ASMC-QAB2-TCEHE - Avago Technologies

ASMC-QxB2-Txxxx

EnvisiumTM 0.5W Power PLCC-4

Surface Mount LED Indicator

Data Sheet

EnvisiumTM

EnvisiumTM is the premier class of mid-Power LEDs using

TS AlInGaP chip technology. EnvisiumTM LEDs oﬀer unpar-

alleled performance, engineering and design ﬂexibility.

Description

The EnvisiumTM 0.5W Power PLCC-4 SMT LED is an

extension of EnvisiumTM Power PLCC-4 SMT LEDs. The

package can be driven at high current due to its superior

package design. The product is able to dissipate the heat

more eﬃciently compared to the EnvisiumTM Power PLCC-

4 SMT LEDs. These LEDs produce higher light output with

better ﬂux performance compared to the EnvisiumTM

Power PLCC-4 SMT LED.

The EnvisiumTM 0.5W Power PLCC-4 SMT LEDs are

designed for higher reliability, better performance, and

operate under a wide range of environmental conditions.

The performance characteristics of these new mid-power

LEDs make them uniquely suitable for use in harsh condi-

tions such as in automotive applications, and in electron-

ics signs and signals.

To facilitate easy pick and place assembly, the LEDs are

packed in EIA-compliant tape and reel. Every reel is

shipped in single intensity and color bin (except for red),

to provide close uniformity. These LEDs are compatible

with the IR solder reﬂow process.

EnvisiumTM 0.5W Power PLCC-4 SMT LED is available in

red orange & amber colors.

Features

x Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm)

x High reliability LED package

x Mid-Power intensity brightness with optimum ﬂux

performance using TS AllnGaP chip technologies

x Available in Red Orange and Amber colors

x High optical eﬃciency

x Available in 8mm carrier tape and 7 inch reel

x Low Thermal Resistance

x Super wide viewing angle at 120q

x Longer life time with minimum degradation due to

enhanced silicone resin material

x JEDEC MSL 2a

Applications

1. Exterior automotive

- Turn signals

- Side repeaters

- CHSML

- Rear combination lamp

- Side markers

- Truck clearance lamp

2. Electronic signs and signals

- Channel lettering

- Contour lighting

- Indoor variable message sign

3. Oﬃce automation, home appliances, industrial

equipment

- Front panel backlighting

- Push button backlighting

- Display backlighting

Note:

1. All Dimensions in millimeters.

2. Lead Polarity as shown in Figure 12.

3. Terminal Finish: Ag plating

4. Encapsulation material: Silicone resin

Figure 1. Package Drawing

Table 1. Device Selection Guide (TJ = 25 °C)

Color Part Number

Luminous Flux, IV [1] (lm)

Dice TechnologyMin. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA)

Amber ASMC-QAB2-TAC0E 4.30 6.60 9.00 150 AlInGaP

Red Orange ASMC-QHB2-TCD0E 7.00 9.30 11.50 150 AlInGaP

Notes:

1. IV is the total luminous ﬂux output as measured with an integrating sphere at mono pulse conditions.

2. Tolerance = ±12%

Part Numbering System

Component Dimensions

A S M C - Q X1 B 2 - T X2 X3 X4 X5

Packaging Option

Color Bin Selection

Max. Flux Bin

Min. Flux Bin

Color

A - Amber

H - Red Orange

3.6 ± 0.2

0.7

3.2 ± 0.2

2.8 ± 0.2

2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3

0.79 ± 0.3

CATHODE

MARKING

I 2.4

1.15 ± 0.2

0.41 (TYP.)

0.56 (TYP.)

0.97

Table 2. Absolute Maximum Ratings (TA = 25 qC)

Parameters ASMC-QxB2-Txxxx

DC Forward Current [1] 150 mA

Peak Forward Current [2] 300 mA

Power Dissipation 470 mW

Reverse Voltage 5 V

Junction Temperature 125 °C

Operating Temperature -40 °C to +100 °C

Storage Temperature -40 °C to +100 °C

Notes:

1. Derate Linearly as shown in Figure 6.

2. Duty Factor = 10%, Frequency = 1kHz

Table 3. Optical Characteristics (TJ = 25 qC)

Color

Part

Number

Dice

Technology

Dominant

Wavelength

OD [1] (nm)

Viewing Angle

2T½ [2]

(Degrees)

Luminous

Eﬃciency

Ke (lm/W)

Total Flux /

Luminous Intensity

FV (lm) / IV (cd)

Typ. Typ. Typ. Typ.

Amber ASMC-QAB2-Txxxx AlInGaP 593.5 120 17 6.5

Red Orange ASMC-QHB2-Txxxx AlInGaP 619.3 120 24 5.0

Notes:

1. The dominant wavelength, OD, is derived from the CIE Chromaticity diagram and represents the color of the device.

2. T½ is the oﬀ-axis angle where the luminous intensity is ½ the peak intensity.

Table 4. Electrical Characteristics (TJ = 25 qC)

Part Number

Forward Voltage

VF (Volts) @ IF = 150 mA

Reverse Voltage

VR @ 100PAThermal Resistance

RTJ-P (°C/W)Typ. Max. Min.

ASMC-QxB2-Txxxx 2.64 3.10 5 60

Figure 3. Forward Current Vs. Forward Voltage

Figure 4. Relative Intensity Vs. Forward Current Figure 5. Relative Intensity Vs. Temperature

Figure 2. Relative Intensity Vs. Wavelength

100

150

200

250

300

350

012345

FORWARD VOLTAGE - V

FORWARD CURRENT - mA

AlInGaP Amber

AlInGaP Red Orange

0.2

0.4

0.6

0.8

1.0

1.2

020406080100 120 140160

DC FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

(NORMALIZATION AT 150 mA)

0.2

0.4

0.6

0.8

1.2

1.4

1.6

-50-250255075100 125

JUNCTION TEMPERATURE - °C

RELATIVE LUMINOUS INTENSITY

(NORMALIZATION AT 25°C)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

380 430480 530580 630 680 730 780

WAVELENGTH - nm

RELATIVE INTENSITY

AlInGaP Amber

AlInGaP Red Orange

Figure 6a. Maximum Forward Current Vs. Ambient Temperature.

Derated Based on TJMAX = 125°C, RTJ-A=130 °C/W, 110°C/W and 100°C/W

Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.

Derated Based on TJMAX = 125°C, RTJP = 60°C/W

MAXIMUM FORWARD CURRENT - mA

100

120

140

160

020406080100 120

AMBIENT TEMPERATURE (°C)

RθJA = 100°C/W

RθJA = 110°C/W

RθJA = 130°C/W

MAXIMUM FORWARD CURRENT - mA

100

120

140

160

020406080100 120

SOLDER POINT TEMPERATURE (°C)

RθJP = 60°C/W

Figure 8. Forward Voltage Shift Vs. Temperature

Figure 9. Radiation Pattern

Figure 7. Dominant Wavelength Vs. Forward Current - AlInGaP Devices

-0.15

-0.1

-0.05

0.05

0.1

0.15

-50-250255075100

TJ - JUNCTION TEMPERATURE - °C

FORWARD VOLTAGE SHIFT - V

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

-90 -60 -300 306090

ANGULAR DISPLACEMENT - DEGREES

NORMALIZED INTENSITY

570

580

590

600

610

620

630

125102050100 150

CURRENT - mA

DOMINANT WAVELENGTH - nm

RED ORANGE

AMBER

Figure 12. Recommended Soldering Pad Pattern

Figure 10. Recommended Pick and Place Nozzle Size Figure 11. Recommended Pb-free Reﬂow Soldering Proﬁle

Note: For detail information on reﬂow soldering of Avago surface mount

LEDs, do refer to Avago Application Note AN 1060 Surface Mounting

SMT LED Indicator Components

Note: Diameter "D" should be smaller than 2.2mm

D217°C

200°C

60 - 120 SEC.

6°C/SEC. MAX.

3°C/SEC. MAX.

150°C

255 - 260°C

100 SEC. MAX.

10 to 30 SEC.

TIME

TEMPERATURE

(Acc. to J-STD-020C)

3°C/SEC. MAX.

CATHODE

MARKING

CATHODE

MARKING

A A

C C

SOLDER MASK

ANODE

CATHODE

0.4

0.3

MINIMUM 55 mm2 OF CATHODE PAD

FOR IMPROVED HEAT DISSIPATION

2.4

0.6

0.9 X 6

4.6

1.1

1.3 x 6

Figure 14. Tape Dimensions

Figure 15. Reeling Orientation

Figure 13. Tape Leader and Trailer Dimensions

200 mm MIN. FOR Ø180 REEL.

200 mm MIN. FOR Ø330 REEL.

TRAILER COMPONENTLEADER

480 mm MIN. FOR Ø180 REEL.

960 mm MIN. FOR Ø330 REEL.

USER FEED DIRECTION

3.8 ± 0.1

2.29 ± 0.1

0.229 ± 0.01

ALL DIMENSIONS IN mm.

2 ± 0.054 ± 0.1 4 ± 0.1

3.05 ± 0.1

3.5 ± 0.05

8+0.3

–0.1

1.75 ± 0.1

Ø1.5+0.1

–0

8°

Ø1+0.1

–0

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

Color Bin Select (X4)

Individual reel will contain parts from one full bin only.

0 Full Distribution

A 1 and 2 only

B 2 and 3 only

C 3 and 4 only

D 4 and 5 only

E 5 and 6 only

G 1, 2 and 3 only

H 2, 3 and 4 only

J 3, 4 and 5 only

K 4, 5 and 6 only

M 1, 2, 3 and 4 only

N 2, 3, 4 and 5 only

P 3, 4, 5 and 6 only

R 1, 2, 3, 4 and 5 only

S 2, 3, 4, 5 and 6 only

Z Special Color Bin

Color Bin Limits

Amber/Yellow Min. (nm) Max. (nm)

2 583.0 586.0

3 586.0 589.0

4 589.0 592.0

5 592.0 595.0

6 595.0 598.0

Red Orange Min. (nm) Max. (nm)

1 611.0 616.0

2 616.0 620.0

3 620.0 625.0

Tolerance of each bin limit = ±1nm

Device Color (X1)

A Amber

H Red Orange

Flux Bin Select (X2X3)

Individual reel will contain parts from one bin only

X2Min Flux Bin

X3Max Flux Bin

Flux Bin Limits

Bin ID Min. (lm) Max. (lm)

A 4.30 5.50

B 5.50 7.00

C 7.00 9.00

D 9.00 11.50

E 11.50 15.00

F 15.00 19.50

G 19.50 25.50

H 25.50 33.00

J 33.00 43.00

K 43.00 56.00

L 56.00 73.00

Tolerance of each bin limit = ± 12%

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-0397EN - September 29, 2009

Moisture Sensitivity

This product is qualiﬁed as Moisture Sensitive Level 2a

per Jedec J-STD-020. Precautions when handling this

moisture sensitive product is important to ensure the reli-

ability of the product. Do refer to Avago Application Note

AN5305 Handling of Moisture Sensitive Surface Mount

Devices for details.

A. Storage before use

- Unopen moisture barrier bag (MBB) can be stored at

<40°C/90%RH for 12 months. If the actual shelf life has

exceeded 12 months and the HIC indicates that baking

is not required, then it is safe to reﬂow the LEDs per the

original MSL rating.

- It is not recommended to open the MBB prior to

assembly (e.g. for IQC).

B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read

immediately upon opening of MBB.

- The LEDs must be kept at <30°C / 60%RH at all time

and all high temperature related process including

soldering, curing or rework need to be completed

within 672 hours.

C. Control for unﬁnished reel

- For any unuse LEDs, they need to be stored in sealed

MBB with desiccant or desiccator at <5%RH.

D. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected

to other high temperature processes, the PCB need to

be stored in sealed MBB with desiccant or desiccator

at <5%RH to ensure no LEDs have exceeded their ﬂoor

life of 672 hours.

E. Baking is required if:

- “10%” is Not blue and “5%” HIC indicator turns pink.

- The LEDs are exposed to condition of >30°C / 60% RH

at any time.

- The LEDs ﬂoor life exceeded 672 hours.

Recommended baking condition: 60±5°C for 20 hours.

Handling Precaution

The encapsulation material of the product is made of

silicone for better reliability of the product. As silicone is a

soft material, please do not press on the silicone or poke

a sharp object onto the silicone. These might damage the

product and cause premature failure. During assembly

of handling, the unit should b e held on the body only.

Please refer to Avago Application Note AN 5288 for detail

information.

Packaging Option (X5)

Option Test Current Package Type Reel Size

E 150mA Top Mount 7 Inch

VF Binning

Bin Min. Max.

2D 2.35 2.50

2E 2.50 2.65

2F 2.65 2.80

2G 2.80 2.95

2H 2.95 3.10

2J 3.10 3.25

Tolerance of each bin = ±0.1V