ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 1 - Revision 2.1
ISD1700
Series
Multi-Message
Single-Chip
Voice Record & Playback Devices
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 2 - Revision 2.1
TABLE OF CONTENTS
1 GENERAL DESCRIPTION .............................................................................................................. 3
2 FEATURES ...................................................................................................................................... 4
3 BLOCK DIAGRAM ........................................................................................................................... 5
4 PINOUT CONFIGURATION ............................................................................................................ 6
5 PIN DESCRIPTION ......................................................................................................................... 7
6 MODES OF OPERATIONS ............................................................................................................. 8
6.1 Standalone (Push-Button) Mode .............................................................................................. 8
6.2 SPI Mode .................................................................................................................................. 8
7 TIMING DIAGRAMS ........................................................................................................................ 8
7.1 Basic Operation ........................................................................................................................ 8
7.2 SPI Operation ......................................................................................................................... 12
8 ABSOLUTE MAXIMUM RATINGS ................................................................................................ 13
8.1 Operating Conditions .............................................................................................................. 13
9 ELECTRICAL CHARACTERISTICS .............................................................................................. 14
9.1 DC Parameters ...................................................................................................................... 14
9.2 AC Parameters ....................................................................................................................... 15
10 TYPICAL APPLICATION CIRCUITS ............................................................................................. 16
10.1 Good Audio Design Practices ................................................................................................ 18
11 PACKAGING .................................................................................................................................. 19
11.1 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) ........................................... 19
11.2 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................. 20
12 ORDERING INFORMATION ......................................................................................................... 20
13 VERSION HISTORY ...................................................................................................................... 22
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 3 - Revision 2.1
1 GENERAL DESCRIPTION
The Nuvoton® ISD1700 ChipCorder® Series is a high quality, fully integrated, single-chip multi-message
voice record and playback device ideally suited to a variety of electronic systems. The message
duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific
device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an
external resistor, giving the user greater flexibility in duration versus recording quality for each
application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices
are optimized for a wide range of battery or line-powered applications.
The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device
incorporates a proprietary message management system that allows the chip to self-manage address
locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a
simple push-button environment. The devices include an on-chip oscillator (with external resistor
control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, anti-
aliasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation
(PWM) Class D speaker driver, and current/voltage output.
The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new
message indicator. With vAlert, the device flashes an external LED to indicate that a new message is
present. Besides, four special sound effects are reserved for audio confirmation of operations, such as
“Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc.
Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique
single-chip solution is made possible through Nuvoton’s patented Multi-Level Storage (MLS)
technology. Audio data are stored directly in solid-state memory without digital compression, providing
superior quality voice and music reproduction.
Voice signals can be fed into the chip through two independent paths: a differential microphone input
and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM)
Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a
standard 8 speaker or typical buzzer, while the separate analog output can be configured as a single-
ended current or voltage output to drive an external amplifier.
While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power
conservation after an operation is completed.
In the SPI mode, the user has full control via the serial interface in operating the device. This includes
random access to any location inside the memory array by specifying the start address and end
address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register.
This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default
configuration for standalone mode can also be modified by storing the APC data into a non-volatile
register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers
have the control and flexibility to implement voice functionality into the high-end products.
Notice: The specifications are subject to change without notice. Please contact Nuvoton Sales Offices or
Representatives to verify current or future specifications. Also refer to the website for any related application
notes.
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 4 - Revision 2.1
2 FEATURES
Integrated message management systems for single-chip, push-button applications
o
REC
: level-trigger for recording
o
PLAY
: edge-trigger for individual message or level-trigger for looping playback sequentially
o
ERASE
: edge-triggered erase for first or last message or level-triggered erase for all messages
o
FWD
: edge-trigger to advance to the next message or fast message scan during the playback
o
VOL
: 8 levels output volume control
o
INTRDY
: ready or busy status indication
o
RESET
: return to the default state
o Automatic power-down after each operation cycle
Selectable sampling frequency controlled by an external oscillator resistor
Sampling Frequency
12 kHz
8 kHz
6.4 kHz
5.3 kHz
4 kHz
Rosc
53 k
80 k
100 k
120 k
160 k
Selectable message duration
o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen
Sample Freq.
