IX4423-IX4424-IX4425 3-Ampere Dual Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features * * * * * * Description 3A Peak Output Current Wide Operating Voltage Range: 4.5V to 35V -40C to +125C Operating Temperature Range Latch-up Protected to 3A Fast Rise and Fall Times Low Power Consumption Applications * * * * * MOSFET Driver Switching Power Supplies Motor Controls DC to DC Converters Pulse Transformer Driver The IX4423, IX4424, and IX4425 are dual high-speed, low-side gate drivers. Each of the two outputs can source and sink 3A of peak current with rise and fall times of less than 10ns. The inputs of each driver are TTL and CMOS compatible, and are virtually immune to latch-up. Low propagation delay times and fast, matched rise and fall times make the IX4423, IX4424, and IX4425 ideal for high-frequency and high-power applications. The IX4423 is configured as a dual inverting driver; the IX4424 is configured as a dual non-inverting driver; and the IX4425 is configured with one inverting driver and one non-inverting driver. All three devices are available in a standard 8-pin SOIC package. Ordering Information Logic Configuration INA A B OUTB INA A OUTA INB B OUTB INA A OUTA B Package Type Packing Method Quantity IX4423N IX4423NTR 8-Pin SOIC 8-Pin SOIC Tube Tape & Reel 100 2000 IX4424N IX4424NTR 8-Pin SOIC 8-Pin SOIC Tube Tape & Reel 100 2000 IX4425N IX4425NTR 8-Pin SOIC 8-Pin SOIC Tube Tape & Reel 100 2000 OUTA INB INB Part Number OUTB DS-IX4423-24-25_R02 www.ixysic.com 1 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40C to +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 5 6 2. IX4423-24-25 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IX4423 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IX4425 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IX4424 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 7 7 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 11 11 11 11 11 12 R02 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IX4423 Pin Name NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB IX4424 NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB Description INA Channel A Logic Input INB Channel B Logic Input OUTA OUTA Channel A Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUTB OUTB Channel B Output - Sources or sinks current to turn on or turn off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device NC No Connection IX4425 NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Supply Voltage VCC Input Voltage VIN -0.3 35 V -5.0 VCC+0.3 Output Current IOUT V - 3 A Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Unless otherwise specified, absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the Recommended Operating Conditions table and other operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Symbol Minimum Maximum Units VCC 4.5 30 V Operating Temperature Range TA -40 +125 C R02 www.ixysic.com Supply Voltage 3 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25C Test Conditions: 4.5V < VCC < 18V. Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High - VIH 3 - - Input Voltage, Low - VIL - - 0.8 0V < VIN < VCC IIN - - 10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 2.5 4 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 1.5 3 Rise Time VCC=18V, CLOAD=1000pF tR - 18 35 Fall Time VCC=18V, CLOAD=1000pF tF - 18 35 On-Time Propagation Delay VCC=18V, CLOAD=1000pF ton - 35 75 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toff - 38 75 VINA=VINB=3.5V VINA=VINB=0V ICC - 1 3 - 0.001 0.01 Input Current Power Supply Current 4 www.ixysic.com Units V A V ns mA R02 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1.6 Electrical Characteristics: TA = - 40C to +125C Test Conditions: 4.5V < VCC < 18V. Parameter Conditions Symbol Minimum Maximum Input Voltage, High - VIH 3.3 - Input Voltage, Low - VIL - 0.65 0V < VIN < VCC IIN - 10 Output Voltage, High - VOH VCC-0.025 - Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 6 Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 5 Rise Time VCC=18V, CLOAD=1000pF tR - 60 Fall Time VCC=18V, CLOAD=1000pF tF - 60 On-Time Propagation Delay VCC=18V, CLOAD=1000pF ton - 100 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toff - 100 - 3.5 - 0.15 Input Current Power Supply Current R02 VINA=VINB=3.5V VINA=VINB=0V www.ixysic.com ICC Units V A V ns mA 5 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 1.7 Thermal Characteristics Package Parameter 8-Pin SOIC Thermal Resistance, Junction-to-Ambient Symbol Rating Units JA 120 C/W 2 IX4423-24-25 Performance 2.1 Timing Diagrams VIH INx VIH INx VIL ton VIL toff toff ton 90% OUTx OUTx 10% 90% 10% tF tR tR tF Non-Inverting Driver Waveforms Inverting Driver Waveforms 2.2 Characteristics Test Diagram VCC + 0.1F 10F VCC - INA OUTA INB OUTB GND 1000pF Tektronix Current Probe 6302 VIN 1000pF 6 www.ixysic.com Tektronix Current Probe 6302 R02 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 3 Block Diagrams & Truth Tables 3.1 IX4423 3.3 IX4424 VCC VCC OUTA INA OUTA INA GND GND VCC VCC OUTB INB OUTB INB INX OUTX INX OUTX 0 1 0 0 1 0 1 1 3.2 IX4425 VCC OUTA INA GND VCC OUTB INB R02 INA OUTA 0 1 1 0 INB OUTB 0 0 1 1 www.ixysic.com 7 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 4 Typical Performance Characteristics Rise Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25C) 120 100 CL=4.7nF CL=1nF CL=470pF 60 40 10 80 CL=4.7nF CL=1nF CL=470pF 60 40 tr 9 8 tf 7 6 20 20 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 5 4 0 5 10 15 20 25 30 Supply Voltage (V) Rise Time vs. Load Capacitance VCC=4.5V VCC=8V VCC=12V 80 VCC=18V VCC=25V 60 VCC=30V VCC=35V 40 Rise Time (ns) Fall Time (ns) 2000 3000 4000 Load Capacitance (pF) 100 toffdly tondly 0 1000 2000 3000 4000 Load Capacitance (pF) Propagation Delay vs. Input Voltage (VCC=18V, CL=1nF) 70 Propagation Delay (ns) 150 5000 60 50 toffdly 40 30 tondly 15 20 25 30 Supply Voltage (V) 0 40 5 10 15 Input Voltage (V) Input Threshold vs. Temperature (VCC=18V, CL=1nF) Propagation Delay vs. Temperature (VCC=18V, CL=1nF) toffdly 50 45 tondly 40 35 30 25 2.6 Min VIH 2.4 2.2 Max VIL 2.0 20 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140 Input Threshold vs. Supply Voltage 3.5 Input Threshold (V) Input Threshold (V) 2.8 35 5000 20 20 0 55 Propagation Delay (ns) 1000 Propagation Delay vs. Supply Voltage (VIN=0-5V, CL=1nF, f=1kHz) 10 100 120 140 0 0 5 20 40 60 80 Temperature (C) 20 0 0 0 VCC=4.5V VCC=8V 100 VCC=12V 80 VCC=18V VCC=25V 60 VCC=30V VCC=35V 40 20 50 -40 -20 40 120 100 200 35 Fall Time vs. Load Capacitance 120 Propagation Delay (ns) Rise & Fall Time vs. Temperature (VIN=0-5V, VCC=18V, CL=1nF) 11 Time (ns) 80 0 3.0 2.5 Min VIH 2.0 Max VIL 1.5 1.0 1.8 -40 -20 8 12 100 Fall Time (ns) Rise Time (ns) Fall Time vs. Supply Voltage (VIN=0-5V, f=10kHz, TA=25C) 120 0 20 40 60 80 Temperature (C) 100 120 140 0 www.ixysic.com 5 10 15 20 25 30 Supply Voltage (V) 35 40 R02 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 50 0 100 Supply Current (mA) 350 300 250 200 150 200 150 100 50 0 100 10000 Supply Current vs. Load Capacitance Both Outputs Active (VCC=35V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 100 1000 Load Capacitance (pF) 200 Supply Current vs. Load Capacitance Both Outputs Active (VCC=18V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 150 100 50 0 100 10000 Supply Current vs. Frequency Both Outputs Active (VCC=8V) 1000 Supply Current (mA) 400 1000 Load Capacitance (pF) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 