This is information on a product in full production.
January 2013 Doc ID 15511 Rev 3 1/9
9
HDMIULC6-4F3
4-line, ultralarge bandwhith ESD protection
Datasheet production data
Features
■4-line 15 kV ESD protection
■Ultralow line capacitance: 1.1 pF
■Ultralarge bandwidth
– no influence on signal rise and fall times
– maximized number of signal harmonics
■Flow-through layout with type C HDMI™
connector
■Low PCB space area: 1.76 mm² footprint
■Very low leakage current 70 nA
■0.4 mm pitch Flip-Chip package (wafer level
CSP) to minimize parasitic inductances
■RoHS compliant
Complies with the standards:
■IEC 61000-4-2 Level 4
– ± 15 kV (air discharge)
– ± 8 kV (contact discharge)
Applications
■Mobile phones
■HDMI ports at 1.65 Gb/s and up to 3.2 Gb/s
■USB 2.0 ports up to 480 Mb/s (Hi-Speed)
■Video line protection
TM: IPAD is a trademark of STMicroelectronics. HDMI, the
HDMI logo and High-Definition Multimedia Interface
are trademarks or registered trademarks of HDMI
Licensing LLC.
Figure 1. Pin configuration (bump side)
Description
The HDMIULC6-4F3 is a monolithic, application
specific discrete device dedicated to ESD
protection of the HDMI connection. It also offers
the same high level of protection for IEEE 1394a
and IEEE 1394b/c, USB 2.0, Ethernet links, and
video lines.
Its ultrahigh cutoff frequency (7 GHz) secures a
high level of signal integrity. The device topology
provides this integrity without compromising the
complete protection of ICs against the most
stringent ESD strikes.
Flip Chip (top view)
10 bumps
DIN_1+
DIN_1-
DIN_2+
DIN_2-
DOUT_1+
GND
GND
DOUT_1-
DOUT_2+
DOUT_2-
321
A
D
B
E
C
F
DOUT = connector side
www.st.com
Characteristics HDMIULC6-4F3
2/9 Doc ID 15511 Rev 3
1 Characteristics
Figure 2. Internal circuit schematic (top view)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP
ESD discharge IEC 61000-4-2
Air discharge
Contact discharge
±15
±8
kV
PPP Peak pulse power dissipation (8/20 µs) 35 W
TjMaximum junction temperature 125 °C
Tstg Storage temperature range -55 to + 150 °C
Table 2. Electrical characteristics (Tamb = 25 °C)
Symbol Parameter Test condition Min. Typ. Max. Unit
VBR
Breakdown voltage
between VBUS and
GND
IR = 1 mA 6 V
IRM Leakage current VRM = 3 V 70 nA
CI/O-GND(1)
1. CI/O-GND values are given per line and relative to one GND.
Capacitance between
I/O and GND
Vline = 0 V, Vosc = 30 mV,
F = 1 MHz 1.1 1.4 pF
CI/O-GND(1) Capacitance variation
between I/O and GND
Vline = 0 V, Vosc = 30 mV,
F = 1 MHz between two lines of the
same lane
0.06 pF
BW Bandwidth - 3 dB 5.3 GHz
HDMIULC6-4F3 Characteristics
Doc ID 15511 Rev 3 3/9
Figure 7. Short pulse measurements (typical value)
Figure 3. Attenuation measurements Figure 4. Analog crosstalk measurements
dB
100k 1M 10M 100M 1G 10G
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
I2 - O2
F (Hz)
100k 1M 10M 100M 1G 10G
- 120
- 110
- 100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
f/Hz
I2 - O3
dB
F (Hz)
Figure 5. +8 kV ESD response (typical value) Figure 6. -8 kV ESD response (typical value)
20 V/div
122.9 V
22.8 V
17.9 V
6V
20 ns/div
V : ESD peak voltage
V :clamping voltage @ 30 ns
V :clamping voltage @ 60 ns
PP
CL
CL
V :clamping voltage @ 100 ns
CL
1
1
2
2
3
4
4
3
20 V/div
-88.9 V
3.3 V -8.6 V -6.9 V
20 ns/div
V : ESD peak voltage
V :clamping voltage @ 30 ns
V :clamping voltage @ 60 ns
PP
CL
CL
V :clamping voltage @ 100 ns
CL
1
1
2
2
3
4
4
3
0
5
10
15
20
25
0 5 10 15 20 25 30
Reverse
Forward
VCL(V)
IPP (A)
Typical application schematic HDMIULC6-4F3
4/9 Doc ID 15511 Rev 3
2 Typical application schematic
Figure 8. Implementation with HDMI type C connector
HDMIULC6-4F3 Layout recommendations
Doc ID 15511 Rev 3 5/9
3 Layout recommendations
Figure 9. Layout recommendations
4 Ordering information scheme
Figure 10. Ordering information scheme
PCB routing:
•TMDS routing on layer 3
•GND plane on layers 1 and 5
•Opening on layers 2 and 4
or
•Everything on top layer
–
opening
on layer 2 and GND on layer 3.
HDMI
type C
connector
HDMI ULC 6 4 F3-
Application
Ultra-low capacitance
Breakdown voltage
Number of lines
Package
HDMI = HDMI type protection
6 = 6 Volts minimum
4 = 4 lines
F3 = Flip Chip, 0.4 mm pitch
Package information HDMIULC6-4F3
6/9 Doc ID 15511 Rev 3
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 11. Package dimensions
400 µm
1600 µm ±40
346 µm
400 µm
200 µm
255 µm
605 µm ±55
1100 µm ± 40
Figure 12. Footprint recommendations Figure 13. Marking
220 µm recommended
220 µm recommended
260 µm maximum
Solder stencil opening:
Copper pad Diameter:
Solder mask opening:
300 µm minimum
x
y
x
w
z
w
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
ECOPACK®grade
HDMIULC6-4F3 Package information
Doc ID 15511 Rev 3 7/9
Figure 14. Flip-Chip tape and reel specifications
Ordering information HDMIULC6-4F3
8/9 Doc ID 15511 Rev 3
6 Ordering information
Table 3. Ordering information
7 Revision history
Table 4. Document revision history
Order code Marking Package Weight Base qty Delivery mode
HDMIULC6-4F3 EP Flip Chip 2.2 mg 10000 Tape and reel (7”)
Date Revision Changes
24-Mar-2009 1 First issue.
10-Sept-2009 2 Removed “Electrical characteristics, parameters” table.Updated Ta bl e
2. and Table 3.Updated Figure 18.Added dimension in Figure 19.
15-Jan-2013 3 Updated features, Table 1., Table 2.,and Table 3.Updated ESD curves
and added Figure 3., Figure 4.and Figure 7.
HDMIULC6-4F3
Doc ID 15511 Rev 3 9/9
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2013 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com