STF202-22T1 - ON Semiconductor - Datasheet.Directory

December, 2010 − Rev. 8

1Publication Order Number:

STF202−22T1/D

STF202-22T1G

USB Filter with ESD

Protection

This device is designed for applications requiring Line

Termination, EMI Filtering and ESD Protection. It is intended for

use in upstream USB ports, Cellular phones, Wireless equipment and

computer applications. This device offers an integrated solution in a

small package (TSOP−6, Case 318G) reducing PCB space and cost.

Features:

•Provides USB Line Termination, Filtering and ESD Protection

•Single IC Offers Cost Savings by Replacing 3 Resistors,

2 Capacitors, and 5 TVs diodes

•Bi−directional EMI Filtering Prevents Noise from Entering/Leaving

the System

•IEC61000−4−2 ESD Protection for USB Port

•Flexible Pull−down or Pull−up Line Termination to Meet USB 1.1

Low Speed and High Speed Specification

•ESD Ratings: Machine Model = C

ESD Ratings: Human Body Model = 3B

•Pb−Free Package is Available

Benefits:

•TSOP−6 Package Minimizes PCB Space

•Integrated Circuit Increases System Reliability versus Discrete

Component Implementation

•TVs Devices Provide ESD Protection That is Better than a Discrete

Implementation because the Small IC minimizes Parasitic

Inductances

Typical Applications:

•USB Hubs

•Computer Peripherals Using USB

MAXIMUM RATINGS (TA = 25°C)

Rating Symbol Value Unit

Steady State Power PD225 mW

Maximum Junction Temperature TJ(max) 125 °C

Operating Temperature Range TJ−55 to +125 °C

Storage Temperature Range Tstg −55 to +125 °C

Lead Solder Temperature

(10 second duration)

TL260 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

TSOP−6

CASE 318G

STYLE 8

Device Package Shipping†

ORDERING INFORMATION

STF202−22T1 TSOP−6 3000/Tape & Reel

CIRCUIT DESCRIPTION

S22 MG

MARKING DIAGRAM

132

123

S22 = Specific Device Code

M = Date Code

G= Pb−Free Package

654

123

CRs1

Rup

CRs2

GND D(OUT) D(OUT)

VBUS D(IN) D(IN)

http://onsemi.com

(Note: Microdot may be in either location)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

STF202−22T1G TSOP−6

(Pb−Free)

3000/Tape & Reel

STF202−22T1G

http://onsemi.com

ELECTRICAL CHARACTERISTICS (TA = 25°C)

Device

Marking

VRWM

(Volts)

VBR @

1 mA

(Volts)

Max IR

@ VRWM

= 5.25 V

VBUS to

GND

(mA)

Max IR

@ VRWM

= 3.3 V

I/O Pin

(mA)

Typical Line

Capacitance

(pF)

(Notes 2, 3)

Series Resistor

RS (W) (Note 1)

Pull−up Resistor

Rup (kW)

Min Max Min Nom Max Min Nom Max

STF202−22T1G S22 5.25 6.0 8.0 5.0 1.0 68 20 22 24 1.35 1.5 1.65

1. For other RS values (i.e. RS = 30 W) contact your local ON Semiconductor sales representative.

2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.

3. For other capacitance values contact your local ON Semiconductor sales representative.

TYPICAL CHARACTERISTICS

Figure 1. Analog Cross−talk (D+ to D−) Figure 2. Insertion Loss Characteristics

0.1 1 100010 100

P = −25 dBm

Vdc = 0 V

(MHz)

−90

−80

−70

−60

−50

−40

−30

−20

−10

(dB)

0.1 1 100010 100

(MHz)

−50

−40

−30

−20

−10

(dB)

P = −25 dBm

Vdc = 0 V

Figure 3. RS versus Temperature Figure 4. Ru

versus Temperature

−30 0 10

TARGET

TEMPERATURE (°C)

21.0

21.2

21.4

21.6

21.8

22.0

22.2

RS (Ohms)

−30 0 10

TEMPERATURE (°C)

1450

1460

1470

1480

1490

1500

1510

1520

1530

1540

Rup (Ohms)

RS− TARGET

−20 −10 20 30 40 50 60 70 80 −20 −10 20 30 40 50 60 70 80

STF202−22T1G

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APPLICATIONS BACKGROUND

What Is USB?

