
WRITE OPERATIONS
The following operations are initiated by observing the
sequence specified in the Write Command Table.
Read Mode
The device can be put into a standard READ mode by
initiating a write cycle with 00H on the data bus. The
subsequent read cycles will be performed similar to a
standard EPROM or EEPROM Read.
Signature Mode
An alternative method for reading device signature (see
Read Operations Signature Mode), is initiated by writing
the code 90H into the command register while keeping
VPP high. A read cycle from address 0000H with CE and
OE low (and WE high) will output the device signature.
CATALYST Code = 00110001 (31H)
A Read cycle from address 0001H retrieves the binary
code for the device on outputs I/O0 to I/O7.
28F512 Code = 1011 1000 (B8H)
Figure 4. A.C. Timing for Erase Operation
Erase Mode
During the first Write cycle, the command 20H is written
into the command register. In order to commence the
erase operation, the identical command of 20H has to be
written again into the register. This two-step process
ensures against accidental erasure of the memory con-
tents. The final erase cycle will be stopped at the rising
edge of WE, at which time the Erase Verify command
(A0H) is sent to the command register. During this cycle,
the address to be verified is sent to the address bus and
latched when WE goes low. An integrated stop timer
allows for automatic timing control over this operation,
eliminating the need for a maximum erase timing speci-
fication. Refer to AC Characteristics (Program/Erase)
for specific timing parameters.
CAT28F512
10
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
Figure 5. Chip Erase Algorithm(1)
Note:
(1) The algorithm MUST BE FOLLOWED to ensure proper and reliable operation of the device.
40H;
START ERASURE
APPLY VPPH
INITIALIZE
ADDRESS
INITIALIZE
PLSCNT = 0
WRITE ERASE
SETUP COMMAND
WRITE ERASE
COMMAND
TIME OUT 10ms
WRITE ERASE
VERIFY COMMAND
TIME OUT 6µs
READ DATA
FROM DEVICE
DATA =
FFH?
LAST
ADDRESS?
WRITE READ
COMMAND
APPLY VPPL
ERASURE
COMPLETED
APPLY VPPL
ERASE
ERROR
INCREMENT
ADDRESS
INC PLSCNT
= 3000 ?
NO
NO
NO
YES
YES
YES
PROGRAM ALL
BYTES TO 00H STANDBY
VPP RAMPS TO VPPH
(OR VPP HARDWIRED)
BUS
OPERATION COMMAND COMMENTS
READ
STANDBY
WRITE
STANDBY
ERASE
ERASE
VERIFY
READ
INITIALIZE ADDRESS
ALL BYTES SHALL BE
PROGRAMMED TO 00
BEFORE AN ERASE
OPERATION
PLSCNT = PULSE COUNT
ACTUAL ERASE
NEEDS 10ms PULSE,
DATA = 20H
WAIT
ADDRESS = BYTE T O VERIFY
DATA = 20H;
STOPS ERASE OPERATION
READ BYTE TO
VERIFY ERASURE
DA TA = 00H
RESETS THE REGISTER
FOR READ OPERA TION
VPP RAMPS TO VPPL
(OR VPP HARDWIRED)
WRITE
WRITE
WRITE
ERASE
WAIT
COMPARE OUTPUT TO FF
INCREMENT PULSE COUNT
DATA = 20H
DATA = 20H
A0H
1000
CAT28F512
11 Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
ADDRESSES
CE (E)
OE (G)
WE (W)
DATA (I/O)
VCC
VPP
tWC tWC tRC
tAS tAH
tCS
tCH tCS
tCH tCH tEHQZ
tDF
tGHWL
tWPH tWHWH1 tWHGL
tWP
tDS
HIGH-Z DATA IN
= 40H DATA IN DATA IN
= C0H VALID
DATA OUT
tDH tWP tDH
tDS tDS
tWP tDH tOLZ
tOE tOH
tLZ
tCE
tVPEL
VPPH
VPPL
0V
5.0V
VCC POWER-UP
& STANDBY SETUP PROGRAM
COMMAND LA TCH ADDRESS
& DATA PROGRAMMING
PROGRAM
VERIFY
COMMAND
PROGRAM
VERIFICATION VCC POWER-DOWN/
STANDBY
Erase-Verify Mode
The Erase-verify operation is performed on every byte
after each erase pulse to verify that the bits have been
erased.
