Multilayer Ceramic Chip Capacitors Kyocera's series of Multilayer Ceramic Chip Capacitors are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications, including the general-purpose CM series, the high-voltage CF series , the low profile CT series, and the DM series for automotive uses. Features * We have factories worldwide in order to supply our global customer bases quickly and efficiently and to maintain our reputation as one of the highest-volume producers in the industry. * All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. * By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications. * Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and super quality. * Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. RoHS Conforming Pb Free CM CA series General CT series Low Profile series Arrays Multilayer Ceramic Chip Capacitors DM series Automotive CF series High-Voltage Structure External Termination Electrodes Nickel Barrier Termination Products Internal Electrodes (Pd, Pd/Ag or Ni) Ni Plating Dielectric Ceramic Layer Temperature compensation :Titanate family High dielectric constant : Barium Titanate family Tape and Reel Ag or Cu or CuNi Sn Plating Bulk Cassette Please contact your local AVX, Kyocera sales office or distributor for specifications not covered in this catalog. Our products are continually being improved. As a result, the capacitance range of each series is subject to change without notice. Please contact an sales representative to confirm compatibility with your application. Multilayer Ceramic Chip Capacitors Kyocera Ceramic Chip Capacitors are available for different applications as classified below: Series Dieletric Options Typical Applications Features Terminations Available Size CM C0G (NP0) X5R X7R X6S X7S Y5V General Purpose Wide Cap Range Nickel Barrier 0201, 0402, 0603 0805, 1206, 1210 1812, 2220 CF C0G (NP0) X7R High Voltage & Power Circuits High Voltage 250VDC, 630VDC 1000VDC, 2000VDC 3000VDC, 4000VDC Nickel Barrier 0805, 1206, 1210 1812, 2208, 1808 2220 CT C0G (NP0) X5R X7R Y5V PLCC (Decoupling) Low Profile Nickel Barrier 0402, 0603, 0805 1206, 1210 DM X7R Automotive Thermal shock Resistivity High Reliability Nickel Barrier 0603, 0805, 1206 CA C0G (NP0) X5R, X7R Digital Signal Pass line Reduction in Placing Costs Nickel Barrier 0405, 0508 Multilayer Ceramic Chip Capacitors Dimensions W L T P P~P P External Electrode Dimensions Tape & Reel Size EIA CODE Dimensions (mm) EIAJ CODE L W P min P max P to P min T max 03 0201 0603 0.60.03 0.30.03 0.10 0.20 0.20 0.33 05 0402 1005 1.00.05 0.50.05 0.15 0.35 0.30 0.55 105 0603 1608 1.60.10 0.80.10 0.20 0.60 0.50 0.90 21 0805 2012 2.00.10 1.250.10 0.20 0.75 0.70 1.35 316 1206 3216 3.20.20 1.600.15 0.30 0.85 1.40 1.75 32 1210 3225 3.20.20 2.500.20 0.30 1.00 1.40 2.70 42 1808 4520 4.50.20 2.000.20 0.15 0.85 2.60 2.20 43 1812 4532 4.50.30 3.200.20 0.30 1.10 2.00 3.0 52 2208 5720 5.70.40 2.000.20 0.15 0.85 4.20 2.20 53 2211 5728 5.70.40 2.800.20 0.15 0.85 4.20 2.80 55 2220 5750 5.70.40 5.000.40 0.30 1.40 2.50 2.70 W T * T (Thickness) depends on capacitance value. Standard thickness is shown on the appropriate product pages. * CA series (please refer applicable page) Bulk Cassette P Size EIA CODE EIAJ CODE L P to P min max min 05 0402 1005 1.00.05 0.50.05 0.50.05 0.15 0.35 0.30 105 0603 1608 1.60.07 0.80.07 0.80.07 0.20 0.60 0.50 21 0805 2012 2.00.1 1.250.1 0.60.1/1.250.1 0.20 0.75 0.70 Note) Regarding support for Bulk cases, please contact us for further information. Multilayer Ceramic Chip Capacitors Ordering Information KYOCERA PART NUMBER: CM 21 X7R 104 SERIES CODE CM CF CT DM = = = = General Purpose High Voltage Low Profile Automotive CA = Capacitor Arrays SIZE CODE SIZE EIA (EIAJ) 03 = 0201 (0603) 05 = 0402 (1005) 105 = 0603 (1608) F12 = 0508 (1220)/4cap SIZE 21 316 32 42 43 EIA (EIAJ) = 