ISD1730
ISD1760
ISD17120
ISD17240
12 kHz
20 secs
40 secs
80 secs
160 secs
8 kHz
30 secs
60 secs
120 secs
240 secs
6.4 kHz
37 secs
75 secs
150 secs
300 secs
5.3 kHz
45 secs
90 secs
181 secs
362 secs
4 kHz
60 secs
120 secs
240 secs
480 secs
Message and operation indicators
o Four customizable Sound Effects (SEs) for audible indication
o Optional vAlert (voiceAlert) to indicate the presence of new messages
o LED: stay on during recording, blink during playback, forward and erase operations
Dual operating modes
o Standalone mode:
Integrated message management techniques
Automatic power-down after each operation cycle
o SPI mode:
Fully user selectable and controllable options via APC register and various SPI commands
Two individual input channels
o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control)
o AnaIn: single-ended auxiliary analog input for recording or feed-through
Dual output channels
o Differential PWM Class D speaker outputs directly drives an 8 Ω speaker or a typical buzzer
o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier
ChipCorder standard features
o High-quality, natural voice and audio reproduction
o 2.4V to 5.5V operating voltage
o 100-year message retention (typical)
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 5 - Revision 2.1
o 100,000 record cycles (typical)
Temperature options:
o Commercial: 0C to +50C (die); 0C to +70C (packaged units)
o Industrial: -40C to +85C (packaged units)
Packaging types: available in die, PDIP and SOIC
Package option: Lead-free packaged units
3 BLOCK DIAGRAM
Internal
Clock Timing
Nonvolatile
Multi-Level Storage
Array
Power Conditioning
Automatic
Gain Control
Anti-
Aliasing
Filter Smoothing
Filter
Sampling
Clock
SP+
SP-
VCCA
AGC
MIC-
MIC+
ROSC
AUD /
AUX
Amp
VCCD
VSSD
Device Control
VSSA VSSP1
VCCP
SPI Interface
MISOMOSISCLKSSREC PLAY ERASE FT
Volume
Control
AnaIn
Amp
MUX
AGC
Amp
AnaIn
Amp
VSSP2 FWD VOL LEDINT/RDYRESET
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 6 - Revision 2.1
4 PINOUT CONFIGURATION
Refer to Design Guide for details before performing any design or PCB layout.
SOIC / PDIP
ISD1700
VCCD
PLAY
RESET
INT / RDY
FWD
VSSA
FT
LED
MIC-
MIC+
VCCA
SP-
ERASE
REC
MOSI
SS
SCLK
MISO
AnaIn
VSSP2
VCCP
VSSP1
Sp+
AUD / AUX
AGC
VOL
ROSC
VSSD
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 7 - Revision 2.1
5 PIN DESCRIPTION
Refer to Design Guide for details before performing any design or PCB layout.
PIN NAME
FUNCTIONS
VCCD
Digital Power Supply: Power supply for digital circuitry.
LED
LED: An LED output.
RESET
RESET: When active, the device enters into a known state.
MISO
Master In Slave Out: Data is shifted out on the falling edge of SCLK.
When the SPI is inactive (
SS
= high), it’s tri-state.
MOSI
Master Out Slave In: Data input of the SPI interface when ISD1700 is a
slave. Data is latched into the device on the rising edge of SCLK.
SCLK
Serial Clock: Clock of the SPI interface.
SS
Slave Select: Selects as a slave device and enables the SPI interface.
VSSA
Analog Ground: Ground path for analog circuitry.
AnaIn
AnaIn: Auxiliary analog input to the device for recording or feed-through.
MIC+
MIC+: Non-inverting input of the differential microphone signal.
MIC-
MIC-: Inverting input of the differential microphone signal.
VSSP2
Ground: Ground path for negative PWM speaker drive.
SP-
SP-: The negative Class D PWM speaker output.
VCCP
Power Supply for PWM Speaker Driver: Power for PWM speaker drive.
SP+
SP+: The positive Class D PWM speaker output.
VSSP1
Ground: Ground path for positive PWM speaker drive.
AUD/AUX
Auxiliary Output: Either an AUD (current) or AUX (voltage) output.
AGC
Automatic Gain Control (AGC): The AGC adjusts the gain of the
microphone preamplifier circuitry.
VOL
Volume: This control has 8 levels of volume adjustment.
ROSC
Oscillator Resistor: A resistor determines the sample frequency of the
device, which sets the duration.
VCCA
Analog Power Supply. Power supply for analog circuitry.
FT
Feed-through: Enable the feed-through path for AnaIn signal to the
outputs.
PLAY
Playback: Plays the recorded message individually, or plays messages
sequential in a looping mode.
REC
Record: When active, starts recording message.
