CHR3664-QEG RoHS COMPLIANT 17-27GHz Down-Converter GaAs Monolithic Microwave IC in SMD leadless package Description The CHR3664-QEG is a multifunction monolithic circuit, which integrates a balanced cold FET mixer, a multiplier by two, and a RF LNA including gain control. It is designed for a wide range of applications, typically ISM and commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in RoHS compliant SMD package. UMS R3664 YYWW 18 Main Features 16 14 Broadband RF performance 17-27GHz 12dB conversion gain 3dBm Input IP3 16dB Gain Control 15dBc Image Rejection DC bias: Vd=4.0Volt @ Id=320mA 24L-QFN4x5 MSL1 Conversion Gain (dB) 12 10 8 6 4 2 0 -2 -4 -6 USB_Gcx=-1,5V -8 USB_Gcx=0V LSB_Gcx=-1,5V LSB_Gcx=0V -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Main Characteristics Tamb.= +25C, Vd = 4.0V Symbol Parameter FRF RF frequency range FOL LO frequency range FIF IF frequency range GC Conversion Gain Ref. : DSCHR3664-QEG1192 - 11 Jul 11 Min 17 7 DC Typ 12 1/22 Max 26.5 15 3.5 Unit GHz GHz GHz dB Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Departementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHR3664-QEG 17-27GHz Down-Converter Main Characteristics Tamb = +25C, VD = VDL = 4.0V Symbol Parameter Min Typ Max Unit FRF RF frequency range 17 26.5 GHz FOL LO frequency range 7 15 GHz FIF IF frequency range DC 3.5 GHz GC Conversion Gain @ min. attenuation 8 12 dB Gain control range 16 dB G Noise Figure @ min. att. from 17 to 24GHz, 3.3 3.8 dB for IF>0.1GHz NF Noise Figure @ min. att. from 24 to 26.5GHz, 4.1 4.6 dB for IF>0.1GHz Im_rej Image rejection (1) 15 dBc PLO LO Input power 0 5 dBm Input IP3 @ min. attenuation 1 3 dBm IIP3 -4 -2 dBm Input IP3 @ all gain range (G) 2LO/RF 2LO leakage at RF port @ max. gain -40 dBc VD, VDL DC drain voltage 4.0 V ID Drain current on VD 245 mA IDL Drain current on VDL 75 mA (2) VGL LNA DC gate voltage -0.6 V GC2,3 Gain control DC voltage -2 -1.5 +0.6 V VGM Mixer DC gate voltage -0.7 V These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". (1) An external combiner 90 is required on I / Q. Typical VGL value for IDL = 75mA See in paragraph " biasing option" other possibility to optimise differently the performances (2) Note: Id is not affected by gain control (GC2, GC3). Ref. : DSCHR3664-QEG1192 - 11 Jul 11 2/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Absolute Maximum Ratings (1) Tamb.= +25C Symbol Parameter Vd Drain bias voltage ID+IDL Drain bias current VGL LNA DC gate voltage VGM Mixer DC gate voltage GC2,3 Gain control voltage PRF Maximum peak input power overdrive PLO Maximum LO input power Tj Junction temperature (2) Ta Operating temperature range Tstg Storage temperature range (1) Operation of this device above anyone of these parameters damage. (2) See "Device thermal performances" Values Unit 5 V 450 mA -2 to +0.4 V -2 to +0.4 V -2 to +0.8 V 10 dBm 10 dBm 175 C -40 to +85 C -55 to +150 C may cause permanent Typical Bias Conditions Tamb.= +25C Symbol Pad No VDL, VD 10, 12 ID+IDL 10, 12 VGL 9 VGM 11 GC2, GC3 7, 8 Parameter DC drain voltages Total drain current DC gate voltage DC gate voltage Gain control DC voltage Ref. : DSCHR3664-QEG1192 - 11 Jul 11 3/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Values 4.0 320 -0.6 -0.7 -2 to +0.6 Unit V mA V V V Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature cannot be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3664-QEG Recommended max. junction temperature (Tj max) : 124 Junction temperature absolute maximum rating : 175 