Model X4C25J1-05G RevB Ultra Low Profile 0805 5dB Directional Coupler Description The X4C25J1-05G is a is a low cost, low profile sub-miniature high performance 5 dB directional coupler in a new easy to use, manufacturing friendly surface mount package. It is designed for 2200 - 2800MHz applications including: 5G applications. It can be used in high power applications up to 5 Watts. All of the Xinger components are constructed from ceramic filled PTFE composites, which possess excellent electrical and mechanical stability. Produced with 6 of 6 RoHS compliant ENIG finish Electrical Specifications ** Features: * 2200-2800 MHz * 5G Applications * High Power * Very Low Loss * Tight Amplitude Balance * High Isolation * Production Friendly * Tape and Reel * RoHS Compliant * Halogen Free Frequency Coupling Insertion Loss Return Loss MHz dB dB Max dB Min 2200-2800 5.0 0.5 0.5 20 Isolation Phase Balance Power dB Min Degrees Avg. CW Watts @105 C 25 90 4 5 Operating Temp. C -55 to +140 **Specification based on performance of unit properly installed on Anaren Test Board with small signal applied. *Specifications subject to change without notice. Refer to parameter definitions for details. Mechanical Outline Top View Bottom View Side View .79.08 2.04.05 1.29.05 Gnd 2 .65 5X .30 1 .22 3X .98 .15 Orientation Mark -Dimensions are in Millimeters Orientation Mark 4 3 .37 -Tolerances are Non-Cumulative Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Directional Coupler Pin Configuration The X4C25J1-05G has an orientation marker to denote Pin 1. Once port one has been identified, the other ports are known automatically. Please see the chart below for clarification: Note: The direct port has a DC connection to the input port and the coupled port has a DC connection to the isolated port. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model X4C25J1-05G RevB Insertion Loss and Power Derating Curves Insertion Loss Derating: The insertion loss, at a given frequency, of a group of couplers is measured at 25C and then averaged. The measurements are performed under small signal conditions (i.e. using a Vector Network Analyzer). The process is repeated at -55C, 105C and 140C. A best-fit line for the measured data is computed and then plotted from -55C to 140C. Power Derating: The power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. The thermal insertion loss is defined in the Power Handling section of the data sheet. As the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero. If mounting temperature is greater than 105C, Xinger coupler will perform reliably as long as the input power is derated to the curve above. Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Typical Performance (-55C, 25C, 105C, and 140C): 2000-3000 MHz USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model X4C25J1-05G RevB Typical Performance (-55C, 25C, 105 and 140C): 2000-3000 MHz Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Definition of Measured Specifications Parameter Definition VSWR (Voltage Standing Wave Ratio) The impedance match of the coupler to a 50 system. A VSWR of 1:1 is optimal. Return Loss Insertion Loss Isolation Phase Balance Coupling Group Delay USA/Canada: Toll Free: Europe: The impedance match of the coupler to a 50 system. Return Loss is an alternate means to express VSWR. The input power divided by the sum of the power at the two output ports. The input power divided by the power at the isolated port. The difference in phase angle between the two output ports. At a given frequency (n), coupling is the input power divided by the power at the coupled port. Group delay is average of group delay's from input port to the coupled port (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Mathematical Representation VSWR = Vmax Vmin Vmax = voltage maxima of a standing wave Vmin = voltage minima of a standing wave Return Loss (dB)= 20log VSWR + 1 VSWR - 1 Insertion Loss(dB)= 10log Pin Pcpl + Pdirect Isolation(dB)= 10log Pin Piso Phase at coupled port - Phase at direct port Pin (n ) P ( ) cpl n Coupling (dB) = C (n ) = 10 log Average ( GD-C) Model X4C25J1-05G RevB Notes on RF Testing and Circuit Layout: The effects of the test fixture on the measured data must be minimized in order to accurately determine the performance of the device under test. If the line impedance is anything other than 50 and/or there is a discontinuity at the microstrip to SMA interface, there will be errors in the data for the device under test. The test environment can never be "perfect", but the procedure used to build and evaluate the test boards (outlined below) demonstrates an attempt to minimize the errors associated with testing these devices. The lower the signal level that is being measured, the more impact the fixture errors will have on the data. Parameters such as Return Loss and Isolation/Directivity, which are specified as low as 27dB and typically measure at much lower levels, will present the greatest measurement challenge. Note: The S-parameter files that are available on the anaren.com website include data for frequencies that are outside of the specified band. Circuit Board Layout The dimensions for the Anaren test board are shown below. The test board is printed on Rogers RO4003 material that is 0.008" thick. Consider the case when a different material is used. First, the pad size must remain the same to accommodate the part. But, if the material thickness or dielectric constant (or both) changes, the reactance at the interface to the coupler will also change. Second, the linewidth required for 50 will be