Programming Mode
The programming operation is initiated using the pro-
gramming algorithm of Figure 7. During the first write
cycle, the command 40H is written into the command
register. During the second write cycle, the address of
the memory location to be programmed is latched on the
falling edge of WE, while the data is latched on the rising
edge of WE. The program operation terminates with the
next rising edge of WE. An integrated stop timer allows
for automatic timing control over this operation, eliminat-
ing the need for a maximum program timing specifica-
tion. Refer to AC Characteristics (Program/Erase) for
specific timing parameters.
Figure 6. A.C. Timing for Programming Operation
Program-Verify Mode
A Program-verify cycle is performed to ensure that all
bits have been correctly programmed following each
byte programming operation. The specific address is
already latched from the write cycle just completed, and
stays latched until the verify is completed. The Program-
verify operation is initiated by writing C0H into the
command register. An internal reference generates the
necessary high voltages so that the user does not need
to modify VCC. Refer to AC Characteristics (Program/
Erase) for specific timing parameters.
CAT28F512
12
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
START
PROGRAMMING
APPL Y VPPH
INITIALIZE
ADDRESS
PLSCNT = 0
WRITE SETUP
PROG. COMMAND
WRITE PROG. CMD
ADDR AND DATA
TIME OUT 10µs
WRITE PROGRAM
VERIFY COMMAND
TIME OUT 6µs
READ DATA
FROM DEVICE
VERIFY
DATA ?
LAST
ADDRESS?
WRITE READ
COMMAND
APPL Y VPPL
PROGRAMMING
COMPLETED
APPL Y VPPL
PROGRAM
ERROR
INCREMENT
ADDRESS
INC
PLSCNT
= 25 ?
NO
NO
NO
YES
YES
YES
STANDBY
WRITE
SETUP
VPP RAMPS TO VPPH
(OR VPP HARDWIRED)
BUS
OPERATION COMMAND COMMENTS
1ST WRITE
CYCLE
2ND WRITE
CYCLE
1ST WRITE
CYCLE
READ
STANDBY
1ST WRITE
CYCLE
STANDBY
PROGRAM
PROGRAM
VERIFY
READ
INITIALIZE ADDRESS
INITIALIZE PULSE COUNT
PLSCNT = PULSE COUNT
DATA = 40H
V ALID ADDRESS AND DA T A
WAIT
READ BYTE TO VERIFY
PROGRAMMING
COMPARE DATA OUTPUT
TO DATA EXPECTED
D A TA = 00H
SETS THE REGISTER FOR
READ OPERA TION
VPP RAMPS TO VPPL
(OR VPP HARDWIRED)
WAIT
DATA = C0H
Figure 7. Programming Algorithm(1)
Note:
(1) The algorithm MUST BE FOLLOWED to ensure proper and reliable operation of the device.
CAT28F512
13 Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
ADDRESSES
WE (E)
OE (G)
CE (W)
DATA (I/O)
VCC
VPP
tWC tWC tRC
tAVEL tELAX
tWLEL
tWLEL tEHQZ
tDF
tGHEL tEHEL tEHEH tEHGL
tELEH
HIGH-Z DATA IN
= 40H DATA IN DATA IN
= C0H VALID
DATA OUT
tEHDX
tOLZ
tOE tOH
tLZ
tCE
tVPEL
VPPH
VPPL
0V
5.0V
VCC POWER-UP
& STANDBY SETUP PROGRAM
COMMAND LA TCH ADDRESS
& DATA PROGRAMMING
PROGRAM
VERIFY
COMMAND
PROGRAM
VERIFICATION VCC POWER-DOWN/
STANDBY
tWLEL
tEHWH
tEHWH tEHWH
tELEH
tDVEH tDVEH tDVEH
tEHDX
tEHDX
Abort/Reset
An Abort/Reset command is available to allow the user
to safely abort an erase or program sequence. Two
consecutive program cycles with FFH on the data bus
will abort an erase or a program operation. The abort/
reset operation can interrupt at any time in a program or
erase operation and the device is reset to the Read
Mode.
