STTH3R04 Ultrafast recovery diode Features Negligible switching losses Low forward and reverse recovery times High junction temperature A K DO-15 DO-201AD STTH3R04Q STTH3R04 Band indicates cathode side. Description The STTH3R04 series uses ST's new 400 V planar Pt doping technology. The STTH3R04 is specially suited for switching mode base drive and transistor circuits. Packaged in axial and surface mount packages, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. May 2008 SMB STTH3R04U Table 1. Rev 1 SMC STTH3R04S Device summary IF(AV) 3A VRRM 400 V Tj (max) 175 C VF (typ) 0.9 V trr (typ) 18 ns 1/10 www.st.com Characteristics 1 STTH3R04 Characteristics Table 2. Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit 400 V 3.0 A 60 A -65 to +175 C 175 C Repetitive peak reverse voltage VRRM Average forward current, = 0.5 IF(AV) DO-15 Tlead = 70 C DO-201AD Tlead = 80 C SMB Tlead = 70 C SMC Tlead = 100 C IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal Tstg Storage temperature range Maximum operating junction temperature(1) Tj 1. On infinite heatsink with 10 mm lead length Table 3. Thermal parameters Symbol Rth(j-l) Parameter Junction to lead Value Lead length = 10 mm on infinite heatsink DO-15 25 DO-201AD 22 SMB 25 SMC 17 Unit C/W Rth(j-l) Table 4. Symbol IR(1) Junction to lead Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Min Typ Forward voltage drop Tj = 100 C A 5 50 1.5 IF = 3.0 A Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.9 x IF(AV) + 0.083 x IF2(RMS) 2/10 Unit 5 VR = VRRM Tj = 25 C VF(2) Max 1.0 1.25 0.9 1.15 V STTH3R04 Characteristics Table 5. Dynamic characteristics (Tj = 25 C unless otherwise stated) Symbol Test conditions Parameter trr tfr VFP Typ Max IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C Reverse recovery time IRM Min Unit 35 ns IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C 18 25 Reverse recovery current IF = 3.0 A, dIF/dt = -200 A/s, VR = 320 V, Tj = 125 C 4 5.5 A Forward recovery time IF = 3.0 A dIF/dt = 100 A/s VFR = 1.1 x VFmax, Tj = 25 C 75 ns Forward recovery voltage IF = 3.0 A Figure 1. Conduction losses versus average forward current Figure 2. P(W) 4.5 =0.05 =0.1 =0.2 dIF/dt = 100 A/s =0.5 4.0 45 3.5 40 Forward voltage drop versus forward current TJ=150C (Maximum values) 35 3.0 V IFM(A) 50 =1 2.5 30 2.5 25 2.0 TJ=150C (Typical values) 20 1.5 15 T 1.0 TJ=25C (Maximum values) 10 0.5 =tp/T IF(AV)(A) 5 tp 0.0 VFM(V) 0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 Figure 4. Relative variation of thermal impedance junction to lead versus pulse duration, DO-15 (epoxy FR4, copper thickness = 35 m) 0.8 1.2 1.6 2.0 2.4 2.8 3.2 Relative variation of thermal impedance junction to ambient versus pulse duration, DO-201AD (epoxy FR4, copper thickness = 35 m) Zth(j-a) /Rth(j-a) Zth(j-l)/Rth(j-l) 1.0 1.0 DO-15 Lleads=10mm 0.9 DO-201AD Lleads=10mm 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.1 0.4 0.2 Single pulse 0.0 1.E-01 0.1 tP(s) Single pulse tP(s) 0.0 1.E+00 1.E+01 1.E+02 1.E+03 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 3/10 Characteristics Figure 5. STTH3R04 Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration, SMB (epoxy FR4, copper thickness = 35 m) Zth(j-a) /Rth(j-a) Zth(j-a) /Rth(j-a) 1.0 1.0 SMB SCu=1cm 0.9 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 0.1 tP(s) Single pulse 0.0 Figure 7. SMC SCu=1cm 0.9 0.8 1.E-01 Relative variation of thermal impedance junction to ambient versus pulse duration, SMC 1.E+00 1.E+01 1.E+02 1.E+03 Junction capacitance versus reverse voltage applied (typical values) Single pulse 0.0 1.E-01 Figure 8. 