INTEGRATED CIRCUITS DIVISION
DS-IX4423-24-25_R02 www.ixysic.com 1
Features
•3A Peak Output Current
•Wide Operating Voltage Range: 4.5V to 35V
•-40°C to +125°C Operating Temperature Range
•Latch-up Protected to 3A
•Fast Rise an d Fall Times
•Low Power Consu mption
Applications
•MOSFET Driver
•Switching Power Supplies
•Motor Controls
•DC to DC Converters
•Pulse Transf ormer Driver
Description
The IX4423, IX4424, and IX4425 are dual high-speed,
low-side gate driv ers. Each of the tw o output s can
source and sink 3A of peak current with rise and fall
times of less than 10ns. The inputs of each driver are
TTL and CMOS compatible, and are virtually immune
to latch-up. Low propagation delay times and fast,
matched rise and fall times mak e the IX4423, I X4424,
and IX4425 ideal f or high-frequency and high-po w er
applications.
The IX4423 is configured as a dual inv erting driver;
the IX4424 is configured as a dual non- inverting
driver; and the IX4425 is configured with one in v erting
driver and one non-in verting driver. All three devices
are available in a standard 8-pin SOIC package .
Ordering Information
Logic Configuration Part Number Package Type Packing Method Quantity
IX4423N 8-Pin SOIC Tube 100
IX4423NTR 8-Pin SOIC Tape & Reel 2000
IX4424N 8-Pin SOIC Tube 100
IX4424NTR 8-Pin SOIC Tape & Reel 2000
IX4425N 8-Pin SOIC Tube 100
IX4425NTR 8-Pin SOIC Tape & Reel 2000
OUTA
OUTB
INA
INB
A
B
OUTA
OUTB
INA
INB
A
B
INA
INB
A
B
OUTA
OUTB
IX4423-IX4424-IX4425
3-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
IX4423-24-25
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1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. IX4423-24-25 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 IX4423 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 IX4425 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 IX4424 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
INTEGRATED CIRCUITS DIVISION
IX4423-24-25
R02 www.ixysic.com 3
1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
1.3 Absolut e Max imum Rating s
Unless otherwise specified, absolute maxim um electrical ratings ar e at 25°C
Absolute maximum ratings are stress r a tings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the Recommended Operating Conditions table and
other operational sections of this data sheet is not implied.
1.4 Recommended Operating Conditions
IX4425
NC
INA
GND
INB
NC
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
IX4423
NC
INA
GND
INB
NC
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
IX4424
NC
INA
GND
INB
NC
OUTA
VCC
OUTB
1
4
3
2
8
5
6
7
A
B
Pin Name Description
INA Channel A Logic Input
INB Channel B Logic Input
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn on or turn off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
NC No Connection
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 35 V
Input Voltage VIN -5.0 VCC+0.3 V
Output Current IOUT -±3A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC 4.5 30 V
Operating Temperature Range T
A-40 +125 °C
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1.5 Electrical Ch ara ct e ri st ic s: TA = 25°C
Test Conditions: 4.5V < VCC < 18V.
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High - VIH 3--
V
Input Voltage, Low - VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -2.54
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -1.53
Rise Time VCC=18V, CLOAD=1000pF tR-1835
ns
Fall Time VCC=18V, CLOAD=1000pF tF-1835
On-Time Propagation Delay VCC=18V, CLOAD=1000pF ton -3575
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toff -3875
Power Supply Current
VINA=VINB=3.5V ICC -13
mA
VINA=VINB=0V - 0.001 0.01
INTEGRATED CIRCUITS DIVISION
IX4423-24-25
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1.6 Electrical Ch ara ct e ri st ic s: TA = - 40°C to +125°C
Test Conditions: 4.5V < VCC < 18V.
