MULTILAYER CERAMIC CAPACITORS
1. INTRODUCTION
2. FEATURES
a. High Q and low ESR performance at high frequency.
b. Ultra low capacitance to 0.1pF.
c. Can offer high precision tolerance to ±0.05pF.
d. Quality improvement of telephone calls for low
power loss and better performance.
3. APPLICATIONS
a. Telecommunication
products & equipments: Mobile
phone, WLAN, Base station.
b. RF module: Power amplifier, VCO.
c. Tuners.
TOLERANCE
A=±0.05pF
B=±0.1pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
SERIES
GUQ=Ultra
High Q &
Low ESR
SIZE
02=0201
(0603)
04=0402
(1005)
06=0603
(1608)
DIELECTRIC
CG = NP0
(C0G)
CAPACITANCE
Two significant
digits followed
b no. of zeros.
An R is in place
of decimal point.
eg.:
0R5=0.5pF
1R0=1.0pF
100=10pF
VOLTAGE
Two significant
digits followed by
no. of zeros. And
R is in place of
decimal point.
25=25 VDC
50=50 VDC
100=100 VDC
250=250 VDC
TERMINATION
N=Cu/Ni/Sn
PACKAGING
T=7” reeled
GUQ
06
CG
101
J
250
N
T
MLCC Consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization,
high density and high efficiency, ceramic condensers are used.
Calchip GUQ series MLCC is used at high frequencies and generally have a small temperature coefficient of capacitance,
typical within the +/-30ppm/C required for NPO (COG) classification and have excellent conductivity internal electrode. Thus,
Calchip GUQ series MLCC will be with the feature of low EST and high Q characteristics.
HOW TO ORDER
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
MULTILAYER CERAMIC CAPACITORS
5. EXTERNAL DIMENSIONS
6. GENERAL ELECTRICAL DATA
Dielectric NP0
Size 0201, 0402, 0603
Capacitance*
0201: 0.1pF to 18pF
0402: 0.1pF to 22pF
0603: 0.4pF to 47pF
Capacitance tolerance
Cap≤5pF: A (±0.05pF ), B (±0.1pF), C (±0.25pF)
5pF<Cap<10pF: B (±0.1pF), C (±0.25pF), D (±0.5pF)
Cap≥10pF: F (±1%), G (±2%), J (±5%)
Rated voltage (WVDC) 25V, 50V, 100V, 250V
Q* 0201 & 0402 sizes: Q≥400+20C
0603 size: Cap<30pF, Q≥800+20C; Cap≥30pF, Q≥1400
Insulation resistance at Ur ≥10G
Operating temperature -55 to +125°C
Capacitance change ±30ppm/°C
Termination Ni/Sn (lead-free termination)
* Measured at the conditions of 25°C ambient temperature and 30~70% related humidity.
Apply 1.0±0.2Vrms, 1.0MHz±10% for Cap≤1000pF and 1.0±0.2Vrms, 1.0kHz±10% for Cap>1000pF.
Size
Inch (mm) L (mm) W (mm) T (mm)/Symbol
M
B
(mm)
0201 (0603) 0.60±0.03 0.30±0.03 0.30±0.03 L
0.15±0.05
0402 (1005) 1.00±0.05
0.50±0.05 0.50±0.05
N
0.25+0.05/-0.10
0603 (1608) 1.60±0.10 0.80±0.10 0.80±0.07 S
0.40±0.15
T
W
L
M
B
M
B
Fig. 1 The outline of MLCC
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
MULTILAYER CERAMIC CAPACITORS
7. CAPACITANCE RANGE
DIELECTRIC NP0
SIZE 0201 0402 0603
RATED VOLTAGE (VDC)
25 50 50
100
250 Tolerance
0.1pF (0R1)
L N B
0.2pF (0R2)
L N A, B
0.3pF (0R3)
L N S S S A, B
0.4pF (0R4)
L N S S S A, B
0.5pF (0R5)
L N S S S A, B, C
0.6pF (0R6)
L N S S S A, B, C
0.7pF (0R7)
L N S S S A, B, C
0.8pF (0R8)
L N S S S A, B, C
0.9pF (0R9)
L N S S S A, B, C
1.0pF (1R0)
L N S S S A, B, C
1.2pF (1R2)
L N S S S A, B, C
1.5pF (1R5)
L N S S S A, B, C
1.8pF (1R8)
L N S S S A, B, C
2.2pF (2R2)
L N S S S A, B, C
2.7pF (2R7)
L N S S S A, B, C
3.3pF (3R3)
L N S S S A, B, C
3.9pF (3R9)
L N S S S A, B, C
4.7pF (4R7)
L N S S S A, B, C
5.6pF (5R6)
L N S S S B, C, D
6.8pF (6R8)
L N S S S B, C, D
8.2pF (8R2)
L N S S S B, C, D
10pF (100)
L N S S S F, G, J
12pF (120)
L N S S S F, G, J
15pF (150)
L N S S S F, G, J
18pF (180)
L N S S S F, G, J
22pF (220)
N S S S F, G, J
27pF (270)
S S S F, G, J
33pF (330)
S S S F, G, J
39pF (390)
S S S F, G, J
Capacitance
47pF (470)