Max. continuous dissipated power (Pdiss. Max.) : 1.3 => Pdiss. Max. derating above Tcase(1)= 85 C : 33 (2) Junction-Case thermal resistance (Rth J-C) : <30 Minimum Tcase operating temperature(3) : -40 Maximum Tcase operating temperature(3) : 85 Minimum storage temperature : -55 Maximum storage temperature : 150 C C W mW/C C/W C C C C (1) Derating at junctio n temperature co nstant = Tj max. (2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased. (3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 1.4 1 0.8 0.6 0.4 0.2 Pdiss. Max. @Tj 75 >75 -32 -30 -28 -26 -24 -22 -20 -18 Input Power DCL (dBm) Spurious on IF outputs RF = 2LO - IF P_RF = -20dBm / P_LO = 0dBm @10GHz nLO 1 2 3 38 16 30 41 16 34 >75 >75 >75 >75 >75 >75 >75 >75 >75 4 30 44 30 >75 >75 5 43 51 52 >75 >75 All values in dBc below IF power level (IF = 1GHz). Data measured without external hybrid coupler. Ref. : DSCHR3664-QEG1192 - 11 Jul 11 11/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] C, VD = VDL = 4.0V, VGL = -0.6V, VGM = -0.7V, P_LO = 0 dBm If no specific mention, the following values are representative of on board measurements (on connector access planes) as defined on the drawing at paragraph "Evaluation mother board". The board losses are estimated from 1.5 to 2dB in the frequency range. Conversion Gain in Supradyne Mode versus Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz, GCx = -1.5V & 0V Board losses de-embedded (result given on package access planes) 18 16 14 Conversion Gain (dB) 12 10 8 6 att.min. @85C att. max. @85C 4 att. min. @25C att. max. @25C att. min. @-40C att. max. @-40C 2 0 -2 -4 -6 -8 -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Conversion Gain in Infradyne Mode versus Frequency RF = 2xF_LO-F_IF, F_IF = 2.0GHz, GCx = -1.5V & 0V Board losses de-embedded (result given on package access planes) 18 16 14 Conversion Gain (dB) 12 10 8 6 att.min. @85C att. max. @85C 4 att. min. @25C att. max. @25C att. min. @-40C att. max. @-40C 2 0 -2 -4 -6 -8 -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3664-QEG1192 - 11 Jul 11 12/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] C, VD = VDL = 4.0V, VGL = -0.6V, VGM = -0.7V, P_LO = 0 dBm Noise Figure in Supradyne Mode at min. att. versus Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz, GCx = -1.5V Board losses de-embedded (result given on package access planes) 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 1 85C 25C -40C 0 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Noise Figure in Infradyne Mode at min. att. versus Frequency F_RF = 2xF_LO-F_IF, F_IF = 2.0GHz, GCx = -1.5V Board losses de-embedded (result given on package access planes) 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 1 85C 25C -40C 0 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3664-QEG1192 - 11 Jul 11 13/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] C, VD = VDL = 4.0V, VGL = -0.6V, VGM = -0.7V, P_LO = 0 dBm Dynamic Range (Gcmax - Gcmin) in Supradyne Mode versus Frequency F_RF = 2xF_LO+F_IF, F_IF = 2.0GHz 20 18 Dynamic Range (dB) 16 14 12 10 8 6 4 85C 2 25C -40C 0 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Dynamic Range (Gcmax - Gcmin) in Infradyne Mode versus Frequency F_RF = 2xF_LO-F_IF, F_IF = 2.0GHz 20 18 Dynamic Range (dB) 16 14 12 10 8 6 4 85C 2 25C -40C 0 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3664-QEG1192 - 11 Jul 11 14/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] C, VD = VDL = 4.0V, VGL = -0.6V, VGM = -0.7V, P_LO = 0 dBm Image Rejection on Supradyne