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High - VIH 3.3 - V
Input Voltage, Low - VIL -0.65
Input Current 0V < VIN < VCC IIN -±10A
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -6
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -5
Rise Time VCC=18V, CLOAD=1000pF tR-60
ns
Fall Time VCC=18V, CLOAD=1000pF tF-60
On-Time Propagation Delay VCC=18V, CLOAD=1000pF ton -100
Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toff -100
Power Supply Current
VINA=VINB=3.5V ICC -3.5
mA
VINA=VINB=0V -0.15
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IX4423-24-25
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1.7 Thermal Characteristics
2 IX4423-24-25 Performance
2.1 Timing Diagrams
2.2 Characterist ic s Test Diagram
Package Parameter Symbol Rating Units
8-Pin SOIC Thermal Resistance, Junction-to-Ambient JA 120 °C/W
10%
90%
t
on
t
off
t
R
t
F
V
IH
V
IL
INx
OUTx
10%
90%
t
on
t
off
t
F
t
R
V
IH
V
IL
INx
OUTx
Inverting Driver WaveformsNon-Inverting Driver Waveforms
INAOUTA
GND
VCC
INB
VCC
+
-
VIN
0.1μF10μF
OUTB
1000pF Tektronix
Current Probe
6302
Tektronix
Current Probe
6302
1000pF
INTEGRATED CIRCUITS DIVISION
IX4423-24-25
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3 Block Diagrams & Truth Tables
3.1 IX4423
3.2 IX4425
3.3 IX4424
INXOUTX
01
10
INA OUTA
01
10
INB OUTB
00
11
INA
GND
INB
OUTA
VCC
OUTB
VCC
INA
GND
INB
OUTA
V
CC
OUTB
V
CC
INXOUTX
00
11
INA
GND
INB
OUTA
VCC
OUTB
VCC
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4 Typical Performance Characteristics
Load Capacitance (pF)
0 1000 2000 3000 4000 5000
Rise Time (ns)
0
20
40
60
80
100
120 Rise Time vs. Load Capacitance
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Time (ns)
4
5
6
7
8
9
10
11
12
Rise & Fall Time vs. Temperature
(VIN=0-5V, VCC=18V, CL=1nF)
tr
tf
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Fall Time (ns)
0
20
40
60
80
100
120
Fall Time vs. Supply Voltage
(VIN=0-5V, f=10kHz, TA=25ºC)
CL=4.7nF
CL=1nF
CL=470pF
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Rise Time (ns)
0
20
40
60
80
100
120
Rise Time vs. Supply V oltage
(VIN=0-5V, f=10kHz, TA=25ºC)
CL=4.7nF
CL=1nF
CL=470pF
Load Capacitance (pF)
0 1000 2000 3000 4000 5000
Fall Time (ns)
0
20
40
60
80
100
120 Fall Time vs. Load Capacitance
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Input Threshold (V)
1.8
2.0
2.2
2.4
2.6
2.8
Input Threshold vs. Temperature
(VCC=18V, CL=1nF)
Min VIH
Max VIL
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Propagation Delay (ns)
20
25
30
35
40
45
50
55
Propagation Delay vs. Temperature
(VCC=18V, CL=1nF)
toffdly
tondly
Input V oltage (V)
0 5 10 15 20
Propagation Delay (ns)
20
30
40
50
60
70
Propagation Delay vs. Input Voltage
(VCC=18V, CL=1nF)
toffdly
tondly
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Propagation Delay (ns)
0
50
100
150
200
Propagation Delay vs. Supply Voltage
(VIN=0-5V, CL=1nF, f=1kHz)
toffdly
tondly
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Input Threshold (V)
1.0
1.5
2.0
2.5
3.0
3.5 Input Threshold vs. Supply Voltage
Min VIH
Max VIL
INTEGRATED CIRCUITS DIVISION
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Frequency (kHz)
0.1 1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=12V)
CL=4.7nF
CL=1nF
CL=470pF
CL=4.7nF
CL=1nF
CL=470pF
Frequency (kHz)
0.1 1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=8V)
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=18V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (pF)
100 1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
350
400
Supply Current vs. Load Capacitance
Both Outputs Active
(VCC=35V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Source Current (A)
0
-1
-2
-3
-4
-5
-6
-7
-8
Output Source Current
vs. Supply Voltage
(CL=27nF)
Frequency (kHz)
0.1 1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=35V)
CL=4.7nF
CL=1nF
CL=470pF
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.6
0.7
0.8
0.9
1.0
1.1
1.2
Dynamic Supply Current
vs. Temperature
(VIN=0-5V, VCC=18V, CL=1nF, f=1kHz)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Quiescent Supply Current
vs. Temperature
(VCC=18V)
VIN=3.5V
VIN=5V
VIN=10V
VIN=0V & 18V
Frequency (kHz)