S S S F, G, J
1. The letter in cell is expressed the symbol of product thickness.
2. For more information about products with special capacitance or other data, please contact WTC local representative.
8. PACKAGING DIMENSION AND QUANTITY
Paper tape
Size
Thickness (mm)/Symbol 7” reel 13” reel
0201 (0603) 0.30±0.03 L 15k -
0402 (1005) 0.50±0.05 N 10k 50k
0603 (1608) 0.80±0.07 S 4K 10K
Unit: pieces
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
MULTILAYER CERAMIC CAPACITORS
9. ELECTRICAL CHARACTERISTICS
RF15, NP0, 50V
0.01
0.1
1
100 1,000 10,000
Frequency (MHz)
ESR (Ω)
6.8pF
3.3pF
1.5pF
1pF
Fig. 2 ESR vs. Frequency
RF15, NP0, 50V
1
10
100
1000
10000
100 1,000 10,000
Frequency (MHz)
Q
6.8pF
1pF
1.5pF
Fig. 3 Q vs. Frequency
RF15, NP0, 50V
1
10
100
1000
10000
100000
1 10 100 1,000 10,000
Frequency (MHz)
IZI (Ω)
1pF
1.5pF
3.3pF
6.8pF
Fig. 4 Impedance vs. Frequency
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
0402, NPO, 50V
0402, NPO, 50V
0402, NPO, 50V
MULTILAYER CERAMIC CAPACITORS
10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS
No.
Item Test Conditions Requirements
1.
Visual and
Mechanical
--- * No remarkable defect.
* Dimensions to conform to individual specification sheet.
2.
Capacitance * Shall not exceed the limits given in the detailed spec.
3.
Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1MHz±10%
At 25°C ambient temperature. * 0201 & 0402 sizes: Q≥400+20C
* 0603 size: Cap<30pF, Q≥800+20C; Cap≥30pF, Q≥1400
4.
Dielectric
Strength
* To apply voltage:
≤100V, ≥250% of rated voltage.
200V, ≥200% of rated voltage.
* Duration: 1 to 5 sec.
* Charge and discharge current less than 50mA.
* No evidence of damage or flash over during test.
5.
Insulation
Resistance
To apply rated voltage for max. 120 sec. ≥10GΩ
6.
Temperature
Coefficient
With no electrical load.
Operating temperature: -55~125°C at 25°C
* Capacitance change: within ±30ppm/°C
7.
Adhesive
Strength of
Termination
* Pressurizing force
0201: 2N
0402 & 0603: 5N
* Test time: 10±1 sec.
* No remarkable damage or removal of the terminations.
8.
Vibration
Resistance
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
* No remarkable damage.
* Cap change and Q/D.F.: To meet initial spec.
9.
Solderability * Solder temperature: 235±5°C
* Dipping time: 2±0.5 sec.
95% min. coverage of all metalized area.
10.
Bending Test
* The middle part of substrate shall be pressurized by means
of the pressurizing rod at a rate of about 1 mm per second
until the deflection becomes 1 mm and then the pressure
shall be maintained for 5±1 sec.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured
before the test.)
11.
Resistance to
Soldering Heat
* Solder temperature: 270±5°C
* Dipping time: 10±1 sec
* Preheating: 120 to 150°C for 1 minute before immerse the
capacitor in a eutectic solder.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
* 25% max. leaching on each edge.
12.
Temperature
Cycle
* Conduct the five cycles according to the temperatures and
time.
Step
Temp. (°C) Time (min.)