0805 (2012) = 1206 (3216) = 1210 (3225) = 1808 (4520) = 1812 (4532) SIZE 52 53 55 D11 D12 EIA (EIAJ) = 2208 (5720) = 5728 (2211) = 2220 (5750) = 0405 (1012)/2cap = 0508 (1220)/2cap DIELECTRIC CODE CODE EIA CODE CG = C0G (NPO) X7S = X7S X5R = X5R X6S = X6S (Option) X7R = X7R Y5V = Y5V Negative dielectric types are available on request. CAPACITANCE CODE Capacitance expressed in pF. 2 significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, eg. 100000pF = 104 1.5pF = 1R5 0.1F = 104 0.5pF = R50 4700pF = 472 100F = 107 TOLERANCE CODE A = 0.05pF B = 0.1pF C = 0.25pF D = 0.5pF F = 1pF G = 2% J = 5% K = 10% M = 20% Z = -20 to +80% VOLTAGE CODE 04 06 10 16 25 35 50 = = = = = = = 4VDC 6.3VDC 10VDC 16VDC 25VDC 35VDC 50VDC 100 250 400 630 = = = = 100VDC 250VDC 400VDC 630VDC 1000 2000 3000 4000 = = = = 1000VDC 2000VDC 3000VDC 4000VDC TERMINATION CODE A = Nickel Barrier B = Silver Palladium (option) C = Silver (option) PACKAGING CODE B = Bulk C = Bulk Cassette (option) T = 7" Reel Taping & 4mm Cavity pitch OPTION Thickness max value is indicated in CT series EX. 125 1.25mm max 095 0.95mm max L = 13" Reel Taping & 4mm Cavity pitch H = 7" Reel Taping & 2mm Cavity pitch N = 13" Reel Taping & 2mm Cavity pitch K 50 A T Multilayer Ceramic Chip Capacitors Temperature Characteristics and Tolerance High Dielectric Constant EIA Dielectric Temperature Range X5R -55 to 85C X7R -55 to 125C X7S -55 to 125C X6S -55 to 105C Y5V -30 to 85C Cmax 15% 22% -82 to +22% Temperature Compensation Type Electric Code Value (pF) C0G U N750 SL +350 to -1000 0.5-2.7 CK UK SL 3.0-3.9 CJ UJ SL 4.0-9.0 CH UJ SL 10 CG UJ SL K = 250ppm/C, J = 120ppm/C, H = 60ppm/C, G = 30ppm/C e.g. CG = 030ppm/C Note: All parts will be marked as "CG" but will conform to the above table. Available Tolerances E Standard Number Dielectric materials, capacitance values and tolerances are available in the following combinations only: EIA Dielectric Tolerance 3 E3 Capacitance A=0.05pF <0.5pF B=0.1pF 5pF COG 1 J=5% K=10% X5R X6R X7R Y5V 2 K=10% M=20% Z=-20% to +80% E24 (Option) 1.0 1.0 1.1 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 2.2 2.2 2.4 2.7 2.7 3.0 3.3 3.3 3.6 3.9 3.9 4.3 4.7 4.7 5.1 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 1.0 1.5 <10pF 2.2 F=1pF G=2% E12 1.0 C=0.25pF D=0.50pF E6 10pF 2.2 E12 Series 3.3 E6 Series 4.7 E3 Series Note: 1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF, 2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF 2 J = 5% for X7R(X5R) is available on request. 3 option 4.7 6.8 CA Series Capacitor Arrays Nickel Barrier Terminations How to Order CA F12 X7R 103 K 25 A T Features * Reduction in assemble costs * Reflow solderable * First class auto placement q w e r t y ui qSeries wSize EIA(EIAJ) F12 = 0508(1220) eDielectric rCapacitance Value tTolerance yVoltage uTermination iPackaging Applications * Digital signal pass line for CPU * High Frequency noise reduction for I/O cable etc. * PC * Printer * Hard Disk Drive * CD-ROM * Mobile telecommunication equipment * Down sizing of digital circuit Capacitance Range Numbers of elements 2 elements 4 elements D11 (1014) Size Temperature Characteristics Rated Voltage (VDC) Capacitance (pF) 100 10 15 22 33 47 68 101 100 220 470 102 1000 2200 4700 103 10000 22000 47000 104 100000 220000 470000 105 1000000 2200000 4700000 C D12 (1220) X5R 25 6.3 F12 (1220) X7R X5R C X5R X7R Y5V 16 10 50 10 25 16 10 A C A C A C A C B C D * Capacitances other than indicated in the above chart are optional. Size D11D12F12 A B C D Taping(180 dia reel) 0.66max 4kp(P8) 0.9max 4kp(P8) 0.95max 4kp(P8) 1.0max 4kp(E8) Taping(330 dia reel) 10kp(P8) 10kp(P8) 10kp(P8) 10kp(E8) Thickness (mm) Note : E8 = 8mm width plastic tape Dimensions (Unit : mm) Recommended Land Pattern D11, D12 F12 (Unit : mm) D11, D12 F12 c c c c c c L L P T T a b b a B A a P A B a d d W W L W P A B a b c d F12 1.250.15 2.000.15 0.1min 0.500.10 0.250.10 F12 0.5 0.5 0.3 0.5 D11 1.000.15 1.370.15 0.1min 0.640.10 0.360.10 D11 0.69 0.28 0.3 0.64 0.600.20 D12 0.68 0.64 0.46 1.0 D12 1.250.15 2.000.15 0.1min 1.000.10 CA Series Capacitor Arrays Cross Talk Characteristics Test Circuit W W W W !"