ERASE
Erase: When active, can erase individual message or do global erase.
FWD
Forward: Advances to the next message from the current location.
INTRDY
An open drain output. Can review ready or interrupt status.
VSSD
Digital Ground: Ground path for digital circuitry
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 8 - Revision 2.1
6 MODES OF OPERATIONS
The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.
6.1 STANDALONE (PUSH-BUTTON) MODE
One can utilize the
REC
,
PLAY
,
FT
,
FWD
,
ERASE
,
VOL
or
RESET
control to initiate a
desired operation. As completed, the device automatically enters into the power-down state.
6.2 SPI MODE
In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI
commands.
For technical details, please refer to the design guide.
7 TIMING DIAGRAMS
The following estimated timing diagrams are not in proper scale.
7.1 BASIC OPERATION
TrTf
RDY
TDeb
REC
TER
TSc1 TRU TRD TSet1
Mic+/-,
AnaIn
LED
Figure 12.1: Record Operation with No Sound Effect
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 9 - Revision 2.1
RDY
Sp+, Sp-
PLAY
TDeb
TSc1
TSet1
Tr
TSc2 TRU TLH
Tf
LED
TCyc
TDeb
TRD
> TDeb
Figure 12.2: Start and Stop Playback Operation
ERASE
RDY
TDeb
TSc1
TRD
TrTf
LED
TSc2
TLS2
TSc2 TE
> TDeb
Figure 12.3: Single Erase Operation with No Sound Effect
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 10 - Revision 2.1
FWD
RDY
TDeb
TSc1
TRD
TrTf
LED
TSc2 TLS1 or TLS2
> TDeb
Figure 12.4: Forward Operation with No Sound Effect
Sp+, Sp-
Note: If SEs are recorded, then Sp+/- will have output.
ERASE
RDY
TDeb
TSc1
TRD
TrTf
LED
TGE1 or (TE + TLS2 or TSE2)
TSc2 TGE2
3x(TLS1 or TSE1)TLS4 or TSE4
Figure 12.5: Global Erase Operation with or without Sound Effects
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 11 - Revision 2.1
RESET
RDY
TReset
TrTf
LED
Device returns to Power Down state
TSet2
Figure 12.6: Reset Operation
RDY
AUD
PLAY
TDeb
TSc1
TRD
Tr
TSc2 TRU TLH
Tf
LED
TCyc
> TDeb
TRU TRD
Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 12 - Revision 2.1
7.2 SPI OPERATION
TSSH TSSmin
TSCKhi
TSSS
TDIS TDIH
TSCKlow
TDF
(TRISTATE)
SS
SCLK
MOSI
MISO LSB
TPD
MSB
LSB MSB
Figure 12.8: SPI Operation
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
SS
Setup Time
TSSS
500
nsec
SS
Hold Time
TSSH
500
nsec
Data in Setup Time
TDIS
200
nsec
Data in Hold Time
TDIH
200
nsec
Output Delay
TPD
500
nsec
Output Delay to HighZ
TDF
500
nsec
SS
HIGH
TSSmin
1
µsec
SCLK High Time
TSCKhi
400
nsec
SCLK Low Time
TSCKlow
400
nsec
CLK Frequency
F0
1,000
KHz
Power-Up Delay [1]
TPUD
50
msec
Notes: [1] The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for
slower sampling frequency.
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 13 - Revision 2.1
8 ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS (DIE) [1]
CONDITIONS
VALUES
Junction temperature
1500C
Storage temperature range
-650C to +1500C
Voltage Applied to any pads
(VSS - 0.3V) to (VCC + 0.3V)
Power supply voltage to ground potential
-0.3V to +7.0V
ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) [1]
CONDITIONS
VALUES
Junction temperature
1500C
Storage temperature range
-650C to +1500C
Voltage Applied to any pins
(VSS - 0.3V) to (VCC + 0.3V)
Voltage applied to any pin (Input current limited to +/-20 mA)
(VSS – 1.0V) to (VCC + 1.0V)
Power supply voltage to ground potential
-0.3V to +7.0V
[1] Stresses above those listed may cause permanent damage to the device. Exposure to the absolute
maximum ratings may affect device reliability. Functional operation is not implied at these conditions.