1 Min. operating temp. +0/-3 30±3
2 Room temp. 2~3
3 Max. operating temp. +3/-0 30±3
4 Room temp. 2~3
* Measurement to be made after keeping at room temp. for
24±2 hrs.
*
No remarkable damage.
*
Cap changewithin ±2.5 or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
MULTILAYER CERAMIC CAPACITORS
No.
Item Test Condition Requirements
13.
Humidity
(Damp Heat)
Steady State
* Test temp.: 40±2°C
* Humidity: 90~95% RH
* Test time: 500+24/-0hrs.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±5.0% or ±0.5pF whichever is larger.
* Q/D.F. value: Cap≥30pF, Q≥350;
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
* I.R.: ≥1GΩ.
14.
Humidity
(Damp Heat)
Load
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltagerated voltage
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value: Cap≥30pF, Q≥200;
Cap<30pF, Q≥100+10/3C
* I.R.: ≥500MΩ.
15.
High
Temperature
Load
(Endurance)
* Test temp.: 125±3°C
* To apply voltage: 200% of rated voltage.
* Test time: 1000+24/-0 hrs.
* Measurement to be made after keeping at room temp. for
24±2 hrs.
* No remarkable damage.
* Cap change: within ±3.0% or ±0.3pF whichever is larger.
* Q/D.F. value: Cap≥30pF, Q≥350
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF, Q≥200+10C
* I.R.: ≥1GΩ.
16.
ESR
The ESR should be measured at room temperature and tested
at frequency 1±0.1 GHz with the equivalent of Agilent 4287A
meter.
0.5pF≤Cap≤1pF: < 350mΩ
1pF<Cap≤5pF: < 300mΩ
5pF<Cap≤22pF: < 250mΩ
11. APPENDIXES
Tape & reel dimensions
Fig. 6 The dimension of reel
Fig. 5 The dimension of paper tape
Size 0402, 0603
Reel size
7” 13”
C 13.0+0.5/-0.2 13.0+0.5/-0.2
W
1
8.4+1.5/-0 8.4+1.5/-0
A 178.0±0.10 330.0±1.0
N 60.0+1.0/-0 100±1.0
Size 0201 0402 0603
Thickness L N S
A
0
0.37±0.03
0.62±0.05
1.00
+0.05/-0.1
B
0
0.67±0.03
1.12±0.05
1.80±0.10
T 0.42±0.03
0.60±0.05
0.95±0.05
K
0
- - -
W 8.00±0.10
8.00±0.10
8.00±0.10
P
0
4.00±0.10
4.00±0.10
4.00±0.10
10xP
0
40.0±0.10
40.0±0.10
40.0±0.20
P
1
2.00±0.05
2.00±0.05
4.00±0.10
P
2
2.00±0.05
2.00±0.05
2.00±0.05
D
0
1.55±0.05
1.55±0.05
1.55±0.05
D
1
- - -
E 1.75±0.05
1.75±0.05
1.75±0.05
F 3.50±0.05
3.50±0.05
3.50±0.05
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
MULTILAYER CERAMIC CAPACITORS
Constructions
Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related humidity conditions.
(2) The product is recommended to be used within one year after shipment. Check solderability in case of shelf life
extension is needed.
Cautions:
a. Don’t store products in a corrosive environment such as sulfide, chloride gas, or acid. It may cause oxidization
of electrode, which easily be resulted in poor soldering.
b. To store products on the shelf and avoid exposure to moisture.
c. Don’t expose products to excessive shock, vibration, direct sunlight and so on.
No. Name NP0
1
Ceramic material BaTiO
3
based
2
Inner electrode Cu
3
Inner layer Cu
4
Middle layer Ni
5
Termination
Outer layer Sn (Matt)
Figure 7 - construction of the MLCC
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)
MULTILAYER CERAMIC CAPACITORS
Recommended soldering conditions
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature
and concentration of N
2
within oven are recommended.
Fig. 8 Recommended IR reflow soldering profile for SMT process
with SnAgCu series solder paste.
Fig. 9 Recommended wave soldering profile for SMT process
with SnAgCu series solder.
Calchip Electronics, INC. www.calchipelectronics.com
59 Steamwhistle Drive, Ivyland, PA. 18974 ph 215-942-8900 fx 215-942-6400
Ultra High Q & Low ESR Series (GUQ)