#$%&' (!( )*"& 2 ,(&("#"& #"# "# X7R Dielectric - 6 7 )%'%($( "$ "## ,(-'(&. / 01)%'%($( "$ "## ,(-'(&. / 01 COG Dielectric ( 58 &" 5 -(,: (&&() -&%4#( ' -9: :0 ;66 5 - 1 6 7 ( 58 &" 5 -(,: (&&() -&%4#( ' 4 5 4 5 -9: :0 ; 5 1 -% 31& * - Multilayer Ceramic Chip Capacitors Electrical Characteristics Capacitance-Temperature (temperature compensation) For temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms at 1MHz, 1Vrms 10 5 0 C DCapacitance(%) 10 DCapacitance(%) Aging (change of capacitance over time) C X7R 0 -10 Y5V -20 -5 U Initial value should be after 48hr of Heat treatment. -10 -60 -40 -20 0 20 40 60 80 100 -30 10 120 100 1,000 Capacitance-Temperature (high dielectric constant) 100,000 X7R, Y5V Impedance-Frequency at 1kHz, 1Vrms 20 X7R at 0VDC 0 -20 Impedance() Capacitance(%) 10,000 Duration(hrs) Temperature(C) X7R at RV/2 -40 at 1Vrms 100 X 7R 0.0 1F X7 10 R0 .1 F 1 X7 R1 0.1 X7R -60 X7 R1 00 0p F C C C 1 10 C 0p 1p F F 0p F 10 00 pF F 10 F Y5V at 0VDC 0.01 -80 Y5V at RV/2 -100 -60 -40 -20 0 20 40 60 80 100 0.001 0.1 120 1 Temperature(C) For temperature compensation at 1MHz, 1Vrms For high dielectric constant at 1kHz, 1Vrms 25 C 0 10,000 For temperature compensation : 1MHz 1 Vrms/for high dielectric constant : 1kHz Rated at 25V : C, X7R, Y5V 20 DCapacitance(%) X7R -20 C/C(%) 1,000 AC Voltage 20 -40 -60 Y5V 15 Y5V X7R 10 5 0 -80 -100 100 Frequency(MHz) DC Bias Rated at 25V : C, X7R, Y5V 10 C -5 0 5 10 15 20 25 -10 VDC Please verify individual characteristics at the design stage to ensure total suitability 1 2 3 AC Voltage(Vrms) 4 5 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specification for Temperature Compensation type(C to U * SL Characteristics) Test Items Specification (C: nominal capacitance) Capacitance Value Within tolerance C1000pF 1MHz10% 0.5 to Q C30pF: Q1000 C<30pF: Q400+20C C>1000pF 1kHz10% 5Vrms Insulation resistance (IR) (6) 10,000M or 500M*F min, whichever is less Measured after the rated voltage is applied for one minute at normal room temperature and humidity. (4) Dielectric Resistance No problem observed (1) Apply 3 times of the rated voltage for 1 to 5 seconds. No problem observed Microscope(10xmagnification) (6) Appearance Termination strength (2) No problem observed Apply a sideward force of 500g(5N) (3) to a PCB-mounted sample. Bending strength (2) No mechanical damage at 1mm bent Glass epoxy PCB (t=1.6mm); fulcrum Spacing: 90mm; for 10 seconds. No significant change is detected. Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/min In X, Y and Z directions: 2 hours each Total 6 hours Vibration test Soldering heat resistance Appearance C Within tolerance Q C30pF: Q1000 C<30pF: Q400+20C Appearance No significant change is detected. C 2.5% or 0.25pF max, whichever is larger. Q C30pF: Q1000 C<30pF: Q400+20C IR (6) Withstand voltage (6) Solderability Temperature cycle Humidity test (5) Resists without problem No significant change is detected. C 2.5% or 0.25pF max, whichever is larger. Q C30pF: Q1000 C<30pF: Q400+20C (6) Resists without problem Appearance No significant change is detected. C 7.5% or 0.75pF max, whichever is larger. Q C30pF: Q200 C<30pF: Q100+10C/3 (6) Temperature 80 to 100C 150 to 200C Time 2minutes 2minutes Soaking Condition Sn63 Solder 2355C Sn-3Ag-0.5Cu 2455C 20.5sec. 30.5sec. After five cycles, measure after 242hours. Measure the test sample after storing it 242hours at a temperature of 40C2C and a relative humidity of 90-95% Rh. for 500+24/-0hours. 