8.1 OPERATING CONDITIONS
OPERATING CONDITIONS (DIE)
CONDITIONS
VALUES
Operating temperature range
0°C to +50°C
Supply voltage (VCC) [1]
+2.4 V to +5.5 V
Ground voltage (VSS) [2]
0 V
Input voltage (VCC) [1]
0 V to 5.5 V
Voltage applied to any pins
(VSS –0.3 V) to (VCC +0.3 V)
OPERATING CONDITIONS (PACKAGED PARTS)
CONDITIONS
VALUES
Operating temperature range (Case temperature)
-40°C to +85°C
Supply voltage (VDD) [1]
+2.4V to +5.5V
Ground voltage (VSS) [2]
0V
Input voltage (VDD) [1]
0V to 5.5V
Voltage applied to any pins
(VSS –0.3V) to (VDD +0.3V)
[1] VCC = VCCA = VCCD= VCCP
[2] VSS = VSSA = VSSD = VSSP1 VSSP2
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 14 - Revision 2.1
9 ELECTRICAL CHARACTERISTICS
9.1 DC PARAMETERS
PARAMETER
SYMBOL
MIN
TYP [1]
MAX
UNITS
CONDITIONS
Supply Voltage
VDD
2.4
5.5
V
Input Low Voltage
VIL
VSS-0.3
0.3xVDD
V
Input High Voltage
VIH
0.7xVDD
VDD
V
Output Low Voltage
VOL
VSS-0.3
0.3xVDD
V
IOL = 4.0 mA[2]
Output High Voltage
VOH
0.7xVDD
VDD
V
IOH = -1.6 mA[2]
Record Current
IDD_Record
20
mA
VDD = 5.5 V, No load,
Sampling freq = 12 kHz
Playback Current
IDD_Playback
20
mA
Erase Current
IDD_Erase
20
mA
Standby Current
ISB
1
10
µA
[3] [4]
Input Leakage Current
IILPD1
1
µA
Force VDD
Input Current Low
IILPD2
-3
-10
µA
Force VSS , others at Vcc
Preamp Input Impedance
RMIC+,RMIC-
7
kΩ
Power-up AGC
AnaIn Input Impedance
RAnaIn
42
kΩ
When active
MIC Differential Input
VIN1
15
300
mV
Peak-to-Peak[5]
AnaIn Input Voltage
VIN2
1
V
Peak-to-Peak
Gain from MIC to SP+/-
AMSP
6
40
dB
VIN = 15~300 mV, AGC =
4.7 µF, VCC = 2.4V~5.5V
Speaker Output Load
RSPK
8
Ω
Across both Speaker pins
AUX Output Load
RAux
5
kΩ
When active
Speaker Output Power
Pout
670
mW
VDD = 5.5 V
1Vp-p,
1 kHz sine
wave at
AnaIn. RSPK
= 8 Ω.
313
mW
VDD = 4.4 V
117
mW
VDD= 3 V
49
mW
VDD= 2.4 V
Speaker Output Voltage
VOUT1
VDD
V
RSPK = 8Ω (Speaker),
Typical buzzer
AUX Output Swing
VOUT2
1
V
Peak-to-Peak
AUX Output DC Level
VOUT3
1.2
V
When active
AUD
IAUD
-3.0
mA
VDD =4.5 V, REXT= 390 Ω
Volume Output
AVol
0 to -28
dB
8 steps of 4dB each
reference to output
Total Harmonic Distortion
THD
1
%
15 mV p-p 1 kHz sine
wave, Cmessage
weighted
Notes: [1] Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25°C, unless otherwise stated.
[2] LED output during Record operation.
[3] VCCA, VCCD and VCCP are connected together. VSSA, VSSP1, VSSP2 and VSSD are connected together.
[4]
REC
,
PLAY
,
FT
,
FWD
,
ERASE
,
VOL
and
RESET
must be at VCCD.
[5] Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or
MIC- input is recommended no more than 150 mV p-p.
