DATASHEET Board Level Cooling - 3719 BOARD LEVEL COOLING - 3719 3719 is a series of square pin fin board level heat sinks designed to cool BGA and FPGA devices. Representative image only. ORDERING INFORMATION Part Number Device Type 371924B00000G 371924B00032G 371924B00034G BGA, FPGA BGA, FPGA BGA, FPGA HEAT SINK DETAILS Property Details Property Details Material Aluminum Heat Sink Width (mm) 35.0 Black Anodize Epoxy, Tape Heat Sink Length (mm) Heat Sink Height (mm) Heat Sink Mounting Direction 35.0 14.0 Horizontal, Vertical Finish Device Attachment Options Thermal Interface Material: 371924B00000G Thermal Interface Material: 371924B00000G Thermal Interface Material: 371924B00000G T405R Chomerics Tape for Metal Surfaces T410R Chomerics Tape for Plastic Surfaces MECHANICAL & PERFORMANCE Drawing dimensions are shown as: in., (mm) USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122 Board Level Cooling www.aavid.com