Figure 8. Alternate A.C. Timing for Program Operation
POWER UP/DOWN PROTECTION
The CAT28F512 offers protection against inadvertent
programming during VPP and VCC power transitions.
When powering up the device there is no power-on
sequencing necessary. In other words, VPP and VCC
may power up in any order. Additionally VPP may be
hardwired to VPPH independent of the state of VCC and
any power up/down cycling. The internal command
register of the CAT28F512 is reset to the Read Mode on
power up.
POWER SUPPLY DECOUPLING
To reduce the effect of transient power supply voltage
spikes, it is good practice to use a 0.1µF ceramic
capacitor between VCC and VSS and VPP and VSS. These
high-frequency capacitors should be placed as close as
possible to the device for optimum decoupling.
CAT28F512
14
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
ALTERNATE CECE
CECE
CE-CONTROLLED WRITES
JEDEC Standard 28F512-90 28F512-12 28F512-15
Symbol Symbol Parameter Min. Max. Min. Max. Min. Max. Unit
tAVAV tWC Write Cycle Time 90 120 120 ns
tAVEL tAS Address Setup Time 0 0 0 ns
tELAX tAH Address Hold Time 40 40 40 ns
tDVEH tDS Data Setup Time 40 40 40 ns
tEHDX tDH Data Hold Time 10 10 10 ns
tEHGL - Write Recovery Time Before Read 6 6 6 µs
tGHEL - Read Recovery Time Before Write 0 0 0 µs
tWLEL tWS WE Setup Time Before CE 000ns
tEHWH -WE Hold Time After CE 000ns
tELEH tCP Write Pulse Width 40 40 40 ns
tEHEL tCPH Write Pulse Width High 20 20 20 ns
tVPEL -V
PP Setup Time to CE Low 100 100 100 ns
CAT28F512
15 Doc. No. MD-1084, Rev. K
© 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
EXAMPLE OF ORDERING INFORMATION(1)
Prefix Device # Suffix
28F512 N IT
Product
Number Temperature Range
Blank = Commercial (0˚C to +70˚C)
I = Industrial (-40˚C to +85˚C)
A = Automotive (-40˚C to +105˚C)
(3)
Tape & Reel
T: 500/Reel
Package
N: PLCC
(2)
T: TSOP (8mmx20mm)
(2)
TR: TSOP (Reverse Pinout)
(2)
Speed
90: 90ns
12: 120ns
15: 150ns
-90CAT
Optional
Company ID
G: PLCC (Lead free, Halogen free)
L: PDIP (Lead free, Halogen free)
H: TSOP (Lead free, Halogen free)
HR: TSOP (Reverse Pinout)
(Lead free, Halogen free)
ORDERING INFORMATION
Notes:
(1) The device used in the above example is a CAT28F512NI-90T (PLCC, Industrial Temperature, 90ns Access Time, Tape & Reel).
(2) Solder-plate (tin-lead) packages, contact Factory for availability.
(3) -40°C to +125°C is available upon request.
srebmuNtraPelbaredrO )seciveDeerF-bProf(
T21-AG215F82TACT21-ARH215F82TAC
T51-AG215F82TACT51-ARH215F82TAC
T09-AG215F82TACT09-ARH215F82TAC
T21-IG215F82TACT21-IRH215F82TAC
T51-IG215F82TACT51-IRH215F82TAC
T09-IG215F82TACT09-IRH215F82TAC
T21-AH215F82TAC21AL215F82TAC
T51-AH215F82TAC51AL215F82TAC
T09-AH215F82TAC09AL215F82TAC
T21-IH215F82TAC21IL215F82TAC
T51-IH215F82TAC51IL215F82TAC
T09-IH215F82TAC09IL215F82TAC
CAT28F512
16
Doc. No. MD-1084, Rev. K © 2009 SCILLC. All rights reserved.
Characteristics subject to change without notice
REVISION HISTORY
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ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to
any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
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