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 15 - Revision 2.1
9.2 AC PARAMETERS
CHARACTERISTIC
SYMBOL
MIN
TYP [1]
MAX
UNITS
CONDITIONS
Sampling Frequency [2]
FS
4
12
kHz
[2] [4]
Duration [3]
TDur
Refer to
duration
table
sec
[3]
Rising Time
Tr
100
nsec
Falling Time
Tf
100
nsec
Debounce Time
TDeb
192/FS
msec
[4]
Ramp Up Time
TRU
128/FS
msec
Ramp Down Time
TRD
128/FS
msec
Initial Scan Time after
power is applied
TSc1
DRN/8/FS
msec
DRN= device row# [4]
Initial Scan Time from PD
state
TSc2
DRN/16/FS
msec
After a PB operation
is run [4]
End Recording Time
TER
32/FS
msec
[4]
LED High Time
TLH
0.5K/FS
msec
[4]
LED Flash Time for SE1
TLS1
3.5K/FS
sec
SE1 not recorded [5]
LED Flash Time for SE2
TLS2
7.5K/FS
sec
SE2 not recorded [5]
LED Flash Time for SE3
TLS3
11.5K/FS
sec
SE3 not recorded [5]
LED Flash Time for SE4
TLS4
15.5K/FS
sec
SE4 not recorded [5]
SE1 Recorded Duration
TSE1
4K/FS
sec
[4] [5]
SE2 Recorded Duration
TSE2
4K/FS
sec
[4] [5]
SE3 Recorded Duration
TSE3
4K/FS
sec
[4] [5]
SE4 Recorded Duration
TSE4
4K/FS
sec
[4] [5]
Erase Time
TE
10MRN/FS
sec
MRN=message row # [4]
Global Erase Wait Time
TGE1
20K/FS
sec
[4] [5]
Global Erase Time
TGE2
34/FS
sec
RESET Pulse
TReset
1
sec
All Fs [4]
Settle Time
TSet1
128/FS
msec
[4]
Settle Time after Reset
TSet2
64/FS
msec
[4]
LED Error Time
TLErr
27.5K/FS
msec
[4] [5]
LED Cycle frequency
TCyc
1
4
Hz
Pending upon FS
Notes: [1] Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25°C, unless otherwise stated.
[2] Characterization data shows that sampling frequency resolution is 5 percent across temperature and voltage
ranges.
[3] Characterization data shows that duration resolution is 5 percent across temperature and voltage ranges.
[4] Vcc=2.4 V~5.5V
[5] K = 1024
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 16 - Revision 2.1
10 TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
* These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10 F, 4.7 F or other values.
Please refer to the applications notes or consult Nuvoton for layout advice.
** It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible.
Example #1: Recording using microphone input via push-button controls
Vcc
ISD1700
ROSC
VCCA
SP+
AUD/AUX
ERASE
PLAY
REC
AGC
VSSD
VCCD
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
VCCA
0.1 F
VCCD
*
24
23
25
26
19
10
11
20
18
1
28
17
22
9
VCCA
VCCD
VCCP
VSSA
VCCP
VSSP1
SP-
VSSP2
VCCP
0.1 F
0.1 F
*
*
21
8
14
16
12 0.1 F
*
INT/RDY 27
7
6
5
4
VCC
4.7 F
4.7 K
0.1 F
4.7 K
0.1 F
4.7 K
** **
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
FT
15
13
Speaker
or Buzzer
VCCD
Optional
100 K
Optional: based upon the appli cations
3900.1 F
VCC
8050C
Speaker
AUX
AUD
Gnd
LED 1 KD1
2vAlert
3
RESET 0.1 F
Reset
: Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 17 - Revision 2.1
Example #2: Recording using AnaIn input via push-button controls
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 18 - Revision 2.1
Example #3: Connecting the SPI Interface to a microcontroller
10.1 GOOD AUDIO DESIGN PRACTICES
To ensure the highest quality of voice reproduction, it is important to follow good audio design practices
in layout and power supply decoupling. See recommendations from below links or other Application
Notes in our websites.
Design Considerations for ISD1700 Family
AN-CC1002 Design Considerations for ISD1700 Family.pdf
Good Audio Design Practices
http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf
Single-Chip Board Layout Diagrams
http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 19 - Revision 2.1
11 PACKAGING
11.1 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC)
28 27 26 25 24 23 22 21 20 19 18 17 16 15
1234 5 6 7 8910 11 12 13 14
A
D
EF
B
G
C
H
Min Nom Max Min Nom Max
A0.701 0.706 0.711 17.81 17.93 18.06
B0.097 0.101 0.104 2.46 2.56 2.64
C0.292 0.296 0.299 7.42 7.52 7.59
D0.005 0.009 0.0115 0.127 0.22 0.29
E0.014 0.016 0.019 0.35 0.41 0.48
F0.050 1.27
G0.400 0.406 0.410 10.16 10.31 10.41
H0.024 0.032 0.040 0.61 0.81 1.02
Note: Lead coplanarity to be within 0.004 inches.