500M or 25M*F min, whichever is smaller Appearance No significant change is detected. C 3% or 0.3pF max, whichever is larger. Q C30pF: Q350 10pFC<30pF: Q275+5C/2 C<10pF: Q200+10C (6) Order 1 2 (Cycle) Normal room temperature (3min) Lowest operation temperature (30min) Normal room temperature (3min) Highest operation temperature (30min) 10,000M or 500M*F min, whichever is samller Withstand voltage (6) IR 2 3 4 10,000M or 500M*F min, whichever is smaller Appearance IR Hightemperature with loading Soak the sample in 260C5C solder for 100.5seconds and place in a room at normal temperature and humidity; measure after 242hours. (Preheating Conditions) Ni/Br termination: 90% min IR 1 Test Conditions After applying (1) twice of the rated voltage at a temperature of 1253C for 1000+48/-0hours, measure the sample after storing 242hours. 1,000M or 50M*F min, whichever is smaller For the CF series, use 1.5 times when the rated voltage is 250V; use/1.2 times when the rated voltage exceeds 630V. Except CT series 2N at 0201 Size Apply 500V for 1minite in case the rated voltage is 1000V or higher. 5 6 Except CF series. The charge and discharge current of the capacitor must not exceed 50mA. Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specification for High Dielectric Type (X5R, X7R, Y5V) Specification Test Items X7R/X5R Capacitance Value Within tolerance 2.5%max, 3.5%max (2), 7.0%max (12) 5.0%max (3), 7.5%max (17) tan(%) 10,000M or 500M*F min, whichever is less Measured after the rated voltage is applied for 2minutes at normal room temperature and humidity. (10) Dielectric Resistance (15) No problem observed (1) Apply 2.5 times of the rated voltage for 1 to 5 seconds. Appearance No problem observed Microscope(10xmagnification) Termination strength (6) No problem observed Apply a sideward force of 500g(5N) (16) to a PCB-mounted sample. Bending strength test (6) No problem observed at 1mm bent Glass epoxy PCB (03,05 type and CA Series : T=0.8mm); fulcrum Spacing: 90mm; for 10 seconds. Vibration Appearance No significant change is detected. test C Within tolerance tan(%) Satisfies the initial value. Appearance No significant change is detected. C Within 7.5% IR 10,000M or 500M*F min, whichever is smaller (15) Appearance Satisfies the initial value. IR 10,000M or 500M*F min, whichever is smaller Withstand voltage (15) Resists without problem Appearance No significant change is detected. tan(%) IR (15) Appearance C IR Within 12.5% Within 30% 200% max of initial value 150% max of initial value (15) 20.5sec. 30.5sec. Do previous treatment (8) (Cycle) Normal room temperature (3min) Lowest operation temperature (30min) Normal room temperature (3min) Highest operation temperature (30min) After five cycles, measure after 484hours. Do previous treatment (9) After storing it at a temperature of 40C2C and a relative humidity of 90-95% for 500+24/-0hours, measure the sample after storing 484hours. 500M or 25M*F min, whichever is smaller No significant change is detected. Within 12.5% tan(%) *8 *9 Within 20% tan(%) (15) Do previous treatment (8) Soak the sample in 260C5C solder for 100.5seconds and place in a room at normal temperature and humidity; measure after 484hours. (Preheating Conditions) Order Temperature Time 1 80 to 100C 2minutes 2 150 to 200C 2minutes Soaking Condition Sn63 Solder 2355C Sn-3Ag-0.5Cu 2455C No significant change is detected. Within 7.5% C Hightemperature with loading Resists without problem Ni/Br termination: 90% min C Humidity test (11) Within 20% Satisfies the initial value. Solderability Temperature cycle Vibration frequency: 10 to 55(Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/min In X, Y and Z directions: 2 hours each Total 6 hours tan(%) Withstand voltage (15) *2 *3 *4 *5 *6 *7 5.0%max, 7.0%max (13) 9.0%max (4), 12.5%max (5) Test Condition Do previous treatment (8, 14) Capacitance Fire Vol C10F 1kHz10% 1.00.1Vrms C>10F 120Hz10% 0.50.1Vrms Insulation resistance (IR) (15) Soldering heat resistance *1 Y5V 200% max of initial value Within 30% 150% max of initialinitial valuevalue Do previous treatment (9) After applying twice (7) of the rated voltage at the highest operating temperature for 1000+48/-0hours, measure the sample after storing 484hours. 