The USB is not a serial port, it is a serial bus, a fact that

enables a single port on the computer to be a link for a myriad

of devices, (up to 127 devices in a USB system). We can

easily chain one device to another and use one port as a

connecting point of many devices by using a hub. All these

enables us to look at the USB system as a small network of

devices.

The Universal Serial Bus (USB) makes connecting

devices to your computer faster, easier and virtually

limitless. High−Speed USB devices are capable of

communicating at speeds up to 12 megabits without shutting

down and without having to open your computer.

Figure 5. Typical USB System

SCANNER

PRINTER

HUB

MONITOR

KEYBOARD

COMPUTER PC

CPU

TELEPHONE

MOUSE

PLOTTER

Typically the USB system consists of one host, hubs and

devices.

The Host in the USB system, is responsible to the whole

complexity of the protocol (simplifies the designing of USB

devices). The host controls the media access, therefore, no

one can access the bus unless it got an approval required

from the host.

The Hub provides an interconnect point, which enables

many devices to connect to a single USB port. The logical

topology of the USB is a star structure, all the devices are

connected (logically) directly to the host. It is totally

transparent to the device what is its hub tier (the number of

hubs the data has to flow through). The hub is connected to

the USB host in the upstream direction (data flows “up” to

the host) and is connected to the USB device in the

downstream direction (data flows “down” from the host to

the device). The hub’s main functionality is the

responsibility of detecting an attachment and detachment of

devices, handling the power management for devices that

are bus−powered (get power from the bus), and

responsibility for bus error detection and recovery. Another

important role of the hub is to manage both full and low

speed devices. When a device is attached to the system the

hub detects the speed, which the device operates in, and

through the whole communication on the bus prevents from

full speed traffic to reach low speed device and vice versa −

prevent from low speed traffic to reach full speed device.

The Device is defined as everything in the USB system,

which is not a host (including hubs). A device provides one

or more USB functions. Most of the devices provide only

one function but there may be some, which provides more

than one and called compound devices. We refer to two

kinds of devices − self powered or bus powered devices. A

device that gets its power from the bus is called bus powered

and on the other hand a device which supplies its own power

is called self powered. There are two kinds of devices:

Full−speed devices − operates in 12 Mb/s

Low−speed devices that work in 1.5 Mb/s

STF202 Device Information

The Universal Serial Bus (USB) specification revision 1.1

requires EMI Filtering and line termination for the USB I/O

lines. The STF202 device from ON Semiconductor

provides upstream termination, EMI Filtering and ESD

Protection to IEC6100−4−2 (Level 4) in an integrated

solution placed in a small and single package (TSOP−6,

Case 318G). The equivalent circuit of this device is shown

in the Figure 6.

Rpu C

GROUND

RS1

RS2

Figure 6.

STF202−22T1G

http://onsemi.com

As previously mentioned, there are two types of

configurations for the USB port which are upstream and

downstream. If your port connects to the host either in a

direct way or through a hub, you are upstream (data flows

“up” to the host) and in the other hand, if you are the host or

your port provides access to the host then you are

downstream (data flows “down” from the host to the

device). In the case of the STF202 device, it provides

upstream termination. The Figure 7 represents the

termination for an upstream USB port.

Figure 7.

Rpu

VCC

The USB Line termination is reached through the series

resistors placed in the D+ and D− lines. These resistors

insure the proper termination to maintain the integrity of the

signal. The Pull up Resistor of 1.5 kW on either the D+ or D−

data lines is used to identify the equipment as either

full−speed or low−speed device.