different and this will introduce a step in the line at the pad where the coupler interfaces with the printed microstrip trace. Both of these conditions will affect the performance of the part. To achieve the specified performance, serious attention must be given to the design and layout of the circuit environment in which this component will be used. If a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance that is present on the Anaren RO4003 test board. When thinner circuit board material is used, the ground plane will be closer to the pad yielding more capacitance for the same size interface pad. The same is true if the dielectric constant of the circuit board material is higher than is used on the Anaren test board. In both of these cases, narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will compensate for the extra capacitive reactance. If a thicker circuit board or one with a lower dielectric constant is used, the interface pad will have less capacitive reactance than the Anaren test board. In this case, a wider section of line before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tuned will match the performance of the Anaren test board. Notice that the board layout shown below is the same for all 0805 "J" size 2dB, 3dB, 4dB, 5dB, 3dB couplers. Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Testing Sample Parts Supplied on Anaren Test Boards If you have received a coupler installed on an Anaren produced microstrip test board, please remember to remove the loss of the test board from the measured data. The loss is small enough that it is not of concern for Return Loss and Isolation/Directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss of the coupler. An S-parameter file for a "Thru" board (see description of "Thru" board above) will be supplied upon request. As a first order approximation, one should consider the following loss estimates: Frequency Band 869-894 MHz 925-960 MHz 1805-1880 MHz 1930-1990 MHz 2110-2170 MHz 2200-2400 MHz 2500-2700 MHz 2800-3000 MHz 3000-3500 MHz 3500-4000 MHz 4000-6000 MHz 6000-8000 MHz Avg. Ins. Loss of Test Board @ 25C ~0.195 dB ~0.208 dB ~0.358 dB ~0.376 dB ~0.406 dB ~0.439 dB ~0.481 dB ~0.506 dB ~0.549 dB ~0.581 dB ~0.757 dB ~0.943 dB It is important to note that the loss of the test board will change with temperature and must be considered if the coupler is to be evaluated at other temperatures. Peak Power Handling High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown voltage of 1Kv (minimum recorded value). This voltage level corresponds to a breakdown resistance capable of handling at least 12dB peaks over average power levels, for very short durations. The breakdown location consistently occurred across the pads and the ground bar (see illustration below). The breakdown levels at these points will be affected by any contamination in the gap area around these pads. These areas must be kept clean for optimum performance. It is recommended that the user test for voltage breakdown under the maximum operating conditions and over worst case modulation induced power peaking. This evaluation should also include extreme environmental conditions (such as high humidity). Breakdown Area USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model X4C25J1-05G RevB Test Plan Xinger couplers are manufactured in large panels and then separated. All parts are RF small signal tested at room temperature. Power Handling The average power handling (total input power) of a Xinger coupler is a function of: * * * * Internal circuit temperature. Unit mounting interface temperature. Unit thermal resistance Power dissipated within the unit. All thermal calculations are based on the following assumptions: * * * * * * The unit has reached a steady state operating condition. Maximum mounting interface temperature is 105C. Conduction Heat Transfer through the mounting interface. No Convection Heat Transfer. No Radiation Heat Transfer. The material properties are constant over the operating temperature range. Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal resistance. The finite element simulation requires the following inputs: * * * * * Unit material stack-up. Material properties. Circuit geometry. Mounting interface temperature. Thermal load (dissipated power). The classical definition for dissipated power is temperature delta (T) divided by thermal resistance (R). The dissipated power (Pdis) can also be calculated as a function of the total input power (Pin) and the thermal insertion loss (ILtherm): - ILtherm T Pdis = = Pin 1 - 10 10 R (W ) (1) Power flow and nomenclature for an "X" style coupler is shown in Figure 1. Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Figure 1 The coupler is excited at the input port with Pin (watts) of power. Assuming the coupler is not ideal, and that there are no radiation losses, power will exit the coupler at all four ports. Symbolically written, Pout(RL) is the power that is returned to the source because of impedance mismatch, Pout(ISO) is the power at the isolated port, Pout(CPL) is the power at the coupled port, and Pout(DC) is the power at the direct port. At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and direct ports: Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a negative number. Obviously, a mere sign change equates the two quantities. Pin IL = 10 log10 P + P out ( DC ) out ( CPL ) (dB) (2) In terms of S-parameters, IL can be computed as follows: 2 2 IL = -10 log10 S31 + S41 (dB) (3) We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the isolated port. For thermal calculations, we