250 Supply Current (mA) 100 300 Supply Current vs. Load Capacitance Both Outputs Active (VCC=12V) 10 1 0.1 100 1000 Load Capacitance (pF) 10000 Supply Current vs. Frequency Both Outputs Active (VCC=12V) 1000 CL=4.7nF CL=1nF 100 CL=470pF Supply Current (mA) 150 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Supply Current (mA) Supply Current (mA) 200 Supply Current vs. Load Capacitance Both Outputs Active (VCC=8V) CL=4.7nF CL=1nF CL=470pF 10 1 0.1 50 1000 Load Capacitance (pF) 10000 Supply Current vs. Frequency Both Outputs Active (VCC=18V) 1000 Supply Current (mA) 10 1 0.1 1 10 100 Frequency (kHz) 1000 10000 0.01 0.1 Supply Current vs. Frequency Both Outputs Active (VCC=35V) 1000 CL=4.7nF CL=1nF 100 CL=470pF Supply Current (mA) 0.01 0.1 1 10 1 0.1 10 100 Frequency (kHz) 1000 10000 Quiescent Supply Current vs. Temperature (VCC=18V) 3.0 CL=4.7nF CL=1nF 100 CL=470pF Supply Current (mA) 0 100 VIN=3.5V 2.5 2.0 VIN=5V 1.5 VIN=10V 1.0 0.5 VIN=0V & 18V 1000 10000 0.01 0.1 Dynamic Supply Current vs. Temperature (VIN=0-5V, VCC=18V, CL=1nF, f=1kHz) 1.1 1.0 0.9 0.8 0.7 0.6 -40 -20 R02 10 100 Frequency (kHz) 1 10 100 Frequency (kHz) 1000 10000 7 -6 6 -5 -4 -3 -2 100 120 140 20 40 60 80 Temperature (C) 100 120 140 5 4 3 2 1 0 0 20 40 60 80 Temperature (C) 0 Output Sink Current vs. Supply Voltage (CL=27nF) 8 -7 -1 0 0.0 -40 -20 Output Source Current vs. Supply Voltage (CL=27nF) -8 Source Current (A) Supply Current (mA) 1.2 1 Sink Current (A) 0.01 0.1 0 5 10 15 20 25 30 Supply Voltage (V) www.ixysic.com 35 40 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 9 IX4423-24-25 INTEGRATED CIRCUITS DIVISION Output Source Current vs. Temperature (VCC=18V, CL=27nF) 5.0 -4.5 4.5 -4.0 4.0 Sink Current (A) Source Current (A) -5.0 -3.5 -3.0 -2.5 -2.0 -1.0 -40 -20 3.0 2.5 2.0 0 20 40 60 80 Temperature (C) 100 120 140 1.0 -40 -20 High-State Output Resistance vs. Supply Voltage (IOUT= -10mA) 8 6 4 2 0 0 20 40 60 80 Temperature (C) 100 120 140 Low State Output Resistance vs. Supply Voltage (IOUT= +10mA) 10 Output Resistance () 10 Output Resistance () 3.5 1.5 -1.5 8 6 4 2 0 0 10 Output Sink Current vs. Temperature (VCC=18V, CL=27nF) 5 10 15 20 25 30 Supply Voltage (V) 35 40 0 www.ixysic.com 5 10 15 20 25 30 Supply Voltage (V) 35 40 R02 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification IX4423N / IX4424N / IX4425N MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles IX4423N / IX4424N / IX4425N 260C 30 seconds 3 5.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based R02 www.ixysic.com 11 IX4423-24-25 INTEGRATED CIRCUITS DIVISION 5.5 Mechanical Dimensions 5.5.1 "N" Package (8-Pin SOIC) 0.31 / 0.51 (0.012 / 0.020) 8x TOP VIEW PCB Land Pattern 1.55 (0.061) 5 5.80 / 6.20 (0.228 / 0.244) 3.75 (0.148) 3.80 / 4.00 (0.150 / 0.157) A PIN #1 1.25 MIN (0.049 MIN) 1.75 MAX (0.069 MAX) 0.25 (0.010) 1.27 0.05 6x A GAUGE PLANE SEATING PLANE 4 8- 0 4.80 / 5.00 (0.189 / 0.197) 0.10 / 0.25 (0.004 / 0.010) 0.60 (0.024) 0.40 / 1.27 (0.016 / 0.050) Dimensions MIN / MAX 0.10 (0.004) 0.10 / 0.25 (0.004 / 0.010) Notes: 1. Controlling dimension: millimeters. 2. All dimensions are in mm (inches). 3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F. 4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 6. Lead thickness includes plating. 5.5.2 "N" Package Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Embossed Carrier Embossment Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX4423-24-25_R02 (c)Copyright 2017, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 10/25/2017 12 www.ixysic.com R02 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: IXYS: IX4426N IX4426NTR IX4423N IX4423NTR IX4424N IX4424NTR IX4425N IX4425NTR IX4426MTR IX4424MTR IX4424NG IX4425MTR IX4423MTR IX4424G