1,000M or 50M*F min, whichever is smaller Use 1.5 times when the rated voltage is 250V or over. Use 1.2 times when the rated voltage is 630V or over. Apply to X5R 35V type, X7R 16V/25V type. Apply to X5R16V/25V type, X7R/X7S 6.3V/10V type. Apply to Y5V 16V type, CM32Y5V335 to 106 (25V Type). Apply to Y5V 6.3V/10V type. Apply 16% to CM21Y5V106/CM316Y5V226. Exclude CT series with thickness of less than 0.66mm and CA series. Use 1.5times when the rated voltage is 4V/6.3V/10V/250V and 100V (32X7R474/43X7R105/55X7R105). Use 1.2times when the rated voltage is 630V or over. Keep specimen at 150C+0/-10C for one hour, leave specimen at room ambient for 484 hours. Apply the same test condition for one hour, then leave the specimen at room ambient for 484 hours. *10 *11 *12 *13 *14 *15 *16 *17 For the CF series over 1000V, apply 500V for 1 minutes at room ambient. Except CF series. Apply to X5R 10V type, X7S 4V type. Apply to 25V series of CM105Y5V154 over, CM21Y5V105 over, 316Y5V155 over. Measurement condition 1kHz, 1Vrms for Y5V, C < 47F type. The charge/discharge current of the capacitor must not exceed 50mA. 2N at 0201 Size Apply to X5R 4V and 6.3V type. Multilayer Ceramic Chip Capacitors Packaging Options Tape and Reel Reel Code Reel A " ;" 13-inch Reel (CODE : L, N) ++"" f "" " Code Reel E W1 7-inch Reel (CODE : T, H) 13-inch Reel (CODE : L, N) B 7-inch Reel (CODE : T, H) * :" f," C D +"& " W2 R ,&' " "" & ""& .& " ! " #$ % ! &$ ! ' = "+$ "&$ "& %0 2)* *3) ** 4 1 Carrier Tape 2 Type A B F 03 (0.60.3) "+/""+ ",/""+ """& 05 (1.00.5) ",&" &" """& 1 "+ %0 "&56 "& %0 "/&56 =! "&$ $ $ $ $ + ,$ +$ !$ & %0 2* 2)* *3) ** 4 1 2 105 (1.60.8) "" " !"" D11 (1.371.0) &" &&" !"" D12 (1.252.0) &" +" !"" F12 (1.252.0) &" +" !"" 21 (2.01.25) 56 &" +" !"" 316 (3.21.6) "" +," !"" 32 (3.22.5) ." +," !"" f " -+"" 1 7 ",56 1 0 8 * * = !+$ &+$ && %0 1 2* 2)* *3) ** 4 56 56 42 (4.52.0) !" !." !"" 43 (4.53.2) +," !." "" 52 (5.72.0) !" ,"" !"" 53 (5.72.8) +" ,"" "" 55 (5.75.0) &+" ,"" "" f " +-" " F Bulk Cassette 1 " 7 ",56 ""& !" " " +, ( () " * " Carrier Tape C D E G /& " ""& H J !" & 2 " "+ +& ""& 2* 2* " "+ && ""& " " +" 9-" Multilayer Ceramic Chip Capacitors Precautions 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitorOs insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 201/4C. 4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. 9. Please contact us upon using conductive adhesives. 1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed. 6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas. Multilayer Ceramic Chip Capacitors Surface Mounting Information Dimensions for recommended typical land Land Pattern Sample capacitor c b a Soldering resist When mounting the capacitor to the substrate, it is important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it is mounted. a) The greater the amount of solder, the greater the stress to the elements. As this may cause the substrate to break or crack, it is important to establish the appropriate dimensions with regard to the amount of solder when designing the land of the substrate. b) In the situation where two or more devices are mounted onto a common land, separate the device into exclusive pads by using soldering resist Standard (Unit : mm) Size LxW a b c 03 0.6x0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40 05 1.0x0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60 105 1.6x0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80 21 2.0x1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10 