are only interested in the power lost "inside" the coupler. Since Pout(RL) is lost in the source termination and Pout(ISO) is lost in an external termination, they are not be included in the insertion loss for thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations: ILtherm Pin = 10 log10 P out ( CPL ) + Pout ( DC ) + Pout ( ISO ) + Pout ( RL ) In terms of S-parameters, ILtherm can be computed as follows: USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. (dB) (4) Model X4C25J1-05G RevB ILtherm = -10 log10 S11 + S 21 + S 31 + S 41 2 2 2 2 (dB) (5) The thermal resistance and power dissipated within the unit are then used to calculate the average total input power of the unit. The average total steady state input power (Pin) therefore is: Pin = Pdis - ILtherm 1 - 10 10 = T R - ILtherm 1 - 10 10 (W ) (6) Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt): T = Tcirc - Tmnt ( oC ) (7) The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit. Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot be used as a boundary condition for power handling calculations. Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the limits defined on the power derating plots for the required average power handling. Additionally appropriate solder composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the mounting interface and RF port temperatures are kept to a minimum. The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes of the power handling of the coupler. Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Mounting Coupler Mounting Process In order for Xinger surface mount couplers to work optimally, there must be 50 transmission lines leading to and from all of the RF ports. Also, there must be a very good ground plane underneath the part to ensure proper electrical performance. If either of these two conditions is not satisfied, electrical performance may not meet published specifications. The process for assembling this component is a conventional surface mount process as shown in Figure 2. This process is conducive to both low and high volume usage. Overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the PCB. This minimizes ground inductance and improves ground continuity. All of the Xinger hybrid and Hybrid couplers are constructed from ceramic filled PTFE composites, which possess excellent electrical and mechanical stability. When a surface mount coupler is mounted to a printed circuit board, the primary concerns are; ensuring the RF pads of the device are in contact with the circuit trace of the PCB and insuring the ground plane of neither the component nor the PCB is in contact with the RF signal. Mounting Footprint Figure 2: Surface Mounting Process Steps Storage of Components: The Xinger products are available in an ENIG finish. IPC storage conditions used to control oxidation should be followed for these surface mount components. Substrate: Depending upon the particular component, the circuit material has a coefficient of thermal expansion (CTE) similar to commonly used board substrates such as RF35, RO4003, FR4, polyimide and G-10 materials. The similarity in CTE minimizes solder joint stresses due to similar expansion rates between component and board. Mounting to "hard" substrates (alumina etc.) is possible depending upon operational temperature requirements. The solder surfaces of the coupler are all copper plated with an ENIG. Solder Paste: All conventional solder paste formulations will work well with Anaren's Xinger surface mount components. Solder paste can be applied with stencils or syringe dispensers. An example of a stenciled solder paste deposit is shown in Figure 3. As shown in the figure solder paste is applied to the four RF pads and the entire ground plane underneath the body of the part. Dimensions are in Millimeters USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model X4C25J1-05G RevB Reflow: The surface mount coupler is conducive to most of today's conventional reflow methods. A low and high temperature thermal reflow profile are shown in Figures 6 and 7, respectively. Manual soldering of these components can be done with conventional surface mount non-contact hot air soldering tools. Board pre-heating is highly recommended for these selective hot air soldering methods. Manual soldering with conventional irons should be avoided. Figure 3: Solder Paste Application Component Positioning: The surface mount component can be placed manually or with automatic pick and place mechanisms. Couplers should be placed (see Figure 4 and 5) onto wet paste with common surface mount techniques and parameters. Pick and place systems must supply adequate vacuum to hold a 0.01 gram coupler. Figure 4: Component Placement Figure 5: Mounting Features Example Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Figure 6 - Low Temperature Solder Reflow Thermal Profile Figure 7 - High Temperature Solder Reflow Thermal Profile USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing. Model X4C25J1-05G RevB Qualification Flow Chart Available on Tape and Reel for Pick and Place Manufacturing. USA/Canada: Toll Free: Europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 Model X4C25J1-05G RevB Packaging and Ordering Information Parts are available in reel and are packaged per EIA 481-D. Parts are oriented in tape and reel as shown below. Minimum order quantities are 4000 per reel. 2.00 4.00 .25 1.75 3.50 8.00 2.41 1.00 1.60 USA/Canada: Toll Free: Europe: 4.00 (315) 432-8909 (800) 411-6596 +44 2392-232392 Available on Tape and Reel for Pick and Place Manufacturing.