Plastic Small Outline Integrated Circuit (SOIC) Dimensions
INCHES
MILLIMETERS
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 20 - Revision 2.1
11.2 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP)
Plastic Dual Inline Package (PDIP) (P) Dimensions
INCHES
MILLIMETERS
Min
Nom
Max
Min
Nom
Max
A
1.445
1.450
1.455
36.70
36.83
36.96
B1
0.150
3.81
B2
0.065
0.070
0.075
1.65
1.78
1.91
C1
0.600
0.625
15.24
15.88
C2
0.530
0.540
0.550
13.46
13.72
13.97
D
0.19
4.83
D1
0.015
0.38
E
0.125
0.135
3.18
3.43
F
0.015
0.018
0.022
0.38
0.46
0.56
G
0.055
0.060
0.065
1.40
1.52
1.65
H
0.100
2.54
J
0.008
0.010
0.012
0.20
0.25
0.30
S
0.070
0.075
0.080
1.78
1.91
2.03
0
0°
15°
0°
15°
12 ORDERING INFORMATION
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 21 - Revision 2.1
Product Number Descriptor Key
When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Nuvoton
Sales Representatives for any questions and the availability.
For the latest product information, please contact the Nuvoton Sales/Rep or access
Nuvoton’s worldwide web site at http://www.Nuvoton-usa.com
I17xxxxxxx
Product Series:
17 = 1700
Duration:
30 : 20 – 60 secs
60 : 40 – 120 secs
120 : 80 – 240 secs
240 : 160 – 480 secs
Package Type:
S = Small Outline Integrated Circuit
(SOIC) Package
P = Plastic Dual Inline Package (PDIP)
Temperature:
I = Industrial (-40C to +85C)
Blank = Commercial
Die (0C to +50C)
Package (0C to +70C)
Tape & Reel:
Blank = None
R = Tape & Reel
Package Options:
Y = Green
Product Name:
I = ISD
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 22 - Revision 2.1
13 VERSION HISTORY
VERSION
DATE
DESCRIPTION
1.3-S
Sep 2006
Initial version
1.3-S1
Nov 2006
Revise Pinout Configuration & Pin Description sections
1.3-S2
Jan 2007
Revise Rosc resistor value
Revise Selectable Message Duration section
Update standby current, sampling frequency & duration parameters
1.31
Oct 31, 2008
Change logo.
2.0
Feb 4, 2010
Remove preliminary sign.
2.1
March, 2017
Removed TSOP package option (Not recommended for new
Design)
ISD1700 DATASHEET
Publication Release Date:March 3, 2017
- 23 - Revision 2.1
Headquarters Nuvoton Technology Corporation America Nuvoton Technology (Shanghai) Ltd.
No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,
Science-Based Industrial Park, CA 95134, U.S.A. 200336 China
Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999
TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998
FAX: 886-3-5665577 http://www.Nuvoton-usa.com/
http://www.Nuvoton.com.tw/
Taipei Office Nuvoton Technology Corporation Japan Nuvoton Technology (H.K.) Ltd.
9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,
Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,
Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong
TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100
FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.
Nuvoton products are not designed, intended, authorized or warranted for use as components in systems or equipment
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Furthermore, Nuvoton products are not intended for applications wherein failure of Nuvoton products could
result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.
Nuvoton customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Nuvoton for any damages resulting from such improper use or sales.
The contents of this document are provided only as a guide for the applications of Nuvoton products. Nuvoton makes no
representation or warranties with respect to the accuracy or completeness of the contents of this publication and
reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.
No license, whether express or implied, to any intellectual property or other right of Nuvoton or others is granted by this
publication. Except as set forth in Nuvoton's Standard Terms and Conditions of Sale, Nuvoton assumes no liability
whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or
infringement of any Intellectual property.
The contents of this document are provided “AS IS”, and Nuvoton assumes no liability whatsoever and disclaims any
express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual
property. In no event, shall Nuvoton be liable for any damages whatsoever (including, without limitation, damages for loss
of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this
documents, even if Nuvoton has been advised of the possibility of such damages.
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only
and Nuvoton makes no representation or warranty that such applications shall be suitable for the use specified.
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the
Nuvoton Reliability Report, and are neither warranted nor guaranteed by Nuvoton. This product incorporates
SuperFlash®.
This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder® product
specifications. In the event any inconsistencies exist between the information in this and other product documentation,
or in the event that other product documentation contains information in addition to the information in this, the information
contained herein supersedes and governs such other information in its entirety.
Copyright© 2005, Nuvoton Technology Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of
Nuvoton Technology Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks
are properties of their respective owners.
