All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Header Solder Type
2.0mm Pitch
4 Rows
Mechanical
Contact Retention Force: 1.0Kg min.
Electrical
Voltage Rating: 750V
Current Rating: 1A
Contact Resistance: 45m
Ω
max.
Dielectrical Withstanding Voltage: 1000V
Insulation Resistance: 1000M
Ω
min.
Physical
Housing: LCP, UL 94-0 rated, Ivory White
Contact: Phosphor Bronze
Plating: See “ORDERING INFORMATION”
DRAWING
ORDERING I N F O R M AT I O N
POS.P/N 192
120
94.00
58.00
DIM. BDIM. A
95.90
59.90
1F11072*-S**4 72 34.0035.90
1F11120*-S**4
1F11192*-S**4
22.0023.90
48
1F11024*-S**4 24 10.0011.90
1F11048*-S**4
96 46.0047.90
1F11096*-S**4
Tail Length(DIM.T)
4=2.65mm
5=3.45mm
Mating Area Plating:
1=GOLD FLASH
3=0.76um(30u")MIN. GOLD PLATING
5=1.27um(50u")MIN. GOLD PLATING
6=0.25um(10u")MIN. GOLD PLATING
A=0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED
PRODUCT NO.: 1 F 1 1 * * * * - S * * 4
POS. NO.:
024=024 pos.
048=048 pos.
072=072 pos.
096=096 pos.
120=120 pos.
192=192 pos.
Tail Style:
S=Solder Type
Body Style
Mating Length(DIM.M)
1=5.00 mm
2=5.75 mm
3=6.50 mm
4=7.25 mm
5=8.00 mm