Mode versus Frequency F_IF = 2.0GHz, GCx = -1.5V 35 30 Image Rejection (dB) 25 20 15 10 5 85C 25C -40C 0 16 17 18 19 20 21 22 23 24 25 26 27 28 27 28 RF Frequency (GHz) Image Rejection on Infradyne Mode versus Frequency F_IF = 2.0GHz, GCx = -1.5V 35 30 Image Rejection (dB) 25 20 15 10 5 85C 25C -40C 0 16 17 18 19 20 21 22 23 24 25 26 RF Frequency (GHz) Ref. : DSCHR3664-QEG1192 - 11 Jul 11 15/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] C, VD = VDL = 4.0V, VGL = -0.6V, VGM = -0.7V, P_LO = 0 dBm Input IP3 versus Temperature at GCx = -1.5V F_RF = 2xF_LO+F_IF, F_RF = 20.5GHz, F_IF = 3.5GHz 16 14 12 Input IP3 (dBm) 10 8 6 4 2 0 -2 -4 85C 25C -40C -6 -27 -25 -23 -21 -19 -17 -15 -13 -11 -9 -11 -9 Input Power DCL (dBm) IMD3 versus Temperature at GCx = -1.5V F_RF = 2xF_LO+F_IF, F_RF = 20.5GHz, F_IF = 3.5GHz 80 75 70 65 60 55 IMD3 (dBc) 50 45 40 35 30 25 20 15 10 85C 5 25C -40C 0 -27 -25 -23 -21 -19 -17 -15 -13 Input Power DCL (dBm) Ref. : DSCHR3664-QEG1192 - 11 Jul 11 16/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678- Nc Nc Nc GND(2) RF in GND(2) GC3 GC2 910111213141516- VGL VDL VGM VD Nc GND(2) LO in GND(2) 1718192021222324- Nc Nc Nc IF_I out GND(2) IF_Q out Nc Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked "Gnd" through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHR3664-QEG1192 - 11 Jul 11 17/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Evaluation mother board Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a micro-strip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Decoupling capacitors of 10nF 10% are recommended for all DC accesses. See application note AN0017 for details. GC3 GC2 VGL VDL VGM VD Decoupling Capacitors = 10nF Hybrid coupler 90 2-4GHz Ref. : DSCHR3664-QEG1192 - 11 Jul 11 18/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Notes 16 15 NC GND 17 LO IN NC 19 18 GND NC NC Due to ESD protection circuits on RF and LO inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses in the application. 14 13 IF_I 20 12 VD GND 21 11 VGM IF_Q 22 10 VDL NC 23 9 VGL NC 24 8 GC2 NC 5 6 7 GC3 NC 4 GND 3 RF IN 2 GND 1 NC X2 ESD protections are implemented on gate accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board, as close as possible to the package. Ref. : DSCHR3664-QEG1192 - 11 Jul 11 19/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter DC Schematic LNA (4.0V, 75mA) Vd=4.0V 2k 45 22 17 15mA 310 25mA 64 35mA 2.8k 3.3k Vg~ -0.6V LO Buffer (4.0V, 245mA) Vd=4.0V 60mA 80mA 25mA 80mA 1k 25 960 5.5 8 1k 40 40 510 185 100 1.6k 15 16 960 510 725 25 5.5 220 100 40 15 190 100 Ref. : DSCHR3664-QEG1192 - 11 Jul 11 20/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Biasing Options In order to improve the conversion gain and the noise figure, the biasing could be tuned. VGL voltage allows controlling IDL current. Table below gives the typical value for main characteristics VD=VDL= 4.0V IDL= 75mA VD=VDL= 4.5V IDL= 110mA 12 3.3 +3 -0.6 245 320 1280 13 3.2 +2 -0.4 250 360 1620 Conversion Gain@min. att. (dB) Noise Figure@ min. att. from 17 to 24GHz (dB) Input IP3@min. att. (dBm) VGL (V) ID (mA) ID + IDL (mA) Total DC power consumption (mW) Ref. : DSCHR3664-QEG1192 - 11 Jul 11 21/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3664-QEG 17-27GHz Down-Converter Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x5 RoHS compliant package: CHR3664-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3664-QEG1192 - 11 Jul 11 22/22 Route Departementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice