ISD1700 DATASHEET ISD1700 Series Multi-Message Single-Chip Voice Record & Playback Devices -1- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET TABLE OF CONTENTS 1 GENERAL DESCRIPTION .............................................................................................................. 3 2 FEATURES ...................................................................................................................................... 4 3 BLOCK DIAGRAM ........................................................................................................................... 5 4 PINOUT CONFIGURATION ............................................................................................................ 6 5 PIN DESCRIPTION ......................................................................................................................... 7 6 MODES OF OPERATIONS ............................................................................................................. 8 6.1 Standalone (Push-Button) Mode .............................................................................................. 8 6.2 SPI Mode.................................................................................................................................. 8 7 TIMING DIAGRAMS ........................................................................................................................ 8 7.1 Basic Operation ........................................................................................................................ 8 7.2 SPI Operation ......................................................................................................................... 12 8 ABSOLUTE MAXIMUM RATINGS ................................................................................................ 13 8.1 Operating Conditions.............................................................................................................. 13 9 ELECTRICAL CHARACTERISTICS .............................................................................................. 14 9.1 DC Parameters ...................................................................................................................... 14 9.2 AC Parameters ....................................................................................................................... 15 10 TYPICAL APPLICATION CIRCUITS ............................................................................................. 16 10.1 Good Audio Design Practices ................................................................................................ 18 11 PACKAGING .................................................................................................................................. 19 11.1 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC) ........................................... 19 11.2 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................. 20 12 ORDERING INFORMATION ......................................................................................................... 20 13 VERSION HISTORY ...................................................................................................................... 22 -2- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 1 GENERAL DESCRIPTION (R) (R) The Nuvoton ISD1700 ChipCorder Series is a high quality, fully integrated, single-chip multi-message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications. The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, antialiasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output. The ISD1700 devices also support an optional "vAlert" (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as "Start Record", "Stop Record", "Erase", "Forward", "Global Erase", and etc. Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Nuvoton's patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction. Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8 speaker or typical buzzer, while the separate analog output can be configured as a singleended current or voltage output to drive an external amplifier. While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed. In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products. Notice: The specifications are subject to change without notice. Please contact Nuvoton Sales Offices or Representatives to verify current or future specifications. Also refer to the website for any related application notes. -3- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 2 FEATURES Integrated message management systems for single-chip, push-button applications o o o o o o REC : level-trigger for recording PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages FWD : edge-trigger to advance to the next message or fast message scan during the playback VOL : 8 levels output volume control RDY INT : ready or busy status indication o RESET : return to the default state o Automatic power-down after each operation cycle Selectable sampling frequency controlled by an external oscillator resistor Sampling Frequency Rosc 12 kHz 53 k 8 kHz 80 k 6.4 kHz 100 k 5.3 kHz 120 k 4 kHz 160 k Selectable message duration o A wide range selection from 20 secs to 480 secs pending upon sampling frequency chosen Sample Freq. ISD1730 20 secs ISD1760 40 secs ISD17120 80 secs ISD17240 160 secs 30 secs 60 secs 120 secs 240 secs 6.4 kHz 37 secs 75 secs 150 secs 300 secs 5.3 kHz 45 secs 90 secs 181 secs 362 secs 4 kHz 60 secs 120 secs 240 secs 480 secs 12 kHz 8 kHz Message and operation indicators o Four customizable Sound Effects (SEs) for audible indication o Optional vAlert (voiceAlert) to indicate the presence of new messages o LED: stay on during recording, blink during playback, forward and erase operations Dual operating modes o Standalone mode: Integrated message management techniques Automatic power-down after each operation cycle o SPI mode: Fully user selectable and controllable options via APC register and various SPI commands Two individual input channels o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through Dual output channels o Differential PWM Class D speaker outputs directly drives an 8 speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier ChipCorder standard features o High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage o 100-year message retention (typical) -4- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET o 100,000 record cycles (typical) Temperature options: o Commercial: 0C to +50C (die); 0C to +70C (packaged units) o Industrial: -40C to +85C (packaged units) Packaging types: available in die, PDIP and SOIC Package option: Lead-free packaged units 3 BLOCK DIAGRAM Internal Clock ROSC MIC+ MICAGC Sampling Clock AnaIn Amp Amp MUX AnaIn Timing AntiAliasing Filter Nonvolatile Multi-Level Storage Array Smoothing Filter Volume Control AUD / AUX SP+ Amp SP- AGC Amp Automatic Gain Control Power Conditioning Device Control SPI Interface VCCA VSSA VCCP VSSP1 VSSP2 VSSD VCCD REC PLAY ERASE FWD FT RESET VOL INT/RDY LED SS SCLK MOSI MISO -5- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 4 PINOUT CONFIGURATION Refer to Design Guide for details before performing any design or PCB layout. VCCD VSSD LED INT / RDY FWD RESET MISO ERASE MOSI REC SCLK PLAY SS VSSA ISD1700 FT VCCA AnaIn ROSC MIC+ VOL MIC- AGC VSSP2 AUD / AUX SP- VSSP1 VCCP Sp+ SOIC / PDIP -6- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 5 PIN DESCRIPTION Refer to Design Guide for details before performing any design or PCB layout. PIN NAME FUNCTIONS VCCD Digital Power Supply: Power supply for digital circuitry. LED LED: An LED output. RESET RESET: When active, the device enters into a known state. MISO Master In Slave Out: Data is shifted out on the falling edge of SCLK. When the SPI is inactive ( SS = high), it's tri-state. MOSI Master Out Slave In: Data input of the SPI interface when ISD1700 is a slave. Data is latched into the device on the rising edge of SCLK. Serial Clock: Clock of the SPI interface. SCLK SS VSSA Slave Select: Selects as a slave device and enables the SPI interface. Analog Ground: Ground path for analog circuitry. AnaIn AnaIn: Auxiliary analog input to the device for recording or feed-through. MIC+ MIC+: Non-inverting input of the differential microphone signal. MIC- MIC-: Inverting input of the differential microphone signal. VSSP2 Ground: Ground path for negative PWM speaker drive. SP-: The negative Class D PWM speaker output. SPVCCP SP+ VSSP1 AUD/AUX AGC VOL ROSC VCCA FT PLAY REC ERASE FWD RDY INT VSSD Power Supply for PWM Speaker Driver: Power for PWM speaker drive. SP+: The positive Class D PWM speaker output. Ground: Ground path for positive PWM speaker drive. Auxiliary Output: Either an AUD (current) or AUX (voltage) output. Automatic Gain Control (AGC): The AGC adjusts the gain of the microphone preamplifier circuitry. Volume: This control has 8 levels of volume adjustment. Oscillator Resistor: A resistor determines the sample frequency of the device, which sets the duration. Analog Power Supply. Power supply for analog circuitry. Feed-through: Enable the feed-through path for AnaIn signal to the outputs. Playback: Plays the recorded message individually, or plays messages sequential in a looping mode. Record: When active, starts recording message. Erase: When active, can erase individual message or do global erase. Forward: Advances to the next message from the current location. An open drain output. Can review ready or interrupt status. Digital Ground: Ground path for digital circuitry -7- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 6 MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode. 6.1 STANDALONE (PUSH-BUTTON) MODE One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a desired operation. As completed, the device automatically enters into the power-down state. 6.2 SPI MODE In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI commands. For technical details, please refer to the design guide. 7 TIMING DIAGRAMS The following estimated timing diagrams are not in proper scale. 7.1 BASIC OPERATION Tr Tf REC TDeb RDY TSc1 TRU TER TRD TSet1 LED Mic+/-, AnaIn Figure 12.1: Record Operation with No Sound Effect -8- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET > TDeb Tr Tf TDeb PLAY TDeb TRDTSet1 RDY TSc1 TSc2 TRU TLH TCyc LED Sp+, Sp- Figure 12.2: Start and Stop Playback Operation > TDeb Tr Tf ERASE TDeb TRD RDY TSc1 TSc2 TE TLS2 TSc2 LED Figure 12.3: Single Erase Operation with No Sound Effect -9- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET > T Deb Tr Tf FWD TDeb TRD RDY TSc1 TSc2 TLS1 or T LS2 LED Figure 12.4: Forward Operation with No Sound Effect Tr Tf ERASE TDeb TRD RDY TSc1 TSc2 TGE1 or (TE + TLS2 or TSE2) 3x(T LS1 or TSE1) TGE2 TLS4 or TSE4 LED Sp+, SpNote: If SEs are recorded, then Sp+/- will have output. Figure 12.5: Global Erase Operation with or without Sound Effects - 10 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET Tr Tf RESET TReset TSet2 Device returns to Power Down state RDY LED Figure 12.6: Reset Operation > T Deb Tr Tf PLAY TDeb TRD RDY TSc1 TSc2 TRU TLH TCyc LED TRU TRD AUD Figure 12.7: Playback Operation with ramp up and ramp down effect at AUD output - 11 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 7.2 SPI OPERATION TSSmin TSSH SS TSCKlow TSSS TSCKhi SCLK TDIS TDIH LSB MOSI MSB TPD MISO TDF (TRISTATE) LSB MSB Figure 12.8: SPI Operation PARAMETER SYMBOL MIN TYP MAX UNITS TSSS 500 nsec TSSH 500 nsec Data in Setup Time TDIS 200 nsec Data in Hold Time TDIH 200 Output Delay TPD 500 nsec Output Delay to HighZ TDF 500 nsec SS Setup Time SS Hold Time nsec TSSmin 1 sec SCLK High Time TSCKhi 400 nsec SCLK Low Time TSCKlow 400 nsec CLK Frequency F0 Power-Up Delay [1] TPUD SS HIGH Notes: [1] 1,000 50 KHz msec The value shown is based upon 8 kHz sampling frequency. Delay increases proportionally for slower sampling frequency. - 12 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 8 ABSOLUTE MAXIMUM RATINGS ABSOLUTE MAXIMUM RATINGS (DIE) [1] CONDITIONS VALUES 0 Junction temperature Storage temperature range Voltage Applied to any pads Power supply voltage to ground potential 150 C 0 0 -65 C to +150 C (VSS - 0.3V) to (VCC + 0.3V) -0.3V to +7.0V ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) CONDITIONS VALUES 0 Junction temperature Storage temperature range Voltage Applied to any pins Voltage applied to any pin (Input current limited to +/-20 mA) Power supply voltage to ground potential [1] 8.1 [1] 150 C 0 0 -65 C to +150 C (VSS - 0.3V) to (VCC + 0.3V) (VSS - 1.0V) to (VCC + 1.0V) -0.3V to +7.0V Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions. OPERATING CONDITIONS OPERATING CONDITIONS (DIE) CONDITIONS VALUES Operating temperature range [1] Supply voltage (VCC) [2] Ground voltage (VSS) [1] Input voltage (VCC) Voltage applied to any pins 0C to +50C +2.4 V to +5.5 V 0V 0 V to 5.5 V (VSS -0.3 V) to (VCC +0.3 V) OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS VALUES Operating temperature range (Case temperature) [1] Supply voltage (VDD) [2] Ground voltage (VSS) [1] Input voltage (VDD) Voltage applied to any pins [1] VCC = VCCA = VCCD= VCCP [2] VSS = VSSA = VSSD = VSSP1 VSSP2 - 13 - -40C to +85C +2.4V to +5.5V 0V 0V to 5.5V (VSS -0.3V) to (VDD +0.3V) Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 9 ELECTRICAL CHARACTERISTICS 9.1 DC PARAMETERS SYMBOL VDD VIL VIH VOL VOH IDD_Record IDD_Playback IDD_Erase ISB IILPD1 IILPD2 RMIC+,RMICRAnaIn VIN1 VIN2 AMSP Speaker Output Load AUX Output Load Speaker Output Power RSPK RAux Pout Speaker Output Voltage VOUT1 670 313 117 49 VDD AUX Output Swing AUX Output DC Level AUD Volume Output VOUT2 VOUT3 IAUD AVol 1.2 -3.0 0 to -28 V V mA dB Total Harmonic Distortion THD 1 % Notes: [1] [2] [3] [4] [5] MIN 2.4 VSS-0.3 0.7xVDD VSS-0.3 0.7xVDD TYP [1] PARAMETER Supply Voltage Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Record Current Playback Current Erase Current Standby Current Input Leakage Current Input Current Low Preamp Input Impedance AnaIn Input Impedance MIC Differential Input AnaIn Input Voltage Gain from MIC to SP+/- 20 20 20 1 -3 MAX 5.5 0.3xVDD VDD 0.3xVDD VDD 10 1 -10 7 42 15 300 1 40 6 UNITS V V V V V mA mA mA A A A k k mV V dB k mW mW mW mW V 8 5 1 CONDITIONS [2] IOL = 4.0 mA [2] IOH = -1.6 mA VDD = 5.5 V, No load, Sampling freq = 12 kHz [3] [4] Force VDD Force VSS , others at Vcc Power-up AGC When active [5] Peak-to-Peak Peak-to-Peak VIN = 15~300 mV, AGC = 4.7 F, VCC = 2.4V~5.5V Across both Speaker pins When active VDD = 5.5 V 1Vp-p, VDD = 4.4 V 1 kHz sine wave at VDD= 3 V AnaIn. RSPK VDD= 2.4 V = 8 . RSPK = 8 (Speaker), Typical buzzer Peak-to-Peak When active VDD =4.5 V, REXT= 390 8 steps of 4dB each reference to output 15 mV p-p 1 kHz sine wave, Cmessage weighted Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25C, unless otherwise stated. LED output during Record operation. VCCA, VCCD and VCCP are connected together. VSSA, VSSP1, VSSP2 and VSSD are connected together. REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at VCCD. Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or MIC- input is recommended no more than 150 mV p-p. - 14 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 9.2 AC PARAMETERS CHARACTERISTIC [2] Sampling Frequency [3] Duration SYMBOL FS TDur Rising Time Falling Time Debounce Time Ramp Up Time Ramp Down Time Initial Scan Time after power is applied Initial Scan Time from PD state End Recording Time LED High Time LED Flash Time for SE1 LED Flash Time for SE2 LED Flash Time for SE3 LED Flash Time for SE4 SE1 Recorded Duration SE2 Recorded Duration SE3 Recorded Duration SE4 Recorded Duration Erase Time Global Erase Wait Time Global Erase Time RESET Pulse Settle Time Settle Time after Reset LED Error Time LED Cycle frequency Tr Tf TDeb TRU TRD TSc1 Notes: MIN 4 TYP [1] MAX 12 Refer to duration table 100 100 UNITS kHz sec CONDITIONS [2] [4] [3] DRN/8/FS nsec nsec msec msec msec msec TSc2 DRN/16/FS msec After a PB operation [4] is run TER TLH TLS1 TLS2 TLS3 TLS4 TSE1 TSE2 TSE3 TSE4 TE TGE1 TGE2 TReset TSet1 TSet2 TLErr TCyc 32/FS 0.5K/FS msec msec sec sec sec sec sec sec sec sec sec sec sec sec msec msec msec Hz [4] 192/FS 128/FS 128/FS 3.5K/FS 7.5K/FS 11.5K/FS 15.5K/FS 4K/FS 4K/FS 4K/FS 4K/FS 10MRN/FS 20K/FS 34/FS 1 128/FS 64/FS 27.5K/FS 4 1 [4] DRN= device row# [4] [5] SE1 not recorded [5] SE2 not recorded [5] SE3 not recorded [5] SE4 not recorded [4] [5] [4] [5] [4] [5] [4] [5] MRN=message row # [4] [5] All Fs [4] [4] [4] [4] [5] Pending upon FS [1] Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25C, unless otherwise stated. Characterization data shows that sampling frequency resolution is 5 percent across temperature and voltage ranges. [3] Characterization data shows that duration resolution is 5 percent across temperature and voltage ranges. [4] Vcc=2.4 V~5.5V [5] K = 1024 [2] - 15 - [4] Publication Release Date:March 3, 2017 Revision 2.1 [4] ISD1700 DATASHEET 10 TYPICAL APPLICATION CIRCUITS The following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each design has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc. The below notes apply to the following applications examples: * ** These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 F, 4.7 F or other values. Please refer to the applications notes or consult Nuvoton for layout advice. It is important to have a separate path for each ground and power back to the related terminals to minimize the noise. Also, the power supplies should be decoupled as close to the device as possible . Example #1: Recording using microphone input via push-button controls Reset 24 23 25 26 19 22 VCC 7 6 4.7 K 5 4.7 F 4 3 REC PLAY ERASE RESET 0.1 F LED 2 D1 1 K FWD VCCD 1 VOL FT VSSD 28 MOSI 0.1 F * ISD1700 Gnd Vcc ** VCCA 0.1 F * VCCP VCCP 14 VSSP1 16 0.1F SCLK ** VCCA VCCD VCCP VCCD VCCA 21 VSSA 8 SS vAlert * * 0.1 F VSSP2 12 MISO 4.7 K 10 0.1 F 11 0.1 F Rosc *** SP- AnaIn 20 ROSC 18 4.7 F 15 Speaker or Buzzer 13 VCC Speaker MIC - 9 4.7 K SP+ MIC+ AUD AUD/AUX 17 8050C VCCD INT/RDY 27 100 K AUX 390 0.1 F Optional AGC Optional: based upon the applications *** At 8kHz sampling freq, Rosc = 80 K : Digital ground; : Analog ground; - 16 - : Ground for SP+; : Ground for SP- Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET Example #2: Recording using AnaIn input via push-button controls - 17 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET Example #3: Connecting the SPI Interface to a microcontroller 10.1 GOOD AUDIO DESIGN PRACTICES To ensure the highest quality of voice reproduction, it is important to follow good audio design practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites. Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family.pdf Good Audio Design Practices http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf - 18 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 11 PACKAGING 11.1 28-LEAD 300-MIL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT (SOIC) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 2 3 4 5 1 6 7 8 9 10 11 12 13 14 A G C B D E H F Plastic Small Outline Integrated Circuit (SOIC) Dimensions INCHES MILLIMETERS Min Nom Max Min Nom Max A 0.701 0.706 0.711 17.81 17.93 18.06 B 0.097 0.101 0.104 2.46 2.56 2.64 C 0.292 0.296 0.299 7.42 7.52 7.59 D 0.005 0.009 0.0115 0.127 0.22 0.29 E 0.014 0.016 0.019 0.35 0.41 0.48 F 0.050 1.27 G 0.400 0.406 0.410 10.16 10.31 10.41 H 0.024 0.032 0.040 0.61 0.81 1.02 Note: Lead coplanarity to be within 0.004 inches. - 19 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 11.2 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP) Plastic Dual Inline Package (PDIP) (P) Dimensions INCHES A B1 B2 C1 C2 D D1 E F G H J S 0 Min 1.445 0.065 0.600 0.530 0.015 0.125 0.015 0.055 0.008 0.070 0 Nom 1.450 0.150 0.070 0.540 0.018 0.060 0.100 0.010 0.075 MILLIMETERS Max 1.455 Min 36.70 0.075 0.625 0.550 0.19 1.65 15.24 13.46 0.135 0.022 0.065 0.38 3.18 0.38 1.40 0.012 0.080 15 0.20 1.78 0 Nom 36.83 3.81 1.78 13.72 0.46 1.52 2.54 0.25 1.91 Max 36.96 1.91 15.88 13.97 4.83 3.43 0.56 1.65 0.30 2.03 15 12 ORDERING INFORMATION - 20 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET Product Number Descriptor Key I17xxxxxxx Product Name: I = ISD Product Series: Tape & Reel: 17 = 1700 Blank = None Duration: 30 : 20 - 60 secs 60 : 40 - 120 secs R Temperature: I = Industrial (-40C to +85C) 120 : 80 - 240 secs 240 : 160 - 480 secs = Tape & Reel Blank = Package Type: S P = = Commercial Die (0C to +50C) Package (0C to +70C) Small Outline Integrated Circuit (SOIC) Package Package Options: Plastic Dual Inline Package (PDIP) Y = Green When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Nuvoton Sales Representatives for any questions and the availability. For the latest product information, please contact the Nuvoton Sales/Rep or access Nuvoton's worldwide web site at http://www.Nuvoton-usa.com - 21 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET 13 VERSION HISTORY VERSION DATE DESCRIPTION 1.3-S Sep 2006 Initial version 1.3-S1 Nov 2006 Revise Pinout Configuration & Pin Description sections 1.3-S2 Jan 2007 Revise Rosc resistor value Revise Selectable Message Duration section Update standby current, sampling frequency & duration parameters 1.31 Oct 31, 2008 Change logo. 2.0 Feb 4, 2010 Remove preliminary sign. 2.1 March, 2017 Removed TSOP package option (Not recommended for new Design) - 22 - Publication Release Date:March 3, 2017 Revision 2.1 ISD1700 DATASHEET Nuvoton products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Nuvoton products are not intended for applications wherein failure of Nuvoton products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Nuvoton customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nuvoton for any damages resulting from such improper use or sales. The contents of this document are provided only as a guide for the applications of Nuvoton products. Nuvoton makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Nuvoton or others is granted by this publication. Except as set forth in Nuvoton's Standard Terms and Conditions of Sale, Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. The contents of this document are provided "AS IS", and Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Nuvoton be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Nuvoton has been advised of the possibility of such damages. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Nuvoton makes no representation or warranty that such applications shall be suitable for the use specified. The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Nuvoton Reliability Report, and are neither warranted nor guaranteed by Nuvoton. This product incorporates SuperFlash(R). This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD (R) ChipCorder(R) product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. Copyright(c) 2005, Nuvoton Technology Corporation. All rights reserved. ChipCorder (R) and ISD(R) are trademarks of Nuvoton Technology Corporation. SuperFlash(R) is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners. Headquarters Nuvoton Technology Corporation America Nuvoton Technology (Shanghai) Ltd. No. 4, Creation Rd. III Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.Nuvoton.com.tw/ 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441797 http://www.Nuvoton-usa.com/ 27F, 299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62356998 Taipei Office Nuvoton Technology Corporation Japan Nuvoton Technology (H.K.) Ltd. 9F, No. 480, Pueiguang Rd. Neihu District Taipei, 114 Taiwan TEL: 886-2-81777168 FAX: 886-2-87153579 7F Daini-ueno BLDG. 3-7-18 Shinyokohama Kohokuku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners. - 23 - Publication Release Date:March 3, 2017 Revision 2.1