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DS-XAA117-R01 1
XAA117
Dual Single Pole OptoMOS® Relay
Part # Description
XAA117 8-Pin DIP (50/Tube)
XAA117S 8-Pin Surface Mount (50/Tube)
XAA117STR 8-Pin Surface Mount (1,000/Reel)
XAA117P 8-Pin Flat Pack (50/Tube)
XAA117PTR 8-Pin Flat Pack (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 60 VP
Load Current 150 mA
Max RON 16 Ω
LED Current to Operate 1 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
ILOAD
10%
90%
T
ON
T
OFF
+
+
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• 3750Vrms Input/Output Isolation
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
• Security
• Passive Infrared Detectors (PIR)
• Data Signaling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Clare's XAA117 is a dual 1-Form-A Solid State
Relay that has two independently controlled, optically
coupled MOSFET switches.
The MOSFET switches and photovoltaic die use
Clare’s patented OptoMOS® architecture to provide
3750 Vrms of input-to-output isolation. The optically
coupled output is controlled by a highly efficient
GaAIAs infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
• UL Recognized: File Number E76270
• CSA Certified: File Number LR 43639-10
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
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2
XAA117
R01
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics @ 25°C
Load Current
Continuous 1-I
L- - 150 mA
Peak t =10ms ILPK - - 400
On-Resistance IL=150mA RON -716
Ω
Off-State Leakage Current VL=60V ILEAK --1μA
Switching Speeds
Turn-On IF=5mA, VL=10V TON - 0.1 5 ms
Turn-Off TOFF - 0.5 5
Output Capacitance 50V; f=1MHz COUT -25-pF
Input Characteristics @ 25°C
Input Control Current IL=150mA IF--1mA
Input Dropout Current - - 0.05 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10μA
Common Characteristics @ 25°C
Input to Output Capacitance - CI/O -3-pF
1 If both poles operate, the load current must be derated so as not to exceed the package power dissipation value.
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate Linearly 1.33 mw/˚C
2 Derate Linearly 6.67 mw/˚C
Electrical absolute maximum ratings are at 25°C
Absolute Maximum Ratings
Electrical Characteristics
XAA117
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R01
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
35
30
25
20
15
10
5
0
1.21 1.22 1.23 1.24 1.25
LED Forward Voltage Drop (V)
Device Count (N)
XAA117
Typical LED Forward Voltage Drop
(TA=25ºC, IF=5mA)
20
15
10
5
0
On-Resistance (Ω)
Device Count (N)
o
6.8 6.9 7.17.0 7.47.2 7.3
XAA117
Typical On-Resistance Distribution
(TA=25ºC, IL=100mA)
0.06 0.08 0.100.05 0.07 0.09 0.11
LED Current (mA)
Device Count (N)
25
15
10
5
0
20
XAA117
Typical IF for Switch Operation
(TA=25ºC, IL=100mA)
75 85 95 10580 90 100
Turn-On (μs)
Device Count (N)
25
20
15
10
5
0
XAA117
Typical Turn-On Time
(TA=25ºC, IL=100mA, IF=5mA)
0.35 0.45 0.55 0.650.600.500.40
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
XAA117
Typical Turn-Off Time
(TA=25ºC, IL=100mA, IF=5mA) 35
30
25
20
15
10
5
0
84 86 88 9085 87 89
Blocking Voltage (VP)
Device Count (N)
XAA117
Typical Blocking Voltage Distribution
(TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
70
80
90
100
110
120
130
140
150
160
XAA117
Typical Load Current vs. Temperature
(IF=2mA)
Single Pole
Both Poles
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
2
4
6
8
10
12
XAA117
Typical Leakage vs. Temperature
Measured Across Pins 5-6 or 7-8
(IL=max rated)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
84
86
88
90
92
94
XAA117
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
XAA117
Typical LED Forward Voltage Drop
vs. Temperature
IF=2mA
IF=50mA
IF=20mA
IF=10mA
IF=5mA
IF=1mA
LED Forward Current (mA)
0 5 10 15 20
TON (μs)
0
200
400
600
800
1000
1200
XAA117
Typical Turn-On vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
0 5 10 15 20
TOFF (μs)
460
465
470
475
480
485
XAA117
Typical Turn-Off vs. LED Forward Current
(IL=100mA)
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4
XAA117
R01
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistence (Ω)
5
6
7
8
9
10
11
12
XAA117
Typical On-Resistance vs. Temperature
(IL=50mA, IF=1mA)
Voltage (V)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Current (mA)
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
XAA117
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On (μs)
0
100
200
300
400
500
600
XAA117
Typical Turn-On vs. Temperature
(IL=50mA)
IF=5mA
IF=1mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
TOFF (μs)
200
300
400
500
600
700
800
XAA117
Typical Turn-Off vs. Temperature
(IL=50mA)
IF=1mA & IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF (mA)
0.08
0.10
0.12
0.14
0.16
0.18
XAA117
Typical IF to Operate vs. Temperature
(IL=100mA)
Time
Load Current (A)
10μs
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100μs 100ms 1s
10ms 10s 100s
XAA117
Energy Rating Curve
XAA117
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R01
MECHANICAL DIMENSIONS
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
8-Pin DIP Through-Hole Package
7.239 TYP.
(0.285)
3.302
(0.130)
9.144 TYP.
(0.360 TYP.)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 Typ
(0.160 Typ)
0.889 ± 0.102
(0.035 ± 0.004)
PC Board Pattern
Dimensions
mm
(inches)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
8-Pin Surface Mount Package
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
8.077 ± 0.127
(0.318 ± 0.005)
4.064 Typ
(0.160 Typ)
0.889 ± 0.102
(0.035 ± 0.004)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
3.302
(0.130)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8 Pin Flatpack Package
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
8.077 ± 0.127
(0.318 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
2.159 TYP.
(0.085 TYP.)
2.286 MAX.
(0.090 MAX.)
0.203
(0.008)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 TYP.
(0.085 TYP.)
Recommended PCB Land Pattern
Dimensions
mm
(inches)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare,
Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-XAA117-R01
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
11/9/07
For additional information please visit our website at: www.clare.com
6
MECHANICAL DIMENSIONS
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
P = 12.00
(0.472)
User Direction of Feed
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
18
K1= 4.20
(0.165)
Top Cover
Tape
K0= 4.90
(0.193)
Tape and Reel Packaging for 8-Pin Surface Mount Package
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
Tape and Reel Packaging for 8 Pin Flatpack Package
User Direction of Feed
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
18
P = 12.00
(0.472)
W = 16.30 max
(0.642 max)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1= 2.00
(0.079)
Top Cover
Tape
K0= 2.70
(0.106)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