100 F=1MHz VOSC=30mVRMS Tj=25C 1.E+00 1.E+01 1.E+02 1.E+03 Reverse recovery charges versus dIF/dt (typical values) QRR(nC) C(pF) 100 tP(s) IF= 3 A VR=320 V 90 80 70 Tj=125 C 60 10 50 40 30 Tj=25 C 20 10 VR(V) 1 1 Figure 9. 100 dIF/dt(A/s) 0 10 100 1000 Reverse recovery time versus dIF/dt (typical values) 10 1000 Figure 10. Peak reverse recovery current versus dIF/dt (typical values) tRR(ns) 8 IF= 3 A VR=320 V 90 100 IRM(A) IF= 3 A VR=320 V 7 80 6 70 5 60 Tj=125 C 4 50 Tj=125 C 40 3 30 Tj=25 C 2 Tj=25 C 20 1 10 0 0 10 4/10 dIF/dt(A/s) dIF/dt(A/s) 100 1000 10 100 1000 STTH3R04 Characteristics Figure 11. Relative variations of dynamic parameters versus junction temperature Figure 12. Transient peak forward voltage versus dIF/dt (typical values) VFp(V) QRR; IRM [T j] / Q RR; IRM [T j=125C] 25 1.4 IF=3 A Tj=125 C IF= 3 A VR=320 V 1.2 20 1.0 IRM 15 0.8 QRR 0.6 10 0.4 5 0.2 T j(C) dIF/dt(A/s) 0 0.0 25 50 75 100 125 Figure 13. Forward recovery time versus dIF/dt (typical values) 130 0 150 50 100 150 200 250 300 350 400 450 500 Figure 14. Thermal resistance versus lead length, DO-15 Rth(j-a) (C/W) tFR(ns) 120 DO-15 IF=3 A Tj=125 C 120 110 100 100 90 80 80 70 60 60 50 40 40 30 20 20 10 Lleads(mm) dIF/dt(A/s) 0 0 0 50 100 150 200 250 300 350 400 450 0.0 500 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 16. Thermal resistance versus lead Figure 15. Thermal resistance junction to length, DO-201AD ambient versus copper surface under each lead, DO-201AD (epoxy FR4, copper thickness = 35 m) Rth(j-a) (C/W) 100 80 DO-201AD Rth(C/W) DO-201AD 90 70 Rth(j-a) 80 60 70 50 60 40 50 40 30 Rth(j-l) 30 20 20 10 10 SCu(cm) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Lleads(mm) 0 0 3.5 4.0 4.5 5.0 5 10 15 20 25 5/10 Package information STTH3R04 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead, SMB, SMC (epoxy FR4, copper thickness = 35 m) Rth(j-a) (C/W) 120 100 SMB 80 60 SMC 40 20 SCU(cm) 0 0.0 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 6. DO201AD dimensions Dimensions Ref. Millimeters Min. B E Min. Max. B A Note 1 Max. Inches E Note 1 A B 9.50 25.40 0.374 1.000 OD Note 2 OC C 5.30 0.209 D 1.30 0.051 E 1.25 0.049 Notes 6/10 1 - The lead diameter o D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15mm) STTH3R04 Package information Table 7. DO-15 dimensions Dimensions C Ref. C A D B Table 8. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 Figure 18. Footprint, dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) 1.62 (0.064) 2.18 (0.086) 5.84 (0.300) 7/10 Package information Table 9. STTH3R04 SMC dimensions Dimensions Ref. Millimeters E1 D E A1 A2 C E2 L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.20 0.114 0.126 c 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 Figure 19. Footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) 8/10 Inches STTH3R04 3 Ordering information Ordering information Table 10. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STTH3R04 STTH3R04 DO-201AD 1.16 g 600 Ammopack STTH3R04RL STTH3R04 DO-201AD 1.16g 1900 Tape and reel STTH3R04Q STTH3R04Q DO-15 0.4 g 1000 Ammopack STTH3R04QRL STTH3R04Q DO-15 0.4 g 6000 Tape and reel STTH3R04S R4S SMC 0.243 g 2500 Tape and reel STTH3R04U 3R4U SMB 0.12 g 2500 Tape and reel Revision history Table 11. Document revision history Date Revision 30-May-2008 1 Description of changes First issue 9/10 STTH3R04 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10