316 3.2x1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30 32 3.2x2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30 42 4.5x2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80 43 4.5x3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00 52 5.7x2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80 53 5.7x2.8 4.20 to 4.70 2.00 to 2.50 2.20 to 2.60 55 5.7x5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70 CA series : Please refer applicable page. Automotive Series (Unit : mm) Size LxW 105 1.6x0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00 a b c 21 2.0x1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40 316 3.2x1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80 Ideal Solder Thickness T/3 to T/2 Chip Capacitor T Solder PCB Typical mounting problems Item Not recommended example Recommended example/Separated by solder Solder resist Multiple parts mount Solder resist Mount with leaded parts Leaded parts Leaded parts Soldering iron Solder resist Wire soldering after mounting Wire Solder resist Overview Solder resist Multilayer Ceramic Chip Capacitors Surface Mounting Information The chip could crack if the PCB warps during processing after the chip has been soldered. (Not recommended) (Ideal) 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf. 3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. Crack Support pin 4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors. 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. Multilayer Ceramic Chip Capacitors Surface Mounting Information Soldering Method 1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference (Delta T) to within 130 degree Celsius. 2) The product size 1.0x0.5mm to 3.2x1.6mm can be used in reflow and wave soldering, and the product size of over 3.2x2.5mm, 0.6x0.3mm, and capacitor arrays can be used in reflow. Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution. 3) Please see our recommended soldering conditions. Please contact us if you use lead free solder because the peak temperature of lead free is different from non-lead free. Recommended Temperature Profile(62Sn Solder) Reflow Recommended Temperature Profile(Sn-3Ag-0.5Cu) Reflow Peak temperature 230C5C 15seconds maximum 300 250C5C 5 to 10sec. Max. Preheat 300 Cool at normal room temperature after removing from furnace. 250 250 Temperature Temperature T 200 150 100 More than180C, 40seconds maximum 200 1 to 3C/sec. 170 to 180C 150 100 50 50 0 0 60seconds Preheat 220C Max. 90 sec Max 60seconds 9030sec. q Minimize soldering time. w Ensure that allowable temperature difference does not exceed 150C. e Ensure that allowable temperature difference does not exceed 130C for 3.2x2.5mm size or larger. Wave q Minimize soldering time. w Ensure that allowable temperature difference does not exceed 150C. e Ensure that allowable temperature difference does not exceed 130C for 3.2x2.5mm size or larger. Wave 300 300 Preheat Preheat Cool at normal room temperature Cool at normal room temperature 250 250 150 260 100 T 200 245 Temperature 230 Temperature T 200 150 260 100 50 0 60 to 120sec. q w e r 60 to 120sec. 5sec. max Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (T) does not exceed 150C. Cool naturally after soldering. Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger. q w e r 5sec. max Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (T) does not exceed 150C. Cool naturally after soldering. Wave soldering is not applicabel for chips with size of 3.2x2.5mm or lager. Sodering iron 1) Temperature of iron chip 2) Wattage 3) Tip shape of soldering iron 4) Soldering Time 350C max 30W max 3.0mm max 3sec. max 5) Cautions a) Pre-heating is necessary Rapid heating must be avoided. Delta T150C. b) Avoid direct touching to capacitors. c) Avoid rapid cooling after soldering. Natural cooling is recommended.