Connection for Full−Speed

and Low−Speed Devices

As mentioned before, there are two kinds of port devices:

Full−Speed devices − operates in 12 Mb/s

Low−Speed devices that work in 1.5 Mb/s

The STF202 device can be shaped to be used for either

Full−Speed or Low−Speed devices which is achieved as

described below:

Full−Speed Devices

The Pull up resistor (Rpu) is connected to the D+ Line.

The terminal 1 is connected to the Voltage Supply Line

(VBUS) while the terminal 6 is connected to ground. The

input of the D+ line is connected in the terminal 3 which

outputs from the terminal 4. Finally, the input of the D− line

is connected in the terminal 2 which outputs from the

terminal 5. The Figure 8 shows the connections of the

STF202 device for “Full−Speed devices”.

Figure 8.

GND

D−

D+

STF202

USB

Controller

D−

D+

5 V

Peripheral

Low−Speed Devices

The Pull up resistor (Rpu) is connected to the D− Line. The

terminal 1 is connected to the Voltage Supply Line (VBUS)

while the terminal 6 is connected to ground. The input of the

D− line is connected in the terminal 3 which outputs from the

terminal 4. Finally, the input of the D+ line is connected in

the terminal 2 which outputs from the terminal 5. The Figure

9 shows the connections of the STF202 device for

“Low−Speed devices”.

Figure 9.

GND

D+

D−

STF202

USB

Controller

D+

D−

5 V

Peripheral

STF202−22T1G

http://onsemi.com

The Figure 10 describes in a simplified way what the USB

port components are. As shown in this diagram, there are

signals for upstream and downstream ports which must be

provided with Line Termination and EMI Filtering to meet

the requirements of the USB specification revision 1.1. In

addition to the Line termination and EMI Filtering, it is also

needed to protect the USB I/O Lines against ESD

conditions, so TVS devices must be added for these

purposes.

Figure 10.

XTAL1

XTAL2

DPO

DMO

VCC

GND

DP1−DP4

DM1−DM4

OC1−OC4

PWR1−PWR4

REGULATOR

POWER

SWITCHING

GND

VBUS

D−

D+

USB Data Lines

and Power to

Downstream

Ports

Upstream

Ports

CLK CRISTAL

As mentioned before, the ON Semiconductor STF202

device provides “upstream termination”, EMI Filtering and

ESD Protection to IEC6100−4−2 in an integrated solution

placed in a small and single package (TSOP−6, Case 318G).

The typical application for the STF202 device is shown in

the Figure 11.

Figure 11.

D1D+

D1D−

PWR

DOD+

DOD−

REGULATOR

TVS

VBUS

D+

D−

STF202

654

123

GND

PWR

D2D+

D2D−

TVS

POWER

SWITCH

VBUS

D+

D−

GND

DOWNSTREAM

TERMINATION

VBUS

D+

D−

GND

DOWNSTREAM

TERMINATION

USB CONTROLLER

STF202−22T1G

http://onsemi.com

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE U

STYLE 8:

PIN 1. Vbus

2. D(in)-

3. D(in)+

4. D(out)+

5. D(out)-

6. GND

ÉÉ

456

0.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM

LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D

AND E1 ARE DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX

MILLIMETERS

0.90 1.00 1.10

A1 0.01 0.06 0.10

b0.25 0.38 0.50

c0.10 0.18 0.26

D2.90 3.00 3.10

E2.50 2.75 3.00

e0.85 0.95 1.05

L0.20 0.40 0.60

0.25 BSC

−

0°10°

1.30 1.50 1.70

RECOMMENDED

NOTE 5

SEATING

PLANE

GAUGE

PLANE

DETAIL Z

0.60

3.20 0.95

0.95

PITCH

DIMENSIONS: MILLIMETERS

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

STF202−22T1/D

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P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

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For additional information, please contact your local

Sales Representative