0.1 1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
Both Outputs Active
(VCC=18V)
CL=4.7nF
CL=1nF
CL=470pF
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Sink Current (A)
0
1
2
3
4
5
6
7
8
Output Sink Current
vs. Supply Voltage
(CL=27nF)
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Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Output Resistance (Ω)
0
2
4
6
8
10
High-State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Sink Current (A)
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Output Sink Current vs. Temperature
(VCC=18V, CL=27nF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Source Current (A)
-1.0
-1.5
-2.0
-2.5
-3.0
-3.5
-4.0
-4.5
-5.0
Output Source Current
vs. Temperature
(VCC=18V, CL=27nF)
Supply V oltage (V)
0 5 10 15 20 25 30 35 40
Output Resistance (Ω)
0
2
4
6
8
10
Low State Output Resistance
vs. Supply Voltage
(IOUT= +10mA)
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5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susc eptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture se nsitivity according to the latest
v ersion o f the joint indust ry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
We test all of our products to t he maximum conditions set forth in the stan dard, and guarantee proper
operation of our devices when handled according to the limitations and information in that st andard as well as to any
limitations set forth in the information or standards ref erenced belo w.
Failure to adhere to the warnings or limitations as estab l ished by the listed specifications could result in reduced
product performance, reduction of operable lif e, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivi ty
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
5.3 Soldering Profile
Provided in the table belo w is t he Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or g reater. The classification temperat ure sets the Maximu m Body
Temperature allow ed for this device during lead-free reflow processes . For through-hole devices, and an y ot her
processes, the guidelines of J-STD-020 must be observ ed.
5.4 Board Wash
IXYS Integr ated Circu it s Division recommends t he use of no-clean f lux formulations . Board washing to reduce or
remove flux residue following the solder reflow process is accep table prov ided proper precautio ns ar e taken to
pre vent damage to the de vice. These precautions include but are not limited to: using a low pressure wash and
providing a follow up bake cycle suff icien t to remov e any moisture trapped within the device due to the washing
process. Due to the v ariability of the w ash parameters used to clean the board, determination of the bake temper ature
and duration necessary to remo ve the moisture trapped within the package is the responsibility of the user
(assembler) . Cleaning or drying methods that employ ultr asonic energy may damage the de vice and should not be
used. Additionally, the device must n ot be exposed to flux or solvents tha t are Chlorine- or Fluorine-based
Device Moisture Sensitivity Level (MSL) Classification
IX4423N / IX4424N / IX4425N MSL 1
Device Classification Temperature (TC)Dwell Time (tp)Max Reflow Cycles
IX4423N / IX4424N / IX4425N 260°C 30 seconds 3
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5.5 Mechanical D ime ns io n s
5.5.1 “N” Package (8-Pin SOIC)
5.5.2 “N” Package Tape & Reel
Dimensions
MIN / MAX
1.75 MAX
(0.069 MAX)
1.25 MIN
(0.049 MIN)
0.10 / 0.25
(0.004 / 0.010)
0.10
(0.004)
4
4.80 / 5.00
(0.189 / 0.197)
TOP VIEW
PIN #1
5.80 / 6.20
(0.228 / 0.244)
5
3.80 / 4.00
(0.150 / 0.157)
0.31 / 0.51
(0.012 / 0.020)
8x
SEATING PLANE
GAUGE PLANE
8°- 0°
0.10 / 0.25
(0.004 / 0.010)
0.40 / 1.27
(0.016 / 0.050)
A
0.25
(0.010)
PCB Land Pattern
1.55
(0.061)
0.60
(0.024)
3.75
(0.148)
A
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. Lead thickness includes plating.
6x
1.27
0.05
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256) P1=8.00
(0.315)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warra nties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IX4423-24-25_R02
©Cop yright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2017
